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AU2003274094A1 - Method for producing a semi-finished printed circuit board, a semi-finished printed circuit board produced by a method of this type and a multi-layer printed circuit board configured from the same - Google Patents

Method for producing a semi-finished printed circuit board, a semi-finished printed circuit board produced by a method of this type and a multi-layer printed circuit board configured from the same

Info

Publication number
AU2003274094A1
AU2003274094A1 AU2003274094A AU2003274094A AU2003274094A1 AU 2003274094 A1 AU2003274094 A1 AU 2003274094A1 AU 2003274094 A AU2003274094 A AU 2003274094A AU 2003274094 A AU2003274094 A AU 2003274094A AU 2003274094 A1 AU2003274094 A1 AU 2003274094A1
Authority
AU
Australia
Prior art keywords
circuit board
printed circuit
semi
finished printed
finished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003274094A
Inventor
Bernfried Fleiner
Thomas Gottwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schweizer Electronic AG
Original Assignee
Schweizer Electronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32049642&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU2003274094(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Schweizer Electronic AG filed Critical Schweizer Electronic AG
Publication of AU2003274094A1 publication Critical patent/AU2003274094A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
AU2003274094A 2002-11-11 2003-10-29 Method for producing a semi-finished printed circuit board, a semi-finished printed circuit board produced by a method of this type and a multi-layer printed circuit board configured from the same Abandoned AU2003274094A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10252308.8 2002-11-11
DE2002152308 DE10252308B3 (en) 2002-11-11 2002-11-11 Semi-finished product for making circuit board, has battery or accumulator element with temperature- and pressure-resistance matching manufacturing parameters fixed in opening in no-conductor region
PCT/EP2003/012009 WO2004045260A1 (en) 2002-11-11 2003-10-29 Method for producing a semi-finished printed circuit board, a semi-finished printed circuit board produced by a method of this type and a multi-layer printed circuit board configured from the same

Publications (1)

Publication Number Publication Date
AU2003274094A1 true AU2003274094A1 (en) 2004-06-03

Family

ID=32049642

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003274094A Abandoned AU2003274094A1 (en) 2002-11-11 2003-10-29 Method for producing a semi-finished printed circuit board, a semi-finished printed circuit board produced by a method of this type and a multi-layer printed circuit board configured from the same

Country Status (3)

Country Link
AU (1) AU2003274094A1 (en)
DE (1) DE10252308B3 (en)
WO (1) WO2004045260A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10897812B2 (en) 2018-12-25 2021-01-19 AT&S (Chongqing) Company Limited Component carrier having a component shielding and method of manufacturing the same

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1755972A (en) * 2004-09-29 2006-04-05 胜光科技股份有限公司 Secondary rechargeable battery manufacturing method
DE102006021023A1 (en) 2006-04-28 2007-10-31 Würth Elektronik Rot am See GmbH & Co. KG modules structure
US8599572B2 (en) 2009-09-01 2013-12-03 Infinite Power Solutions, Inc. Printed circuit board with integrated thin film battery
US9602914B2 (en) 2010-08-27 2017-03-21 Apple Inc. Porting audio using a connector in a small form factor electronic device
US8634204B2 (en) 2010-08-19 2014-01-21 Apple Inc. Compact folded configuration for integrated circuit packaging
US8515113B2 (en) 2010-08-19 2013-08-20 Apple Inc. Composite microphone boot to optimize sealing and mechanical properties
KR101494555B1 (en) * 2010-08-19 2015-02-17 애플 인크. Portable electronic device
US8427379B2 (en) 2010-08-19 2013-04-23 Apple Inc. Modular material antenna assembly
US8391010B2 (en) 2010-08-19 2013-03-05 Apple Inc. Internal frame optimized for stiffness and heat transfer
US8477492B2 (en) 2010-08-19 2013-07-02 Apple Inc. Formed PCB
US9287627B2 (en) 2011-08-31 2016-03-15 Apple Inc. Customizable antenna feed structure
US9406999B2 (en) 2011-09-23 2016-08-02 Apple Inc. Methods for manufacturing customized antenna structures
PL3034289T3 (en) * 2014-12-17 2017-12-29 Mayr-Melnhof Karton Ag Method for producing a substrate and substrate, in particular for a package

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01251778A (en) * 1988-03-31 1989-10-06 Toshiba Corp Ic card
US5019468A (en) * 1988-10-27 1991-05-28 Brother Kogyo Kabushiki Kaisha Sheet type storage battery and printed wiring board containing the same
GB2255450A (en) * 1991-04-16 1992-11-04 Dowty Electronic Components Electrical power supply
DE19627543B9 (en) * 1996-05-18 2004-10-14 Thomas Hofmann Multi-layer substrate and method for its production
JPH11274735A (en) * 1998-03-25 1999-10-08 Toshiba Battery Co Ltd Multilayer printed wiring board
JP3659167B2 (en) * 1999-04-16 2005-06-15 松下電器産業株式会社 Module parts and manufacturing method thereof
US6621012B2 (en) * 2001-02-01 2003-09-16 International Business Machines Corporation Insertion of electrical component within a via of a printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10897812B2 (en) 2018-12-25 2021-01-19 AT&S (Chongqing) Company Limited Component carrier having a component shielding and method of manufacturing the same

Also Published As

Publication number Publication date
WO2004045260A1 (en) 2004-05-27
DE10252308B3 (en) 2004-04-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase