DE10254782A1 - Flexible printed circuit board for a foil keypad/foil-covered keypad, has a conductive coating with segments between strip conductors produced by applying a conductive coating - Google Patents
Flexible printed circuit board for a foil keypad/foil-covered keypad, has a conductive coating with segments between strip conductors produced by applying a conductive coating Download PDFInfo
- Publication number
- DE10254782A1 DE10254782A1 DE2002154782 DE10254782A DE10254782A1 DE 10254782 A1 DE10254782 A1 DE 10254782A1 DE 2002154782 DE2002154782 DE 2002154782 DE 10254782 A DE10254782 A DE 10254782A DE 10254782 A1 DE10254782 A1 DE 10254782A1
- Authority
- DE
- Germany
- Prior art keywords
- foil
- keyboards
- conductive coating
- covered
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 17
- 238000000576 coating method Methods 0.000 title claims abstract description 14
- 239000011248 coating agent Substances 0.000 title claims abstract description 12
- 239000011888 foil Substances 0.000 title claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- 239000012528 membrane Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000001311 chemical methods and process Methods 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims 1
- 238000000608 laser ablation Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000004922 lacquer Substances 0.000 abstract description 4
- 239000003973 paint Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 abstract 1
- 239000002966 varnish Substances 0.000 description 2
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/78—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites
- H01H13/785—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by the contacts or the contact sites characterised by the material of the contacts, e.g. conductive polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2201/00—Contacts
- H01H2201/022—Material
- H01H2201/024—Material precious
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2207/00—Connections
- H01H2207/04—Details of printed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/016—Selective etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2229/00—Manufacturing
- H01H2229/02—Laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Die Erfindung betrifft eine leitfähig beschichtete Folie für Folientastaturen und/oder folienabgedeckte Tastaturen, wobei die leitfähig beschichtete Folie durch Materialabtrag der leitenden Beschichtung hergestellt wird, wobei der Materialabtrag durch mechanische und/oder chemische Verfahren und/oder Laserverfahren und/oder Schleifen erfolgt.The invention relates to a conductive coated Slide for Membrane keyboards and / or foil-covered keyboards, the conductive coated film by material removal of the conductive coating is produced, the removal of material by mechanical and / or chemical process and / or laser process and / or grinding takes place.
Bisher werden leiftähig beschichtete Folien für Folientastaturen und/oder folienabgedeckte Tastaturen im Siebdruckverfahren hergestellt, wobei zunächst Filme und Siebe mit den Leiterbahnen erstellt werden müssen. Dies ist, sehr zeit-, material- und arbeitsaufwendig, was bei kleinen Stückzahlen zu hohen Stückkosten führt.So far, conductive coatings have been applied Foils for Membrane keyboards and / or foil-covered keyboards in the screen printing process manufactured, initially Films and screens must be created with the conductor tracks. This is, very time, material and labor consuming, what small numbers at high unit costs leads.
Aufgabe der Erfindung ist es, eine leitfähig beschichtete Folie für Folientastaturen und/oder folienabgedeckte Tastaturen der eingangs genannten Art zu schaffen, bei denen die erforderlichen Leiterbahnen durch Materialabtrag der leitenden Beschichtung in den betreffenden Bereichen erreicht wird und nicht durch Bedrucken erfolgt.The object of the invention is a conductive coated Slide for Membrane keyboards and / or foil-covered keyboards of the beginning to create the type mentioned, in which the required conductor tracks by removing the conductive coating from the material in question Areas is reached and not done by printing.
Diese Aufgabe wird bei leitfähig beschichteten Folien für Folientastaturen und/oder folienabgedeckte Tastaturen dadurch gelöst, daß bei einer mit Silberleitlack oder ähnlichen leitenden Beschichtungen die Bereiche außerhalb der Leiterbahnen durch entsprechende Verfahren wie Laserbearbeitung und/oder Polieren und/oder Schleifen o.ä. abtragende Verfahren auf chemischen und/oder mechanischem Wege entfernt werden und nur noch die Leiterbahnen stehen bleiben.This task is coated with conductive Foils for Membrane keyboards and / or foil-covered keyboards solved in that at one with conductive silver varnish or similar conductive coatings the areas outside the conductor tracks by appropriate Processes such as laser processing and / or polishing and / or grinding etc. ablative Processes are removed by chemical and / or mechanical means and only the conductor tracks remain.
Bei einer bevorzugten Ausführungsform leitfähig beschichteten und/oder kupferkaschierten Folien für Folientastaturen und/oder folienabgedeckte Tastaturen werden bei einer mit Silberleitlack beschichteten Folie die Segmente bzw. Bereiche zwischen den Leiterbahnen durch Materialabtrag entfernt, wobei der Materialabtrag mit Laserabtragverfahren erfolgt.In a preferred embodiment conductive coated and / or copper-clad foils for membrane keyboards and / or foil-covered keyboards are used with a conductive silver lacquer coated film the segments or areas between the conductor tracks removed by material removal, the material removal using laser removal processes he follows.
Bei einer weiteren bevorzugten Ausführungsform werden Segmente bzw. Bereiche zwischen den Leiterbahnen durch Polieren und/oder Schleifen im Bereich entfernt.In a further preferred embodiment segments or areas between the conductor tracks by polishing and / or loops in the area.
Die Erfindung wird anhand eines in der Zeichnung dargestellten Ausführungsbeispieles näher erläutert. Es zeigen:The invention is based on a the drawing shown embodiment explained in more detail. It demonstrate:
In den Figuren bezeichnen, sofern nicht anders angegeben, gleiche Bezugsquellen gleiche Teile mit gleicher Bedeutung.Designate in the figures, if not stated otherwise, the same sources of supply use the same parts of equal importance.
- 1.1.
- Foliefoil
- 2.Second
- Silberleitlacksilver lacquer
- 3.Third
- Leiterbahnconductor path
- 4.4th
- Bereich zwischen den LeiterbahnenArea between the conductor tracks
In
In
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2002154782 DE10254782A1 (en) | 2002-11-22 | 2002-11-22 | Flexible printed circuit board for a foil keypad/foil-covered keypad, has a conductive coating with segments between strip conductors produced by applying a conductive coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2002154782 DE10254782A1 (en) | 2002-11-22 | 2002-11-22 | Flexible printed circuit board for a foil keypad/foil-covered keypad, has a conductive coating with segments between strip conductors produced by applying a conductive coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10254782A1 true DE10254782A1 (en) | 2004-06-03 |
Family
ID=32240347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2002154782 Withdrawn DE10254782A1 (en) | 2002-11-22 | 2002-11-22 | Flexible printed circuit board for a foil keypad/foil-covered keypad, has a conductive coating with segments between strip conductors produced by applying a conductive coating |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE10254782A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012206973A1 (en) * | 2012-04-26 | 2013-10-31 | Osram Gmbh | Method for producing conductor tracks in copper layer of substrate e.g. direct copper bonded (DCB) substrate used for mounting LED in LED module, involves forming copper layer with specific region having reduced thickness |
| WO2016004921A1 (en) * | 2014-07-09 | 2016-01-14 | Carmen Diegel | Sensor device having a flexible electrical conductor structure |
-
2002
- 2002-11-22 DE DE2002154782 patent/DE10254782A1/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012206973A1 (en) * | 2012-04-26 | 2013-10-31 | Osram Gmbh | Method for producing conductor tracks in copper layer of substrate e.g. direct copper bonded (DCB) substrate used for mounting LED in LED module, involves forming copper layer with specific region having reduced thickness |
| DE102012206973B4 (en) * | 2012-04-26 | 2021-02-18 | Ledvance Gmbh | METHOD OF CREATING CONDUCTOR TRACKS AND SUBSTRATE |
| WO2016004921A1 (en) * | 2014-07-09 | 2016-01-14 | Carmen Diegel | Sensor device having a flexible electrical conductor structure |
| US10098223B2 (en) | 2014-07-09 | 2018-10-09 | Schreiner Group Gmbh & Co. Kg | Sensor device with a flexible electrical conductor structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8141 | Disposal/no request for examination |