DE1246985B - Multi-layer sanded parquet board - Google Patents

Description

FEDERAL REPUBLIC OF GERMANY

GERMAN

PATENT OFFICE

EDITORIAL

Int. Cl .:

E04f

German KL: 37 d- 15/04

Number: 1246 985

File number: W 28858 V / 37 d

Filing date: November 7, 1960

Opened on: August 10, 1967

The invention relates to a multi-layer, sanded parquet board made of thin layers of wood adhesive edges protruding on two adjacent sides as connecting means.

It is known to produce two-layer parquet floors by placing the two layers of wood below one another be connected by means of a contact adhesive. Since the chopsticks of the The upper layer of wood is arranged vertically or diagonally to the sticks of the lower layer of wood Overlaps that allow the chopsticks of one layer of wood by means of the chopsticks of the to join another layer of wood in place. This parquet floor is ideal for precise prefabrication not suitable, since with parquet boards made of thin wood layers the overlap is only one layer Adhesive edges are not sufficient as a connecting means and when laying on uneven floors the butt joints would protrude from the edges. Known butt joints, e.g. B. tongue and groove, are only with much greater total thickness of the plates possible. However, a greater total thickness prevents that in one Parquet flooring of the specified type, necessary adaptation to the unevenness of the sub-floors.

In order to improve the adaptation to the sub-floor and with a low cost of materials get by, it is known to produce parquet panels from thin face and blind veneers. One Butt joint is not provided for these parquet panels, so that protruding at the butt joints Edges can only be avoided if the sub-floor is flat.

In addition, a rubber floor element with a wood fiber or plywood core is known in which at Adhesive edges protrude on two adjacent sides. However, this floor element is stiff in the middle and only soft at the edges, which means that unevenness is not yet properly leveled out can.

The invention is therefore based on the object of creating a prefabricated parquet board that has a requires little material, can be laid by unskilled workers and uneven subfloors compensates even without additional aids and still results in smooth board joints and without Connection to the sub-floor can be laid and easily resumed.

This object is achieved according to the invention in that the parquet board has two layers and that a flexible connecting layer is stuck to the sanded, flexible parquet board, whereby the underside of the parquet board and the upper multilayer sanded parquet board

Applicant:

Willem van Wingerden, Rotterdam (Netherlands)

Representative:

Dipl.-Ing. H. ν. Schumann,

Patent attorney and lawyer,

Munich 22, Widenmayerstr. 5

Named as inventor:
Willem van Wingerden,
Rotterdam (Netherlands)

side of the connecting layer are provided with contact adhesive over the entire surface.

Since the parquet boards are sanded to the exact dimensions before the connection layer is applied, the edges of adjacent panels are also of the same thickness. Protruding edges occur at the butt joints not because the adjacent edges are offset by the connecting layer that is arranged in relation to the parquet board are supported in the same way, even if the connecting layers are laid next to one another Parquet boards are unevenly thick or the sub-floor has unevenness.

Because the bottom of the parquet board and the top of the connecting layer already in the factory are provided with contact adhesive over the entire surface, the respective adhesive layers are also uniformly thick. In addition, they do not need to be applied on the spot, which means additional labor savings. When laying, it is sufficient to Place the speaking adhesive edges on top of each other and tap with a rubber mallet. On this simple one This way, a good connection of the parquet boards and a smooth butt joint will very quickly be achieved reached, even if the sub-floor has a hollow just below the butt joint.

There are also parquet strips milled out of solid wood with adhesive edges protruding on the sides known. However, these parquet strips must also take into account the direction of the wood fibers Milling process can be thicker than the parquet boards designed according to the invention on an uneven sub-floor with a contact

709 620/221

Claims (1)

glue should not be laid, because due to the stiffness of the parquet glue, there is hardly any proper connection would come. An embodiment of the invention is shown in the drawing, it shows F i g. 1 the top view of a parquet board, F i g. 2 shows the plan view of a floor covering composed of a plurality of these panels, whereby one or two layers of some plates are partially not shown. According to FIGS. 1 and 2, each parquet board consists of two layers 1 and 2, each made of thin Rods or friezes are assembled to which an offset connecting layer 3 is glued. The parquet board is trimmed and sanded to measure, and then completely covered with contact adhesive on the underside Mistake. The connecting layer 3, which in the exemplary embodiment consists of narrow strips, is provided with contact adhesive over the entire surface and is attached to the Parquet board glued on. The protruding adhesive edges are even with this procedure Provide contact adhesive. Claim: Multi-layer sanded parquet board made of thin layers of wood with two adjacent layers Adhesive edges protruding from the sides as connecting means, characterized in that the parquet board has two layers and that A flexible connecting layer is stuck to the fully sanded, flexible parquet board is, the underside of the parquet board and the top of the connecting layer are provided with contact adhesive over the entire surface. Considered publications:
German Patent No. 863,992;
German utility model No. 1 689 122,
740 559.1 762 705.1 783 414.1 793 921;
French patent specification No. 956 378. 1 sheet of drawings 709 620/221 7.67 © Bundesdruckerei Berlin