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DE112004000039D2 - Verfahren zur Herstellung einer elektronischen Baugruppe - Google Patents

Verfahren zur Herstellung einer elektronischen Baugruppe

Info

Publication number
DE112004000039D2
DE112004000039D2 DE112004000039T DE112004000039T DE112004000039D2 DE 112004000039 D2 DE112004000039 D2 DE 112004000039D2 DE 112004000039 T DE112004000039 T DE 112004000039T DE 112004000039 T DE112004000039 T DE 112004000039T DE 112004000039 D2 DE112004000039 D2 DE 112004000039D2
Authority
DE
Germany
Prior art keywords
producing
electronic assembly
electronic
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE112004000039T
Other languages
English (en)
Inventor
Udo Wozar
Heinz Helmut
Sybill Koenig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of DE112004000039D2 publication Critical patent/DE112004000039D2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE112004000039T 2003-01-24 2004-01-17 Verfahren zur Herstellung einer elektronischen Baugruppe Expired - Fee Related DE112004000039D2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2003102923 DE10302923A1 (de) 2003-01-24 2003-01-24 Elektronische Baugruppen
PCT/DE2004/000063 WO2004068533A2 (de) 2003-01-24 2004-01-17 Verfahren zur herstellung einer elektronischen baugruppe

Publications (1)

Publication Number Publication Date
DE112004000039D2 true DE112004000039D2 (de) 2005-06-30

Family

ID=32602944

Family Applications (2)

Application Number Title Priority Date Filing Date
DE2003102923 Withdrawn DE10302923A1 (de) 2003-01-24 2003-01-24 Elektronische Baugruppen
DE112004000039T Expired - Fee Related DE112004000039D2 (de) 2003-01-24 2004-01-17 Verfahren zur Herstellung einer elektronischen Baugruppe

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE2003102923 Withdrawn DE10302923A1 (de) 2003-01-24 2003-01-24 Elektronische Baugruppen

Country Status (2)

Country Link
DE (2) DE10302923A1 (de)
WO (1) WO2004068533A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006053312A1 (de) * 2006-11-13 2008-06-19 Robert Bosch Gmbh Elektronische Schaltungsanordnung mit mindestens einer flexiblen gedruckten Schaltung und Verfahren zu deren Verbindung mit einer zweiten Schaltung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3500411C2 (de) * 1985-01-08 1994-03-31 Siemens Ag Verfahren zum Lötverbinden der Leiterbahnen einer flexiblen gedruckten Leitung oder Schaltung mit den Anschlußflächen einer Leiterplatte
JPH09139559A (ja) * 1995-11-13 1997-05-27 Minolta Co Ltd 回路基板の接続構造
US6093894A (en) * 1997-05-06 2000-07-25 International Business Machines Corporation Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer
EP0964608A3 (de) * 1998-06-12 2001-09-05 Ford Motor Company Verfahren zum Laserlöten
DE19832062C2 (de) * 1998-07-16 2001-03-01 Siemens Ag Steuergerät für ein Kraftfahrzeug
JP2001357916A (ja) * 2000-06-13 2001-12-26 Yazaki Corp フラット回路体の接続構造
US6833526B2 (en) * 2001-03-28 2004-12-21 Visteon Global Technologies, Inc. Flex to flex soldering by diode laser
DE10224266A1 (de) * 2002-05-31 2003-12-11 Conti Temic Microelectronic Elektronische Baugruppe

Also Published As

Publication number Publication date
WO2004068533A2 (de) 2004-08-12
WO2004068533A3 (de) 2004-10-07
DE10302923A1 (de) 2004-07-29

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Legal Events

Date Code Title Description
8181 Inventor (new situation)

Inventor name: KOENIG, SYBILL, DIPL.-ING. (TU), 86706 WEICHERING,

Inventor name: WOZAR, UDO, 86643 RENNERTSHOFEN, DE

Inventor name: HELMUT, HEINZ, DIPL.-ING., 91522 ANSBACH, DE

8110 Request for examination paragraph 44
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee