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DE20317554U1 - Befestigungsvorrichtung zum Befestigen eines Bauteils an einer Leiterplatte - Google Patents

Befestigungsvorrichtung zum Befestigen eines Bauteils an einer Leiterplatte Download PDF

Info

Publication number
DE20317554U1
DE20317554U1 DE20317554U DE20317554U DE20317554U1 DE 20317554 U1 DE20317554 U1 DE 20317554U1 DE 20317554 U DE20317554 U DE 20317554U DE 20317554 U DE20317554 U DE 20317554U DE 20317554 U1 DE20317554 U1 DE 20317554U1
Authority
DE
Germany
Prior art keywords
fastening
free
component
solder
place
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20317554U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weidmueller Interface GmbH and Co KG
Original Assignee
Weidmueller Interface GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Weidmueller Interface GmbH and Co KG filed Critical Weidmueller Interface GmbH and Co KG
Priority to DE20317554U priority Critical patent/DE20317554U1/de
Publication of DE20317554U1 publication Critical patent/DE20317554U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10598Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/1084Notched leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10984Component carrying a connection agent, e.g. solder, adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE20317554U 2003-11-12 2003-11-12 Befestigungsvorrichtung zum Befestigen eines Bauteils an einer Leiterplatte Expired - Lifetime DE20317554U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20317554U DE20317554U1 (de) 2003-11-12 2003-11-12 Befestigungsvorrichtung zum Befestigen eines Bauteils an einer Leiterplatte

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20317554U DE20317554U1 (de) 2003-11-12 2003-11-12 Befestigungsvorrichtung zum Befestigen eines Bauteils an einer Leiterplatte

Publications (1)

Publication Number Publication Date
DE20317554U1 true DE20317554U1 (de) 2005-03-24

Family

ID=34399742

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20317554U Expired - Lifetime DE20317554U1 (de) 2003-11-12 2003-11-12 Befestigungsvorrichtung zum Befestigen eines Bauteils an einer Leiterplatte

Country Status (1)

Country Link
DE (1) DE20317554U1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105007694A (zh) * 2015-07-30 2015-10-28 苏州佳像视讯科技有限公司 一种电子元器件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085602A (en) * 1987-02-18 1992-02-04 Sanders Associates, Inc. Electrical circuit board mounting apparatus and method
DE10017774A1 (de) * 2000-04-10 2001-10-18 Epcos Ag Befestigungsplatte, Befestigungsanordnung mit der Befestigungsplatte und Verwendung der Befestigungsplatte
DE10202077C1 (de) * 2002-01-18 2003-04-30 Leonhardy Gmbh Vorrichtung zum Befestigen eines Bauelementes auf einer Platte

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085602A (en) * 1987-02-18 1992-02-04 Sanders Associates, Inc. Electrical circuit board mounting apparatus and method
DE10017774A1 (de) * 2000-04-10 2001-10-18 Epcos Ag Befestigungsplatte, Befestigungsanordnung mit der Befestigungsplatte und Verwendung der Befestigungsplatte
DE10202077C1 (de) * 2002-01-18 2003-04-30 Leonhardy Gmbh Vorrichtung zum Befestigen eines Bauelementes auf einer Platte

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105007694A (zh) * 2015-07-30 2015-10-28 苏州佳像视讯科技有限公司 一种电子元器件

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Legal Events

Date Code Title Description
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H05K0003300000

Ipc: H05K0007020000

R163 Identified publications notified
R207 Utility model specification

Effective date: 20050428

R150 Term of protection extended to 6 years

Effective date: 20061208

R151 Term of protection extended to 8 years

Effective date: 20091202

R152 Term of protection extended to 10 years
R152 Term of protection extended to 10 years

Effective date: 20111128

R071 Expiry of right
R071 Expiry of right