DE60317862D1 - Lichtemittierende Halbleitervorrichtung - Google Patents
Lichtemittierende HalbleitervorrichtungInfo
- Publication number
- DE60317862D1 DE60317862D1 DE60317862T DE60317862T DE60317862D1 DE 60317862 D1 DE60317862 D1 DE 60317862D1 DE 60317862 T DE60317862 T DE 60317862T DE 60317862 T DE60317862 T DE 60317862T DE 60317862 D1 DE60317862 D1 DE 60317862D1
- Authority
- DE
- Germany
- Prior art keywords
- light
- semiconductor device
- emitting semiconductor
- emitting
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002178536 | 2002-06-19 | ||
| JP2002178536A JP2004022970A (ja) | 2002-06-19 | 2002-06-19 | 半導体発光素子 |
| JP2002178531 | 2002-06-19 | ||
| JP2002178531A JP2004022969A (ja) | 2002-06-19 | 2002-06-19 | 半導体発光素子 |
| JP2002252837A JP4300004B2 (ja) | 2002-08-30 | 2002-08-30 | 半導体発光素子 |
| JP2002252837 | 2002-08-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60317862D1 true DE60317862D1 (de) | 2008-01-17 |
| DE60317862T2 DE60317862T2 (de) | 2008-12-18 |
Family
ID=29740559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60317862T Expired - Lifetime DE60317862T2 (de) | 2002-06-19 | 2003-04-24 | Lichtemittierende Halbleitervorrichtung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6927426B2 (de) |
| EP (1) | EP1389814B1 (de) |
| KR (1) | KR100568701B1 (de) |
| CN (1) | CN1324772C (de) |
| DE (1) | DE60317862T2 (de) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005013365A2 (en) * | 2003-07-30 | 2005-02-10 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting device, light emitting module, and lighting apparatus |
| DE60332559D1 (de) * | 2003-08-08 | 2010-06-24 | Centre Nat Rech Scient | Verfahren zur herstellung von quantenpunkten aus indiumnitrid und erzeugnis enthaltend diese quantenpunkten |
| TWI243489B (en) * | 2004-04-14 | 2005-11-11 | Genesis Photonics Inc | Single chip light emitting diode with red, blue and green three wavelength light emitting spectra |
| CN1595670B (zh) * | 2004-06-25 | 2011-12-28 | 清华大学 | 宽谱白光led的量子点有源区结构及其外延生长方法 |
| KR100513923B1 (ko) * | 2004-08-13 | 2005-09-08 | 재단법인서울대학교산학협력재단 | 질화물 반도체층을 성장시키는 방법 및 이를 이용하는 질화물 반도체 발광소자 |
| US8309843B2 (en) * | 2004-08-19 | 2012-11-13 | Banpil Photonics, Inc. | Photovoltaic cells based on nanoscale structures |
| KR20070054722A (ko) * | 2004-09-28 | 2007-05-29 | 스미또모 가가꾸 가부시키가이샤 | Ⅲ-ⅴ족 화합물 반도체 및 그 제조 방법 |
| EP1670068A1 (de) * | 2004-12-09 | 2006-06-14 | SuperNova Optoelectronics Corporation | Weiss-Licht emittierende Vorrichtung und Herstelungsverfahren |
| CN101351935A (zh) * | 2005-07-18 | 2009-01-21 | Mrv通信公司 | 激光器波长的稳定 |
| WO2007060931A1 (ja) * | 2005-11-22 | 2007-05-31 | Rohm Co., Ltd. | 窒化物半導体素子 |
| US9406505B2 (en) | 2006-02-23 | 2016-08-02 | Allos Semiconductors Gmbh | Nitride semiconductor component and process for its production |
| US20070240631A1 (en) * | 2006-04-14 | 2007-10-18 | Applied Materials, Inc. | Epitaxial growth of compound nitride semiconductor structures |
| US20070256635A1 (en) * | 2006-05-02 | 2007-11-08 | Applied Materials, Inc. A Delaware Corporation | UV activation of NH3 for III-N deposition |
| KR100716648B1 (ko) * | 2006-05-12 | 2007-05-09 | 서울옵토디바이스주식회사 | 복수개의 발광셀들을 갖는 발광소자 및 그 제조방법 |
| US20080247430A1 (en) * | 2006-07-18 | 2008-10-09 | Shengzhong Zhang | Laser wavelength stabilization |
| EP2074666B1 (de) * | 2006-09-08 | 2012-11-14 | Agency for Science, Technology and Research | Leuchtdiode mit abstimmbarer wellenlänge |
| JP2008109084A (ja) * | 2006-09-26 | 2008-05-08 | Showa Denko Kk | Iii族窒化物化合物半導体発光素子の製造方法、及びiii族窒化物化合物半導体発光素子、並びにランプ |
| WO2008066712A2 (en) * | 2006-11-15 | 2008-06-05 | The Regents Of The University Of California | High light extraction efficiency light emitting diode (led) with emitters within structured materials |
| KR100898586B1 (ko) * | 2007-03-30 | 2009-05-20 | 서울옵토디바이스주식회사 | 발광 다이오드 |
| US20080314311A1 (en) * | 2007-06-24 | 2008-12-25 | Burrows Brian H | Hvpe showerhead design |
| JP2009038239A (ja) * | 2007-08-02 | 2009-02-19 | Toshiba Corp | 光半導体装置 |
| US20090149008A1 (en) * | 2007-10-05 | 2009-06-11 | Applied Materials, Inc. | Method for depositing group iii/v compounds |
| TWI374556B (en) | 2007-12-12 | 2012-10-11 | Au Optronics Corp | White light emitting device and producing method thereof |
| GB2460666A (en) * | 2008-06-04 | 2009-12-09 | Sharp Kk | Exciton spin control in AlGaInN quantum dots |
| JP4510931B2 (ja) * | 2008-09-09 | 2010-07-28 | パナソニック株式会社 | 窒化物系半導体発光素子およびその製造方法 |
| JP2010232597A (ja) * | 2009-03-30 | 2010-10-14 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子及びその製造方法 |
| US8183132B2 (en) * | 2009-04-10 | 2012-05-22 | Applied Materials, Inc. | Methods for fabricating group III nitride structures with a cluster tool |
| US8491720B2 (en) * | 2009-04-10 | 2013-07-23 | Applied Materials, Inc. | HVPE precursor source hardware |
| KR20120003493A (ko) * | 2009-04-24 | 2012-01-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 후속하는 고온 그룹 ⅲ 증착들을 위한 기판 전처리 |
| US8110889B2 (en) * | 2009-04-28 | 2012-02-07 | Applied Materials, Inc. | MOCVD single chamber split process for LED manufacturing |
| WO2010127156A2 (en) * | 2009-04-29 | 2010-11-04 | Applied Materials, Inc. | Method of forming in-situ pre-gan deposition layer in hvpe |
| WO2011011111A1 (en) | 2009-07-20 | 2011-01-27 | S.O.I.Tec Silicon On Insulator Technologies | Methods of fabricating semiconductor structures and devices using quantum dot structures and related structures |
| US20110057213A1 (en) * | 2009-09-08 | 2011-03-10 | Koninklijke Philips Electronics N.V. | Iii-nitride light emitting device with curvat1jre control layer |
| US8580593B2 (en) * | 2009-09-10 | 2013-11-12 | Micron Technology, Inc. | Epitaxial formation structures and associated methods of manufacturing solid state lighting devices |
| US20110220945A1 (en) * | 2010-03-09 | 2011-09-15 | Dae Sung Kang | Light emitting device and light emitting device package having the same |
| US20110256692A1 (en) | 2010-04-14 | 2011-10-20 | Applied Materials, Inc. | Multiple precursor concentric delivery showerhead |
| TWI534291B (zh) | 2011-03-18 | 2016-05-21 | 應用材料股份有限公司 | 噴淋頭組件 |
| US8927958B2 (en) * | 2011-07-12 | 2015-01-06 | Epistar Corporation | Light-emitting element with multiple light-emitting stacked layers |
| TWI555226B (zh) * | 2011-07-12 | 2016-10-21 | 晶元光電股份有限公司 | 具有多層發光疊層的發光元件 |
| US20130015461A1 (en) * | 2011-07-13 | 2013-01-17 | Kun Hsin Technology Inc. | Light-emitting Device Capable of Producing White Light And Light Mixing Method For Producing White Light With Same |
| DE102011116232B4 (de) * | 2011-10-17 | 2020-04-09 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
| JP6271934B2 (ja) * | 2012-11-02 | 2018-01-31 | キヤノン株式会社 | 窒化物半導体面発光レーザ及びその製造方法 |
| KR102158576B1 (ko) * | 2014-02-18 | 2020-09-22 | 엘지이노텍 주식회사 | 자외선 발광소자 및 이를 구비하는 발광소자 패키지 |
| JP6595801B2 (ja) | 2014-05-30 | 2019-10-23 | エルジー イノテック カンパニー リミテッド | 発光素子 |
| KR102455084B1 (ko) * | 2016-02-23 | 2022-10-14 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 및 이를 갖는 표시장치 |
| CN108209941B (zh) * | 2018-01-03 | 2021-06-08 | 中国科学院半导体研究所 | 血氧探测器探测单元、探头及其制备方法 |
| CN111128899B (zh) * | 2018-10-31 | 2022-03-22 | 成都辰显光电有限公司 | 外延基板及其制造方法 |
| CN112331130A (zh) * | 2019-07-31 | 2021-02-05 | Tcl集团股份有限公司 | 一种量子点发光二极管的驱动方法、驱动装置及显示装置 |
| CN112289897A (zh) * | 2020-09-17 | 2021-01-29 | 华灿光电(浙江)有限公司 | 发光二极管外延片的制造方法及发光二极管外延片 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS618981A (ja) * | 1984-06-23 | 1986-01-16 | Oki Electric Ind Co Ltd | 半導体発光素子 |
| JP2910023B2 (ja) * | 1993-12-24 | 1999-06-23 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子 |
| US5656832A (en) * | 1994-03-09 | 1997-08-12 | Kabushiki Kaisha Toshiba | Semiconductor heterojunction device with ALN buffer layer of 3nm-10nm average film thickness |
| JPH07254732A (ja) * | 1994-03-15 | 1995-10-03 | Toshiba Corp | 半導体発光装置 |
| US5777350A (en) * | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
| US5798537A (en) * | 1995-08-31 | 1998-08-25 | Kabushiki Kaisha Toshiba | Blue light-emitting device |
| JP3905935B2 (ja) * | 1995-09-01 | 2007-04-18 | 株式会社東芝 | 半導体素子及び半導体素子の製造方法 |
| EP0772249B1 (de) * | 1995-11-06 | 2006-05-03 | Nichia Corporation | Halbleitervorrichtung aus einer Nitridverbindung |
| US5684309A (en) * | 1996-07-11 | 1997-11-04 | North Carolina State University | Stacked quantum well aluminum indium gallium nitride light emitting diodes |
| US5834331A (en) * | 1996-10-17 | 1998-11-10 | Northwestern University | Method for making III-Nitride laser and detection device |
| JP3282174B2 (ja) * | 1997-01-29 | 2002-05-13 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
| EP0881691B1 (de) * | 1997-05-30 | 2004-09-01 | Matsushita Electric Industrial Co., Ltd. | Anordnung mit Quanten-Schachteln |
| US6266355B1 (en) * | 1997-09-12 | 2001-07-24 | Sdl, Inc. | Group III-V nitride laser devices with cladding layers to suppress defects such as cracking |
| JPH11135838A (ja) * | 1997-10-20 | 1999-05-21 | Ind Technol Res Inst | 白色発光ダイオード及びその製造方法 |
| JPH11243251A (ja) * | 1998-02-26 | 1999-09-07 | Toshiba Corp | 半導体レーザ装置 |
| EP0975027A2 (de) * | 1998-07-23 | 2000-01-26 | Sony Corporation | Licht-emittierende Vorrichtung und Herstellungsverfahren |
| JP2000244060A (ja) * | 1998-12-22 | 2000-09-08 | Sony Corp | 半導体発光装置およびその製造方法 |
| US6744800B1 (en) * | 1998-12-30 | 2004-06-01 | Xerox Corporation | Method and structure for nitride based laser diode arrays on an insulating substrate |
| US6521917B1 (en) * | 1999-03-26 | 2003-02-18 | Matsushita Electric Industrial Co., Ltd. | Semiconductor structures using a group III-nitride quaternary material system with reduced phase separation |
| JP2001077475A (ja) * | 1999-09-03 | 2001-03-23 | Rohm Co Ltd | 半導体レーザ |
| US6531719B2 (en) * | 1999-09-29 | 2003-03-11 | Toyoda Gosei Co., Ltd. | Group III nitride compound semiconductor device |
| JP2001308374A (ja) * | 2000-03-04 | 2001-11-02 | Joryoku Kooria Kk | クアンタムホールの形成方法とそのクアンタムホールを用いる半導体発光素子及びその製造方法 |
| JP4063520B2 (ja) * | 2000-11-30 | 2008-03-19 | 日本碍子株式会社 | 半導体発光素子 |
| US20030047743A1 (en) * | 2001-09-04 | 2003-03-13 | Gang Li | Semiconductor light emitting device |
| TW522534B (en) * | 2001-09-11 | 2003-03-01 | Hsiu-Hen Chang | Light source of full color LED using die bonding and packaging technology |
| US6724013B2 (en) * | 2001-12-21 | 2004-04-20 | Xerox Corporation | Edge-emitting nitride-based laser diode with p-n tunnel junction current injection |
-
2003
- 2003-03-26 CN CNB031075312A patent/CN1324772C/zh not_active Expired - Lifetime
- 2003-03-26 KR KR1020030018788A patent/KR100568701B1/ko not_active Expired - Lifetime
- 2003-04-24 DE DE60317862T patent/DE60317862T2/de not_active Expired - Lifetime
- 2003-04-24 EP EP03090120A patent/EP1389814B1/de not_active Expired - Lifetime
- 2003-04-30 US US10/426,464 patent/US6927426B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE60317862T2 (de) | 2008-12-18 |
| CN1467888A (zh) | 2004-01-14 |
| KR100568701B1 (ko) | 2006-04-07 |
| US6927426B2 (en) | 2005-08-09 |
| KR20040002471A (ko) | 2004-01-07 |
| CN1324772C (zh) | 2007-07-04 |
| EP1389814B1 (de) | 2007-12-05 |
| US20030234404A1 (en) | 2003-12-25 |
| EP1389814A3 (de) | 2005-01-26 |
| EP1389814A2 (de) | 2004-02-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8332 | No legal effect for de | ||
| 8370 | Indication related to discontinuation of the patent is to be deleted | ||
| 8364 | No opposition during term of opposition |