|
DE4410732C2
(de)
*
|
1994-03-28 |
1997-05-07 |
Amatech Gmbh & Co Kg |
Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit
|
|
KR100480522B1
(ko)
*
|
1995-08-01 |
2005-08-31 |
오스트리아 카드 플라스틱카르텐 운트 아우스바이스시스템게젤샤프트 엠베하 |
컴포넌트보유모듈및코일을갖는데이터캐리어와이데이터캐리어의제조방법
|
|
US5861661A
(en)
*
|
1995-12-27 |
1999-01-19 |
Industrial Technology Research Institute |
Composite bump tape automated bonded structure
|
|
DE19609134A1
(de)
*
|
1996-03-08 |
1997-09-11 |
Giesecke & Devrient Gmbh |
Verfahren zur Herstellung eines Datenträgers mit einem elektronischen Modul
|
|
DE19753619A1
(de)
*
|
1997-10-29 |
1999-05-06 |
Meto International Gmbh |
Identifizierungselement und Verfahren zu seiner Herstellung
|
|
FR2756648B1
(fr)
|
1996-11-29 |
1999-01-08 |
Solaic Sa |
Carte a memoire du type sans contact
|
|
FR2756955B1
(fr)
|
1996-12-11 |
1999-01-08 |
Schlumberger Ind Sa |
Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
|
|
EP1034942A4
(de)
*
|
1996-12-26 |
2005-07-06 |
Hitachi Ltd |
Halbleiteranordnung und herstellungsverfahren dafür
|
|
JPH10193849A
(ja)
*
|
1996-12-27 |
1998-07-28 |
Rohm Co Ltd |
回路チップ搭載カードおよび回路チップモジュール
|
|
JP3960645B2
(ja)
*
|
1996-12-27 |
2007-08-15 |
ローム株式会社 |
回路チップ搭載カードおよび回路チップモジュール
|
|
JPH10203066A
(ja)
*
|
1997-01-28 |
1998-08-04 |
Hitachi Ltd |
非接触icカード
|
|
DE19713642A1
(de)
*
|
1997-04-02 |
1998-10-08 |
Ods Gmbh & Co Kg |
Verfahren zur Herstellung kontaktloser Chipkarten
|
|
DE19716342C2
(de)
*
|
1997-04-18 |
1999-02-25 |
Pav Card Gmbh |
Verfahren zur Herstellung einer Chipkarte
|
|
CN1075451C
(zh)
*
|
1997-05-19 |
2001-11-28 |
日立马库塞鲁株式会社 |
柔性信用卡模块及其制造方法以及使用柔性信用卡模块制造信息载体的方法
|
|
JPH10320519A
(ja)
*
|
1997-05-19 |
1998-12-04 |
Rohm Co Ltd |
Icカード通信システムにおける応答器
|
|
WO1998052772A1
(en)
*
|
1997-05-19 |
1998-11-26 |
Hitachi Maxell, Ltd. |
Flexible ic module and method of its manufacture, and method of manufacturing information carrier comprising flexible ic module
|
|
JPH1111055A
(ja)
*
|
1997-06-20 |
1999-01-19 |
Toshiba Corp |
無線モジュール及び無線カード
|
|
CN1110770C
(zh)
*
|
1997-06-23 |
2003-06-04 |
罗姆股份有限公司 |
智能卡用模块、智能卡及智能卡用模块的制造方法
|
|
DE69819299T2
(de)
*
|
1997-06-23 |
2004-07-29 |
Rohm Co. Ltd. |
Ic modul und ic karte
|
|
JPH1131784A
(ja)
*
|
1997-07-10 |
1999-02-02 |
Rohm Co Ltd |
非接触icカード
|
|
FR2769109B1
(fr)
*
|
1997-09-26 |
1999-11-19 |
Gemplus Sca |
Dispositif electronique a puce jetable et procede de fabrication
|
|
FR2769441A1
(fr)
*
|
1997-10-07 |
1999-04-09 |
Philips Electronics Nv |
Carte electronique sans contact et son procede de fabrication
|
|
FR2769389B1
(fr)
*
|
1997-10-07 |
2000-01-28 |
Rue Cartes Et Systemes De |
Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte
|
|
FR2769390B1
(fr)
*
|
1997-10-08 |
2003-02-14 |
Gemplus Card Int |
Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
|
|
JP3663938B2
(ja)
*
|
1997-10-24 |
2005-06-22 |
セイコーエプソン株式会社 |
フリップチップ実装方法
|
|
JPH11161760A
(ja)
*
|
1997-11-26 |
1999-06-18 |
Hitachi Ltd |
薄型電子回路部品及びその製造方法及びその製造装置
|
|
CN1217396C
(zh)
*
|
1998-02-13 |
2005-08-31 |
新光电气工业株式会社 |
Ic卡及ic卡框架
|
|
JPH11250214A
(ja)
*
|
1998-03-03 |
1999-09-17 |
Matsushita Electron Corp |
部品の実装方法とicカード及びその製造方法
|
|
FR2778475B1
(fr)
*
|
1998-05-11 |
2001-11-23 |
Schlumberger Systems & Service |
Carte a memoire du type sans contact, et procede de fabrication d'une telle carte
|
|
US6255725B1
(en)
|
1998-05-28 |
2001-07-03 |
Shinko Electric Industries Co., Ltd. |
IC card and plane coil for IC card
|
|
TW428149B
(en)
*
|
1998-05-28 |
2001-04-01 |
Shinko Electric Ind Co |
IC card and plane coil for IC card
|
|
US6130613A
(en)
*
|
1998-06-09 |
2000-10-10 |
Motorola, Inc. |
Radio frequency indentification stamp and radio frequency indentification mailing label
|
|
FR2781298B1
(fr)
*
|
1998-07-20 |
2003-01-31 |
St Microelectronics Sa |
Procede de fabrication d'une carte a puce electronique et carte a puce electronique
|
|
EP0977145A3
(de)
*
|
1998-07-28 |
2002-11-06 |
Kabushiki Kaisha Toshiba |
Radio IC-Karte
|
|
CN1326085C
(zh)
*
|
1998-07-31 |
2007-07-11 |
松下电器产业株式会社 |
Ic卡、终端装置和通信系统
|
|
US6147605A
(en)
*
|
1998-09-11 |
2000-11-14 |
Motorola, Inc. |
Method and apparatus for an optimized circuit for an electrostatic radio frequency identification tag
|
|
JP3484356B2
(ja)
*
|
1998-09-28 |
2004-01-06 |
新光電気工業株式会社 |
Icカード及びicカード用アンテナ並びにicカード用アンテナフレーム
|
|
KR100629923B1
(ko)
*
|
1998-09-30 |
2006-09-29 |
돗빤호무즈가부시기가이샤 |
도전성페이스트와 도전성페이스트의 경화방법, 및 도전성페이스트를 이용한 비접촉형 데이터송수신체용 안테나의 형성방법과, 비접촉형 데이터송수신체
|
|
FR2785072B1
(fr)
*
|
1998-10-23 |
2001-01-19 |
St Microelectronics Sa |
Circuit electronique autocollant
|
|
TW484101B
(en)
*
|
1998-12-17 |
2002-04-21 |
Hitachi Ltd |
Semiconductor device and its manufacturing method
|
|
FR2787609B1
(fr)
*
|
1998-12-21 |
2001-02-09 |
Gemplus Card Int |
Procede de fabrication de carte a puce sans contact
|
|
US6262692B1
(en)
|
1999-01-13 |
2001-07-17 |
Brady Worldwide, Inc. |
Laminate RFID label and method of manufacture
|
|
DE19905886A1
(de)
*
|
1999-02-11 |
2000-08-17 |
Meto International Gmbh |
Identifizierungselement und Verfahren zur Herstellung eines Identifizierungselements
|
|
KR100530760B1
(ko)
*
|
1999-02-18 |
2005-11-23 |
삼성테크윈 주식회사 |
비접촉형 집적회로카드 및 그 제조방법
|
|
JP3335938B2
(ja)
*
|
1999-03-01 |
2002-10-21 |
新光電気工業株式会社 |
Icカード用アンテナフレーム及びicカードの製造方法
|
|
FR2793054B1
(fr)
*
|
1999-04-29 |
2001-06-29 |
Schlumberger Systems & Service |
Procede de fabrication de cartes sans contact par laminage et carte sans contact fabriquee selon un tel procede
|
|
JP3687459B2
(ja)
|
1999-06-29 |
2005-08-24 |
ソニーケミカル株式会社 |
Icカード
|
|
JP2001024145A
(ja)
*
|
1999-07-13 |
2001-01-26 |
Shinko Electric Ind Co Ltd |
半導体装置及びその製造方法
|
|
WO2001006558A1
(en)
*
|
1999-07-16 |
2001-01-25 |
Matsushita Electric Industrial Co., Ltd. |
Package of semiconductor device and method of manufacture thereof
|
|
JP2001043336A
(ja)
*
|
1999-07-29 |
2001-02-16 |
Sony Chem Corp |
Icカード
|
|
ATE383621T1
(de)
*
|
1999-08-31 |
2008-01-15 |
Nxp Bv |
Datenträger mit integriertem schaltkreis und übertragungsspule
|
|
US7070112B2
(en)
*
|
1999-09-07 |
2006-07-04 |
American Express Travel Related Services Company, Inc. |
Transparent transaction device
|
|
US7889052B2
(en)
|
2001-07-10 |
2011-02-15 |
Xatra Fund Mx, Llc |
Authorizing payment subsequent to RF transactions
|
|
US7239226B2
(en)
|
2001-07-10 |
2007-07-03 |
American Express Travel Related Services Company, Inc. |
System and method for payment using radio frequency identification in contact and contactless transactions
|
|
WO2001026910A1
(fr)
*
|
1999-10-08 |
2001-04-19 |
Dai Nippon Printing Co., Ltd. |
Support de donnees et puce de circuit integre sans contact
|
|
WO2001041054A2
(de)
*
|
1999-12-02 |
2001-06-07 |
Infineon Technologies Ag |
Chipkartenmodul mit anisotrop leitfähiger trägerfolie
|
|
JP2001188891A
(ja)
*
|
2000-01-05 |
2001-07-10 |
Shinko Electric Ind Co Ltd |
非接触型icカード
|
|
AU2001243473A1
(en)
*
|
2000-03-07 |
2001-09-17 |
American Express Travel Related Services Company, Inc. |
System for facilitating a transaction
|
|
FI112287B
(fi)
|
2000-03-31 |
2003-11-14 |
Rafsec Oy |
Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi
|
|
WO2001075772A2
(en)
*
|
2000-04-04 |
2001-10-11 |
Smartag (S) Pte Ltd. |
Method for manufacturing of rfid inlet
|
|
NZ504686A
(en)
*
|
2000-05-22 |
2002-08-28 |
Frederick Johnston Needham |
Office chair including self contained air conditioning system
|
|
JP2001344580A
(ja)
*
|
2000-05-31 |
2001-12-14 |
Toppan Forms Co Ltd |
非接触型データ送受信体およびその製造方法
|
|
JP2002074305A
(ja)
*
|
2000-09-05 |
2002-03-15 |
Dainippon Printing Co Ltd |
非接触icカード及びその製造方法
|
|
JP2002141722A
(ja)
*
|
2000-10-31 |
2002-05-17 |
Toppan Forms Co Ltd |
Icチップブリッジ型アンテナ
|
|
US6424263B1
(en)
*
|
2000-12-01 |
2002-07-23 |
Microchip Technology Incorporated |
Radio frequency identification tag on a single layer substrate
|
|
FI112121B
(fi)
|
2000-12-11 |
2003-10-31 |
Rafsec Oy |
Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
|
|
JP2002319011A
(ja)
*
|
2001-01-31 |
2002-10-31 |
Canon Inc |
半導体装置、半導体装置の製造方法及び電子写真装置
|
|
US7650314B1
(en)
|
2001-05-25 |
2010-01-19 |
American Express Travel Related Services Company, Inc. |
System and method for securing a recurrent billing transaction
|
|
FI112550B
(fi)
*
|
2001-05-31 |
2003-12-15 |
Rafsec Oy |
Älytarra ja älytarraraina
|
|
JP4789348B2
(ja)
*
|
2001-05-31 |
2011-10-12 |
リンテック株式会社 |
面状コイル部品、面状コイル部品の特性調整方法、idタグ、及び、idタグの共振周波数の調整方法
|
|
EP2315510A3
(de)
*
|
2001-06-05 |
2012-05-02 |
Dai Nippon Printing Co., Ltd. |
Leiterplatte mit passiven Elementen
|
|
DE60228090D1
(de)
*
|
2001-06-19 |
2008-09-18 |
Nippon Carbide Kogyo Kk |
Retroreflektives produkt, in dem eine integrierte schaltung versiegelt wird
|
|
FI117331B
(fi)
|
2001-07-04 |
2006-09-15 |
Rafsec Oy |
Menetelmä ruiskuvaletun tuotteen valmistamiseksi
|
|
US9024719B1
(en)
|
2001-07-10 |
2015-05-05 |
Xatra Fund Mx, Llc |
RF transaction system and method for storing user personal data
|
|
US7543738B1
(en)
|
2001-07-10 |
2009-06-09 |
American Express Travel Related Services Company, Inc. |
System and method for secure transactions manageable by a transaction account provider
|
|
US7705732B2
(en)
*
|
2001-07-10 |
2010-04-27 |
Fred Bishop |
Authenticating an RF transaction using a transaction counter
|
|
US8548927B2
(en)
|
2001-07-10 |
2013-10-01 |
Xatra Fund Mx, Llc |
Biometric registration for facilitating an RF transaction
|
|
US8284025B2
(en)
|
2001-07-10 |
2012-10-09 |
Xatra Fund Mx, Llc |
Method and system for auditory recognition biometrics on a FOB
|
|
US20090008441A1
(en)
*
|
2001-07-10 |
2009-01-08 |
Xatra Fund Mx, Llc |
Tracking rf transaction activity using a transaction device identifier
|
|
US9031880B2
(en)
*
|
2001-07-10 |
2015-05-12 |
Iii Holdings 1, Llc |
Systems and methods for non-traditional payment using biometric data
|
|
US7303120B2
(en)
|
2001-07-10 |
2007-12-04 |
American Express Travel Related Services Company, Inc. |
System for biometric security using a FOB
|
|
US20040236699A1
(en)
|
2001-07-10 |
2004-11-25 |
American Express Travel Related Services Company, Inc. |
Method and system for hand geometry recognition biometrics on a fob
|
|
US7249112B2
(en)
|
2002-07-09 |
2007-07-24 |
American Express Travel Related Services Company, Inc. |
System and method for assigning a funding source for a radio frequency identification device
|
|
US7360689B2
(en)
|
2001-07-10 |
2008-04-22 |
American Express Travel Related Services Company, Inc. |
Method and system for proffering multiple biometrics for use with a FOB
|
|
US8001054B1
(en)
|
2001-07-10 |
2011-08-16 |
American Express Travel Related Services Company, Inc. |
System and method for generating an unpredictable number using a seeded algorithm
|
|
US7735725B1
(en)
|
2001-07-10 |
2010-06-15 |
Fred Bishop |
Processing an RF transaction using a routing number
|
|
US7746215B1
(en)
|
2001-07-10 |
2010-06-29 |
Fred Bishop |
RF transactions using a wireless reader grid
|
|
US7668750B2
(en)
|
2001-07-10 |
2010-02-23 |
David S Bonalle |
Securing RF transactions using a transactions counter
|
|
US8294552B2
(en)
|
2001-07-10 |
2012-10-23 |
Xatra Fund Mx, Llc |
Facial scan biometrics on a payment device
|
|
US9454752B2
(en)
|
2001-07-10 |
2016-09-27 |
Chartoleaux Kg Limited Liability Company |
Reload protocol at a transaction processing entity
|
|
KR20010086181A
(ko)
*
|
2001-07-13 |
2001-09-10 |
0 |
비접촉형 아이씨 모듈과 이를 장착한 아이씨 카드
|
|
US6693541B2
(en)
|
2001-07-19 |
2004-02-17 |
3M Innovative Properties Co |
RFID tag with bridge circuit assembly and methods of use
|
|
FI119401B
(fi)
|
2001-12-21 |
2008-10-31 |
Upm Raflatac Oy |
Älytarraraina ja menetelmä sen valmistamiseksi
|
|
US6805287B2
(en)
|
2002-09-12 |
2004-10-19 |
American Express Travel Related Services Company, Inc. |
System and method for converting a stored value card to a credit card
|
|
EP2450870A2
(de)
*
|
2002-10-08 |
2012-05-09 |
Nippon Carbide Kogyo Kabushiki Kaisha |
Retroreflektive Anzeigevorrichtungen
|
|
US6912805B2
(en)
*
|
2003-06-24 |
2005-07-05 |
Chi Lung Ngan |
Magnetized card holder
|
|
EP1653506A4
(de)
*
|
2003-08-05 |
2008-01-02 |
Lintec Corp |
Flip-chip-anbringungssubstrat
|
|
JP2005093867A
(ja)
*
|
2003-09-19 |
2005-04-07 |
Seiko Epson Corp |
半導体装置及びその製造方法
|
|
FR2870351B1
(fr)
*
|
2004-05-14 |
2006-07-14 |
Alstom Transport Sa |
Dispositif de mesure d'un champ electromagnetique, systeme de commande utilisant ce dispositif et circuit electronique concu pour ce dispositif
|
|
USD510103S1
(en)
*
|
2004-06-03 |
2005-09-27 |
American Express Travel Related Services Company, Inc. |
Transparent card with an antenna
|
|
USD507598S1
(en)
*
|
2004-06-03 |
2005-07-19 |
American Express Travel Related Services Company, Inc. |
Transparent card with an antenna and a blue rectangle
|
|
USD508261S1
(en)
*
|
2004-06-03 |
2005-08-09 |
American Express Travel Related Services Company, Inc. |
Transparent card with an antenna and a rectangle
|
|
USD512095S1
(en)
*
|
2004-06-03 |
2005-11-29 |
American Express Travel Related Services Company, Inc. |
Card with an antenna and a blue rectangle
|
|
USD507298S1
(en)
*
|
2004-06-03 |
2005-07-12 |
American Express Travel Related Services Company, Inc. |
Card with an antenna and a rectangle
|
|
KR100602621B1
(ko)
|
2004-06-16 |
2006-07-19 |
한국조폐공사 |
조립식 콤비카드 및 이의 제조방법
|
|
US7314165B2
(en)
|
2004-07-01 |
2008-01-01 |
American Express Travel Related Services Company, Inc. |
Method and system for smellprint recognition biometrics on a smartcard
|
|
US7318550B2
(en)
|
2004-07-01 |
2008-01-15 |
American Express Travel Related Services Company, Inc. |
Biometric safeguard method for use with a smartcard
|
|
US8049594B1
(en)
|
2004-11-30 |
2011-11-01 |
Xatra Fund Mx, Llc |
Enhanced RFID instrument security
|
|
JP4628835B2
(ja)
*
|
2005-03-24 |
2011-02-09 |
トッパン・フォームズ株式会社 |
通信用回路保持体
|
|
EP1952312B1
(de)
*
|
2005-10-14 |
2012-02-01 |
Semiconductor Energy Laboratory Co., Ltd. |
Halbleiteranordnung und die halbleiteranordnung verwendendes kommunikationssystem
|
|
WO2007063786A1
(en)
*
|
2005-11-29 |
2007-06-07 |
Semiconductor Energy Laboratory Co., Ltd. |
Antenna and manufacturing method thereof, semiconductor device including antenna and manufacturing method thereof, and radio communication system
|
|
US20070131781A1
(en)
*
|
2005-12-08 |
2007-06-14 |
Ncr Corporation |
Radio frequency device
|
|
IL184260A0
(en)
*
|
2007-06-27 |
2008-03-20 |
On Track Innovations Ltd |
Mobile telecommunications device having sim/antenna coil interface
|
|
US7948384B1
(en)
|
2007-08-14 |
2011-05-24 |
Mpt, Inc. |
Placard having embedded RFID device for tracking objects
|
|
US8028923B2
(en)
*
|
2007-11-14 |
2011-10-04 |
Smartrac Ip B.V. |
Electronic inlay structure and method of manufacture thereof
|
|
US20090123743A1
(en)
*
|
2007-11-14 |
2009-05-14 |
Guy Shafran |
Method of manufacture of wire imbedded inlay
|
|
JP2008090863A
(ja)
*
|
2007-12-11 |
2008-04-17 |
Hitachi Chem Co Ltd |
Icカード
|
|
JP4525786B2
(ja)
*
|
2008-03-31 |
2010-08-18 |
Tdk株式会社 |
電子部品及び電子部品モジュール
|
|
WO2010000806A1
(en)
*
|
2008-07-02 |
2010-01-07 |
Imec |
Rfid device
|
|
JP5248224B2
(ja)
*
|
2008-07-09 |
2013-07-31 |
リンテック株式会社 |
電子回路及びicタグ
|
|
US20100090008A1
(en)
*
|
2008-10-13 |
2010-04-15 |
Oded Bashan |
Authentication seal
|
|
JP4556002B2
(ja)
*
|
2008-10-14 |
2010-10-06 |
日立化成工業株式会社 |
非接触式icカード
|
|
US8169060B2
(en)
*
|
2010-03-29 |
2012-05-01 |
Infineon Technologies Ag |
Integrated circuit package assembly including wave guide
|
|
DE102010028444B4
(de)
*
|
2010-04-30 |
2016-06-23 |
Bundesdruckerei Gmbh |
Dokument mit einem Chip und Verfahren zur Herstellung eines Dokuments
|
|
US8195236B2
(en)
*
|
2010-06-16 |
2012-06-05 |
On Track Innovations Ltd. |
Retrofit contactless smart SIM functionality in mobile communicators
|
|
JP2010277609A
(ja)
*
|
2010-09-01 |
2010-12-09 |
Hitachi Chem Co Ltd |
Icカード
|
|
US8424757B2
(en)
|
2010-12-06 |
2013-04-23 |
On Track Innovations Ltd. |
Contactless smart SIM functionality retrofit for mobile communication device
|
|
DE102011114635A1
(de)
*
|
2011-10-04 |
2013-04-04 |
Smartrac Ip B.V. |
Chipkarte und Verfahren zur Herstellung einer Chipkarte
|
|
DE102012203260B4
(de)
|
2012-03-01 |
2024-07-25 |
Bundesdruckerei Gmbh |
Verfahren zum Herstellen einer elektrischen Leiterzugstruktur und Wert- und/oder Sicherheitsdokument mit einer Transpondereinheit
|
|
DE102012203270A1
(de)
|
2012-03-01 |
2013-09-05 |
Bundesdruckerei Gmbh |
Dokument und Verfahren zum Herstellen des Dokuments
|
|
EP2669852A1
(de)
|
2012-05-31 |
2013-12-04 |
Gemalto SA |
Chip-Modul eines integrierten Schaltkreises mit Antenne
|
|
CN102945817A
(zh)
*
|
2012-11-21 |
2013-02-27 |
兰荣 |
一体式智能卡封装系统及封装方法
|
|
USD776664S1
(en)
*
|
2015-05-20 |
2017-01-17 |
Chaya Coleena Hendrick |
Smart card
|
|
FR3038105B1
(fr)
|
2015-06-29 |
2017-08-04 |
Oberthur Technologies |
Module equipe d'un condensateur et d'une antenne, avec disposition d'electrode de condensateur amelioree
|
|
JP6401119B2
(ja)
*
|
2015-07-21 |
2018-10-03 |
太陽誘電株式会社 |
モジュール基板
|
|
FR3073307B1
(fr)
*
|
2017-11-08 |
2021-05-28 |
Oberthur Technologies |
Dispositif de securite tel qu'une carte a puce
|
|
US10755157B2
(en)
*
|
2018-03-23 |
2020-08-25 |
International Business Machines Corporation |
Advance alert system against copy of contact-less card information
|
|
US10628722B2
(en)
|
2018-03-23 |
2020-04-21 |
International Business Machines Corporation |
Method and apparatus to enhance the security of contact-less cards
|