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DE60233444D1 - Teileanbringvorrichtung und teileanbringverfahren - Google Patents

Teileanbringvorrichtung und teileanbringverfahren

Info

Publication number
DE60233444D1
DE60233444D1 DE60233444T DE60233444T DE60233444D1 DE 60233444 D1 DE60233444 D1 DE 60233444D1 DE 60233444 T DE60233444 T DE 60233444T DE 60233444 T DE60233444 T DE 60233444T DE 60233444 D1 DE60233444 D1 DE 60233444D1
Authority
DE
Germany
Prior art keywords
attaching method
parts attachment
attachment
parts
attaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60233444T
Other languages
English (en)
Inventor
Kazunobu Sakai
Makoto Nakashima
Wataru Hirai
Yasuyuki Ishitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Application granted granted Critical
Publication of DE60233444D1 publication Critical patent/DE60233444D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE60233444T 2001-06-08 2002-09-20 Teileanbringvorrichtung und teileanbringverfahren Expired - Lifetime DE60233444D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001174187A JP2002368495A (ja) 2001-06-08 2001-06-08 部品実装装置及び部品実装方法
PCT/JP2002/009660 WO2004028228A1 (ja) 2001-06-08 2002-09-20 部品実装装置及び部品実装方法

Publications (1)

Publication Number Publication Date
DE60233444D1 true DE60233444D1 (de) 2009-10-01

Family

ID=32715267

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60233444T Expired - Lifetime DE60233444D1 (de) 2001-06-08 2002-09-20 Teileanbringvorrichtung und teileanbringverfahren

Country Status (6)

Country Link
US (1) US7185422B2 (de)
EP (1) EP1545181B1 (de)
JP (1) JP2002368495A (de)
CN (1) CN1278594C (de)
DE (1) DE60233444D1 (de)
WO (1) WO2004028228A1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368495A (ja) 2001-06-08 2002-12-20 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
WO2007001062A1 (en) * 2005-06-27 2007-01-04 Matsushita Electric Industrial Co., Ltd. Mounting condition determination method
JP4733499B2 (ja) * 2005-10-31 2011-07-27 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
KR101228315B1 (ko) * 2005-11-10 2013-01-31 삼성테크윈 주식회사 부품 실장기용 헤드 어셈블리
JP4237766B2 (ja) * 2006-02-10 2009-03-11 パナソニック株式会社 部品実装機制御方法、部品実装機およびプログラム
US8151449B2 (en) * 2007-01-05 2012-04-10 Universal Instruments Corporation Component placement machine
DE112009000375T5 (de) * 2008-02-21 2011-05-19 Panasonic Corporation, Kadoma-shi Verfahren zum Bestimmen der Montagebedingungen
JP4582181B2 (ja) * 2008-04-08 2010-11-17 ソニー株式会社 部品実装装置、実装品の製造方法
JP5131069B2 (ja) * 2008-07-17 2013-01-30 ソニー株式会社 ノズルユニット及び部品実装装置
US20100122456A1 (en) * 2008-11-17 2010-05-20 Chen-Hua Yu Integrated Alignment and Bonding System
JP5562659B2 (ja) * 2010-01-21 2014-07-30 オリンパス株式会社 実装装置および実装方法
JP2012019112A (ja) * 2010-07-08 2012-01-26 Sony Corp 部品実装装置、部品実装方法および基板製造方法
CN101907772B (zh) * 2010-07-12 2011-12-28 南京理工大学 红外与微光多光谱融合前端光机结构
JP5434884B2 (ja) * 2010-10-27 2014-03-05 パナソニック株式会社 電子部品実装装置および電子部品実装方法
JP5440486B2 (ja) * 2010-12-17 2014-03-12 パナソニック株式会社 部品実装装置および部品実装装置における機種切替え方法
US8590143B2 (en) * 2011-05-25 2013-11-26 Asm Technology Singapore Pte. Ltd. Apparatus for delivering semiconductor components to a substrate
JP5795882B2 (ja) * 2011-06-03 2015-10-14 ヤマハ発動機株式会社 演算装置、部品実装装置、及びプログラム
CN102556410A (zh) * 2012-01-17 2012-07-11 邹建炀 新型旋转90度等分料装置
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
JP5758976B2 (ja) * 2013-12-20 2015-08-05 ファナック株式会社 数値制御装置付き工作機械
US10555448B2 (en) * 2014-02-25 2020-02-04 Fuji Corporation Component mounting device
JP5972941B2 (ja) * 2014-08-06 2016-08-17 ファナック株式会社 数値制御装置付き工作機械
US11140801B2 (en) * 2014-11-11 2021-10-05 Fuji Corporation Data input and control devices of an electronic component mounting machine
US10712729B2 (en) * 2015-04-09 2020-07-14 Panasonic Intellectual Property Management Co., Ltd. Setting support system for setting operational parameter
JP6831401B2 (ja) * 2017-01-25 2021-02-17 株式会社Ｆｕｊｉ 制御装置、実装装置及び制御方法
JP7212055B2 (ja) * 2018-10-11 2023-01-24 株式会社Fuji 作業機
CN114473433B (zh) * 2022-04-15 2022-07-08 杭州泰尚智能装备有限公司 一种xy筋微型密封圈寻角装配装置以及装配方法
CN115847073B (zh) * 2023-02-28 2023-05-09 广州市德鑫运动用品有限公司 一种多自由度镜片加工安装系统

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62114289A (ja) * 1985-11-14 1987-05-26 松下電器産業株式会社 電子部品の装着方法および装置
JPS63232496A (ja) * 1987-03-20 1988-09-28 松下電器産業株式会社 電子部品装着装置
JP2604167B2 (ja) 1987-08-18 1997-04-30 三洋電機株式会社 部品実装方法及び部品実装装置
US4914808A (en) * 1987-10-16 1990-04-10 Sanyo Electric Co., Ltd Automatic electronic parts mounting apparatus for repeatedly mounting in forward and reverse sequences
JP2568623B2 (ja) * 1988-04-12 1997-01-08 松下電器産業株式会社 電子部品の実装方法
JP3003300B2 (ja) * 1991-08-06 2000-01-24 日本電気株式会社 半導体パッケージの搬送方法及び回転防止機能付半導体パッケージ
JPH06338700A (ja) * 1993-05-31 1994-12-06 Sony Corp 実装装置
JP3433218B2 (ja) * 1995-01-17 2003-08-04 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
US5926950A (en) * 1995-12-28 1999-07-27 Fuji Machine Mfg. Co., Ltd. Electronic component transferring device and method, and electronic component mounting system and method
US6088911A (en) * 1995-12-28 2000-07-18 Fuji Machine Mfg. Co., Ltd. Electronic component transferring apparatus
JPH10224092A (ja) * 1997-02-12 1998-08-21 Matsushita Electric Ind Co Ltd 電子部品装着方法及びその装置
JP3473730B2 (ja) * 1997-03-10 2003-12-08 松下電器産業株式会社 電子部品実装装置
JP3459182B2 (ja) 1998-09-03 2003-10-20 松下電器産業株式会社 部品装着装置および部品装着方法
JP4408515B2 (ja) * 2000-02-09 2010-02-03 パナソニック株式会社 電子部品実装装置のキャリブレーション方法及びキャリブレーション装置
US6718626B2 (en) * 2000-09-13 2004-04-13 Fuji Machine Mfg. Co., Ltd. Apparatus for detecting positioning error of a component with respect to a suction nozzle
US6739036B2 (en) * 2000-09-13 2004-05-25 Fuji Machine Mfg., Co., Ltd. Electric-component mounting system
JP2002204096A (ja) * 2000-12-28 2002-07-19 Fuji Mach Mfg Co Ltd 電気部品装着システムおよび電気部品装着方法
JP2002368495A (ja) 2001-06-08 2002-12-20 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法

Also Published As

Publication number Publication date
WO2004028228A1 (ja) 2004-04-01
US20050060883A1 (en) 2005-03-24
US7185422B2 (en) 2007-03-06
EP1545181A1 (de) 2005-06-22
EP1545181A4 (de) 2006-04-05
JP2002368495A (ja) 2002-12-20
CN1278594C (zh) 2006-10-04
EP1545181B1 (de) 2009-08-19
CN1613284A (zh) 2005-05-04

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Legal Events

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8364 No opposition during term of opposition