DE60302398D1 - Poliervorrichtung - Google Patents
PoliervorrichtungInfo
- Publication number
- DE60302398D1 DE60302398D1 DE60302398T DE60302398T DE60302398D1 DE 60302398 D1 DE60302398 D1 DE 60302398D1 DE 60302398 T DE60302398 T DE 60302398T DE 60302398 T DE60302398 T DE 60302398T DE 60302398 D1 DE60302398 D1 DE 60302398D1
- Authority
- DE
- Germany
- Prior art keywords
- polisher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- H10P52/00—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002251381 | 2002-08-29 | ||
| JP2002251381 | 2002-08-29 | ||
| JP2003292132A JP2004106173A (ja) | 2002-08-29 | 2003-08-12 | 両面研磨装置 |
| JP2003292132 | 2003-08-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60302398D1 true DE60302398D1 (de) | 2005-12-29 |
| DE60302398T2 DE60302398T2 (de) | 2006-07-27 |
Family
ID=31497689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60302398T Expired - Fee Related DE60302398T2 (de) | 2002-08-29 | 2003-08-28 | Poliervorrichtung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6830505B2 (de) |
| EP (1) | EP1393858B1 (de) |
| JP (1) | JP2004106173A (de) |
| KR (1) | KR20040019918A (de) |
| CN (1) | CN100408270C (de) |
| DE (1) | DE60302398T2 (de) |
| TW (1) | TWI306794B (de) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005058544A1 (en) * | 2003-12-18 | 2005-06-30 | Carl Zeiss Smt Ag | Device and method for surface working |
| JP4343020B2 (ja) * | 2003-12-22 | 2009-10-14 | 株式会社住友金属ファインテック | 両面研磨方法及び装置 |
| JP4727218B2 (ja) * | 2004-12-10 | 2011-07-20 | 株式会社住友金属ファインテック | 両面研磨用キャリア |
| JP2007152499A (ja) * | 2005-12-06 | 2007-06-21 | Fujikoshi Mach Corp | ワーク研磨方法 |
| JP4764782B2 (ja) * | 2006-08-07 | 2011-09-07 | 株式会社チップトン | 遠心バレル研磨機及び遠心バレル研磨機のワーク投入方法 |
| US7399217B1 (en) * | 2007-02-05 | 2008-07-15 | P.R. Hoffman Machine Products | Lapping machine |
| KR100801489B1 (ko) * | 2007-05-10 | 2008-02-12 | 한국공작기계 주식회사 | 매엽식 양면 래핑머신 |
| JP4985451B2 (ja) * | 2008-02-14 | 2012-07-25 | 信越半導体株式会社 | ワークの両頭研削装置およびワークの両頭研削方法 |
| JP2009196012A (ja) * | 2008-02-19 | 2009-09-03 | Disco Abrasive Syst Ltd | 両面研磨装置 |
| DE102009038942B4 (de) * | 2008-10-22 | 2022-06-23 | Peter Wolters Gmbh | Vorrichtung zur beidseitigen Bearbeitung von flachen Werkstücken sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung mehrerer Halbleiterscheiben |
| CN102528650A (zh) * | 2011-12-21 | 2012-07-04 | 贵州航天控制技术有限公司 | 一种挠性接头轴组合研磨夹具 |
| CN102979870B (zh) * | 2012-12-05 | 2015-06-17 | 中国科学院光电技术研究所 | 一种传递旋转扭矩并可轴向往复移动机构 |
| CN102941529B (zh) * | 2012-12-08 | 2015-11-18 | 中国科学院光电技术研究所 | 一种行星运动式研磨装置 |
| US20140273756A1 (en) * | 2013-03-14 | 2014-09-18 | Chih Hung Chen | Substrate precession mechanism for cmp polishing head |
| CN103465159A (zh) * | 2013-09-03 | 2013-12-25 | 宇环数控机床股份有限公司 | 一种应用于磨削设备的内齿圈抬升旋转机构 |
| KR101572103B1 (ko) | 2014-09-11 | 2015-12-04 | 주식회사 엘지실트론 | 웨이퍼 연마 장치 |
| JP6491024B2 (ja) * | 2015-04-20 | 2019-03-27 | 不二越機械工業株式会社 | 両面研磨装置および研磨方法 |
| CN105904334B (zh) * | 2016-06-30 | 2018-01-02 | 广东利鸿基不锈钢实业有限公司 | 立式自动平抛机 |
| CN107584381A (zh) * | 2017-09-29 | 2018-01-16 | 南京博尔迈兴机械设备有限公司 | 一种手持式汽车抛光机 |
| CN108942567A (zh) * | 2018-08-14 | 2018-12-07 | 天长市永鑫制冷设备有限公司 | 套筒式手持抛光装置 |
| US11443973B2 (en) * | 2019-07-12 | 2022-09-13 | Applied Materials, Inc. | Robot for simultaneous substrate transfer |
| CN114959865B (zh) * | 2022-07-01 | 2023-08-08 | 天朗科技有限公司 | 一种钢板抛光装置及抛光方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB718184A (en) * | 1951-06-28 | 1954-11-10 | Nat Res And Dev Corp | Improvements in or relating to lapping machines |
| US4205489A (en) * | 1976-12-10 | 1980-06-03 | Balabanov Anatoly S | Apparatus for finishing workpieces on surface-lapping machines |
| DE3730795A1 (de) * | 1987-09-14 | 1989-03-23 | Wolters Peter Fa | Hon-, laepp- oder poliermaschine |
| JPH11179649A (ja) * | 1997-12-16 | 1999-07-06 | Speedfam Co Ltd | ワークの取出方法及びワーク取出機構付き平面研磨装置 |
| JPH11254308A (ja) * | 1998-03-06 | 1999-09-21 | Fujikoshi Mach Corp | 両面研磨装置 |
| JP4256977B2 (ja) | 1999-04-13 | 2009-04-22 | 不二越機械工業株式会社 | 両面研磨装置システム |
| US6206765B1 (en) * | 1999-08-16 | 2001-03-27 | Komag, Incorporated | Non-rotational dresser for grinding stones |
| JP2002036099A (ja) | 2000-07-21 | 2002-02-05 | Fujikoshi Mach Corp | 両面研磨装置 |
-
2003
- 2003-08-12 JP JP2003292132A patent/JP2004106173A/ja active Pending
- 2003-08-20 TW TW092122888A patent/TWI306794B/zh not_active IP Right Cessation
- 2003-08-25 KR KR1020030058592A patent/KR20040019918A/ko not_active Withdrawn
- 2003-08-25 US US10/648,680 patent/US6830505B2/en not_active Expired - Fee Related
- 2003-08-28 DE DE60302398T patent/DE60302398T2/de not_active Expired - Fee Related
- 2003-08-28 EP EP03255336A patent/EP1393858B1/de not_active Expired - Lifetime
- 2003-08-29 CN CNB031577849A patent/CN100408270C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1393858A3 (de) | 2004-06-16 |
| KR20040019918A (ko) | 2004-03-06 |
| CN1488470A (zh) | 2004-04-14 |
| JP2004106173A (ja) | 2004-04-08 |
| EP1393858B1 (de) | 2005-11-23 |
| TWI306794B (en) | 2009-03-01 |
| CN100408270C (zh) | 2008-08-06 |
| US20040043713A1 (en) | 2004-03-04 |
| EP1393858A2 (de) | 2004-03-03 |
| TW200403132A (en) | 2004-03-01 |
| US6830505B2 (en) | 2004-12-14 |
| DE60302398T2 (de) | 2006-07-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |