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DE60304244D1 - Tropfenerzeuger und Chipverarbeitung - Google Patents

Tropfenerzeuger und Chipverarbeitung

Info

Publication number
DE60304244D1
DE60304244D1 DE60304244T DE60304244T DE60304244D1 DE 60304244 D1 DE60304244 D1 DE 60304244D1 DE 60304244 T DE60304244 T DE 60304244T DE 60304244 T DE60304244 T DE 60304244T DE 60304244 D1 DE60304244 D1 DE 60304244D1
Authority
DE
Germany
Prior art keywords
chip processing
drop generator
drop
generator
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60304244T
Other languages
English (en)
Other versions
DE60304244T2 (de
Inventor
Simon Dodd
Sean P Mcclelland
Vooren Colby Van
Terry E Mcmahon
Antonio Cruz-Uribe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Publication of DE60304244D1 publication Critical patent/DE60304244D1/de
Application granted granted Critical
Publication of DE60304244T2 publication Critical patent/DE60304244T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B41J2/14129—Layer structure
DE60304244T 2002-10-31 2003-05-06 Tropfenerzeuger und Chipverarbeitung Expired - Lifetime DE60304244T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/286,125 US6885083B2 (en) 2002-10-31 2002-10-31 Drop generator die processing
US286125 2002-10-31

Publications (2)

Publication Number Publication Date
DE60304244D1 true DE60304244D1 (de) 2006-05-18
DE60304244T2 DE60304244T2 (de) 2006-08-31

Family

ID=32093574

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60304244T Expired - Lifetime DE60304244T2 (de) 2002-10-31 2003-05-06 Tropfenerzeuger und Chipverarbeitung

Country Status (5)

Country Link
US (2) US6885083B2 (de)
EP (1) EP1415810B1 (de)
JP (1) JP4335641B2 (de)
DE (1) DE60304244T2 (de)
TW (1) TWI283040B (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6885083B2 (en) * 2002-10-31 2005-04-26 Hewlett-Packard Development Company, L.P. Drop generator die processing
US7150516B2 (en) * 2004-09-28 2006-12-19 Hewlett-Packard Development Company, L.P. Integrated circuit and method for manufacturing
JP2009071263A (ja) * 2007-08-20 2009-04-02 Casio Comput Co Ltd 半導体装置およびその製造方法
WO2009082391A1 (en) * 2007-12-20 2009-07-02 Hewlett-Packard Development Company, L.P. Droplet generator
CA2798123C (en) 2010-05-05 2020-06-23 The Governing Council Of The University Of Toronto Method of processing dried samples using digital microfluidic device
US9476811B2 (en) 2010-10-01 2016-10-25 The Governing Council Of The University Of Toronto Digital microfluidic devices and methods incorporating a solid phase
US9259932B2 (en) * 2011-05-27 2016-02-16 Hewlett-Packard Development Company, L.P. Assembly to selectively etch at inkjet printhead
CN107206793B (zh) * 2015-04-10 2018-12-04 惠普发展公司，有限责任合伙企业 在形成打印头时去除金属导体的倾斜段
CN108026494A (zh) 2015-06-05 2018-05-11 米罗库鲁斯公司 限制蒸发和表面结垢的空气基质数字微流控装置和方法
US10695762B2 (en) 2015-06-05 2020-06-30 Miroculus Inc. Evaporation management in digital microfluidic devices
CA3034064A1 (en) 2016-08-22 2018-03-01 Miroculus Inc. Feedback system for parallel droplet control in a digital microfluidic device
WO2018126082A1 (en) 2016-12-28 2018-07-05 Miroculis Inc. Digital microfluidic devices and methods
US11623219B2 (en) 2017-04-04 2023-04-11 Miroculus Inc. Digital microfluidics apparatuses and methods for manipulating and processing encapsulated droplets
CN110892258A (zh) 2017-07-24 2020-03-17 米罗库鲁斯公司 具有集成的血浆收集设备的数字微流控系统和方法
CN115582155B (zh) 2017-09-01 2025-08-26 因特格拉生物科学股份公司 数字微流控设备及其使用方法
CA3096855A1 (en) 2018-05-23 2019-11-28 Miroculus Inc. Control of evaporation in digital microfluidics
CA3126435A1 (en) 2019-01-31 2020-08-06 Miroculus Inc. Non fouling compositions and methods for manipulating and processing encapsulated droplets
US11738345B2 (en) 2019-04-08 2023-08-29 Miroculus Inc. Multi-cartridge digital microfluidics apparatuses and methods of use
EP3962793A4 (de) * 2019-04-29 2023-01-04 Hewlett-Packard Development Company, L.P. Korrosionstolerante mikroelektromechanische flüssigkeitsausstossvorrichtung
US11524298B2 (en) 2019-07-25 2022-12-13 Miroculus Inc. Digital microfluidics devices and methods of use thereof
US11857961B2 (en) 2022-01-12 2024-01-02 Miroculus Inc. Sequencing by synthesis using mechanical compression

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
US435898A (en) * 1890-09-02 johnson
US3575740A (en) 1967-06-08 1971-04-20 Ibm Method of fabricating planar dielectric isolated integrated circuits
JPS56108247A (en) 1980-01-31 1981-08-27 Sanyo Electric Co Ltd Semiconductor device
US4435898A (en) 1982-03-22 1984-03-13 International Business Machines Corporation Method for making a base etched transistor integrated circuit
US4719477A (en) 1986-01-17 1988-01-12 Hewlett-Packard Company Integrated thermal ink jet printhead and method of manufacture
US5363134A (en) 1992-05-20 1994-11-08 Hewlett-Packard Corporation Integrated circuit printhead for an ink jet printer including an integrated identification circuit
US5635966A (en) 1994-01-11 1997-06-03 Hewlett-Packard Company Edge feed ink delivery thermal inkjet printhead structure and method of fabrication
US5567643A (en) * 1994-05-31 1996-10-22 Taiwan Semiconductor Manufacturing Company Method of forming contamination guard ring for semiconductor integrated circuit applications
US5578517A (en) * 1994-10-24 1996-11-26 Taiwan Semiconductor Manufacturing Company Ltd. Method of forming a highly transparent silicon rich nitride protective layer for a fuse window
US5538924A (en) * 1995-09-05 1996-07-23 Vanguard International Semiconductor Co. Method of forming a moisture guard ring for integrated circuit applications
AUPN623895A0 (en) 1995-10-30 1995-11-23 Eastman Kodak Company A manufacturing process for lift print heads with nozzle rim heaters
US5790154A (en) 1995-12-08 1998-08-04 Hitachi Koki Co., Ltd. Method of manufacturing an ink ejection recording head and a recording apparatus using the recording head
US6336714B1 (en) 1996-02-07 2002-01-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having thin film layer shelf
US6543884B1 (en) 1996-02-07 2003-04-08 Hewlett-Packard Company Fully integrated thermal inkjet printhead having etched back PSG layer
US5943076A (en) 1997-02-24 1999-08-24 Xerox Corporation Printhead for thermal ink jet devices
ATE359915T1 (de) 1997-07-15 2007-05-15 Silverbrook Res Pty Ltd Thermisches betätigungselement mit gezahntem heizelement
KR100314133B1 (ko) * 1999-11-26 2001-11-15 윤종용 가장자리에 흡습방지막이 형성된 반도체 칩 및 이흡습방지막의 형성방법
US6433405B1 (en) 2000-03-02 2002-08-13 Hewlett-Packard Company Integrated circuit having provisions for remote storage of chip specific operating parameters
US6325483B1 (en) 2000-07-19 2001-12-04 Hewlett-Packard Company Techniques for increasing ink-jet pen identification information in an interconnect limited environment
US7160806B2 (en) * 2001-08-16 2007-01-09 Hewlett-Packard Development Company, L.P. Thermal inkjet printhead processing with silicon etching
US6885083B2 (en) * 2002-10-31 2005-04-26 Hewlett-Packard Development Company, L.P. Drop generator die processing

Also Published As

Publication number Publication date
TWI283040B (en) 2007-06-21
JP4335641B2 (ja) 2009-09-30
US20040087151A1 (en) 2004-05-06
EP1415810B1 (de) 2006-03-29
DE60304244T2 (de) 2006-08-31
US7713456B2 (en) 2010-05-11
US20050127029A1 (en) 2005-06-16
TW200406868A (en) 2004-05-01
US6885083B2 (en) 2005-04-26
EP1415810A1 (de) 2004-05-06
JP2004148834A (ja) 2004-05-27

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Legal Events

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