DE60030391D1 - Halbleiterschaltung mit Prüfungsfähigkeit - Google Patents

Halbleiterschaltung mit Prüfungsfähigkeit

Info

Publication number: DE60030391D1
Authority: DE; Germany
Prior art keywords: semiconductor circuit; testing capability; capability; testing; semiconductor
Prior art date: 1999-11-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

DE60030391T

Other languages

English (en)

Other versions

DE60030391T2 (de

Inventor

Kumi Miyachi

Toshifumi Yamashita

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sharp Corp

Original Assignee

Sharp Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-11-09

Filing date

2000-07-06

Publication date

2006-10-12

2000-07-06 Application filed by Sharp Corp filed Critical Sharp Corp

2006-10-12 Publication of DE60030391D1 publication Critical patent/DE60030391D1/de

2007-08-30 Application granted granted Critical

2007-08-30 Publication of DE60030391T2 publication Critical patent/DE60030391T2/de

2020-07-07 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
- G01R31/318536—Scan chain arrangements, e.g. connections, test bus, analog signals
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
- H10W90/754—
- H10W90/756—

Landscapes

Engineering & Computer Science (AREA)
General Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Tests Of Electronic Circuits (AREA)
Semiconductor Integrated Circuits (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)

DE60030391T 1999-11-09 2000-07-06 Halbleiterschaltung mit Prüfungsfähigkeit Expired - Lifetime DE60030391T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP31848599A JP3763385B2 (ja)	1999-11-09	1999-11-09	半導体装置
JP31848599		1999-11-09

Publications (2)

Publication Number	Publication Date
DE60030391D1 true DE60030391D1 (de)	2006-10-12
DE60030391T2 DE60030391T2 (de)	2007-08-30

Family

ID=18099655

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE60030391T Expired - Lifetime DE60030391T2 (de)	1999-11-09	2000-07-06	Halbleiterschaltung mit Prüfungsfähigkeit

Country Status (6)

Country	Link
US (1)	US7036058B1 (de)
EP (1)	EP1099953B1 (de)
JP (1)	JP3763385B2 (de)
KR (1)	KR100392300B1 (de)
DE (1)	DE60030391T2 (de)
TW (1)	TW472154B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2004264057A (ja) *	2003-02-12	2004-09-24	Sharp Corp	バウンダリスキャンコントローラ、半導体装置、半導体装置の半導体回路チップ識別方法、半導体装置の半導体回路チップ制御方法
CN100427964C (zh) *	2003-08-04	2008-10-22	华为技术有限公司	一种电路板的边界扫描测试方法
DE60314525T2 (de)	2003-12-17	2008-02-28	Stmicroelectronics Ltd., Almondsbury	TAP Zeitmultiplexen mit Abtasttest
JP2007518093A (ja) *	2004-01-13	2007-07-05	コーニンクレッカフィリップスエレクトロニクスエヌヴィ	マルチチップパックのためのｊｔａｇテストアーキテクチャ
JP4525125B2 (ja) *	2004-03-24	2010-08-18	ソニー株式会社	マルチチップ型半導体装置
KR100630716B1 (ko)	2004-11-11	2006-10-02	삼성전자주식회사	다양한 패턴 데이터를 쓸 수 있는 반도체 메모리 소자 및그 전기적 검사방법
US7650542B2 (en) *	2004-12-16	2010-01-19	Broadcom Corporation	Method and system of using a single EJTAG interface for multiple tap controllers
KR100850208B1 (ko)	2007-01-09	2008-08-04	삼성전자주식회사	Ｐｂｔ 장치 및 그 방법
US8621301B2 (en) *	2009-03-04	2013-12-31	Alcatel Lucent	Method and apparatus for virtual in-circuit emulation
KR102566994B1 (ko)	2015-12-14	2023-08-14	삼성전자주식회사	멀티 칩 디버깅 방법 및 이를 적용하는 멀티 칩 시스템
US11199582B2 (en) *	2020-04-06	2021-12-14	Xilinx, Inc.	Implementing a JTAG device chain in multi-die integrated circuit
CN114597195A (zh) *	2022-03-02	2022-06-07	上海壁仞智能科技有限公司	多芯片系统以及多芯片系统的操作方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS55111151A (en)	1979-02-20	1980-08-27	Nec Corp	Integrated circuit device
JP2874248B2 (ja)	1990-02-26	1999-03-24	日本電気株式会社	診断用スキャンパス付き電子回路
JP2627464B2 (ja)	1990-03-29	1997-07-09	三菱電機株式会社	集積回路装置
US5068886A (en) *	1990-06-28	1991-11-26	Monica Lavia	Catheter or cannula position indicator for use in hemodynamic monitoring and the like
JPH05322988A (ja)	1992-05-18	1993-12-07	Sony Corp	電子装置の検査方法
US5627842A (en) *	1993-01-21	1997-05-06	Digital Equipment Corporation	Architecture for system-wide standardized intra-module and inter-module fault testing
US5621740A (en) *	1993-05-14	1997-04-15	Matsushita Electric Industrial Co., Ltd.	Output pad circuit for detecting short faults in integrated circuits
US6006343A (en) *	1993-07-30	1999-12-21	Texas Instruments Incorporated	Method and apparatus for streamlined testing of electrical circuits
JP3479653B2 (ja) *	1993-10-15	2003-12-15	コーニンクレッカフィリップスエレクトロニクスエヌヴィ	テスト装置
US5448525A (en) *	1994-03-10	1995-09-05	Intel Corporation	Apparatus for configuring a subset of an integrated circuit having boundary scan circuitry connected in series and a method thereof
US6058602A (en) *	1998-09-21	2000-05-09	Integrated Packaging Assembly Corporation	Method for encapsulating IC packages with diamond substrate
JPH09186418A (ja)	1995-12-28	1997-07-15	Oki Electric Ind Co Ltd	バウンダリスキャンテストにおけるプリント配線板の接続構造
US5808877A (en) *	1996-09-19	1998-09-15	Samsung Electronics Co., Ltd.	Multichip package having exposed common pads
US6260165B1 (en) *	1996-10-18	2001-07-10	Texas Instruments Incorporated	Accelerating scan test by re-using response data as stimulus data
US6199182B1 (en) *	1997-03-27	2001-03-06	Texas Instruments Incorporated	Probeless testing of pad buffers on wafer
US6000051A (en) *	1997-10-10	1999-12-07	Logic Vision, Inc.	Method and apparatus for high-speed interconnect testing
US6163867A (en) *	1998-08-28	2000-12-19	Hewlett-Packard Company	Input-output pad testing using bi-directional pads

1999
- 1999-11-09 JP JP31848599A patent/JP3763385B2/ja not_active Expired - Fee Related
2000
- 2000-07-06 TW TW089113402A patent/TW472154B/zh not_active IP Right Cessation
- 2000-07-06 EP EP00305720A patent/EP1099953B1/de not_active Expired - Lifetime
- 2000-07-06 DE DE60030391T patent/DE60030391T2/de not_active Expired - Lifetime
- 2000-07-13 KR KR10-2000-0040162A patent/KR100392300B1/ko not_active Expired - Fee Related
- 2000-07-13 US US09/615,956 patent/US7036058B1/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
EP1099953A2 (de)	2001-05-16
EP1099953A3 (de)	2001-05-23
TW472154B (en)	2002-01-11
KR100392300B1 (ko)	2003-07-22
EP1099953B1 (de)	2006-08-30
US7036058B1 (en)	2006-04-25
KR20010049778A (ko)	2001-06-15
JP2001135786A (ja)	2001-05-18
DE60030391T2 (de)	2007-08-30
JP3763385B2 (ja)	2006-04-05

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DE69943120D1 (de)	2011-02-24	Integrierte Halbleiterschaltung
DE69942509D1 (de)	2010-07-29	Gegenstand mit halbleiterchip
DE69927658D1 (de)	2005-11-17	Integrierte Halbleiterschaltung
DE10066443B8 (de)	2012-04-19	Halbleitervorrichtung mit Abstrahlungsbauteilen
DE60143340D1 (de)	2010-12-09	Integrierte Halbleiterschaltung mit reduziertem Leckstrom
DE69824972D1 (de)	2004-08-12	Integrierter halbleiterschaltkreis
NO20022736D0 (no)	2002-06-07	Kretsinnkapsling med en integrert dobbelbrikke
DE69828234D1 (de)	2005-01-27	Integrierte Halbleiterschaltungsanordnung
DE69830962D1 (de)	2005-09-01	Integrierte Halbleiterschaltungsanordnung
DE69827863D1 (de)	2005-01-05	Integriertes Halbleiterschaltkreisbauelement
DE69938585D1 (de)	2008-06-05	Integrierte schaltungsanordnung
DE69830772D1 (de)	2005-08-11	Integrierte Halbleiterschaltungsanordnung
NO20006133D0 (no)	2000-12-01	Elektronisk halvlederkomponent
DE69942813D1 (de)	2010-11-11	Halbleitervorrichtung
DE69940029D1 (de)	2009-01-15	Halbleiterbauelement
DE60016477D1 (de)	2005-01-13	Schaltungsanordnung mit Schwachstromdetektion
DE69837135D1 (de)	2007-04-05	Integrierte Halbleiterschaltungsanordnung
DE19980453T1 (de)	2000-03-30	Halbleiterbauelement-Testgerät
DE69920486D1 (de)	2004-10-28	Halbleiterschaltung
DE50003281D1 (de)	2003-09-18	Schaltung mit eingebautem selbsttest
DE69830878D1 (de)	2005-08-25	Integrierte Halbleiterschaltungsanordnung
NO20020244D0 (no)	2002-01-16	Kortslutningsinnretning
DE60029554D1 (de)	2006-09-07	Halbleiterbauelement mit hochspannungselement
DE50107889D1 (de)	2005-12-08	Integrierter Schaltkreis mit Selbsttest-Schaltung
DE60030391D1 (de)	2006-10-12	Halbleiterschaltung mit Prüfungsfähigkeit

Legal Events

Date	Code	Title	Description
2007-10-04	8364	No opposition during term of opposition