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DE602006006262D1 - Klebstoffzusammensetzung und Schicht mit einer Haftschicht von der Zusammensetzung. - Google Patents

Klebstoffzusammensetzung und Schicht mit einer Haftschicht von der Zusammensetzung.

Info

Publication number
DE602006006262D1
DE602006006262D1 DE200660006262 DE602006006262T DE602006006262D1 DE 602006006262 D1 DE602006006262 D1 DE 602006006262D1 DE 200660006262 DE200660006262 DE 200660006262 DE 602006006262 T DE602006006262 T DE 602006006262T DE 602006006262 D1 DE602006006262 D1 DE 602006006262D1
Authority
DE
Germany
Prior art keywords
composition
layer
adhesive
adhesive layer
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
DE200660006262
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English (en)
Inventor
Shouhei Kozakai
Nobuhiro Ichiroku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE602006006262D1 publication Critical patent/DE602006006262D1/de
Active legal-status Critical Current
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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10Block or graft copolymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • H10P72/7402
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/20Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00Presence of polyamine or polyimide
    • C09J2479/08Presence of polyamine or polyimide polyimide
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00Presence of polysiloxane
    • H10P72/7416
    • H10W72/01331
    • H10W72/073
    • H10W72/07337
    • H10W72/30
    • H10W72/325
    • H10W72/352
    • H10W72/354
    • H10W74/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31721Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
DE200660006262 2005-10-20 2006-10-20 Klebstoffzusammensetzung und Schicht mit einer Haftschicht von der Zusammensetzung. Active DE602006006262D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005306238 2005-10-20
JP2006282285A JP5046366B2 (ja) 2005-10-20 2006-10-17 接着剤組成物及び該接着剤からなる接着層を備えたシート

Publications (1)

Publication Number Publication Date
DE602006006262D1 true DE602006006262D1 (de) 2009-05-28

Family

ID=37546748

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200660006262 Active DE602006006262D1 (de) 2005-10-20 2006-10-20 Klebstoffzusammensetzung und Schicht mit einer Haftschicht von der Zusammensetzung.

Country Status (4)

Country Link
US (1) US7488539B2 (de)
EP (1) EP1777278B1 (de)
JP (1) JP5046366B2 (de)
DE (1) DE602006006262D1 (de)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4107417B2 (ja) 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
JP4283596B2 (ja) * 2003-05-29 2009-06-24 日東電工株式会社 チップ状ワークの固定方法
JP4443962B2 (ja) * 2004-03-17 2010-03-31 日東電工株式会社 ダイシング・ダイボンドフィルム
DE102005006282A1 (de) * 2005-02-10 2006-08-24 Henkel Kgaa Strahlungsvernetzbare Schmelzhaftklebstoffe
CN101506948B (zh) * 2006-09-12 2012-12-12 日东电工株式会社 切割/芯片焊接膜
JP5266696B2 (ja) * 2007-09-19 2013-08-21 東レ株式会社 電子機器用接着剤組成物およびそれを用いた電子機器用接着剤シート
JP5710099B2 (ja) * 2007-10-12 2015-04-30 日立化成株式会社 半導体封止用フィルム状接着剤及びその接着剤を用いた半導体装置の製造方法並びに半導体装置
JP2009114295A (ja) * 2007-11-05 2009-05-28 Shin Etsu Chem Co Ltd 接着剤組成物
JP5345313B2 (ja) * 2007-12-19 2013-11-20 新日鉄住金化学株式会社 フィルム状接着剤、それを用いた半導体パッケージ、及びその製造方法
JP2009260232A (ja) * 2008-03-26 2009-11-05 Hitachi Chem Co Ltd 半導体封止用フィルム状接着剤、半導体装置及びその製造方法
JP5303326B2 (ja) * 2008-06-18 2013-10-02 積水化学工業株式会社 接着フィルム、ダイシング−ダイボンディングテープ及び半導体装置の製造方法
FR2935537B1 (fr) * 2008-08-28 2010-10-22 Soitec Silicon On Insulator Procede d'initiation d'adhesion moleculaire
DE102008041657A1 (de) * 2008-08-28 2010-03-04 Robert Bosch Gmbh Verfahren zum Verkleben von Bauteilen unter Ausbildung einer temperaturbeständigen Klebstoffschicht
JP5375513B2 (ja) 2008-10-31 2013-12-25 信越化学工業株式会社 シリコーンエラストマー球状微粒子をポリオルガノシルセスキオキサンで被覆したシリコーン微粒子およびその製造方法
JP5434467B2 (ja) * 2008-10-31 2014-03-05 信越化学工業株式会社 シリコーンエラストマー球状微粒子をポリオルガノシルセスキオキサンで被覆したシリコーン微粒子およびその製造方法
JP4897778B2 (ja) * 2008-11-20 2012-03-14 ソニーケミカル&インフォメーションデバイス株式会社 接続フィルム、並びに、接合体及びその製造方法
FR2943177B1 (fr) 2009-03-12 2011-05-06 Soitec Silicon On Insulator Procede de fabrication d'une structure multicouche avec report de couche circuit
JP5421626B2 (ja) * 2009-03-19 2014-02-19 積水化学工業株式会社 接着シート及びダイシング−ダイボンディングテープ
JP5272866B2 (ja) * 2009-04-15 2013-08-28 信越化学工業株式会社 熱圧着用シリコーンゴムシート
JP2010275509A (ja) * 2009-06-01 2010-12-09 Furukawa Electric Co Ltd:The 粘着フィルム及び半導体ウエハ加工用テープ
CN101924055A (zh) * 2009-06-15 2010-12-22 日东电工株式会社 半导体背面用切割带集成膜
FR2947380B1 (fr) 2009-06-26 2012-12-14 Soitec Silicon Insulator Technologies Procede de collage par adhesion moleculaire.
CN102471461A (zh) * 2009-07-10 2012-05-23 东丽株式会社 粘合剂组合物、粘合片材、使用它们的电路基板及半导体器件以及它们的制造方法
JP5532845B2 (ja) * 2009-11-18 2014-06-25 信越化学工業株式会社 化粧料
JP5581662B2 (ja) * 2009-11-18 2014-09-03 信越化学工業株式会社 化粧料
JP5439264B2 (ja) 2010-04-19 2014-03-12 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5681374B2 (ja) * 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5562134B2 (ja) * 2010-06-17 2014-07-30 キヤノン株式会社 放射線検出装置、その製造方法及び放射線撮像システム
US9457572B2 (en) 2010-11-08 2016-10-04 Konica Minolta, Inc. Inkjet head and method for producing inkjet head
JP5385247B2 (ja) * 2010-12-03 2014-01-08 信越化学工業株式会社 ウエハモールド材及び半導体装置の製造方法
JP5846060B2 (ja) * 2011-07-27 2016-01-20 信越化学工業株式会社 ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
JP6084854B2 (ja) * 2012-02-23 2017-02-22 積水化学工業株式会社 多層プリント配線板用エポキシ樹脂材料及び多層プリント配線板
US8999817B2 (en) * 2012-02-28 2015-04-07 Shin-Etsu Chemical Co., Ltd. Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer
JP5767159B2 (ja) * 2012-04-27 2015-08-19 信越化学工業株式会社 ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
JP5687230B2 (ja) * 2012-02-28 2015-03-18 信越化学工業株式会社 ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
TWI524998B (zh) * 2013-09-25 2016-03-11 友達光電股份有限公司 基板之黏結及分離的方法
JP6184291B2 (ja) * 2013-10-22 2017-08-23 キヤノン株式会社 シリコン基板の加工方法
JP6528404B2 (ja) * 2013-11-27 2019-06-12 東レ株式会社 半導体用樹脂組成物および半導体用樹脂フィルムならびにこれらを用いた半導体装置
EP3080219A1 (de) 2013-12-09 2016-10-19 3M Innovative Properties Company Härtbare silsesquioxanpolymere, zusammensetzungen, artikel und verfahren
JPWO2015178369A1 (ja) * 2014-05-23 2017-04-20 日立化成株式会社 ダイボンドダイシングシート
WO2015195355A1 (en) 2014-06-20 2015-12-23 3M Innovative Properties Company Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods
US10370564B2 (en) 2014-06-20 2019-08-06 3M Innovative Properties Company Adhesive compositions comprising a silsesquioxane polymer crosslinker, articles and methods
US9957416B2 (en) 2014-09-22 2018-05-01 3M Innovative Properties Company Curable end-capped silsesquioxane polymer comprising reactive groups
WO2016048736A1 (en) 2014-09-22 2016-03-31 3M Innovative Properties Company Curable polymers comprising silsesquioxane polymer core silsesquioxane polymer outer layer, and reactive groups
KR102699455B1 (ko) 2015-09-30 2024-08-26 셀라니즈 세일즈 저머니 게엠베하 저마찰성의 스퀵 프리 어셈블리
JP6695757B2 (ja) * 2016-08-09 2020-05-20 京セラ株式会社 接着シート
EP3613817A4 (de) * 2017-04-20 2021-01-20 Dow Toray Co., Ltd. Verfahren zur herstellung eines silikonbasierten haftelements
JP7509502B2 (ja) * 2017-11-28 2024-07-02 住友電工プリントサーキット株式会社 フレキシブルプリント配線板の製造方法及びフレキシブルプリント配線板
CN108467568B (zh) * 2018-02-27 2021-03-23 榛硕(武汉)智能科技有限公司 一种有机硅环氧树脂复合材料及其制备方法
CN110157374A (zh) * 2018-03-26 2019-08-23 昆山普瑞凯纳米技术有限公司 一种有机硅压敏胶及其制备方法
TWI675899B (zh) * 2018-04-25 2019-11-01 達興材料股份有限公司 暫時黏著被加工物之方法及黏著劑
JP7020341B2 (ja) * 2018-08-10 2022-02-16 信越化学工業株式会社 半導体封止用熱硬化性樹脂組成物及び半導体装置
JP7135970B2 (ja) * 2019-03-27 2022-09-13 味の素株式会社 樹脂組成物
JP7465284B2 (ja) 2019-04-25 2024-04-10 サムスン エスディアイ カンパニー,リミテッド シリコン系粘着性保護フィルム及びそれを含む光学部材
KR20220008987A (ko) 2020-07-14 2022-01-24 삼성전자주식회사 가공 테이프 및 이를 사용한 반도체 장치 제조 방법
US20230348767A1 (en) * 2020-09-23 2023-11-02 Sekisui Chemical Co., Ltd. Provisional fixation material and method for producing electronic component
JPWO2022138341A1 (de) 2020-12-25 2022-06-30

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01299884A (ja) * 1988-05-28 1989-12-04 Tomoegawa Paper Co Ltd ダイボンディング接着テープ
JPH03189127A (ja) 1989-12-19 1991-08-19 Tokico Ltd 接着式組立体
JPH0726758B2 (ja) 1990-10-12 1995-03-29 キッコーマン株式会社 間接加熱装置
JPH04264003A (ja) 1991-02-18 1992-09-18 Maruzen Petrochem Co Ltd 含窒素置換基を有するポリ−p−ヒドロキシスチレン誘導体系抗菌・抗かび剤
JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
JPH073159A (ja) * 1993-06-15 1995-01-06 Shin Etsu Chem Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP2832143B2 (ja) * 1993-12-28 1998-12-02 信越化学工業株式会社 シリコーン微粒子およびその製造方法
JPH07224259A (ja) 1994-02-08 1995-08-22 Ube Ind Ltd Tab用キャリアテープ
JP2984549B2 (ja) 1994-07-12 1999-11-29 リンテック株式会社 エネルギー線硬化型感圧粘着剤組成物およびその利用方法
JPH0827427A (ja) 1994-07-13 1996-01-30 Sumitomo Bakelite Co Ltd 耐熱性フィルム接着剤及びその製造方法
JPH0967558A (ja) 1995-08-31 1997-03-11 Lintec Corp ウェハダイシング・接着用シート
JP2873815B2 (ja) 1997-05-30 1999-03-24 株式会社巴川製紙所 シロキサン変性ポリアミドイミド樹脂組成物
US6214152B1 (en) * 1999-03-22 2001-04-10 Rjr Polymers, Inc. Lead frame moisture barrier for molded plastic electronic packages
TWI269800B (en) * 1999-06-17 2007-01-01 Arakawa Chem Ind Epoxy resin composition
JP2001031943A (ja) * 1999-07-26 2001-02-06 Tomoegawa Paper Co Ltd 半導体用接着剤及び半導体用接着テープ
US6645632B2 (en) * 2000-03-15 2003-11-11 Shin-Etsu Chemical Co., Ltd. Film-type adhesive for electronic components, and electronic components bonded therewith
JP4537555B2 (ja) * 2000-09-11 2010-09-01 新日鐵化学株式会社 半導体パッケージの製造方法及び半導体パッケージ
JP4876317B2 (ja) * 2001-02-23 2012-02-15 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置
JP2002256236A (ja) 2001-03-01 2002-09-11 Hitachi Chem Co Ltd 接着シート、半導体装置の製造方法および半導体装置
JP3544362B2 (ja) * 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP3954330B2 (ja) * 2001-06-18 2007-08-08 信越化学工業株式会社 液状樹脂組成物及びこれを硬化してなる半導体装置保護用材料
JP4019254B2 (ja) 2002-04-24 2007-12-12 信越化学工業株式会社 導電性樹脂組成物
US6881786B2 (en) 2002-05-20 2005-04-19 Ppg Industries Ohio, Inc. One-component, waterborne film-forming composition
JP3901615B2 (ja) * 2002-08-21 2007-04-04 信越化学工業株式会社 シリコーン接着剤及び接着フイルム
JP4344912B2 (ja) * 2002-10-04 2009-10-14 信越化学工業株式会社 シリコーン接着剤及びシリコーン接着フイルム
JP4219660B2 (ja) * 2002-11-18 2009-02-04 信越化学工業株式会社 ウエハダイシング・ダイボンドシート
JP4171898B2 (ja) * 2003-04-25 2008-10-29 信越化学工業株式会社 ダイシング・ダイボンド用接着テープ
JP4235808B2 (ja) * 2003-09-19 2009-03-11 信越化学工業株式会社 接着剤組成物及び接着フィルム
JP4530125B2 (ja) * 2003-10-17 2010-08-25 信越化学工業株式会社 接着剤組成物及び接着フイルム並びにダイシング・ダイボンド用接着テープ
TWI460249B (zh) * 2006-02-16 2014-11-11 Shinetsu Chemical Co 黏合組成物、黏合膜及製造半導體元件的方法

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