DE10254783A1 - Flexible printed circuit board for a foil keypad/foil-covered keypad has a conductive coating with segments between strip conductors produced by applying a conductive coating - Google Patents
Flexible printed circuit board for a foil keypad/foil-covered keypad has a conductive coating with segments between strip conductors produced by applying a conductive coating Download PDFInfo
- Publication number
- DE10254783A1 DE10254783A1 DE2002154783 DE10254783A DE10254783A1 DE 10254783 A1 DE10254783 A1 DE 10254783A1 DE 2002154783 DE2002154783 DE 2002154783 DE 10254783 A DE10254783 A DE 10254783A DE 10254783 A1 DE10254783 A1 DE 10254783A1
- Authority
- DE
- Germany
- Prior art keywords
- keyboards
- foil
- circuit board
- conductive coating
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 18
- 238000000576 coating method Methods 0.000 title claims abstract description 14
- 239000011248 coating agent Substances 0.000 title claims abstract description 12
- 239000011888 foil Substances 0.000 title claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 239000010949 copper Substances 0.000 claims abstract description 3
- 239000012528 membrane Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 10
- 238000000227 grinding Methods 0.000 claims description 4
- 239000002966 varnish Substances 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 3
- 238000001311 chemical methods and process Methods 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims description 2
- 238000000608 laser ablation Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 239000003973 paint Substances 0.000 abstract description 4
- 239000004922 lacquer Substances 0.000 abstract description 3
- 238000003698 laser cutting Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/78—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites
- H01H13/785—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites characterised by the material of the contacts, e.g. conductive polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2201/00—Contacts
- H01H2201/022—Material
- H01H2201/024—Material precious
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2207/00—Connections
- H01H2207/04—Details of printed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/016—Selective etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/02—Laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Die Erfindung betrifft eine leitfähig beschichtete flexible Leiterplatte für Folientastaturen und/oder folienabgedeckte Tastaturen, wobei die leitfähig beschichtete flexible Leiterplatte, die kupferkaschiert oder mit Silberleitlack beschichtet sein kann, durch Materialabtrag der leitenden Beschichtung hergestellt wird, wobei die Segmente und/oder Bereiche zwischen den Leiterbahnen abgetragen werden und der Materialabtrag durch mechanische und/oder chemische Verfahren und/oder Laserverfahren und/oder Schleifen erfolgt.The invention relates to a conductive coated flexible circuit board for Membrane keyboards and / or foil-covered keyboards, the conductive coated flexible circuit board, copper-clad or with Silver conductive varnish can be coated by removing the conductive material Coating is produced, the segments and / or areas between the conductor tracks are removed and the material removal by mechanical and / or chemical processes and / or laser processes and / or grinding takes place.
Bisher werden leitfähig beschichtete flexible Leiterplatten für Folientastaturen und/oder folienabgedeckte Tastaturen im Siebdruckverfahren hergestellt, wobei zunächst Filme und Siebe mit den Leiterbahnen erstellt werden müssen. Dies ist sehr zeit-, material- und arbeitsaufwendig, was bei kleinen Stückzahlen zu hohen Stückkosten führt. Weiter ist bekannt, daß kupferkaschierte flexible Leiterplatten im Ätzverfahren hergestellt werden und als flexible Leiterplatten für folienabgedeckte Tastaturen auf Leiterplattenbasis verwendet werden.So far, conductive coatings have been used flexible circuit boards for Membrane keyboards and / or foil-covered keyboards in the screen printing process manufactured, initially Films and screens must be created with the conductor tracks. This is very time, material and labor intensive, what with small quantities at high unit costs leads. It is also known that copper-clad flexible printed circuit boards in the etching process be produced and as flexible circuit boards for foil-covered PCB-based keyboards can be used.
Aufgabe der Erfindung ist es, eine leitfähig beschichtete flexible Leiterplatte für Folientastaturen und/oder folienabgedeckte Tastaturen der eingangs genannten Art zu schaffen, bei denen die erforderlichen Leiterbahnen durch Materialabtrag der leitenden Beschichtung in den betreffenden Bereichen erreicht wird und nicht durch Bedrucken bzw. Ätzen erfolgt.The object of the invention is a conductive coated flexible circuit board for Membrane keyboards and / or membrane-covered keyboards of the aforementioned Kind of creating the required traces through Material removal of the conductive coating in the areas concerned is achieved and is not done by printing or etching.
Diese Aufgabe wird bei leitfähig beschichteten flexiblen Leiterplatten für Folientastaturen und/oder folienabgedeckte Tastaturen dadurch gelöst, daß bei einer mit Silberleitlack oder ähnlichen leitenden Beschichtungen beschichteten flexiblen Leiterplatte die Bereiche außerhalb der Leiterbahnen durch entsprechende Verfahren wie Laserbearbeitung und/oder Polieren und/oder Schleifen o.ä. abtragende Verfahren auf chemischen und/oder mechanischem Wege entfernt werden und nur noch die Leiterbahnen stehen bleiben.This task is coated with conductive flexible circuit boards for Membrane keyboards and / or foil-covered keyboards solved in that at one with conductive silver paint or similar conductive Coatings coated the PCB's flexible areas outside the conductor tracks by appropriate methods such as laser processing and / or polishing and / or grinding or the like ablative procedures chemical and / or mechanical ways are removed and only the conductor tracks stop.
Bei einer bevorzugten Ausführungsform leitfähig beschichteten flexibler Leiterplatten für Folientastaturen und/oder folienabgedeckte Tastaturen werden bei einer mit Silberleitlack beschichteten flexiblen Leiterplatte die Segmente bzw. Bereiche zwischen den Leiterbahnen durch Materialabtrag entfernt, wobei der Materialabtrag mit Laserabtragverfahren erfolgt.In a preferred embodiment conductive coated flexible printed circuit boards for membrane keyboards and / or Foil-covered keyboards are used with a silver conductive varnish coated flexible circuit board the segments or areas removed between the conductor tracks by material removal, the Material removal takes place with laser removal processes.
Bei einer weiteren bevorzugten Ausführungsform werden bei einer kupferkaschierten flexiblen Leiterplatte die Segmente bzw. Bereiche zwischen den Leiterbahnen durch Polieren und/oder Schleifen entfernt.In a further preferred embodiment the segments of a copper-clad flexible circuit board or areas between the conductor tracks by polishing and / or grinding away.
Die Erfindung wird anhand eines in der Zeichnung dargestellten Ausführungsbeispieles näher erläutert. Es zeigen:The invention is based on a the drawing shown embodiment explained in more detail. It demonstrate:
In den Figuren bezeichnen, sofern nicht anders angegeben, gleiche Bezugsquellen gleiche Teile mit gleicher Bedeutung.Designate in the figures, if not stated otherwise, the same sources of supply use the same parts of equal importance.
- 1.1.
- Flexible Leiterplatteflexible circuit board
- 2.Second
- Silberleitlacksilver lacquer
- 3.Third
- Kupferkaschierungcopper cladding
- 4.4th
- Leiterbahnconductor path
- 5.5th
- Bereich zwischen den LeiterbahnenArea between the conductor tracks
In
In
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2002154783 DE10254783A1 (en) | 2002-11-22 | 2002-11-22 | Flexible printed circuit board for a foil keypad/foil-covered keypad has a conductive coating with segments between strip conductors produced by applying a conductive coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2002154783 DE10254783A1 (en) | 2002-11-22 | 2002-11-22 | Flexible printed circuit board for a foil keypad/foil-covered keypad has a conductive coating with segments between strip conductors produced by applying a conductive coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10254783A1 true DE10254783A1 (en) | 2004-06-03 |
Family
ID=32240348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2002154783 Withdrawn DE10254783A1 (en) | 2002-11-22 | 2002-11-22 | Flexible printed circuit board for a foil keypad/foil-covered keypad has a conductive coating with segments between strip conductors produced by applying a conductive coating |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE10254783A1 (en) |
-
2002
- 2002-11-22 DE DE2002154783 patent/DE10254783A1/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8141 | Disposal/no request for examination |