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DE602005027028D1 - Herstellungsverfahren für eine Dünnfilmtransistormatrix - Google Patents

Herstellungsverfahren für eine Dünnfilmtransistormatrix

Info

Publication number
DE602005027028D1
DE602005027028D1 DE602005027028T DE602005027028T DE602005027028D1 DE 602005027028 D1 DE602005027028 D1 DE 602005027028D1 DE 602005027028 T DE602005027028 T DE 602005027028T DE 602005027028 T DE602005027028 T DE 602005027028T DE 602005027028 D1 DE602005027028 D1 DE 602005027028D1
Authority
DE
Germany
Prior art keywords
thin film
manufacturing process
film transistor
transistor matrix
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602005027028T
Other languages
English (en)
Inventor
Woo-Geun Lee
Hye-Young Ryu
Sang-Gab Kim
Jang-Soo Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE602005027028D1 publication Critical patent/DE602005027028D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0231Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H10P50/667
    • H10W20/031

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
DE602005027028T 2004-10-06 2005-09-23 Herstellungsverfahren für eine Dünnfilmtransistormatrix Expired - Lifetime DE602005027028D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040079521A KR101090249B1 (ko) 2004-10-06 2004-10-06 박막 트랜지스터 표시판의 제조 방법

Publications (1)

Publication Number Publication Date
DE602005027028D1 true DE602005027028D1 (de) 2011-05-05

Family

ID=36126084

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005027028T Expired - Lifetime DE602005027028D1 (de) 2004-10-06 2005-09-23 Herstellungsverfahren für eine Dünnfilmtransistormatrix

Country Status (7)

Country Link
US (2) US7425476B2 (de)
EP (1) EP1646076B1 (de)
JP (1) JP2006108612A (de)
KR (1) KR101090249B1 (de)
CN (1) CN1767175B (de)
DE (1) DE602005027028D1 (de)
TW (1) TWI395001B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070009321A (ko) * 2005-07-15 2007-01-18 삼성전자주식회사 박막 트랜지스터 기판 및 이의 제조 방법
KR101232061B1 (ko) * 2006-04-24 2013-02-12 삼성디스플레이 주식회사 금속 배선의 제조 방법 및 표시 기판의 제조 방법
KR20080034598A (ko) * 2006-10-17 2008-04-22 삼성전자주식회사 박막 트랜지스터 표시판의 제조 방법
US8786793B2 (en) * 2007-07-27 2014-07-22 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
TWI374510B (en) 2008-04-18 2012-10-11 Au Optronics Corp Gate driver on array of a display and method of making device of a display
CN101266951B (zh) * 2008-05-05 2012-02-01 友达光电股份有限公司 显示装置的栅极驱动电路以及制作显示装置的器件的方法
KR101582946B1 (ko) * 2009-12-04 2016-01-08 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
KR101750430B1 (ko) * 2010-11-29 2017-06-26 삼성디스플레이 주식회사 박막 트랜지스터 표시판의 제조 방법
KR102063983B1 (ko) * 2013-06-26 2020-02-11 엘지디스플레이 주식회사 금속 산화물 반도체를 포함하는 박막 트랜지스터 기판 및 그 제조 방법
CN103500764B (zh) 2013-10-21 2016-03-30 京东方科技集团股份有限公司 一种薄膜晶体管及其制备方法、阵列基板、显示器
KR102132445B1 (ko) * 2013-12-31 2020-07-09 엘지디스플레이 주식회사 액정 디스플레이 패널 및 이의 제조 방법
KR102423678B1 (ko) * 2015-09-25 2022-07-21 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
CN107134460B (zh) * 2017-04-11 2019-08-02 深圳市华星光电半导体显示技术有限公司 显示装置及其goa电路
JP7063019B2 (ja) * 2018-03-09 2022-05-09 Tdk株式会社 薄膜コンデンサの製造方法及び薄膜コンデンサ
CN110729197A (zh) * 2018-06-29 2020-01-24 中华映管股份有限公司 一种半导体薄膜晶体管的制造方法及显示面板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4231811A (en) * 1979-09-13 1980-11-04 Intel Corporation Variable thickness self-aligned photoresist process
US6287899B1 (en) * 1998-12-31 2001-09-11 Samsung Electronics Co., Ltd. Thin film transistor array panels for a liquid crystal display and a method for manufacturing the same
KR100494683B1 (ko) * 2000-05-31 2005-06-13 비오이 하이디스 테크놀로지 주식회사 4-마스크를 이용한 박막 트랜지스터 액정표시장치의제조시에 사용하는 할프톤 노광 공정용 포토 마스크
JP2002131886A (ja) * 2000-10-27 2002-05-09 Hitachi Ltd 半導体装置の製造方法
JP2002151381A (ja) * 2000-11-09 2002-05-24 Nec Kagoshima Ltd パターン形成方法
TW480728B (en) * 2001-02-02 2002-03-21 Hannstar Display Corp Polysilicon thin film transistor structure and the manufacturing method thereof
JP4462775B2 (ja) * 2001-03-02 2010-05-12 Nec液晶テクノロジー株式会社 パターン形成方法及びそれを用いた液晶表示装置の製造方法
JP3871923B2 (ja) * 2001-11-26 2007-01-24 鹿児島日本電気株式会社 パターン形成方法及びそれを用いたアクティブマトリクス基板の製造方法
US7102168B2 (en) * 2001-12-24 2006-09-05 Samsung Electronics Co., Ltd. Thin film transistor array panel for display and manufacturing method thereof
KR100897505B1 (ko) * 2002-11-19 2009-05-15 삼성전자주식회사 액정 표시 장치의 박막 트랜지스터 기판 및 이의 제조 방법
TW579604B (en) * 2002-12-17 2004-03-11 Ind Tech Res Inst Method of forming a top-gate type thin film transistor device

Also Published As

Publication number Publication date
EP1646076A1 (de) 2006-04-12
TW200612140A (en) 2006-04-16
US20080299712A1 (en) 2008-12-04
KR20060030664A (ko) 2006-04-11
TWI395001B (zh) 2013-05-01
US7425476B2 (en) 2008-09-16
US20060073645A1 (en) 2006-04-06
CN1767175B (zh) 2011-03-16
JP2006108612A (ja) 2006-04-20
CN1767175A (zh) 2006-05-03
KR101090249B1 (ko) 2011-12-06
EP1646076B1 (de) 2011-03-23

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