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DE60310206D1 - Hydrosilylationsaushärtung von kollodiale kieselsäure enthaltendem silikonharz und herstellungsverfahren dafür - Google Patents

Hydrosilylationsaushärtung von kollodiale kieselsäure enthaltendem silikonharz und herstellungsverfahren dafür

Info

Publication number
DE60310206D1
DE60310206D1 DE60310206T DE60310206T DE60310206D1 DE 60310206 D1 DE60310206 D1 DE 60310206D1 DE 60310206 T DE60310206 T DE 60310206T DE 60310206 T DE60310206 T DE 60310206T DE 60310206 D1 DE60310206 D1 DE 60310206D1
Authority
DE
Germany
Prior art keywords
hydrosilylation
resinant
cureing
manufacturing
silicone resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60310206T
Other languages
English (en)
Other versions
DE60310206T2 (de
Inventor
Zhongtao Li
J Mcgarry
E Katsoulis
R Keryk
F Bergstrom
S Kwan
Bizhong Zhu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Massachusetts Institute of Technology
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Massachusetts Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp, Massachusetts Institute of Technology filed Critical Dow Corning Corp
Application granted granted Critical
Publication of DE60310206D1 publication Critical patent/DE60310206D1/de
Publication of DE60310206T2 publication Critical patent/DE60310206T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
DE60310206T 2002-03-05 2003-02-20 Hydrosilylationsaushärtung von kollodiale kieselsäure enthaltendem silikonharz und herstellungsverfahren dafür Expired - Lifetime DE60310206T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US91685 2002-03-05
US10/091,685 US6646039B2 (en) 2002-03-05 2002-03-05 Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same
PCT/US2003/005355 WO2003076182A1 (en) 2002-03-05 2003-02-20 Hydrosilylation cure of silicone resin containing colloidal silica and a process for producing the same

Publications (2)

Publication Number Publication Date
DE60310206D1 true DE60310206D1 (de) 2007-01-18
DE60310206T2 DE60310206T2 (de) 2007-09-13

Family

ID=27804131

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60310206T Expired - Lifetime DE60310206T2 (de) 2002-03-05 2003-02-20 Hydrosilylationsaushärtung von kollodiale kieselsäure enthaltendem silikonharz und herstellungsverfahren dafür

Country Status (10)

Country Link
US (1) US6646039B2 (de)
EP (1) EP1483112B1 (de)
JP (1) JP4601962B2 (de)
KR (1) KR100991968B1 (de)
CN (1) CN100335265C (de)
AT (1) ATE347484T1 (de)
AU (1) AU2003230561A1 (de)
CA (1) CA2477945C (de)
DE (1) DE60310206T2 (de)
WO (1) WO2003076182A1 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
US6689859B2 (en) * 2002-03-05 2004-02-10 Dow Corning Corporation High fracture toughness hydrosilyation cured silicone resin
US6750273B2 (en) * 2002-10-02 2004-06-15 Dow Corning Corporation Filled silicone composition and cured silicone product
CA2543366A1 (en) * 2003-08-01 2005-02-24 Dow Corning Corporation Silicone based dielectric coatings and films for photovoltaic applications
JP2005089671A (ja) * 2003-09-19 2005-04-07 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物
ATE442417T1 (de) * 2004-11-19 2009-09-15 Dow Corning Silikonzusammensetzung und gehärtetes silikonharz
EP1819775B1 (de) * 2004-11-19 2008-09-24 Dow Corning Corporation Zusammensetzung aus organohydrogenpolysiloxanharz und silizium
US7691459B2 (en) * 2005-03-22 2010-04-06 Fujifilm Corporation Inorganic fine particle-containing composition, optical film, antireflection film and polarizing film, and polarizing plate and display device using the same
US20080221263A1 (en) * 2006-08-31 2008-09-11 Subbareddy Kanagasabapathy Coating compositions for producing transparent super-hydrophobic surfaces
US7919225B2 (en) * 2008-05-23 2011-04-05 International Business Machines Corporation Photopatternable dielectric materials for BEOL applications and methods for use
CN102272231B (zh) * 2008-11-19 2013-10-30 陶氏康宁公司 硅氧烷组合物和制备该硅氧烷组合物的方法
US20130026507A1 (en) * 2009-07-06 2013-01-31 Paragon Semiconductor Lighting Technology Co., Ltd. Multichip package structure and method of manufacturing the same
TWI464920B (zh) * 2012-01-19 2014-12-11 柏友照明科技股份有限公司 多晶片封裝結構及其製作方法
US9856400B2 (en) 2012-04-27 2018-01-02 Burning Bush Group, Llc High performance silicon based coating compositions
WO2013170124A1 (en) 2012-05-10 2013-11-14 Burning Bush Group High performance silicon based thermal coating compositions
CN107236453B (zh) 2012-07-03 2019-06-11 伯宁布什集团有限公司 硅基高性能涂料组合物
US9006355B1 (en) * 2013-10-04 2015-04-14 Burning Bush Group, Llc High performance silicon-based compositions
WO2015194159A1 (ja) * 2014-06-20 2015-12-23 東レ・ダウコーニング株式会社 オルガノポリシロキサンおよびその製造方法
WO2016152073A1 (en) * 2015-03-20 2016-09-29 Dow Corning Toray Co., Ltd. Organopolysiloxane, production method thereof, and curable silicone composition
JP6347237B2 (ja) * 2015-08-21 2018-06-27 信越化学工業株式会社 付加硬化型オルガノポリシロキサン組成物及び半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2656319B1 (fr) * 1989-12-27 1992-03-20 Rhone Poulenc Chimie Microspheres composites magnetisables a base d'un polymere organosilicie reticule, leur procede de preparation et leur application en biologie.
US5110845A (en) * 1990-12-03 1992-05-05 Dow Corning Corporation Extrudable curable organosiloxane compositions
JP3024439B2 (ja) * 1993-06-07 2000-03-21 信越化学工業株式会社 オルガノポリシロキサン組成物
US5623030A (en) * 1994-12-01 1997-04-22 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Curable composition and process for producing molded articles using the same
DE69728846T2 (de) * 1996-12-31 2005-04-21 Dow Corning Verfahren zur Herstellung von Gummi-modifizierte feste Silikon-Harze und daraus hergestellte Komposite
JP3635180B2 (ja) * 1997-02-24 2005-04-06 ダウ コーニング アジア株式会社 シリル化ポリメチルシルセスキオキサン、その製造方法、それを用いた組成物
US6252030B1 (en) * 1999-03-17 2001-06-26 Dow Corning Asia, Ltd. Hydrogenated octasilsesquioxane-vinyl group-containing copolymer and method for manufacture
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
JP2001089662A (ja) * 1999-09-22 2001-04-03 Kanegafuchi Chem Ind Co Ltd 硬化性組成物及びそれを用いた成形体の作製方法
US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product
US6689859B2 (en) * 2002-03-05 2004-02-10 Dow Corning Corporation High fracture toughness hydrosilyation cured silicone resin

Also Published As

Publication number Publication date
DE60310206T2 (de) 2007-09-13
WO2003076182A1 (en) 2003-09-18
US6646039B2 (en) 2003-11-11
AU2003230561A1 (en) 2003-09-22
EP1483112B1 (de) 2006-12-06
CN100335265C (zh) 2007-09-05
KR100991968B1 (ko) 2010-11-04
CA2477945C (en) 2012-01-03
JP4601962B2 (ja) 2010-12-22
EP1483112A4 (de) 2005-03-23
CN1642732A (zh) 2005-07-20
JP2005519171A (ja) 2005-06-30
CA2477945A1 (en) 2003-09-18
EP1483112A1 (de) 2004-12-08
KR20050014794A (ko) 2005-02-07
ATE347484T1 (de) 2006-12-15
US20030171476A1 (en) 2003-09-11

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