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DE60334428D1 - Halter, lithographisches Gerät und Verfahren zur Herstellung einer Vorrichtung - Google Patents

Halter, lithographisches Gerät und Verfahren zur Herstellung einer Vorrichtung

Info

Publication number
DE60334428D1
DE60334428D1 DE60334428T DE60334428T DE60334428D1 DE 60334428 D1 DE60334428 D1 DE 60334428D1 DE 60334428 T DE60334428 T DE 60334428T DE 60334428 T DE60334428 T DE 60334428T DE 60334428 D1 DE60334428 D1 DE 60334428D1
Authority
DE
Germany
Prior art keywords
holder
making
lithographic apparatus
lithographic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60334428T
Other languages
English (en)
Inventor
Martinus Hendricus Hendricus Hoeks
Joost Jeroen Ottens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Application granted granted Critical
Publication of DE60334428D1 publication Critical patent/DE60334428D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H10P72/722—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60334428T 2002-08-23 2003-08-20 Halter, lithographisches Gerät und Verfahren zur Herstellung einer Vorrichtung Expired - Lifetime DE60334428D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02255915 2002-08-23

Publications (1)

Publication Number Publication Date
DE60334428D1 true DE60334428D1 (de) 2010-11-18

Family

ID=32241343

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60334428T Expired - Lifetime DE60334428D1 (de) 2002-08-23 2003-08-20 Halter, lithographisches Gerät und Verfahren zur Herstellung einer Vorrichtung

Country Status (7)

Country Link
US (1) US7092231B2 (de)
JP (1) JP2004104114A (de)
KR (1) KR100532522B1 (de)
CN (1) CN100492172C (de)
DE (1) DE60334428D1 (de)
SG (1) SG108323A1 (de)
TW (1) TWI240153B (de)

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KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
TWI251127B (en) * 2002-11-12 2006-03-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1498777A1 (de) * 2003-07-15 2005-01-19 ASML Netherlands B.V. Substrathalter und lithographischer Projektionsapparat
JP2005044893A (ja) * 2003-07-24 2005-02-17 Canon Inc 基板保持装置
JP2005175016A (ja) * 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
KR101265081B1 (ko) * 2004-06-30 2013-05-16 엘지디스플레이 주식회사 노광용 척 및 이를 이용한 액정표시소자의 제조방법
US7041989B1 (en) * 2004-10-22 2006-05-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI271815B (en) * 2004-11-30 2007-01-21 Sanyo Electric Co Method for processing stuck object and electrostatic sticking method
US20070139855A1 (en) 2005-12-21 2007-06-21 Asml Netherlands B.V. Lithographic apparatus and method of manufacturing an electrostatic clamp for a lithographic apparatus
US7626681B2 (en) * 2005-12-28 2009-12-01 Asml Netherlands B.V. Lithographic apparatus and method
US7649611B2 (en) * 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7352438B2 (en) * 2006-02-14 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1840657A1 (de) * 2006-03-28 2007-10-03 Carl Zeiss SMT AG Halterungsstruktur zur vorübergehenden Halterung eines Substrats
KR100803834B1 (ko) * 2006-08-21 2008-02-14 프라임 뷰 인터내셔널 코오포레이션 리미티드 포토레지스트 회전 도포기의 척
KR100755395B1 (ko) * 2006-08-31 2007-09-04 삼성전자주식회사 반사 마스크, 반사 마스크 고정 장치 및 방법
JP2010514558A (ja) * 2006-12-26 2010-05-06 フジフィルム ディマティックス， インコーポレイテッド 導電性要素を有するプリントシステム
US7944677B2 (en) * 2007-09-11 2011-05-17 Canon Anelva Corporation Electrostatic chuck
KR101479804B1 (ko) 2007-09-13 2015-01-06 아사히 가라스 가부시키가이샤 ＴｉＯ２ 함유 석영 유리 기판
US7940511B2 (en) * 2007-09-21 2011-05-10 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
JP5017232B2 (ja) * 2007-10-31 2012-09-05 エーエスエムエル ネザーランズ ビー．ブイ． クリーニング装置および液浸リソグラフィ装置
JP5283707B2 (ja) * 2008-10-20 2013-09-04 株式会社クリエイティブ テクノロジー 静電チャックの検査方法及び静電チャック装置
US8139340B2 (en) * 2009-01-20 2012-03-20 Plasma-Therm Llc Conductive seal ring electrostatic chuck
WO2012005294A1 (ja) * 2010-07-09 2012-01-12 株式会社クリエイティブ テクノロジー 静電チャック装置及びその製造方法
WO2012026421A1 (ja) * 2010-08-24 2012-03-01 株式会社クリエイティブ テクノロジー 静電チャック装置及びその製造方法
WO2012076207A1 (en) 2010-12-08 2012-06-14 Asml Holding N.V. Electrostatic clamp, lithographic apparatus and method of manufacturing an electrostatic clamp
NL2007768A (en) 2010-12-14 2012-06-18 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
EP2490073B1 (de) 2011-02-18 2015-09-23 ASML Netherlands BV Substrathalter, lithografische Vorrichtung und Verfahren zur Herstellung eines Substrathalters
KR101872886B1 (ko) * 2011-03-17 2018-06-29 에이에스엠엘 네델란즈 비.브이. 정전기 클램프, 리소그래피 장치, 및 디바이스 제조 방법
NL2008630A (en) 2011-04-27 2012-10-30 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
EP2555234B1 (de) * 2011-08-02 2020-08-19 ASML Holding N.V. Elektrostatische Klemme, lithografische Vorrichtung und Verfahren zur Herstellung einer elektrostatischen Klemme
NL2009487A (en) * 2011-10-14 2013-04-16 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
WO2013113569A1 (en) 2012-02-03 2013-08-08 Asml Netherlands B.V. Substrate holder and method of manufacturing a substrate holder
JP6192711B2 (ja) 2012-04-23 2017-09-06 エーエスエムエル ネザーランズ ビー．ブイ． 静電クランプ、リソグラフィ装置および方法
US9449865B2 (en) * 2012-07-17 2016-09-20 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus and method
NL2011592A (en) 2012-10-31 2014-05-06 Asml Netherlands Bv Compensation for patterning device deformation.
WO2014084060A1 (ja) * 2012-11-28 2014-06-05 京セラ株式会社 載置用部材およびその製造方法
WO2015154917A1 (en) 2014-04-09 2015-10-15 Asml Netherlands B.V. Apparatus for cleaning an object
WO2016159239A1 (ja) 2015-04-02 2016-10-06 株式会社アルバック 吸着装置及び真空処理装置
KR102630782B1 (ko) * 2016-08-19 2024-01-31 삼성전자주식회사 기판 처리 장치
WO2019094421A1 (en) * 2017-11-10 2019-05-16 Applied Materials, Inc. Patterned chuck for double-sided processing
WO2020017314A1 (ja) * 2018-07-19 2020-01-23 ボンドテック株式会社 基板接合装置
US11373890B2 (en) * 2018-12-17 2022-06-28 Applied Materials, Inc. Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing
DE102019101657A1 (de) 2019-01-23 2020-07-23 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Haltevorrichtung zur elektrostatischen Halterung eines Bauteils mit einem durch Diffusionsbonden gefügten Grundkörper und Verfahren zu deren Herstellung
US20230031443A1 (en) * 2019-12-26 2023-02-02 Asml Holding N.V. Wafer clamp hard burl production and refurbishment
DE102020104907A1 (de) 2020-02-25 2021-08-26 Berliner Glas GmbH Verfahren zur Herstellung eines Bauelements durch atomares Diffusionsbonden
US12393126B2 (en) * 2020-06-23 2025-08-19 Asml Holding N.V. Sub micron particle detection on burl tops by applying a variable voltage to an oxidized wafer
EP4002010A1 (de) 2020-11-18 2022-05-25 ASML Netherlands B.V. Elektrostatische klemme
US11699611B2 (en) * 2021-02-23 2023-07-11 Applied Materials, Inc. Forming mesas on an electrostatic chuck
EP4206822A1 (de) * 2021-12-28 2023-07-05 ASML Netherlands B.V. Objekthalter, lithographische vorrichtung mit einem solchen objekthalter und verfahren für einen objekthalter
KR20250068556A (ko) * 2022-09-13 2025-05-16 에이에스엠엘 네델란즈 비.브이. Euv 리소그래피에 사용하기 위한 패터닝 디바이스 전압 바이어싱 시스템
EP4390541A1 (de) * 2022-12-23 2024-06-26 ASML Netherlands B.V. Objekttisch

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Also Published As

Publication number Publication date
CN100492172C (zh) 2009-05-27
TWI240153B (en) 2005-09-21
TW200413864A (en) 2004-08-01
KR100532522B1 (ko) 2005-12-01
US7092231B2 (en) 2006-08-15
JP2004104114A (ja) 2004-04-02
US20040114124A1 (en) 2004-06-17
SG108323A1 (en) 2005-01-28
KR20040030259A (ko) 2004-04-09
CN1487360A (zh) 2004-04-07

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