DE19681390T1 - Verfahren zur Herstellung von Metalleinlagerungs-Verbundwerkstoffen, die elektrische Isolatoren enthalten - Google Patents
Verfahren zur Herstellung von Metalleinlagerungs-Verbundwerkstoffen, die elektrische Isolatoren enthaltenInfo
- Publication number
- DE19681390T1 DE19681390T1 DE19681390T DE19681390T DE19681390T1 DE 19681390 T1 DE19681390 T1 DE 19681390T1 DE 19681390 T DE19681390 T DE 19681390T DE 19681390 T DE19681390 T DE 19681390T DE 19681390 T1 DE19681390 T1 DE 19681390T1
- Authority
- DE
- Germany
- Prior art keywords
- production
- composite materials
- materials containing
- metal storage
- electrical insulators
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/14—Machines with evacuated die cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- B22D19/14—Casting in, on, or around objects which form part of the product the objects being filamentary or particulate in form
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
- C04B41/515—Other specific metals
- C04B41/5155—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1005—Pretreatment of the non-metallic additives
- C22C1/1015—Pretreatment of the non-metallic additives by preparing or treating a non-metallic additive preform
- C22C1/1021—Pretreatment of the non-metallic additives by preparing or treating a non-metallic additive preform the preform being ceramic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
- C22C47/02—Pretreatment of the fibres or filaments
- C22C47/06—Pretreatment of the fibres or filaments by forming the fibres or filaments into a preformed structure, e.g. using a temporary binder to form a mat-like element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H10W40/257—
-
- H10W70/02—
-
- H10W70/04—
-
- H10W70/6875—
-
- H10W76/15—
-
- H10W76/17—
-
- H10W99/00—
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00905—Uses not provided for elsewhere in C04B2111/00 as preforms
- C04B2111/00913—Uses not provided for elsewhere in C04B2111/00 as preforms as ceramic preforms for the fabrication of metal matrix comp, e.g. cermets
- C04B2111/00931—Coated or infiltrated preforms, e.g. with molten metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2204/00—End product comprising different layers, coatings or parts of cermet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H10W72/877—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Structural Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/444,171 US5616421A (en) | 1991-04-08 | 1995-05-18 | Metal matrix composites containing electrical insulators |
| PCT/US1996/006824 WO1996036450A2 (en) | 1995-05-18 | 1996-05-13 | Fabricating metal matrix composites containing electrical insulators |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE19681390T1 true DE19681390T1 (de) | 1998-07-02 |
Family
ID=23763791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19681390T Withdrawn DE19681390T1 (de) | 1995-05-18 | 1996-05-13 | Verfahren zur Herstellung von Metalleinlagerungs-Verbundwerkstoffen, die elektrische Isolatoren enthalten |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5616421A (de) |
| JP (1) | JPH11505177A (de) |
| AU (1) | AU5745396A (de) |
| DE (1) | DE19681390T1 (de) |
| WO (1) | WO1996036450A2 (de) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19814018A1 (de) * | 1998-03-28 | 1999-09-30 | Andreas Roosen | Verfahren zur Herstellung von Verbundwerkstoffen mit mindestens einer keramischen Komponente |
| DE102008035974A1 (de) * | 2008-07-31 | 2010-02-11 | Ami Doduco Gmbh | Löschplatte für eine Lichtbogen-Löschkammer |
| DE102012015944A1 (de) * | 2012-08-10 | 2014-02-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines Bauteils mit einer Verbundstruktur sowie mit dem Verfahren herstellbares Bauteil |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3391636B2 (ja) * | 1996-07-23 | 2003-03-31 | 明久 井上 | 高耐摩耗性アルミニウム基複合合金 |
| US6033787A (en) * | 1996-08-22 | 2000-03-07 | Mitsubishi Materials Corporation | Ceramic circuit board with heat sink |
| US6018188A (en) * | 1997-03-28 | 2000-01-25 | Nec Corporation | Semiconductor device |
| US6245442B1 (en) | 1997-05-28 | 2001-06-12 | Kabushiki Kaisha Toyota Chuo | Metal matrix composite casting and manufacturing method thereof |
| US6255671B1 (en) * | 1998-01-05 | 2001-07-03 | International Business Machines Corporation | Metal embedded passivation layer structure for microelectronic interconnect formation, customization and repair |
| US6137237A (en) | 1998-01-13 | 2000-10-24 | Fusion Lighting, Inc. | High frequency inductive lamp and power oscillator |
| US6313587B1 (en) | 1998-01-13 | 2001-11-06 | Fusion Lighting, Inc. | High frequency inductive lamp and power oscillator |
| JP4304749B2 (ja) | 1998-02-24 | 2009-07-29 | 住友電気工業株式会社 | 半導体装置用部材の製造方法 |
| AT408153B (de) * | 1998-09-02 | 2001-09-25 | Electrovac | Metall-matrix-composite- (mmc-) bauteil |
| US6284389B1 (en) * | 1999-04-30 | 2001-09-04 | Pacific Aerospace & Electronics, Inc. | Composite materials and methods for manufacturing composite materials |
| US6355362B1 (en) * | 1999-04-30 | 2002-03-12 | Pacific Aerospace & Electronics, Inc. | Electronics packages having a composite structure and methods for manufacturing such electronics packages |
| AU2002218493A1 (en) * | 2000-11-29 | 2002-06-11 | Denki Kagaku Kogyo Kabushiki Kaisha | Integral-type ceramic circuit board and method of producing same |
| JP3869255B2 (ja) * | 2001-06-14 | 2007-01-17 | 富士通株式会社 | 金属成形体製造方法およびこれにより製造される金属成形体 |
| US20040065432A1 (en) * | 2002-10-02 | 2004-04-08 | Smith John R. | High performance thermal stack for electrical components |
| SE526366C3 (sv) * | 2003-03-21 | 2005-10-26 | Silex Microsystems Ab | Elektriska anslutningar i substrat |
| US8091455B2 (en) | 2008-01-30 | 2012-01-10 | Cummins Filtration Ip, Inc. | Apparatus, system, and method for cutting tubes |
| KR101003591B1 (ko) * | 2009-05-28 | 2010-12-22 | 삼성전기주식회사 | 메탈 적층판 및 이를 이용한 발광 다이오드 패키지의 제조 방법 |
| US9375783B2 (en) | 2010-06-04 | 2016-06-28 | Triton Systems, Inc. | Discontinuous short fiber preform and fiber-reinforced aluminum billet and methods of manufacturing the same |
| WO2012068350A2 (en) | 2010-11-17 | 2012-05-24 | Alcoa Inc. | Methods of making a reinforced composite and reinforced composite products |
| US8564968B1 (en) * | 2011-05-10 | 2013-10-22 | Triquint Semiconductor, Inc. | Air cavity package including a package lid having at least one protrusion configured to facilitate coupling of the package lid with a package wall |
| CN104119095B (zh) * | 2013-04-27 | 2016-04-27 | 比亚迪股份有限公司 | 一种金属陶瓷复合制品及其制备方法 |
| US9826662B2 (en) * | 2013-12-12 | 2017-11-21 | General Electric Company | Reusable phase-change thermal interface structures |
| US20160373154A1 (en) * | 2015-06-16 | 2016-12-22 | Ii-Vi Incorporated | Electronic Device Housing Utilizing A Metal Matrix Composite |
| CN107611040B (zh) * | 2017-09-18 | 2019-06-14 | 上海开朋科技有限公司 | 铝金刚石复合材料表面覆盖铜箔同时镶嵌陶瓷材料的工艺 |
| CN107470588B (zh) * | 2017-09-18 | 2019-05-10 | 上海开朋科技有限公司 | 在铝金刚石复合材料表面覆盖铜箔的方法 |
| GB202005524D0 (en) * | 2020-04-16 | 2020-06-03 | Global Skyware Ltd | Improving cooling of data signal processing apparatus |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3350763A (en) * | 1965-10-21 | 1967-11-07 | Clevite Corp | Method of making dual-material flange bearings |
| US3547180A (en) * | 1968-08-26 | 1970-12-15 | Aluminum Co Of America | Production of reinforced composites |
| US3874855A (en) * | 1969-07-22 | 1975-04-01 | Cegedur Gp | Composite shock resisting bodies |
| US3721841A (en) * | 1971-06-16 | 1973-03-20 | Motorola Inc | Contact for piezoelectric crystals |
| JPS54141209U (de) * | 1978-03-27 | 1979-10-01 | ||
| US4205418A (en) * | 1978-07-28 | 1980-06-03 | Burroughs Corporation | Method of making a curved electrode plate |
| US4340109A (en) * | 1980-02-25 | 1982-07-20 | Emerson Electric Co. | Process of die casting with a particulate inert filler uniformly dispersed through the casting |
| US4376804A (en) * | 1981-08-26 | 1983-03-15 | The Aerospace Corporation | Pyrolyzed pitch coatings for carbon fiber |
| GB2115327B (en) * | 1982-02-08 | 1985-10-09 | Secr Defence | Casting fibre reinforced metals |
| JPS58215263A (ja) * | 1982-06-07 | 1983-12-14 | Toyota Motor Corp | 複合材料の製造方法 |
| US4554613A (en) * | 1983-10-31 | 1985-11-19 | Kaufman Lance R | Multiple substrate circuit package |
| JPS60223655A (ja) * | 1984-04-23 | 1985-11-08 | Daido Steel Co Ltd | セラミクス−金属複合体の製造方法 |
| JPS60240365A (ja) * | 1984-05-15 | 1985-11-29 | Toyota Motor Corp | セラミツクス体の鋳ぐるみ方法 |
| JPS60240366A (ja) * | 1984-05-15 | 1985-11-29 | Toyota Motor Corp | セラミツクス体の鋳ぐるみ方法 |
| US4589057A (en) * | 1984-07-23 | 1986-05-13 | Rogers Corporation | Cooling and power and/or ground distribution system for integrated circuits |
| JPS60145340A (ja) * | 1984-08-06 | 1985-07-31 | Res Inst Iron Steel Tohoku Univ | シリコンカ−バイド繊維強化アルミニウム複合材料の製造方法 |
| GB8500856D0 (en) * | 1985-01-12 | 1985-02-20 | Gkn Technology Ltd | Metal matrix composite |
| EP0235682B2 (de) * | 1986-02-20 | 1997-11-12 | Kabushiki Kaisha Toshiba | Gesinterter Körper aus Aluminiumnitrid mit leitender metallisierter Schicht |
| JPS62197379A (ja) * | 1986-02-20 | 1987-09-01 | 株式会社東芝 | 窒化アルミニウム基板 |
| JPS62238063A (ja) * | 1986-04-09 | 1987-10-19 | Mitsubishi Heavy Ind Ltd | 溶湯加圧含浸装置 |
| JPS62240152A (ja) * | 1986-04-12 | 1987-10-20 | Mitsubishi Heavy Ind Ltd | 溶湯加圧含浸装置の型締めヘツド |
| FR2605913A1 (fr) * | 1986-10-31 | 1988-05-06 | Pechiney Aluminium | Procede de moulage sous pression de pieces metalliques contenant eventuellement des fibres en ceramiques |
| FR2608476B1 (fr) * | 1986-12-18 | 1989-05-12 | Peugeot | Procede de fabrication de pieces metalliques coulees comportant un insert en matiere ceramique |
| US4906511A (en) * | 1987-02-12 | 1990-03-06 | Kabushiki Kaisha Toshiba | Aluminum nitride circuit board |
| US4828008A (en) * | 1987-05-13 | 1989-05-09 | Lanxide Technology Company, Lp | Metal matrix composites |
| US4806704A (en) * | 1987-06-08 | 1989-02-21 | General Electric Company | Metal matrix composite and structure using metal matrix composites for electronic applications |
| FR2616363B1 (fr) * | 1987-06-11 | 1991-04-19 | Cegedur | Procede et dispositif de moulage en sable de pieces composites a matrice en alliage leger et insert fibreux |
| JPS6431565A (en) * | 1987-07-28 | 1989-02-01 | Atsugi Motor Parts Co Ltd | Production of fiber reinforced composite material |
| US4961461A (en) * | 1988-06-16 | 1990-10-09 | Massachusetts Institute Of Technology | Method and apparatus for continuous casting of composites |
| US4901781A (en) * | 1988-08-30 | 1990-02-20 | General Motors Corporation | Method of casting a metal matrix composite |
| US5111871B1 (en) * | 1989-03-17 | 1993-12-28 | J. Cook Arnold | Method of vacuum casting |
| US4920864A (en) * | 1989-04-14 | 1990-05-01 | Jpi Transportation Products, Inc. | Reinforced piston |
| US5361678A (en) * | 1989-09-21 | 1994-11-08 | Aluminum Company Of America | Coated ceramic bodies in composite armor |
| EP0422558B1 (de) * | 1989-10-09 | 2001-03-28 | Mitsubishi Materials Corporation | Keramisches Substrat angewendet zum Herstellen einer elektrischen oder elektronischen Schaltung |
| US5039577A (en) * | 1990-05-31 | 1991-08-13 | Hughes Aircraft Company | Hybrid metal matrix composite chassis structure for electronic circuits |
| JP2504610B2 (ja) * | 1990-07-26 | 1996-06-05 | 株式会社東芝 | 電力用半導体装置 |
| US5259436A (en) * | 1991-04-08 | 1993-11-09 | Aluminum Company Of America | Fabrication of metal matrix composites by vacuum die casting |
| US5311920A (en) * | 1991-07-29 | 1994-05-17 | Cook Arnold J | Method of forming a metal matrix component with internal and external structures |
| US5306571A (en) * | 1992-03-06 | 1994-04-26 | Bp Chemicals Inc., Advanced Materials Division | Metal-matrix-composite |
| EP0665591A1 (de) * | 1992-11-06 | 1995-08-02 | Motorola, Inc. | Verfahren zur herstellung einer Verpackung für Leistungsschaltungen |
-
1995
- 1995-05-18 US US08/444,171 patent/US5616421A/en not_active Expired - Fee Related
-
1996
- 1996-05-13 WO PCT/US1996/006824 patent/WO1996036450A2/en not_active Ceased
- 1996-05-13 JP JP8534962A patent/JPH11505177A/ja not_active Abandoned
- 1996-05-13 AU AU57453/96A patent/AU5745396A/en not_active Abandoned
- 1996-05-13 DE DE19681390T patent/DE19681390T1/de not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19814018A1 (de) * | 1998-03-28 | 1999-09-30 | Andreas Roosen | Verfahren zur Herstellung von Verbundwerkstoffen mit mindestens einer keramischen Komponente |
| DE102008035974A1 (de) * | 2008-07-31 | 2010-02-11 | Ami Doduco Gmbh | Löschplatte für eine Lichtbogen-Löschkammer |
| DE102008035974B4 (de) * | 2008-07-31 | 2010-07-08 | Ami Doduco Gmbh | Löschplatte für eine Lichtbogen-Löschkammer |
| DE102012015944A1 (de) * | 2012-08-10 | 2014-02-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung eines Bauteils mit einer Verbundstruktur sowie mit dem Verfahren herstellbares Bauteil |
Also Published As
| Publication number | Publication date |
|---|---|
| WO1996036450A2 (en) | 1996-11-21 |
| JPH11505177A (ja) | 1999-05-18 |
| US5616421A (en) | 1997-04-01 |
| AU5745396A (en) | 1996-11-29 |
| WO1996036450A3 (en) | 1997-01-16 |
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