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DE10302923A1 - Elektronische Baugruppen - Google Patents

Elektronische Baugruppen Download PDF

Info

Publication number
DE10302923A1
DE10302923A1 DE2003102923 DE10302923A DE10302923A1 DE 10302923 A1 DE10302923 A1 DE 10302923A1 DE 2003102923 DE2003102923 DE 2003102923 DE 10302923 A DE10302923 A DE 10302923A DE 10302923 A1 DE10302923 A1 DE 10302923A1
Authority
DE
Germany
Prior art keywords
circuit board
electronic assembly
conductor
assembly according
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE2003102923
Other languages
German (de)
English (en)
Inventor
Udo Wozar
Sibyll Dipl.-Ing. König
Helmut Dipl.-Ing. Heinz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Priority to DE2003102923 priority Critical patent/DE10302923A1/de
Priority to PCT/DE2004/000063 priority patent/WO2004068533A2/fr
Priority to DE112004000039T priority patent/DE112004000039D2/de
Publication of DE10302923A1 publication Critical patent/DE10302923A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE2003102923 2003-01-24 2003-01-24 Elektronische Baugruppen Withdrawn DE10302923A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE2003102923 DE10302923A1 (de) 2003-01-24 2003-01-24 Elektronische Baugruppen
PCT/DE2004/000063 WO2004068533A2 (fr) 2003-01-24 2004-01-17 Procede pour realiser un module electronique
DE112004000039T DE112004000039D2 (de) 2003-01-24 2004-01-17 Verfahren zur Herstellung einer elektronischen Baugruppe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2003102923 DE10302923A1 (de) 2003-01-24 2003-01-24 Elektronische Baugruppen

Publications (1)

Publication Number Publication Date
DE10302923A1 true DE10302923A1 (de) 2004-07-29

Family

ID=32602944

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2003102923 Withdrawn DE10302923A1 (de) 2003-01-24 2003-01-24 Elektronische Baugruppen
DE112004000039T Expired - Fee Related DE112004000039D2 (de) 2003-01-24 2004-01-17 Verfahren zur Herstellung einer elektronischen Baugruppe

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112004000039T Expired - Fee Related DE112004000039D2 (de) 2003-01-24 2004-01-17 Verfahren zur Herstellung einer elektronischen Baugruppe

Country Status (2)

Country Link
DE (2) DE10302923A1 (fr)
WO (1) WO2004068533A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008058782A1 (fr) * 2006-11-13 2008-05-22 Robert Bosch Gmbh Agencement circuit électronique qui présente au moins un circuit imprimé souple et procédé pour le relier à un deuxième circuit

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3500411C2 (de) * 1985-01-08 1994-03-31 Siemens Ag Verfahren zum Lötverbinden der Leiterbahnen einer flexiblen gedruckten Leitung oder Schaltung mit den Anschlußflächen einer Leiterplatte
US5764497A (en) * 1995-11-13 1998-06-09 Minolta Co, Ltd. Circuit board connection method and connection structure
DE19832062A1 (de) * 1998-07-16 2000-01-27 Siemens Ag Steuergerät für ein Kraftfahrzeug
US6093894A (en) * 1997-05-06 2000-07-25 International Business Machines Corporation Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0964608A3 (fr) * 1998-06-12 2001-09-05 Ford Motor Company Procédé de soudage par laser
JP2001357916A (ja) * 2000-06-13 2001-12-26 Yazaki Corp フラット回路体の接続構造
US6833526B2 (en) * 2001-03-28 2004-12-21 Visteon Global Technologies, Inc. Flex to flex soldering by diode laser
DE10224266A1 (de) * 2002-05-31 2003-12-11 Conti Temic Microelectronic Elektronische Baugruppe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3500411C2 (de) * 1985-01-08 1994-03-31 Siemens Ag Verfahren zum Lötverbinden der Leiterbahnen einer flexiblen gedruckten Leitung oder Schaltung mit den Anschlußflächen einer Leiterplatte
US5764497A (en) * 1995-11-13 1998-06-09 Minolta Co, Ltd. Circuit board connection method and connection structure
US6093894A (en) * 1997-05-06 2000-07-25 International Business Machines Corporation Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer
DE19832062A1 (de) * 1998-07-16 2000-01-27 Siemens Ag Steuergerät für ein Kraftfahrzeug

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008058782A1 (fr) * 2006-11-13 2008-05-22 Robert Bosch Gmbh Agencement circuit électronique qui présente au moins un circuit imprimé souple et procédé pour le relier à un deuxième circuit

Also Published As

Publication number Publication date
WO2004068533A3 (fr) 2004-10-07
WO2004068533A2 (fr) 2004-08-12
DE112004000039D2 (de) 2005-06-30

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8143 Withdrawn due to claiming internal priority