[go: up one dir, main page]

DE602004001539D1 - Polierkissen - Google Patents

Polierkissen

Info

Publication number
DE602004001539D1
DE602004001539D1 DE602004001539T DE602004001539T DE602004001539D1 DE 602004001539 D1 DE602004001539 D1 DE 602004001539D1 DE 602004001539 T DE602004001539 T DE 602004001539T DE 602004001539 T DE602004001539 T DE 602004001539T DE 602004001539 D1 DE602004001539 D1 DE 602004001539D1
Authority
DE
Germany
Prior art keywords
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004001539T
Other languages
English (en)
Other versions
DE602004001539T2 (de
Inventor
Yukio Hosaka
Hiroshi Shiho
Kou Hasegawa
Nobuo Kawahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of DE602004001539D1 publication Critical patent/DE602004001539D1/de
Application granted granted Critical
Publication of DE602004001539T2 publication Critical patent/DE602004001539T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE602004001539T 2003-05-23 2004-05-21 Polierkissen Expired - Lifetime DE602004001539T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003146458A JP4292025B2 (ja) 2003-05-23 2003-05-23 研磨パッド
JP2003146458 2003-05-23

Publications (2)

Publication Number Publication Date
DE602004001539D1 true DE602004001539D1 (de) 2006-08-31
DE602004001539T2 DE602004001539T2 (de) 2007-06-28

Family

ID=33095491

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004001539T Expired - Lifetime DE602004001539T2 (de) 2003-05-23 2004-05-21 Polierkissen

Country Status (7)

Country Link
US (1) US6976910B2 (de)
EP (1) EP1479479B1 (de)
JP (1) JP4292025B2 (de)
KR (1) KR101006648B1 (de)
CN (1) CN100505171C (de)
DE (1) DE602004001539T2 (de)
TW (1) TWI280903B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4616571B2 (ja) * 2004-03-31 2011-01-19 東洋ゴム工業株式会社 研磨パッド
JP2005340271A (ja) 2004-05-24 2005-12-08 Jsr Corp 化学機械研磨用パッド
US7153191B2 (en) * 2004-08-20 2006-12-26 Micron Technology, Inc. Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods
JP3872081B2 (ja) * 2004-12-29 2007-01-24 東邦エンジニアリング株式会社 研磨用パッド
US7807252B2 (en) * 2005-06-16 2010-10-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having secondary polishing medium capacity control grooves
US8765259B2 (en) * 2007-02-15 2014-07-01 San Fang Chemical Industry Co., Ltd. Carrier film for mounting polishing workpiece and method for making the same
WO2013042507A1 (ja) * 2011-09-22 2013-03-28 東洋ゴム工業株式会社 研磨パッド
CN102658522A (zh) * 2012-05-16 2012-09-12 南京英星光学仪器有限公司 球面光学元件加工用固结磨料研磨抛光垫
US10106662B2 (en) * 2016-08-04 2018-10-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Thermoplastic poromeric polishing pad

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5650039A (en) 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
JPH08216029A (ja) 1995-02-07 1996-08-27 Daiki:Kk 精密研磨シート
JP3708167B2 (ja) * 1995-05-17 2005-10-19 株式会社荏原製作所 研磨布及び該研磨布を備えたポリッシング装置
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US5913713A (en) * 1997-07-31 1999-06-22 International Business Machines Corporation CMP polishing pad backside modifications for advantageous polishing results
JP3668046B2 (ja) 1998-05-11 2005-07-06 株式会社東芝 研磨布及びこの研磨布を用いた半導体装置の製造方法
JP3918359B2 (ja) 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
US6093085A (en) * 1998-09-08 2000-07-25 Advanced Micro Devices, Inc. Apparatuses and methods for polishing semiconductor wafers
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
JP2002141313A (ja) 2000-08-22 2002-05-17 Nikon Corp Ｃｍｐ装置及び半導体デバイスの製造方法
EP1252973B1 (de) 2001-04-25 2008-09-10 JSR Corporation Lichtduchlässiges Polierkissen für eine Halbleiterschleife
JP3826729B2 (ja) 2001-04-25 2006-09-27 Ｊｓｒ株式会社 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
US6705923B2 (en) * 2002-04-25 2004-03-16 Taiwan Semiconductor Manufacturing Co., Ltd Chemical mechanical polisher equipped with chilled wafer holder and polishing pad and method of using
KR100578133B1 (ko) * 2003-11-04 2006-05-10 삼성전자주식회사 화학적 기계적 연마 장치 및 이에 사용되는 연마 패드

Also Published As

Publication number Publication date
CN100505171C (zh) 2009-06-24
EP1479479A1 (de) 2004-11-24
EP1479479B1 (de) 2006-07-19
TW200513346A (en) 2005-04-16
TWI280903B (en) 2007-05-11
JP4292025B2 (ja) 2009-07-08
US20050003749A1 (en) 2005-01-06
CN1572422A (zh) 2005-02-02
US6976910B2 (en) 2005-12-20
DE602004001539T2 (de) 2007-06-28
JP2004345048A (ja) 2004-12-09
KR20040101047A (ko) 2004-12-02
KR101006648B1 (ko) 2011-01-10

Similar Documents

Publication Publication Date Title
DE502004011842D1 (de) Schleifteller
DE60325925D1 (de) Polierkissen
DE602005004220D1 (de) Polierkissen
DE60336386D1 (de) Poliereinrichtung
DE602004032093D1 (de) Polierzusammensetzung
DE60331327D1 (de) Polierbürste
FI20050721L (fi) Hakkeen jauhatus
FI20030917L (fi) Jauhin
DE60306785D1 (de) Polierkissen
EP1583493A4 (de) Wundauflage
DE602004024997D1 (de) Verstellbare seitenpolster
DE60305827D1 (de) Polierzusammensetzung
EP1558426A4 (de) Poliervorrichtung
EP1800800A4 (de) Polierkissen
DE602004011133D1 (de) Schleifscheibe
DE60302398D1 (de) Poliervorrichtung
DE602004022237D1 (de) Chemisch-mechanische Polierscheibe
SG111222A1 (en) Polishing pad
DE60221163D1 (de) Poliermaschine
DK1471124T3 (da) Politursammensætning
EP1693032A4 (de) Inter-labium-einlage
DE602004031295D1 (de) Substratpoliergerät
EP1598038A4 (de) Inter-labium-einlage
DE602004003239D1 (de) Kippsegmentlageranordnung
DE602004001539D1 (de) Polierkissen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition