DE60322459D1 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung

Info

Publication number: DE60322459D1
Authority: DE; Germany
Prior art keywords: semiconductor device; semiconductor
Prior art date: 2002-02-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE60322459T

Other languages

English (en)

Inventor

Koichi Hirata

Osamu Isaki

Tsutomu Aono

Toshikazu Hirai

Tetsuro Asano

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sanyo Electric Co Ltd

Original Assignee

Sanyo Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-02-27

Filing date

2003-02-20

Publication date

2008-09-11

2003-02-20 Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd

2008-09-11 Application granted granted Critical

2008-09-11 Publication of DE60322459D1 publication Critical patent/DE60322459D1/de

2023-02-21 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H10W72/00—
- H10W70/411—
- H10W44/20—
- H10W70/60—
- H10W72/5449—
- H10W72/884—
- H10W74/00—
- H10W90/756—

DE60322459T 2002-02-27 2003-02-20 Halbleitervorrichtung Expired - Fee Related DE60322459D1 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2002050940A JP3913574B2 (ja)	2002-02-27	2002-02-27	半導体装置

Publications (1)

Publication Number	Publication Date
DE60322459D1 true DE60322459D1 (de)	2008-09-11

Family

ID=27784574

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60322459T Expired - Fee Related DE60322459D1 (de)	2002-02-27	2003-02-20	Halbleitervorrichtung

Country Status (7)

Country	Link
US (1)	US6894371B2 (de)
EP (1)	EP1347514B1 (de)
JP (1)	JP3913574B2 (de)
KR (1)	KR100643820B1 (de)
CN (1)	CN100353531C (de)
DE (1)	DE60322459D1 (de)
TW (1)	TW583758B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102004016940B4 (de) *	2004-04-06	2019-08-08	Continental Automotive Gmbh	Schaltungsträger für einen Halbleiterchip und ein Bauelement mit einem Halbleiterchip
US20070200210A1 (en) *	2006-02-28	2007-08-30	Broadcom Corporation	Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages
JP6535509B2 (ja) *	2014-05-12	2019-06-26	ローム株式会社	半導体装置
CN111587538B (zh)	2018-01-11	2022-03-11	株式会社村田制作所	开关模块
WO2021202076A1 (en) *	2020-04-03	2021-10-07	Cree, Inc.	Stacked rf circuit topology using transistor die with through silicon carbide vias on gate and/or drain

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL6604965A (de) *	1966-04-14	1967-10-16
JPS53135574A (en) *	1977-05-02	1978-11-27	Hitachi Ltd	Lead frame
JPH04280664A (ja) *	1990-10-18	1992-10-06	Texas Instr Inc <Ti>	半導体装置用リードフレーム
US5294826A (en) *	1993-04-16	1994-03-15	Northern Telecom Limited	Integrated circuit package and assembly thereof for thermal and EMI management
JP2944403B2 (ja) *	1993-12-24	1999-09-06	日本電気株式会社	半導体装置
US5519576A (en) *	1994-07-19	1996-05-21	Analog Devices, Inc.	Thermally enhanced leadframe
JP3907743B2 (ja) *	1995-05-11	2007-04-18	ローム株式会社	半導体装置
JPH09283690A (ja) *	1996-04-08	1997-10-31	Murata Mfg Co Ltd	半導体集積回路用リードフレーム
US5859387A (en) *	1996-11-29	1999-01-12	Allegro Microsystems, Inc.	Semiconductor device leadframe die attach pad having a raised bond pad
JP2891233B2 (ja) *	1997-04-11	1999-05-17	日本電気株式会社	半導体装置
US6121674A (en) *	1998-02-23	2000-09-19	Micron Technology, Inc.	Die paddle clamping method for wire bond enhancement
US6114756A (en) *	1998-04-01	2000-09-05	Micron Technology, Inc.	Interdigitated capacitor design for integrated circuit leadframes
JP3770763B2 (ja) *	1999-12-07	2006-04-26	ローム株式会社	電気機器駆動装置
JP2003204027A (ja) *	2002-01-09	2003-07-18	Matsushita Electric Ind Co Ltd	リードフレーム及びその製造方法、樹脂封止型半導体装置及びその製造方法
US6627977B1 (en) *	2002-05-09	2003-09-30	Amkor Technology, Inc.	Semiconductor package including isolated ring structure

2002
- 2002-02-27 JP JP2002050940A patent/JP3913574B2/ja not_active Expired - Fee Related
- 2002-11-28 TW TW091134580A patent/TW583758B/zh not_active IP Right Cessation
2003
- 2003-02-06 US US10/359,251 patent/US6894371B2/en not_active Expired - Lifetime
- 2003-02-14 CN CNB031044468A patent/CN100353531C/zh not_active Expired - Fee Related
- 2003-02-20 EP EP03003224A patent/EP1347514B1/de not_active Expired - Lifetime
- 2003-02-20 DE DE60322459T patent/DE60322459D1/de not_active Expired - Fee Related
- 2003-02-26 KR KR1020030011948A patent/KR100643820B1/ko not_active Expired - Fee Related

Also Published As

Publication number	Publication date
EP1347514A2 (de)	2003-09-24
TW200303605A (en)	2003-09-01
JP3913574B2 (ja)	2007-05-09
EP1347514B1 (de)	2008-07-30
US20030164536A1 (en)	2003-09-04
KR100643820B1 (ko)	2006-11-10
EP1347514A3 (de)	2005-10-19
US6894371B2 (en)	2005-05-17
KR20030071524A (ko)	2003-09-03
JP2003258188A (ja)	2003-09-12
CN100353531C (zh)	2007-12-05
CN1441485A (zh)	2003-09-10
TW583758B (en)	2004-04-11

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Legal Events

Date	Code	Title	Description
2009-08-20	8364	No opposition during term of opposition
2010-12-16	8339	Ceased/non-payment of the annual fee