[go: up one dir, main page]

AU2002218493A1 - Integral-type ceramic circuit board and method of producing same - Google Patents

Integral-type ceramic circuit board and method of producing same

Info

Publication number
AU2002218493A1
AU2002218493A1 AU2002218493A AU1849302A AU2002218493A1 AU 2002218493 A1 AU2002218493 A1 AU 2002218493A1 AU 2002218493 A AU2002218493 A AU 2002218493A AU 1849302 A AU1849302 A AU 1849302A AU 2002218493 A1 AU2002218493 A1 AU 2002218493A1
Authority
AU
Australia
Prior art keywords
baseplate
ceramic
circuit board
integral
ceramic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002218493A
Inventor
Hideki Hirotsuru
Masahiro Ibukiyama
Akira Miyai
Yukihiko Nakajima
Ryozo Nonogaki
Takuya Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000362450A external-priority patent/JP4349739B2/en
Priority claimed from JP2001182914A external-priority patent/JP4674999B2/en
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Publication of AU2002218493A1 publication Critical patent/AU2002218493A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W70/6875—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H10W40/255—
    • H10W70/692—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y10T29/49982—Coating
    • Y10T29/49984—Coating and casting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

A substrate for mounting an electronic component, comprising a baseplate having a main surface formed with or without a recess; a ceramic substrate provided on the main surface of the baseplate and having a smaller size than the baseplate; and a metal layer provided so as to cover both of the baseplate and the ceramic substrate; wherein the metal layer has a surface remote from the baseplate and the ceramic substrate made flat, the baseplate is made of a metal-ceramic composite of a metallic material and a ceramic material, and the metallic material in the composite and the metal layer have different compositions. There is provided an integral ceramic circuit board, which is resistant to repeated thermal stress and is superior in reliability. <IMAGE>
AU2002218493A 2000-11-29 2001-11-28 Integral-type ceramic circuit board and method of producing same Abandoned AU2002218493A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000-362450 2000-11-29
JP2000362450A JP4349739B2 (en) 2000-11-29 2000-11-29 Base plate integrated ceramic circuit board and its manufacturing method
JP2001-182914 2001-06-18
JP2001182914A JP4674999B2 (en) 2001-06-18 2001-06-18 Integrated ceramic circuit board manufacturing method
PCT/JP2001/010408 WO2002045161A1 (en) 2000-11-29 2001-11-28 Integral-type ceramic circuit board and method of producing same

Publications (1)

Publication Number Publication Date
AU2002218493A1 true AU2002218493A1 (en) 2002-06-11

Family

ID=26604783

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002218493A Abandoned AU2002218493A1 (en) 2000-11-29 2001-11-28 Integral-type ceramic circuit board and method of producing same

Country Status (5)

Country Link
US (2) US7130174B2 (en)
EP (1) EP1345264B1 (en)
AT (1) ATE553498T1 (en)
AU (1) AU2002218493A1 (en)
WO (1) WO2002045161A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7993728B2 (en) 2006-04-26 2011-08-09 Denki Kagaku Kogyo Kabushiki Kaisha Aluminum/silicon carbide composite and radiating part comprising the same
US8587955B2 (en) * 2007-05-23 2013-11-19 Apple Inc. Electronic device with a ceramic component
US8076587B2 (en) * 2008-09-26 2011-12-13 Siemens Energy, Inc. Printed circuit board for harsh environments
JP5713684B2 (en) * 2009-02-13 2015-05-07 電気化学工業株式会社 Composite material substrate for LED light emitting device, method for producing the same, and LED light emitting device
US8187901B2 (en) 2009-12-07 2012-05-29 Micron Technology, Inc. Epitaxial formation support structures and associated methods
US8598463B2 (en) * 2010-08-05 2013-12-03 Unimicron Technology Corp. Circuit board and manufacturing method thereof
TWI505765B (en) * 2010-12-14 2015-10-21 欣興電子股份有限公司 Circuit board and manufacturing method thereof
US20150116958A1 (en) * 2013-10-28 2015-04-30 Apple Inc. Circuit board modules having mechanical features
US10051724B1 (en) 2014-01-31 2018-08-14 Apple Inc. Structural ground reference for an electronic component of a computing device
US9525222B2 (en) 2014-04-11 2016-12-20 Apple Inc. Reducing or eliminating board-to-board connectors
US9666967B2 (en) 2014-07-28 2017-05-30 Apple Inc. Printed circuit board connector for non-planar configurations
US10945664B1 (en) 2015-09-30 2021-03-16 Apple, Inc. Protective case with coupling gasket for a wearable electronic device
CN113501725B (en) * 2021-07-21 2022-11-08 江苏富乐华半导体科技股份有限公司 Preparation method of aluminum-coated ceramic insulating lining plate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1020914B1 (en) * 1989-10-09 2004-04-28 Mitsubishi Materials Corporation Ceramic substrate used for fabricating electric or electronic circuit
US5406029A (en) * 1991-02-08 1995-04-11 Pcc Composites, Inc. Electronic package having a pure metal skin
US5570502A (en) * 1991-04-08 1996-11-05 Aluminum Company Of America Fabricating metal matrix composites containing electrical insulators
US6003221A (en) * 1991-04-08 1999-12-21 Aluminum Company Of America Metal matrix composites containing electrical insulators
US5616421A (en) * 1991-04-08 1997-04-01 Aluminum Company Of America Metal matrix composites containing electrical insulators
JPH11130568A (en) * 1997-10-24 1999-05-18 Denki Kagaku Kogyo Kk Composite material and heat sink using the same
JP4204656B2 (en) 1997-11-12 2009-01-07 電気化学工業株式会社 Method for producing composite
JP3449683B2 (en) * 1997-12-01 2003-09-22 電気化学工業株式会社 Ceramic circuit board and method of manufacturing the same
JP2000277953A (en) * 1999-03-23 2000-10-06 Hitachi Metals Ltd Ceramic circuit board

Also Published As

Publication number Publication date
US7207105B2 (en) 2007-04-24
US20040038011A1 (en) 2004-02-26
US20050167792A1 (en) 2005-08-04
US7130174B2 (en) 2006-10-31
EP1345264A1 (en) 2003-09-17
EP1345264B1 (en) 2012-04-11
ATE553498T1 (en) 2012-04-15
WO2002045161A1 (en) 2002-06-06
EP1345264A4 (en) 2007-03-28

Similar Documents

Publication Publication Date Title
EP1187198A3 (en) Metal-ceramic circuit board and manufacturing method thereof
AU2002218493A1 (en) Integral-type ceramic circuit board and method of producing same
EP0681322A3 (en) Bonded ceramic metal composite substrates and circuit boards constructed therewith
TW200802744A (en) Electronic component module
AU2879389A (en) Hot pressing dense ceramic sheets for electronic substrates and for multilayer ceramic electronic substrates
EP0092020A3 (en) Composite structure, particularly for use as a printed-circuit board
TW200701375A (en) Metal-ceramic composite substrate and manufacturing method thereof
CA2149929A1 (en) Devices Using Metallized Magnetic Substrates
WO2003017364A1 (en) Electronic device and production method therefor
CA2211533A1 (en) Glass bonding layer for a ceramic circuit board support substrate
US20020094929A1 (en) Glass ceramic sintered product and process for production thereof
EP1345480A3 (en) Ceramic circuit board and power module
EP0935526A1 (en) Metal ceramic composites with improved interfacial properties
EP1667226A3 (en) Thermal management of surface-mount circuit devices
CA2395080A1 (en) Multilayer printed board
EP1761114A3 (en) Circuit board
WO2008132913A1 (en) Multilayered ceramic substrate, process for producing the multilayered ceramic substrate, and electronic component
WO2003021669A1 (en) Composite structural material, and method of producing the same
EP1237397A3 (en) Insulating substrate boards for semiconductor and power modules
EP1298968A3 (en) Metal/ceramic circuit board
TW200618697A (en) Aluminum-silicon carbide composite
TW200613127A (en) Metallic laminate and method for preparing thereof
MY124850A (en) Substrate adhesion enhancement to film
EP1395103A3 (en) PCB Heatsink
WO2004038795A3 (en) Thermal-conductive substrate package