DE60017304D1 - Metallmatrix-verbundmaterial, Verfahren zu seiner Herstellung und seine Verwendung - Google Patents
Metallmatrix-verbundmaterial, Verfahren zu seiner Herstellung und seine VerwendungInfo
- Publication number
- DE60017304D1 DE60017304D1 DE60017304T DE60017304T DE60017304D1 DE 60017304 D1 DE60017304 D1 DE 60017304D1 DE 60017304 T DE60017304 T DE 60017304T DE 60017304 T DE60017304 T DE 60017304T DE 60017304 D1 DE60017304 D1 DE 60017304D1
- Authority
- DE
- Germany
- Prior art keywords
- preparation
- composite material
- matrix composite
- metal matrix
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
-
- H10W40/00—
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
-
- H10W40/255—
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- H10W40/778—
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- H10W70/6875—
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- H10W90/00—
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- H10W70/682—
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- H10W70/685—
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- H10W72/07336—
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- H10W72/07554—
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- H10W72/352—
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- H10W72/354—
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- H10W72/381—
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- H10W72/5363—
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- H10W72/547—
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- H10W72/5473—
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- H10W72/5475—
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- H10W72/5522—
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- H10W72/5524—
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- H10W72/884—
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- H10W72/926—
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- H10W72/952—
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- H10W74/00—
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- H10W90/734—
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- H10W90/754—
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- H10W90/756—
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
- Powder Metallurgy (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06954099A JP3690171B2 (ja) | 1999-03-16 | 1999-03-16 | 複合材料とその製造方法及び用途 |
| JP6954099 | 1999-03-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60017304D1 true DE60017304D1 (de) | 2005-02-17 |
| DE60017304T2 DE60017304T2 (de) | 2005-12-22 |
Family
ID=13405664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60017304T Expired - Lifetime DE60017304T2 (de) | 1999-03-16 | 2000-03-03 | Metallmatrix-Verbundmaterial, Verfahren zu seiner Herstellung und seine Verwendung |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US6646344B1 (de) |
| EP (1) | EP1036849B1 (de) |
| JP (1) | JP3690171B2 (de) |
| KR (1) | KR20010049226A (de) |
| DE (1) | DE60017304T2 (de) |
| RU (1) | RU2198949C2 (de) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030211062A1 (en) * | 2001-05-07 | 2003-11-13 | Karl Laden | Anhydrous skin cleaners |
| JP4672902B2 (ja) * | 2001-05-11 | 2011-04-20 | 株式会社三社電機製作所 | 電力用半導体モジュール |
| JP2002368168A (ja) * | 2001-06-13 | 2002-12-20 | Hitachi Ltd | 半導体装置用複合部材、それを用いた絶縁型半導体装置、又は非絶縁型半導体装置 |
| JP2003017254A (ja) * | 2001-06-29 | 2003-01-17 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置の製造方法 |
| JP2003017255A (ja) * | 2001-06-29 | 2003-01-17 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置の製造方法 |
| JP2003163342A (ja) * | 2001-11-29 | 2003-06-06 | Olympus Optical Co Ltd | 固体撮像装置及びその製造方法 |
| US6833617B2 (en) * | 2001-12-18 | 2004-12-21 | Hitachi, Ltd. | Composite material including copper and cuprous oxide and application thereof |
| JP3910072B2 (ja) | 2002-01-30 | 2007-04-25 | 東洋アルミニウム株式会社 | ペースト組成物およびそれを用いた太陽電池 |
| JP3566269B2 (ja) * | 2002-06-07 | 2004-09-15 | 富士通株式会社 | リードフレーム及びその製造方法、及び半導体装置。 |
| DE10235771A1 (de) * | 2002-08-05 | 2004-02-26 | Texas Instruments Deutschland Gmbh | Gekapselter Chip und Verfahren zu seiner Herstellung |
| JP3740117B2 (ja) * | 2002-11-13 | 2006-02-01 | 三菱電機株式会社 | 電力用半導体装置 |
| US6870243B2 (en) * | 2002-11-27 | 2005-03-22 | Freescale Semiconductor, Inc. | Thin GaAs die with copper back-metal structure |
| US7449780B2 (en) * | 2003-03-31 | 2008-11-11 | Intel Corporation | Apparatus to minimize thermal impedance using copper on die backside |
| US7239024B2 (en) * | 2003-04-04 | 2007-07-03 | Thomas Joel Massingill | Semiconductor package with recess for die |
| KR100705868B1 (ko) * | 2003-05-06 | 2007-04-10 | 후지 덴키 디바이스 테크놀로지 가부시키가이샤 | 반도체 장치 및 그 제조 방법 |
| US8395253B2 (en) * | 2004-01-28 | 2013-03-12 | International Rectifier Corporation | Hermetic surface mounted power package |
| DE102004025082B4 (de) * | 2004-05-21 | 2006-12-28 | Infineon Technologies Ag | Elektrisch und durch Strahlung zündbarer Thyristor und Verfahren zu dessen Kontaktierung |
| RU2285978C2 (ru) * | 2004-06-07 | 2006-10-20 | Общество с ограниченной ответственностью "Научно-технический комплекс "Криогенная техника" | Способ криостатирования активных элементов электронной микросхемы (варианты) |
| DE102004062183B3 (de) * | 2004-12-23 | 2006-06-08 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Thyristoranordnung mit integriertem Schutzwiderstand und Verfahren zu deren Herstellung |
| JP2008044009A (ja) * | 2006-07-19 | 2008-02-28 | Honda Motor Co Ltd | 熱膨張係数が異なる部材の接合方法 |
| KR101409048B1 (ko) * | 2007-02-16 | 2014-06-18 | 스미토모 베이클리트 컴퍼니 리미티드 | 회로 기판의 제조 방법, 반도체 제조 장치, 회로 기판 및 반도체 장치 |
| JP5252819B2 (ja) * | 2007-03-26 | 2013-07-31 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
| US8067834B2 (en) * | 2007-08-21 | 2011-11-29 | Hvvi Semiconductors, Inc. | Semiconductor component |
| US8253233B2 (en) | 2008-02-14 | 2012-08-28 | Infineon Technologies Ag | Module including a sintered joint bonding a semiconductor chip to a copper surface |
| JP4748173B2 (ja) * | 2008-03-04 | 2011-08-17 | 株式会社デンソー | 半導体モジュール及びその製造方法 |
| MD249Z (ro) * | 2009-04-29 | 2011-02-28 | Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы | Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat |
| DE102011002458A1 (de) | 2011-01-05 | 2012-07-05 | Robert Bosch Gmbh | Elektronische Baugruppe mit verbessertem Thermo-Management |
| JP2013243340A (ja) | 2012-04-27 | 2013-12-05 | Canon Inc | 電子部品、実装部材、電子機器およびこれらの製造方法 |
| JP5885690B2 (ja) * | 2012-04-27 | 2016-03-15 | キヤノン株式会社 | 電子部品および電子機器 |
| JP6296687B2 (ja) | 2012-04-27 | 2018-03-20 | キヤノン株式会社 | 電子部品、電子モジュールおよびこれらの製造方法。 |
| KR101614669B1 (ko) * | 2012-08-27 | 2016-04-21 | 미쓰비시덴키 가부시키가이샤 | 전력용 반도체 장치 |
| JP2017170627A (ja) * | 2016-03-18 | 2017-09-28 | 富士電機株式会社 | モールド製品の製造方法およびモールド製品 |
| CN110036473B (zh) | 2016-12-06 | 2023-09-05 | 联合材料公司 | 复合构件、散热构件、半导体装置和制造复合构件的方法 |
| EP3506344A1 (de) * | 2017-12-29 | 2019-07-03 | Siemens Aktiengesellschaft | Halbleiterbaugruppe |
| JP7202869B2 (ja) * | 2018-12-10 | 2023-01-12 | ヌヴォトンテクノロジージャパン株式会社 | 半導体装置及び半導体装置の製造方法 |
| CN113133233A (zh) * | 2020-01-15 | 2021-07-16 | 浙江盘毂动力科技有限公司 | 一种绝缘导热灌封电气元件及其灌封方法 |
| CN116265770B (zh) * | 2021-12-16 | 2025-12-12 | 北京科技大学 | 一种粉末冶金摩擦材料及其制备方法和应用 |
| JP7557692B2 (ja) * | 2023-02-09 | 2024-09-30 | 株式会社Flosfia | 電子装置 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE68913800T2 (de) | 1988-04-30 | 1994-07-14 | Toyota Motor Co Ltd | Verfahren zur Herstellung von Verbundmetall unter Beschleunigung der Infiltration des Matrix-Metalls durch feine Teilchen eines dritten Materials. |
| US5443615A (en) * | 1991-02-08 | 1995-08-22 | Honda Giken Kogyo Kabushiki Kaisha | Molded ceramic articles |
| US5045972A (en) | 1990-08-27 | 1991-09-03 | The Standard Oil Company | High thermal conductivity metal matrix composite |
| US5089356A (en) | 1990-09-17 | 1992-02-18 | The Research Foundation Of State Univ. Of New York | Carbon fiber reinforced tin-lead alloy as a low thermal expansion solder preform |
| JP3492681B2 (ja) | 1990-11-27 | 2004-02-03 | アルキャン・インターナショナル・リミテッド | 改良された過共晶合金の製造方法およびこれを基本とする複合材料 |
| US5561321A (en) * | 1992-07-03 | 1996-10-01 | Noritake Co., Ltd. | Ceramic-metal composite structure and process of producing same |
| RU2047952C1 (ru) * | 1992-09-25 | 1995-11-10 | Московский Институт Инженеров Железнодорожного Транспорта | Охладитель для силового полупроводникового прибора |
| US6238454B1 (en) * | 1993-04-14 | 2001-05-29 | Frank J. Polese | Isotropic carbon/copper composites |
| US5490627A (en) * | 1994-06-30 | 1996-02-13 | Hughes Aircraft Company | Direct bonding of copper composites to ceramics |
| JPH0837252A (ja) * | 1994-07-22 | 1996-02-06 | Nec Corp | 半導体装置 |
| JPH0878578A (ja) | 1994-09-08 | 1996-03-22 | Sanyo Special Steel Co Ltd | 放熱基板用材料及びその製造方法 |
| JPH0891836A (ja) * | 1994-09-19 | 1996-04-09 | Furukawa Co Ltd | 亜酸化銅粉末の製造方法 |
| JP3493844B2 (ja) * | 1994-11-15 | 2004-02-03 | 住友電気工業株式会社 | 半導体基板材料とその製造方法及び該基板を用いた半導体装置 |
| JPH0915773A (ja) | 1995-06-30 | 1997-01-17 | Fuji Photo Film Co Ltd | ハロゲン化銀写真感光材料 |
| JP3426827B2 (ja) | 1995-12-25 | 2003-07-14 | 京セラ株式会社 | 半導体装置 |
| JPH09209058A (ja) | 1996-01-30 | 1997-08-12 | Kyocera Corp | 高熱伝導性複合材料とその製造方法 |
| US5882532A (en) * | 1996-05-31 | 1999-03-16 | Hewlett-Packard Company | Fabrication of single-crystal silicon structures using sacrificial-layer wafer bonding |
| US6056186A (en) * | 1996-06-25 | 2000-05-02 | Brush Wellman Inc. | Method for bonding a ceramic to a metal with a copper-containing shim |
| US6245442B1 (en) * | 1997-05-28 | 2001-06-12 | Kabushiki Kaisha Toyota Chuo | Metal matrix composite casting and manufacturing method thereof |
| US6074888A (en) * | 1998-08-18 | 2000-06-13 | Trw Inc. | Method for fabricating semiconductor micro epi-optical components |
| US6114048A (en) * | 1998-09-04 | 2000-09-05 | Brush Wellman, Inc. | Functionally graded metal substrates and process for making same |
| WO2000034539A1 (fr) | 1998-12-07 | 2000-06-15 | Hitachi, Ltd. | Materiau composite et son utilisation |
| JP3040768B1 (ja) * | 1999-03-01 | 2000-05-15 | 株式会社 大阪合金工業所 | 鋳造欠陥、偏析および酸化物の含有を抑制した銅合金鋳塊の製造方法 |
-
1999
- 1999-03-16 JP JP06954099A patent/JP3690171B2/ja not_active Expired - Fee Related
-
2000
- 2000-02-25 US US09/513,330 patent/US6646344B1/en not_active Expired - Lifetime
- 2000-03-03 EP EP00104647A patent/EP1036849B1/de not_active Expired - Lifetime
- 2000-03-03 DE DE60017304T patent/DE60017304T2/de not_active Expired - Lifetime
- 2000-03-15 KR KR1020000012995A patent/KR20010049226A/ko not_active Withdrawn
- 2000-03-15 RU RU2000106644/28A patent/RU2198949C2/ru active
-
2002
- 2002-03-21 US US10/101,852 patent/US6630734B2/en not_active Expired - Lifetime
- 2002-03-21 US US10/101,851 patent/US6611056B2/en not_active Expired - Lifetime
-
2003
- 2003-08-20 US US10/643,976 patent/US20040031545A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1036849A3 (de) | 2002-09-25 |
| US20020135061A1 (en) | 2002-09-26 |
| DE60017304T2 (de) | 2005-12-22 |
| JP2000265227A (ja) | 2000-09-26 |
| JP3690171B2 (ja) | 2005-08-31 |
| US6630734B2 (en) | 2003-10-07 |
| US20040031545A1 (en) | 2004-02-19 |
| US6611056B2 (en) | 2003-08-26 |
| EP1036849B1 (de) | 2005-01-12 |
| EP1036849A2 (de) | 2000-09-20 |
| RU2198949C2 (ru) | 2003-02-20 |
| US20020145195A1 (en) | 2002-10-10 |
| KR20010049226A (ko) | 2001-06-15 |
| US6646344B1 (en) | 2003-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |