DE20317554U1 - Fastening apparatus for fastening a component to a circuit board whereby a gap remains when the fastener pin is in place and this is free of solder - Google Patents
Fastening apparatus for fastening a component to a circuit board whereby a gap remains when the fastener pin is in place and this is free of solder Download PDFInfo
- Publication number
- DE20317554U1 DE20317554U1 DE20317554U DE20317554U DE20317554U1 DE 20317554 U1 DE20317554 U1 DE 20317554U1 DE 20317554 U DE20317554 U DE 20317554U DE 20317554 U DE20317554 U DE 20317554U DE 20317554 U1 DE20317554 U1 DE 20317554U1
- Authority
- DE
- Germany
- Prior art keywords
- fastening
- free
- component
- solder
- place
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 4
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The fastening apparatus has at least one through opening (2) arranged to receive a fastening pin (3). This through opening is surrounded by solder material (6). The fastening pin has a recess (5) in its circumference in the axial region engaging with the through opening. The recess only surrounds part of the pin circumference. The recess can be filled with the solder material. When the pin is in its assembled position a gap (7) remains between the component (4) and the opening (7). This gap is free of solder material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE20317554U DE20317554U1 (en) | 2003-11-12 | 2003-11-12 | Fastening apparatus for fastening a component to a circuit board whereby a gap remains when the fastener pin is in place and this is free of solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE20317554U DE20317554U1 (en) | 2003-11-12 | 2003-11-12 | Fastening apparatus for fastening a component to a circuit board whereby a gap remains when the fastener pin is in place and this is free of solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE20317554U1 true DE20317554U1 (en) | 2005-03-24 |
Family
ID=34399742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE20317554U Expired - Lifetime DE20317554U1 (en) | 2003-11-12 | 2003-11-12 | Fastening apparatus for fastening a component to a circuit board whereby a gap remains when the fastener pin is in place and this is free of solder |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE20317554U1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105007694A (en) * | 2015-07-30 | 2015-10-28 | 苏州佳像视讯科技有限公司 | Electronic component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5085602A (en) * | 1987-02-18 | 1992-02-04 | Sanders Associates, Inc. | Electrical circuit board mounting apparatus and method |
| DE10017774A1 (en) * | 2000-04-10 | 2001-10-18 | Epcos Ag | Mounting plate, mounting arrangement with the mounting plate and use of the mounting plate |
| DE10202077C1 (en) * | 2002-01-18 | 2003-04-30 | Leonhardy Gmbh | Circuit board component fixing device uses fixing pin of component secured in seat of printed circuit board by solder |
-
2003
- 2003-11-12 DE DE20317554U patent/DE20317554U1/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5085602A (en) * | 1987-02-18 | 1992-02-04 | Sanders Associates, Inc. | Electrical circuit board mounting apparatus and method |
| DE10017774A1 (en) * | 2000-04-10 | 2001-10-18 | Epcos Ag | Mounting plate, mounting arrangement with the mounting plate and use of the mounting plate |
| DE10202077C1 (en) * | 2002-01-18 | 2003-04-30 | Leonhardy Gmbh | Circuit board component fixing device uses fixing pin of component secured in seat of printed circuit board by solder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105007694A (en) * | 2015-07-30 | 2015-10-28 | 苏州佳像视讯科技有限公司 | Electronic component |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H05K0003300000 Ipc: H05K0007020000 |
|
| R163 | Identified publications notified | ||
| R207 | Utility model specification |
Effective date: 20050428 |
|
| R150 | Term of protection extended to 6 years |
Effective date: 20061208 |
|
| R151 | Term of protection extended to 8 years |
Effective date: 20091202 |
|
| R152 | Term of protection extended to 10 years | ||
| R152 | Term of protection extended to 10 years |
Effective date: 20111128 |
|
| R071 | Expiry of right | ||
| R071 | Expiry of right |