DE60317270D1 - Halbleitermodul und Leistungswandler - Google Patents

Halbleitermodul und Leistungswandler

Info

Publication number: DE60317270D1
Authority: DE; Germany
Prior art keywords: power converter; semiconductor module; semiconductor; module; converter
Prior art date: 2002-07-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60317270T

Other languages

English (en)

Other versions

DE60317270T2 (de

Inventor

A Yoshizaki

K Mashino

H Anan

Y Ochiai

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hitachi Ltd

Hitachi Astemo Ltd

Original Assignee

Hitachi Ltd

Hitachi Car Engineering Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-07-03

Filing date

2003-07-02

Publication date

2007-12-20

2003-07-02 Application filed by Hitachi Ltd, Hitachi Car Engineering Co Ltd filed Critical Hitachi Ltd

2007-12-20 Publication of DE60317270D1 publication Critical patent/DE60317270D1/de

2008-08-28 Application granted granted Critical

2008-08-28 Publication of DE60317270T2 publication Critical patent/DE60317270T2/de

2023-07-03 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- H10W40/10—
- H10W76/138—
- H10W90/00—
- H10W72/075—
- H10W72/50—
- H10W72/5366—
- H10W72/951—
- H10W90/756—

DE60317270T 2002-07-03 2003-07-02 Halbleitermodul und Leistungswandler Expired - Lifetime DE60317270T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2002194077		2002-07-03
JP2002194077A JP3780230B2 (ja)	2002-07-03	2002-07-03	半導体モジュール及び電力変換装置

Publications (2)

Publication Number	Publication Date
DE60317270D1 true DE60317270D1 (de)	2007-12-20
DE60317270T2 DE60317270T2 (de)	2008-08-28

Family

ID=29720263

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60317270T Expired - Lifetime DE60317270T2 (de)	2002-07-03	2003-07-02	Halbleitermodul und Leistungswandler

Country Status (4)

Country	Link
US (1)	US6873045B2 (de)
EP (1)	EP1378941B1 (de)
JP (1)	JP3780230B2 (de)
DE (1)	DE60317270T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102004015654A1 (de) *	2003-04-02	2004-10-21	Luk Lamellen Und Kupplungsbau Beteiligungs Kg	Endstufe zum Ansteuern einer elektrischen Maschine
JP4363190B2 (ja) *	2004-01-08	2009-11-11	株式会社豊田自動織機	半導体装置及びその製造方法
DE102005007373B4 (de) *	2005-02-17	2013-05-29	Infineon Technologies Ag	Leistungshalbleiterbaugruppe
DE102005050534B4 (de) *	2005-10-21	2008-08-07	Semikron Elektronik Gmbh & Co. Kg	Leistungshalbleitermodul
JP4564937B2 (ja) *	2006-04-27	2010-10-20	日立オートモティブシステムズ株式会社	電気回路装置及び電気回路モジュール並びに電力変換装置
JP4694514B2 (ja) *	2007-02-08	2011-06-08	トヨタ自動車株式会社	半導体素子の冷却構造
CN102648519A (zh) *	2009-11-25	2012-08-22	丰田自动车株式会社	半导体装置的冷却构造
JP2012028400A (ja) *	2010-07-20	2012-02-09	Denso Corp	半導体装置
JP2012028401A (ja) *	2010-07-20	2012-02-09	Denso Corp	半導体装置
JP2012028398A (ja) *	2010-07-20	2012-02-09	Denso Corp	半導体装置
JP2012028399A (ja) *	2010-07-20	2012-02-09	Denso Corp	半導体装置
JP5414644B2 (ja)	2010-09-29	2014-02-12	三菱電機株式会社	半導体装置
CN103426874A (zh) *	2013-08-20	2013-12-04	绍兴旭昌科技企业有限公司	一种超薄高压瞬态电压抑制二极管及其应用
JP6363051B2 (ja) *	2015-09-04	2018-07-25	日立オートモティブシステムズ株式会社	半導体装置及びインバータ回路
DE112016006331B4 (de)	2016-01-29	2021-07-22	Mitsubishi Electric Corporation	Halbleitervorrichtung
KR102638979B1 (ko) *	2016-12-21	2024-02-22	현대자동차주식회사	전력 모듈, 그의 제조 방법 및 그를 가지는 차량
JP6870531B2 (ja) *	2017-08-21	2021-05-12	三菱電機株式会社	パワーモジュールおよび電力変換装置
WO2021080016A1 (ja) *	2019-10-25	2021-04-29	株式会社デンソー	半導体モジュールを含む電子装置
DE102020125371B4 (de) *	2020-09-29	2025-05-28	Infineon Technologies Ag	Package mit Pad, welches eine offene Aussparung hat
WO2024029336A1 (ja) *	2022-08-02	2024-02-08	ローム株式会社	半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2592308B2 (ja) *	1988-09-30	1997-03-19	株式会社日立製作所	半導体パッケージ及びそれを用いたコンピュータ
JPH0671062B2 (ja) *	1989-08-30	1994-09-07	株式会社東芝	樹脂封止型半導体装置
JP3879150B2 (ja)	1996-08-12	2007-02-07	株式会社デンソー	半導体装置
EP1014451A4 (de)	1997-03-26	2000-11-15	Hitachi Ltd	Flache halbleiteranordnung und stromrichter mit derselben
JPH11121666A (ja)	1997-10-20	1999-04-30	Fujitsu Ltd	マルチチップモジュールの冷却装置
US6396127B1 (en) *	1998-09-25	2002-05-28	International Rectifier Corporation	Semiconductor package
US6072240A (en) *	1998-10-16	2000-06-06	Denso Corporation	Semiconductor chip package
FR2786657B1 (fr)	1998-11-27	2001-06-01	Alstom Technology	Composant electronique de puissance comportant des moyens de refroidissement et procede de fabrication d'un tel composant
JP3871486B2 (ja) *	1999-02-17	2007-01-24	株式会社ルネサステクノロジ	半導体装置
DE19950026B4 (de)	1999-10-09	2010-11-11	Robert Bosch Gmbh	Leistungshalbleitermodul
US6521982B1 (en) *	2000-06-02	2003-02-18	Amkor Technology, Inc.	Packaging high power integrated circuit devices
JP2001244391A (ja)	1999-12-21	2001-09-07	Toyota Central Res & Dev Lab Inc	マルチチップモジュールの冷却構造
JP2001308265A (ja)	2000-04-21	2001-11-02	Toyota Industries Corp	半導体装置
US6528880B1 (en) *	2001-06-25	2003-03-04	Lovoltech Inc.	Semiconductor package for power JFET having copper plate for source and ribbon contact for gate

2002
- 2002-07-03 JP JP2002194077A patent/JP3780230B2/ja not_active Expired - Fee Related
2003
- 2003-07-02 US US10/610,822 patent/US6873045B2/en not_active Expired - Lifetime
- 2003-07-02 DE DE60317270T patent/DE60317270T2/de not_active Expired - Lifetime
- 2003-07-02 EP EP03254224A patent/EP1378941B1/de not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP1378941A3 (de)	2004-04-28
JP2004040899A (ja)	2004-02-05
US20040012064A1 (en)	2004-01-22
JP3780230B2 (ja)	2006-05-31
US6873045B2 (en)	2005-03-29
EP1378941A2 (de)	2004-01-07
DE60317270T2 (de)	2008-08-28
EP1378941B1 (de)	2007-11-07

Publication	Publication Date	Title
DE60317270D1 (de)	2007-12-20	Halbleitermodul und Leistungswandler
DE10362232B8 (de)	2011-11-10	Leistungshalbleitervorrichtung
DE10294771D2 (de)	2004-08-05	Leistungshalbleitermodul
DE202004021352U8 (de)	2008-02-21	Leistungshalbleitervorrichtungen
AU2003230699A8 (en)	2003-10-08	Power semiconductor device
DE60311032D1 (de)	2007-02-22	Wandlervorrichtung
DE602004027981D1 (de)	2010-08-19	Batteriemodul und Kombinationsbatterie
DE60015052D1 (de)	2004-11-25	Halbleiter Leistungsumwandlungsvorrichtung
DE60217818D1 (de)	2007-03-15	Halbleitervorrichtung und tragbare Endgerät
EP1401021A4 (de)	2008-03-26	Leistungshalbleiterbauelement
DE60044992D1 (de)	2010-11-04	Halbleiterbauelement und dieses verwendender Leistungswandler
DE59912676D1 (de)	2005-11-24	Leistungshalbleitermodul
DE60236898D1 (de)	2010-08-12	Stromversorgungseinrichtung und elektronisches Gerät
DE60229722D1 (de)	2008-12-18	Spannungsumsetzungsmodul
DE60309462D1 (de)	2006-12-14	Seriell-parallel und parallel-seriell umwandlungsvorrichtung
DE60304244D1 (de)	2006-05-18	Tropfenerzeuger und Chipverarbeitung
DE60306040D1 (de)	2006-07-27	Halbleitermodul und Leistungswandlervorrichtung
DE60239484D1 (de)	2011-04-28	Leistungsverstärker
DE60331887D1 (de)	2010-05-12	Halbleiterbauelement und Belastungsschaltkreis
DE50004627D1 (de)	2004-01-15	Leistungshalbleiter-Modul
AU2003304509A1 (en)	2005-05-05	Power semiconductor module, power converter employing it and mobile unit
DE502004012150D1 (de)	2011-03-10	Leistungshalbleitermodul
DE10293997D2 (de)	2004-07-22	Leistungshalbleitermodul
DE50205609D1 (de)	2006-04-06	Leistungsmodul
DE50013161D1 (de)	2006-08-24	Leistungshalbleitermodul

Legal Events

Date	Code	Title	Description
2008-11-27	8364	No opposition during term of opposition