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WO2012042667A9 - 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 - Google Patents

部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 Download PDF

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Publication number
WO2012042667A9
WO2012042667A9 PCT/JP2010/067259 JP2010067259W WO2012042667A9 WO 2012042667 A9 WO2012042667 A9 WO 2012042667A9 JP 2010067259 W JP2010067259 W JP 2010067259W WO 2012042667 A9 WO2012042667 A9 WO 2012042667A9
Authority
WO
WIPO (PCT)
Prior art keywords
component
built
conductive layer
substrate
dummy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2010/067259
Other languages
English (en)
French (fr)
Other versions
WO2012042667A1 (ja
Inventor
今村圭男
松本徹
清水良一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiko Electronics Co Ltd
Original Assignee
Meiko Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiko Electronics Co Ltd filed Critical Meiko Electronics Co Ltd
Priority to JP2012536127A priority Critical patent/JP5525618B2/ja
Priority to PCT/JP2010/067259 priority patent/WO2012042667A1/ja
Priority to CN201080069364.5A priority patent/CN103125151B/zh
Priority to EP10857880.8A priority patent/EP2624672A4/en
Priority to US13/824,437 priority patent/US9320185B2/en
Priority to KR1020137007858A priority patent/KR20130115230A/ko
Priority to TW100129325A priority patent/TWI474768B/zh
Publication of WO2012042667A1 publication Critical patent/WO2012042667A1/ja
Anticipated expiration legal-status Critical
Publication of WO2012042667A9 publication Critical patent/WO2012042667A9/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H10P72/74—
    • H10W46/00—
    • H10W74/019—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H10P72/743—
    • H10W46/101—
    • H10W46/301—
    • H10W46/607—
    • H10W72/07307—
    • H10W72/07323—
    • H10W72/387—
    • H10W72/9413—
    • H10W90/736—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

導体パターン（１８）となるべき薄膜の導電層を準備し、前記導電層上に複数の実接続位置及び少なくとも１個のダミー接続位置を除き、前記導電層上にマスク層（３）を形成し、前記導電層から露出した前記実接続位置及び前記ダミー接続位置に半田を用いて実半田パッド（６）及びダミー半田パッド（７）をそれぞれ形成し、前記実半田パッド（６）に電気又は電子的な部品（８）の接続端子（９）を接続し、前記導電層に直接又は前記マスク層（３）を介して積層され、且つ、前記部品（８）を埋設させた樹脂製の絶縁基材（１６）を形成し、前記ダミー半田バッド（７）を基準として前記導電層の一部を除去し、前記導体パターン（１８）を形成する。
PCT/JP2010/067259 2010-10-01 2010-10-01 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板 Ceased WO2012042667A1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2012536127A JP5525618B2 (ja) 2010-10-01 2010-10-01 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板
PCT/JP2010/067259 WO2012042667A1 (ja) 2010-10-01 2010-10-01 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板
CN201080069364.5A CN103125151B (zh) 2010-10-01 2010-10-01 元器件内置基板的制造方法及使用该方法的元器件内置基板
EP10857880.8A EP2624672A4 (en) 2010-10-01 2010-10-01 METHOD FOR PRODUCING A SUBSTRATE WITH INTEGRATED COMPONENT AND SUBSTRATE PRODUCED BY THIS PROCESS WITH INTEGRATED COMPONENT
US13/824,437 US9320185B2 (en) 2010-10-01 2010-10-01 Method of manufacturing a component-embedded substrate
KR1020137007858A KR20130115230A (ko) 2010-10-01 2010-10-01 부품 내장 기판의 제조 방법 및 이것을 이용한 부품 내장 기판
TW100129325A TWI474768B (zh) 2010-10-01 2011-08-17 A method of manufacturing a substrate having a built-in member, and a substrate for a built-in member manufactured by the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/067259 WO2012042667A1 (ja) 2010-10-01 2010-10-01 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板

Publications (2)

Publication Number Publication Date
WO2012042667A1 WO2012042667A1 (ja) 2012-04-05
WO2012042667A9 true WO2012042667A9 (ja) 2013-08-22

Family

ID=45892171

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/067259 Ceased WO2012042667A1 (ja) 2010-10-01 2010-10-01 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板

Country Status (7)

Country Link
US (1) US9320185B2 (ja)
EP (1) EP2624672A4 (ja)
JP (1) JP5525618B2 (ja)
KR (1) KR20130115230A (ja)
CN (1) CN103125151B (ja)
TW (1) TWI474768B (ja)
WO (1) WO2012042667A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2897447A4 (en) * 2012-09-11 2016-05-25 Meiko Electronics Co Ltd METHOD FOR PRODUCING A SUBSTRATE WITH AN EMBEDDED COMPONENT AND SUBSTRATE PRODUCED IN THIS METHOD WITH AN EMBEDDED COMPONENT
JP6033878B2 (ja) 2012-09-26 2016-11-30 株式会社メイコー 部品内蔵基板の製造方法
CN104938040B (zh) * 2013-01-18 2017-10-24 名幸电子有限公司 内置有零件的基板及其制造方法
CN104982097A (zh) * 2013-02-12 2015-10-14 名幸电子有限公司 内置有零件的基板及其制造方法
JP6308007B2 (ja) * 2013-07-16 2018-04-11 ソニー株式会社 配線基板および配線基板の製造方法
KR102194718B1 (ko) * 2014-10-13 2020-12-23 삼성전기주식회사 임베디드 기판 및 임베디드 기판의 제조 방법
CN106304611A (zh) * 2015-06-10 2017-01-04 宏启胜精密电子(秦皇岛)有限公司 电路板及其制造方法、应用该电路板的电子装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2660077B2 (ja) 1988-03-16 1997-10-08 ジーイーシー ― マルコニ リミテッド フリップチップ接着された装置用の副尺構造
US5186383A (en) * 1991-10-02 1993-02-16 Motorola, Inc. Method for forming solder bump interconnections to a solder-plated circuit trace
JPH08242276A (ja) * 1995-03-06 1996-09-17 Hitachi Telecom Technol Ltd 電話機用プリント回路板とその製造方法
JPH10163365A (ja) * 1996-11-28 1998-06-19 Toshiba Corp 半導体パッケージおよび実装回路装置
JP3645136B2 (ja) * 1999-06-22 2005-05-11 三菱電機株式会社 電子回路パッケージ及び実装ボード
JP2003017819A (ja) * 2001-06-29 2003-01-17 Fujitsu Ltd プリント配線板及びその識別方法
FI119583B (fi) * 2003-02-26 2008-12-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
US7178229B2 (en) 2003-11-20 2007-02-20 E. I. Du Pont De Nemours And Company Method of making interlayer panels
JP2006261463A (ja) * 2005-03-17 2006-09-28 Seiko Epson Corp 電子部品の実装構造、該実装構造を備えた記録装置、電子機器、並びに電子部品の実装方法
JP2007027510A (ja) 2005-07-19 2007-02-01 Fujikura Ltd 実装基板及び電子部品の実装方法
JP2008300690A (ja) * 2007-05-31 2008-12-11 Icom Inc 表面部品実装方法および表面部品実装用基板
US8024858B2 (en) 2008-02-14 2011-09-27 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
WO2009147936A1 (ja) * 2008-06-02 2009-12-10 イビデン株式会社 多層プリント配線板の製造方法
JP4874305B2 (ja) 2008-07-22 2012-02-15 株式会社メイコー 電気・電子部品内蔵回路基板とその製造方法

Also Published As

Publication number Publication date
CN103125151B (zh) 2016-09-07
US20130242516A1 (en) 2013-09-19
US9320185B2 (en) 2016-04-19
EP2624672A1 (en) 2013-08-07
TW201218897A (en) 2012-05-01
EP2624672A4 (en) 2014-11-26
CN103125151A (zh) 2013-05-29
JPWO2012042667A1 (ja) 2014-02-03
TWI474768B (zh) 2015-02-21
WO2012042667A1 (ja) 2012-04-05
KR20130115230A (ko) 2013-10-21
JP5525618B2 (ja) 2014-06-18

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