DE10252308B3 - Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region - Google Patents
Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region Download PDFInfo
- Publication number
- DE10252308B3 DE10252308B3 DE2002152308 DE10252308A DE10252308B3 DE 10252308 B3 DE10252308 B3 DE 10252308B3 DE 2002152308 DE2002152308 DE 2002152308 DE 10252308 A DE10252308 A DE 10252308A DE 10252308 B3 DE10252308 B3 DE 10252308B3
- Authority
- DE
- Germany
- Prior art keywords
- battery
- circuit board
- intermediate layer
- cutout
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Revoked
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 239000011265 semifinished product Substances 0.000 title abstract description 11
- 238000000034 method Methods 0.000 claims description 13
- 239000000834 fixative Substances 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 claims 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 29
- 239000000463 material Substances 0.000 description 17
- 239000011229 interlayer Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10037—Printed or non-printed battery
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Die Erfindung betrifft allgemein das technische Gebiet von Leiterplatten, welche einseitig oder beidseitig oder auch in Zwischenlagen mit Leitermustern versehen sind und welche mit einer Spannungsquelle und/oder einer Stromquelle verbunden werden, um die auf der Leiterplatte oder in der Leiterplatte vorgesehenen Schaltungen mit elektrischer Energie zu speisen.The invention relates generally the technical field of printed circuit boards which are single-sided or double-sided or are provided with conductor patterns in intermediate layers and which be connected to a voltage source and / or a current source, around those provided on the printed circuit board or in the printed circuit board To supply circuits with electrical energy.
Es ist allgemein bekannt, insbesondere mobile elektronische Geräte mit in einem Wechselfach untergebrachten Batterien oder wiederaufladbaren Akkus zu versehen, welche die zentrale Versorgung der gesamten elektronischen Schaltung des betreffenden mobilen Gerätes darstellen.It is well known, especially mobile electronic devices with batteries or rechargeable batteries housed in an interchangeable compartment to provide the central supply of all electronic Show circuit of the relevant mobile device.
Die auswechselbaren Batterien oder Akkus haben beträchtlichen Raumbedarf und das für sie vorzusehende Wechselfach begrenzt die für den Konstrukteur zur Verfügung stehenden Abmessungen der im Gerät vorgesehenen Leiterplatten oder Schaltungsträgerplatten. Die Zuleitungen für die elektrische Energie von den Batterien oder Akkus zu den Schaltungsteilen der Leiterplatten nehmen auf letzteren beträchtliche Leitermusterfläche in Anspruch.The replaceable batteries or Batteries have considerable Space requirements and that for the interchangeable subject to be provided limits the ones available for the designer Dimensions of the in the device provided circuit boards or circuit board. The supply lines for the electrical Energy from the batteries or accumulators to the circuit parts of the Printed circuit boards take up considerable conductor pattern area on the latter.
Werden Stromquellen oder Spannungsquellen in der üblichen Weise auf den Leiterplatten montiert, so bereitet es Schwierigkeiten, Leiterplatten mit darauf angeordneten Stromquellen oder Spannungsquellen übereinander zu stapeln, da aufgrund der Abmessungen der Stromquelle oder Spannungsquelle die Abstände zwischen gestapelten Leiterplatten nicht unter ein bestimmtes Maß verringert werden können.Become current sources or voltage sources in the usual Way mounted on the circuit boards, so it is difficult Printed circuit boards with current sources or voltage sources arranged one above the other to stack because of the dimensions of the current source or voltage source distances between stacked circuit boards not reduced below a certain level can be.
Aus der
Aus der US-Patentschrift 5018051 ist es bekannt, eine mehrschichtige Leiterplatte unter Verwendung einer isolierenden Zwischenschicht herzustellen, in welcher Ausschnitte zur Aufnahme von elektronischen Bauelementen oder von dünnen Gleichstrombatterien vorgesehen sind. Die Ausschnitte oder Ausnehmungen der isolierenden Zwischenschicht haben eine Dicke, welche an die Dicke der eingesetzten elektronischen Bauteile oder Batterieelemente angepaßt ist, so daß diese in die Ausschnitte eingebettet sind. Über die isolierende Zwischenschicht und über die darin eingebetteten elektronischen Bauteile oder Batterieelemente werden dann bei der bekannten Leiterplatte weitere Isolierschichten und auf diesen wiederum angeordnete Leitermuster gebreitet, wobei diese Leitermuster in zueinander senkrechten Koordinatenrichtungen verlaufen und über Durchkontaktierungen mit den Anschlüssen der elektronischen Bauteile oder der Batterieelemente verbunden werden. In Randbereichen der bekannten Leiterplatte ist die isolierende Zwischenschicht mit einer Anschlußkontaktreihe versehen, deren Dicke der Gesamtdicke der weiteren Isolierschichten entspricht.From U.S. Patent 5018051 it is known to use a multilayer printed circuit board to produce an insulating intermediate layer in which cutouts for holding electronic components or thin DC batteries are provided. The cutouts or recesses of the insulating Interlayer have a thickness that matches the thickness of the used is adapted to electronic components or battery elements, so this in which cutouts are embedded. Over the insulating intermediate layer and over the electronic components or battery elements embedded in it are then further insulation layers in the known circuit board and again arranged on this arranged conductor pattern, whereby these conductor patterns in mutually perpendicular coordinate directions run and over Vias with the connections of the electronic components or the battery elements are connected. In marginal areas of the known circuit board is the insulating intermediate layer with a Terminal contact row provided, the thickness of the total thickness of the further insulating layers equivalent.
Es ist Aufgabe der vorliegenden Erfindung, eine Halberzeugnisleiterplatte zu schaffen, mittels welcher das von einer Leiterplatte mit zugehöriger Stromversorgung und Spannungsversorgung eingenommene Volumen extrem flach gestaltet werden kann wobei unter Verwendung der nach dem angegebenen Verfahren gefertigten Halberzeugnisleiterplatten noch flachere und handlichere Baugruppen aufgebaut werden können, als dies mit bekannten Leiterplattenkonstruktionen möglich ist.It is an object of the present invention To create semi-product circuit board, by means of which the one PCB with associated power supply and power supply volume designed extremely flat can be made using the method indicated manufactured semi-finished circuit boards even flatter and more manageable Assemblies can be built than is possible with known circuit board designs.
Diese Aufgabe wird erfindungsgemäß durch ein Verfahren mit den Merkmalen des Anspruches 1 gelöst.This object is achieved by a Method with the features of claim 1 solved.
Vorteilhafte Ausgestaltungen und Weiterbildungen der in diesem Anspruch definierten Gedanken bilden Gegenstand der nachgeordneten Patentansprüche.Advantageous configurations and Develop further developments of the ideas defined in this claim Subject of the subordinate claims.
Einer Diskussion von Ausführungsbeispielen seien folgende allgemeine Betrachtungen vorausgeschickt: Der Erfindung baut auf der Erkenntnis auf, daß gegenwärtig Dünnfilm-Lithiumbatterien und Dünnfilm-Lithiumionenbatterien sowie auch andere Arten von extrem flach bauenden Batterien und Akkus zur Verfügung stehen, die in solchem Maße temperaturfest und druckresistent sind, daß sie bei entsprechender Auswahl der Parameter für die Herstellung von Leiterplatten den dabei auftretenden Temperaturen und Drücken widerstehen, wodurch es möglich wird, solche Batterie- oder Akkuelemente in Leiterplatten zu integrieren, derart, daß sie nicht über die Umrisse einer Leiterplatte vorstehen, so daß eine Leiterplatte mit ihr zugeordneten Strom- und/oder Spannungsquellen in einer Form geschaffen werden kann, die sich von einer herkömmlichen Leiterplatte nicht unterscheidet, welche letztere über gesondert vorzusehende Leiterpfade mit einer Strom- und/oder Spannungsquelle verbunden werden muß.A discussion of exemplary embodiments Given the following general considerations: The invention builds on the realization that thin film lithium batteries are currently and thin film lithium ion batteries as well as other types of extremely flat batteries and Batteries available stand to such an extent They are temperature-resistant and pressure-resistant if they are selected accordingly the parameter for the production of printed circuit boards the temperatures that occur and press resist what makes it possible will integrate such battery or accumulator elements in printed circuit boards, such that they not about that Outline a circuit board so that a circuit board with it assigned current and / or voltage sources created in one form can be different from a conventional circuit board distinguishes which latter about separately provided conductor paths with a current and / or voltage source must be connected.
Bei vergleichsweise einfacher Herstellung einer Halberzeugnisleiterplatte in der hier angegebenen Art vereinfacht sich zusätzlich der Schaltungs- und Montageaufwand, weil die Halberzeugnisleiterplatte bei der Weiterverarbeitung zur Bildung einer Mehrschichtleiterplatte als einstöckige Baueinheit handhabbar ist. Die an der Halberzeugnisleiterplatte zur Verfügung stehenden Flächen für Leitungsmuster werden wesentlich vergrößert und bei der Stapelung mehrerer Leiterplatten kann ihr Abstand in solchen Fällen beträchtlich verringert werden, in denen bisher aufgrund dazwischenliegender Batterie- oder Akkuelemente ein bestimmter Mindestabstand einzuhalten war.With a comparatively simple manufacture of a semi-finished printed circuit board in the manner specified here, the circuitry and assembly outlay are additionally simplified because the semi-finished printed circuit board is a single-storey unit during further processing to form a multilayer printed circuit board is manageable. The areas available for the line pattern on the semifinished printed circuit board are considerably enlarged and their spacing can be considerably reduced when several printed circuit boards are stacked in those cases in which a certain minimum distance had to be maintained up to now due to intervening battery or battery elements.
Das hier vorgeschlagene Konzept ermöglicht es, innerhalb eines an oder in einer Leiterplatte vorgesehenen Schaltungsmusters bestimmten Schaltungsbereichen jeweils gesonderte Strom- und/oder Spannungsquellen zuzuordnen. Handelt es sich bei den Strom- und/oder Spannungsquellen um wiederaufladbare Elemente, so können diese bedarfsweise nach einem bestimmten Ladeprogramm wieder aufgeladen werden. Innerhalb einer Leiterplatte können mehrere Strom- und/oder Spannungsquellen von unterschiedlichen Spannungsniveau vorgesehen werden, was in bestimmten Fällen den gesamten Schaltungsaufbau vorteilhaft beeinflußt.The concept proposed here enables within a circuit pattern provided on or in a printed circuit board specific circuit areas each have separate current and / or voltage sources assigned. Is it the current and / or voltage sources to rechargeable items, these can be used as needed can be recharged using a specific charging program. Within A circuit board can have several Current and / or voltage sources of different voltage levels be provided, which in certain cases the entire circuit structure advantageously influenced.
Dann, wenn das Herstellungsverfahren für eine Halberzeugnisleiterplatte der hier angegebenen Art so gewählt ist, daß für die Verbindung ihrer Schichten bzw. Lagen nur mäßige Temperaturen und Drücke zur Aushärtung des verwendeten Kunstharzes zur Anwendung kommen, können selbstverständlich entsprechende Batterie- oder Akkuelemente in die in der Zwischenschicht oder in den Zwischenschichten vorgesehenen Ausschnitte eingesetzt und darin eingebettet werden, die eine geringere Widerstandsfähigkeit gegenüber erhöhten Temperaturen und erhöhten Drücken haben.Then when the manufacturing process for one Semi-product circuit board of the type specified here is selected so that for connection their layers or layers only moderate temperatures and pressures for curing of the synthetic resin used can of course be used accordingly Battery elements in the intermediate layer or in the cutouts provided in the interlayers and therein be embedded, the lower resilience across from increased Temperatures and elevated To press to have.
Es sei hier noch bemerkt, daß das Einsetzten von Batterie- oder Akkuelementen in Ausschnitte einer Zwischenschicht oder von Zwischenschichten der Leiterplatte gemäß einer anderen Ausbildung auch in von den Seitenrändern der Leiterplatte zugängliche Ausschnitte nach Herstellung der Leiterplatte im übrigen vorgenommen werden kann, wenn für ein solchen seitliches Einsetzen das betreffende Batterie- oder Akkuelement oder die betreffenden Batterie- oder Akkuelemente entsprechende Eigensteifigkeit besitzt bzw. besitzen.It should be noted here that the use of Battery elements in sections of an intermediate layer or of intermediate layers of the printed circuit board according to another embodiment in from the side edges accessible to the circuit board Cut-outs made after the manufacture of the circuit board can be if for such a lateral insertion of the battery or Battery element or the relevant battery or battery elements corresponding Has or has inherent rigidity.
Weitere Vorteile und Ausgestaltungen des hier angegebenen Verfahrens ergeben sich aus der nachfolgenden Beschreibung von Ausführungsbeispielen unter Bezugnahme auf die Zeichnung. In dieser stellen dar:Further advantages and configurations of the method specified here result from the following Description of exemplary embodiments with reference to the drawing. In this represent:
In den jeweiligen Ausschnitt
Die Dicke des Batterie- oder Akkuelementes
Durch Fixierungsmittel
Die Befestigungsmittel
Eine Form eines Halberzeugnisses
der hier angegebenen Art sieht vor, daß die Befestigungsmittel
Es sei an dieser Stelle bemerkt, daß unter einer Prepreg-Bahn im allgemeinen eine mit einem noch nicht ausgehärteten Kunstharz imprägnierte Faservliesbahn zu verstehen ist.It should be noted at this point that under a prepreg sheet generally one with a not yet hardened synthetic resin impregnated nonwoven web is to be understood.
Bei der Ausführungsform des Halberzeugnisses
nach
Vorteilhaft ist bei der Ausführungsform
nach
Während
bei der Ausführungsform
nach
Gemäß einer in der Zeichnung nicht
gezeigten Abwandlung des Halberzeugnisses nach
Über
dem Schichtenverband mit den Platten
Bei der Herstellung der Mehrschicht-Leiterplatte
nach
Die Leitermuster
Es sei hier noch bemerkt, daß selbstverständlich die
zwischen den beiden jeweils Zwischenschichten ausbildenden Platten
Gegenüber zuvor angedeuteten Ausführungsformen,
bei denen ein flaches Batterie- oder Akkuelement in zum Rand eines
Plattenmaterials
Letztgenannte, bevorzugte Ausführungsformen sehen vornehmlich eine dauerhafte, Bestandteil des Herstellungsverfahrens bildende Kontaktierung zwischen den Batterie- oder Akkuelementen und den Leitermustern vor.The latter preferred embodiments primarily see a permanent, part of the manufacturing process Forming contact between the battery or battery elements and the ladder pattern.
Leiterplatten der hier angegebenen Art können entweder der ausschließlichen Stromversorgung der auf ihnen vorgesehenen Schaltungen, gegebenenfalls auf unterschiedlichen Spannungs- und/oder Stromniveaus dienen oder können auch der Datensicherung bei Stromausfall dienen.Printed circuit boards of the specified here Kind can either the exclusive Power supply to the circuits provided on them, if necessary serve at different voltage and / or current levels or can also serve as data backup in the event of a power failure.
Abschließend sei darauf hingewiesen, daß im Rahmen der hier gegebenen Beschreibung von Ausführungsformen auch Merkmalskombinationen jedweder Art von Merkmalen unterschiedlicher Ausführungsformen als offenbart zu betrachten sind.Finally, it should be noted that in Within the scope of the description of embodiments given here, combinations of features of any kind Kind of features of different embodiments as disclosed are to be considered.
Claims (5)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE20220468U DE20220468U1 (en) | 2002-11-11 | 2002-11-11 | Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region |
| DE2002152308 DE10252308B3 (en) | 2002-11-11 | 2002-11-11 | Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region |
| AU2003274094A AU2003274094A1 (en) | 2002-11-11 | 2003-10-29 | Method for producing a semi-finished printed circuit board, a semi-finished printed circuit board produced by a method of this type and a multi-layer printed circuit board configured from the same |
| PCT/EP2003/012009 WO2004045260A1 (en) | 2002-11-11 | 2003-10-29 | Method for producing a semi-finished printed circuit board, a semi-finished printed circuit board produced by a method of this type and a multi-layer printed circuit board configured from the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2002152308 DE10252308B3 (en) | 2002-11-11 | 2002-11-11 | Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10252308B3 true DE10252308B3 (en) | 2004-04-29 |
Family
ID=32049642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2002152308 Revoked DE10252308B3 (en) | 2002-11-11 | 2002-11-11 | Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2003274094A1 (en) |
| DE (1) | DE10252308B3 (en) |
| WO (1) | WO2004045260A1 (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1643582A1 (en) * | 2004-09-29 | 2006-04-05 | Antig Technology Co., Ltd. | Method of fabricating rechargeable batteries |
| EP1850645A1 (en) | 2006-04-28 | 2007-10-31 | Würth Elektronik Rot am See GmbH & Co. KG | Module structure |
| WO2012024578A3 (en) * | 2010-08-19 | 2012-04-12 | Apple Inc. | Portable electronic device |
| US8391010B2 (en) | 2010-08-19 | 2013-03-05 | Apple Inc. | Internal frame optimized for stiffness and heat transfer |
| US8427379B2 (en) | 2010-08-19 | 2013-04-23 | Apple Inc. | Modular material antenna assembly |
| US8477492B2 (en) | 2010-08-19 | 2013-07-02 | Apple Inc. | Formed PCB |
| US8515113B2 (en) | 2010-08-19 | 2013-08-20 | Apple Inc. | Composite microphone boot to optimize sealing and mechanical properties |
| US8634204B2 (en) | 2010-08-19 | 2014-01-21 | Apple Inc. | Compact folded configuration for integrated circuit packaging |
| US9287627B2 (en) | 2011-08-31 | 2016-03-15 | Apple Inc. | Customizable antenna feed structure |
| EP3034289A1 (en) * | 2014-12-17 | 2016-06-22 | Mayr-Melnhof Karton AG | Method for producing a substrate and substrate, in particular for a package |
| US9406999B2 (en) | 2011-09-23 | 2016-08-02 | Apple Inc. | Methods for manufacturing customized antenna structures |
| US9532453B2 (en) | 2009-09-01 | 2016-12-27 | Sapurast Research Llc | Printed circuit board with integrated thin film battery |
| US9602914B2 (en) | 2010-08-27 | 2017-03-21 | Apple Inc. | Porting audio using a connector in a small form factor electronic device |
| US10897812B2 (en) | 2018-12-25 | 2021-01-19 | AT&S (Chongqing) Company Limited | Component carrier having a component shielding and method of manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5018051A (en) * | 1988-03-31 | 1991-05-21 | Kabushiki Kaisha Toshiba | IC card having circuit modules for mounting electronic components |
| DE19627543A1 (en) * | 1996-05-18 | 1997-11-20 | Thomas Hofmann | Multilayer substrate for printed circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5019468A (en) * | 1988-10-27 | 1991-05-28 | Brother Kogyo Kabushiki Kaisha | Sheet type storage battery and printed wiring board containing the same |
| GB2255450A (en) * | 1991-04-16 | 1992-11-04 | Dowty Electronic Components | Electrical power supply |
| JPH11274735A (en) * | 1998-03-25 | 1999-10-08 | Toshiba Battery Co Ltd | Multilayer printed wiring board |
| JP3659167B2 (en) * | 1999-04-16 | 2005-06-15 | 松下電器産業株式会社 | Module parts and manufacturing method thereof |
| US6621012B2 (en) * | 2001-02-01 | 2003-09-16 | International Business Machines Corporation | Insertion of electrical component within a via of a printed circuit board |
-
2002
- 2002-11-11 DE DE2002152308 patent/DE10252308B3/en not_active Revoked
-
2003
- 2003-10-29 AU AU2003274094A patent/AU2003274094A1/en not_active Abandoned
- 2003-10-29 WO PCT/EP2003/012009 patent/WO2004045260A1/en not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5018051A (en) * | 1988-03-31 | 1991-05-21 | Kabushiki Kaisha Toshiba | IC card having circuit modules for mounting electronic components |
| DE19627543A1 (en) * | 1996-05-18 | 1997-11-20 | Thomas Hofmann | Multilayer substrate for printed circuit board |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1643582A1 (en) * | 2004-09-29 | 2006-04-05 | Antig Technology Co., Ltd. | Method of fabricating rechargeable batteries |
| EP1850645B1 (en) * | 2006-04-28 | 2014-05-14 | Würth Elektronik GmbH & Co. KG | Module structure |
| EP1850645A1 (en) | 2006-04-28 | 2007-10-31 | Würth Elektronik Rot am See GmbH & Co. KG | Module structure |
| US10080291B2 (en) | 2009-09-01 | 2018-09-18 | Sapurast Research Llc | Printed circuit board with integrated thin film battery |
| US9532453B2 (en) | 2009-09-01 | 2016-12-27 | Sapurast Research Llc | Printed circuit board with integrated thin film battery |
| US8427379B2 (en) | 2010-08-19 | 2013-04-23 | Apple Inc. | Modular material antenna assembly |
| US8515113B2 (en) | 2010-08-19 | 2013-08-20 | Apple Inc. | Composite microphone boot to optimize sealing and mechanical properties |
| US8634204B2 (en) | 2010-08-19 | 2014-01-21 | Apple Inc. | Compact folded configuration for integrated circuit packaging |
| US8477492B2 (en) | 2010-08-19 | 2013-07-02 | Apple Inc. | Formed PCB |
| US9049801B2 (en) | 2010-08-19 | 2015-06-02 | Apple Inc. | Internal frame optimized for stiffness and heat transfer |
| US8391010B2 (en) | 2010-08-19 | 2013-03-05 | Apple Inc. | Internal frame optimized for stiffness and heat transfer |
| WO2012024578A3 (en) * | 2010-08-19 | 2012-04-12 | Apple Inc. | Portable electronic device |
| US9602914B2 (en) | 2010-08-27 | 2017-03-21 | Apple Inc. | Porting audio using a connector in a small form factor electronic device |
| US9287627B2 (en) | 2011-08-31 | 2016-03-15 | Apple Inc. | Customizable antenna feed structure |
| US9406999B2 (en) | 2011-09-23 | 2016-08-02 | Apple Inc. | Methods for manufacturing customized antenna structures |
| EP3034289A1 (en) * | 2014-12-17 | 2016-06-22 | Mayr-Melnhof Karton AG | Method for producing a substrate and substrate, in particular for a package |
| US10897812B2 (en) | 2018-12-25 | 2021-01-19 | AT&S (Chongqing) Company Limited | Component carrier having a component shielding and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003274094A1 (en) | 2004-06-03 |
| WO2004045260A1 (en) | 2004-05-27 |
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| 8100 | Publication of the examined application without publication of unexamined application | ||
| 8364 | No opposition during term of opposition | ||
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| 8331 | Complete revocation |