DE102024200776A1 - Manipulator for adjusting an optical element - Google Patents

Abstract

A manipulator (134) for adjusting an optical element (102) has a magnet assembly (142) that can be coupled to the optical element (102), a coil assembly (152) that can be linearly displaced by means of the magnet assembly (142) in order to adjust the optical element (102), a manipulator housing (140) to which the coil assembly (152) is connected and which serves to dissipate heat from the coil assembly (152), and a mass element (166). The coil assembly (152) is connected to the mass element (166) via a connecting section (168).

Description

The invention relates to a manipulator for adjusting an optical element with a magnet assembly that can be coupled to the optical element and with a coil assembly that can be linearly displaced by means of the magnet assembly in order to adjust the optical element.

The invention further relates to an optical system for a semiconductor technology plant, a semiconductor technology plant and an electronic component.

In the state of the art, systems for semiconductor technology are those systems that are used to manufacture or test microstructured components or the components required for them. An example of such a system is a projection exposure system for photolithography.

Photolithography is used to produce microstructured components, such as integrated circuits. The projection exposure system used comprises an illumination system and a projection system. The image of a mask (also referred to as a reticle) illuminated by the illumination system is projected in a reduced size by the projection system onto a substrate coated with a light-sensitive layer and arranged in the image plane of the projection system, for example a silicon wafer, in order to transfer the mask structure onto a light-sensitive coating on the substrate.

From the DE 10 2022 211 799 A1 A manipulator for adjusting an optical element with a manipulator housing, a magnet assembly and a coil assembly is known. The coil assembly has an exchangeable mass element with which the natural frequency of the manipulator can be adjusted. The manipulator, which works according to the electromotive principle, i.e. with the Lorentz force, is able to adjust the optical element with extremely high precision. The coil assembly used to actuate the magnet assembly heats up with increasing force, which leads to very high demands on heat dissipation.

A further problem with the known solution may be that the individual components of the manipulator cannot be replaced if individual components or individual parts of the components are defective and instead a complete replacement of the manipulator is required.

It is an object of the present invention to provide a manipulator for adjusting an optical element which ensures improved heat dissipation and a more reliable, consistent dynamic behavior.

According to the invention, this object is achieved by the features mentioned in claim 1.

The manipulator according to the invention for adjusting an optical element accordingly has a magnet assembly that can be coupled to the optical element, a coil assembly that can be linearly displaced by means of the magnet assembly for adjusting the optical element, a manipulator housing to which the coil assembly is connected and which serves to dissipate heat from the coil assembly, and a mass element that sets the desired dynamic behavior and causes a phase shift. The coil assembly is connected to the mass element via a connecting section.

The mass element is therefore not directly connected to the coil assembly, but only indirectly via the connecting section, which prevents these two components from influencing each other. Instead, the mass element can take on its intended task, namely setting the desired dynamics, while the manipulator housing dissipates the heat generated in the coil assembly.

In a very advantageous development of the invention, it can be provided that the manipulator housing has the connecting section for connecting the coil assembly to the mass element. The integration of the connecting section used to connect the coil assembly to the mass element into the manipulator housing not only results in a very simple construction, but also ensures very reliable dissipation of the heat generated in the coil assembly into the manipulator housing.

In a further very advantageous embodiment of the invention, it can be provided that the coil assembly is detachably connected to the connecting section. In this way, the coil assembly can be removed very easily from the connecting section, which means that, for example, if there is a defect in the area of the coil assembly, it can be replaced very easily. This not only saves costs, but also enables faster repairs. Furthermore, this design makes it possible to dispense with the adhesive connections previously used, which means the entire manipulator is designed to be more thermally reliable.

A very simple design of the detachable connection of the coil assembly to the connecting section is achieved if the coil assembly is connected to the connecting section by means of screws. However, other connecting elements are also conceivable.

Furthermore, it can be provided that the coil assembly is accommodated in the connecting section via a fit. This results in a very precise connection between the coil assembly and the connecting section.

In a further advantageous embodiment of the invention, it can be provided that the mass element is detachably connected to the connecting section. As a result, the mass element, similar to the coil assembly, can be very easily removed from the connecting section in the event of a defect and replaced by another mass element.

In this context, it can be provided that the mass element is connected to the connecting section by means of screws. This enables the mass element to be attached and removed from the connecting section very easily. Other connecting elements are also conceivable here.

Another very advantageous embodiment of the invention can consist in the mass element having a first component connected to the manipulator housing and a second component connected to the first component connected to the manipulator housing. In this way, the mass of the mass element, which significantly influences the dynamic behavior, can be adapted to the respective requirements in a very simple manner.

Claim 9 specifies an optical system for a system for semiconductor technology with an optical element and with a manipulator according to the invention, in which the magnet assembly is coupled to the optical element.

Such an optical system can, for example, contain a mirror as an optical element, which is adjusted by means of the manipulator.

A system for semiconductor technology with at least one manipulator according to the invention and/or an optical system according to the invention is specified in claim 10.

In connection with the present invention, the term "system for semiconductor technology" refers to any system that can be used to manufacture or check microstructured components or the components required for them. In addition to projection exposure systems for photolithography, this also includes inspection systems, in particular for masks or wafers, as well as metrology systems with which masks, wafers or other optical elements, such as mirrors in particular, can be measured, whereby increased variability in the lighting can improve the measurement results.

Claim 11 specifies an electronic component produced with the aid of such a semiconductor technology system, which preferably has structures in the micrometer and/or nanometer range.

Features that have been described in connection with one of the objects of the invention, namely given by the method according to the invention, the device according to the invention or the EUV projection exposure system according to the invention, can also be implemented advantageously for the other objects of the invention. Likewise, advantages that have been mentioned in connection with one of the objects of the invention can also be understood to relate to the other objects of the invention.

It should also be noted that terms such as "comprising", "having" or "with" do not exclude other features or steps. Furthermore, terms such as "a" or "the", which refer to a singular number of steps or features, do not exclude a plurality of features or steps - and vice versa.

In a purist embodiment of the invention, however, it can also be provided that the features introduced in the invention with the terms "comprising", "having" or "with" are listed exhaustively. Accordingly, one or more lists of features can be considered complete within the scope of the invention, for example considered for each claim. The invention can, for example, consist exclusively of the features mentioned in claim 1.

In the following, embodiments of the invention are described in more detail with reference to the drawing.

The figures each show preferred embodiments in which individual features of the present invention are shown in combination with one another. Features of one embodiment can also be implemented separately from the other features of the same embodiment and can therefore be easily combined by a person skilled in the art to form further useful combinations and sub-combinations with features of other embodiments.

• 1 einen schematischen Meridionalschnitt einer Projektionsbelichtungsanlage für die EUV-Projektionslithografie;
• 2 eine schematische Ansicht einer Ausführungsform eines optischen Systems für die Projektionsbelichtungsanlage gemäß 1;
• 3 eine schematische Draufsicht auf das optische System gemäß 2; und
• 4 eine schematische Schnittansicht eines Manipulators für das optische System gemäß 2.

They show:

• 1 a schematic meridional section of a projection exposure system for EUV projection lithography;
• 2 a schematic view of an embodiment of an optical system for the projection exposure apparatus according to 1 ;
• 3 a schematic plan view of the optical system according to 2 ; and
• 4 a schematic sectional view of a manipulator for the optical system according to 2 .

In the figures, identical or functionally equivalent elements have been given the same reference symbols unless otherwise stated. It should also be noted that the representations in the figures are not necessarily to scale.

1 shows an embodiment of a projection exposure system 1 (lithography system), in particular an EUV lithography system. An embodiment of an illumination system 2 of the projection exposure system 1 has, in addition to a light or radiation source 3, an illumination optics 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a separate module from the rest of the illumination system 2. In this case, the illumination system 2 does not comprise the light source 3.

A reticle 7 arranged in the object field 5 is exposed. The reticle 7 is held by a reticle holder 8. The reticle holder 8 can be displaced via a reticle displacement drive 9, in particular in a scanning direction.

In 1 For explanation purposes, a Cartesian coordinate system with an x-direction x, a y-direction y and a z-direction z is shown. The x-direction x runs perpendicularly into the drawing plane. The y-direction y runs horizontally and the z-direction z runs vertically. The scanning direction runs in 1 along the y-direction y. The z-direction z runs perpendicular to the object plane 6.

The projection exposure system 1 comprises a projection optics 10. The projection optics 10 serves to image the object field 5 into an image field 11 in an image plane 12. The image plane 12 runs parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible.

A structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 13 arranged in the area of the image field 11 in the image plane 12. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be displaced via a wafer displacement drive 15, in particular along the y-direction y. The displacement of the reticle 7 on the one hand via the reticle displacement drive 9 and the wafer 13 on the other hand via the wafer displacement drive 15 can be synchronized with one another.

The light source 3 is an EUV radiation source. The light source 3 emits in particular EUV radiation 16, which is also referred to below as useful radiation, illumination radiation or illumination light. The useful radiation 16 has in particular a wavelength in the range between 5 nm and 30 nm. The light source 3 can be a plasma source, for example an LPP source (Laser Produced Plasma, plasma generated with the aid of a laser) or a DPP source (Gas Discharged Produced Plasma, plasma generated by means of gas discharge). It can also be a synchrotron-based radiation source. The light source 3 can be a free-electron laser (FEL).

The illumination radiation 16 that emanates from the light source 3 is bundled by a collector 17. The collector 17 can be a collector with one or more ellipsoidal and/or hyperboloidal reflection surfaces. The at least one reflection surface of the collector 17 can be exposed to the illumination radiation 16 in grazing incidence (GI), i.e. with angles of incidence greater than 45°, or in normal incidence (NI), i.e. with angles of incidence less than 45°. The collector 17 can be structured and/or coated on the one hand to optimize its reflectivity for the useful radiation and on the other hand to suppress stray light.

After the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focus plane 18. The intermediate focus plane 18 can be a separation between a radiation source module, comprising the light source 3 and the collector 17, and the illumination optics 4.

The illumination optics 4 comprise a deflection mirror 19 and a first facet mirror 20 arranged downstream of this in the beam path. The deflection mirror 19 can be a flat deflection mirror or alternatively a mirror with a beam-influencing effect beyond the pure deflection effect. Alternatively or additionally, the deflection mirror 19 can be designed as a spectral filter which separates a useful light wavelength of the illumination radiation 16 from false light of a different wavelength. If the first facet mirror 20 is arranged in a plane of the illumination optics 4 which is optically conjugated to the object plane 6 as a field plane, it is also referred to as a field facet mirror. The first facet mirror 20 comprises a plurality of individual first facets 21, which can also be referred to as field facets. Of these first facets 21, 1 Some examples are shown.

The first facets 21 can be designed as macroscopic facets, in particular as rectangular facets or as facets with an arcuate or partially circular edge contour. The first facets 21 can be designed as flat facets or alternatively as convex or concave curved facets.

As for example from the DE 10 2008 009 600 A1 As is known, the first facets 21 themselves can also be composed of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirror 20 can in particular be designed as a microelectromechanical system (MEMS system). For details, see the DE 10 2008 009 600 A1 referred to.

Between the collector 17 and the deflection mirror 19, the illumination radiation 16 runs horizontally, i.e. along the y-direction y.

In the beam path of the illumination optics 4, a second facet mirror 22 is arranged downstream of the first facet mirror 20. If the second facet mirror 22 is arranged in a pupil plane of the illumination optics 4, it is also referred to as a pupil facet mirror. The second facet mirror 22 can also be arranged at a distance from a pupil plane of the illumination optics 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from the US 2006/0132747 A1 , the EP 1 614 008 B1 and the US 6,573,978 .

The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

The second facets 23 can also be macroscopic facets, which can be round, rectangular or hexagonal, for example, or alternatively facets composed of micromirrors. In this regard, reference is also made to the DE 10 2008 009 600 A1 referred to.

The second facets 23 can have planar or alternatively convex or concave curved reflection surfaces.

The illumination optics 4 thus forms a double-faceted system. This basic principle is also known as a fly's eye integrator.

It may be advantageous not to arrange the second facet mirror 22 exactly in a plane that is optically conjugated to a pupil plane of the projection optics 10. In particular, the second facet mirror 22 can be arranged tilted relative to a pupil plane of the projection optics 10, as is the case, for example, in the DE 10 2017 220 586 A1 described.

With the help of the second facet mirror 22, the individual first facets 21 are imaged in the object field 5. The second facet mirror 22 is the last bundle-forming or actually the last mirror for the illumination radiation 16 in the beam path in front of the object field 5.

In a further embodiment of the illumination optics 4 (not shown), a transmission optics can be arranged in the beam path between the second facet mirror 22 and the object field 5, which contributes in particular to the imaging of the first facets 21 in the object field 5. The transmission optics can have exactly one mirror, but alternatively also two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics 4. The transmission optics can in particular comprise one or two mirrors for vertical incidence (NI mirrors, normal incidence mirrors) and/or one or two mirrors for grazing incidence (GI mirrors, grazing incidence mirrors).

The lighting optics 4 has in the version shown in 1 As shown, after the collector 17 there are exactly three mirrors, namely the deflection mirror 19, the first facet mirror 20 and the second facet mirror 22.

In a further embodiment of the illumination optics 4, the deflection mirror 19 can also be omitted, so that the illumination optics 4 can then have exactly two mirrors after the collector 17, namely the first facet mirror 20 and the second facet mirror 22.

The imaging of the first facets 21 by means of the second facets 23 or with the second facets 23 and a transmission optics into the object plane 6 is usually only an approximate imaging.

The projection optics 10 comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1.

In the 1 In the example shown, the projection optics 10 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve or another number of mirrors Mi are also possible. The projection optics 10 is a double-obscured optics. The penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16. The projection optics 10 has a numerical aperture on the image side that is greater than 0.5 and can also be greater than 0.6 and can be, for example, 0.7 or 0.75.

Reflection surfaces of the mirrors Mi can be designed as free-form surfaces without a rotational symmetry axis. Alternatively, the reflection surfaces of the mirrors Mi can be designed as aspherical surfaces with exactly one rotational symmetry axis of the reflection surface shape. The mirrors Mi, just like the mirrors of the illumination optics 4, can have highly reflective coatings for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

The projection optics 10 have a large object-image offset in the y-direction y between a y-coordinate of a center of the object field 5 and a y-coordinate of the center of the image field 11. This object-image offset in the y-direction y can be approximately as large as a z-distance between the object plane 6 and the image plane 12.

The projection optics 10 can in particular be anamorphic. In particular, it has different image scales βx, By in the x and y directions x, y. The two image scales βx, By of the projection optics 10 are preferably (8x, βy) = (+/- 0.25, +/- 0.125). A positive image scale 6 means an image without image inversion. A negative sign for the image scale β means an image with image inversion.

The projection optics 10 thus leads to a reduction in the ratio 4:1 in the x-direction x, i.e. in the direction perpendicular to the scanning direction.

The projection optics 10 leads to a reduction of 8:1 in the y-direction y, i.e. in the scanning direction.

Other image scales are also possible. Image scales with the same sign and absolutely the same in the x and y directions x, y, for example with absolute values of 0.125 or 0.25, are also possible.

The number of intermediate image planes in the x and y directions x, y in the beam path between the object field 5 and the image field 11 can be the same or can be different depending on the design of the projection optics 10. Examples of projection optics with different numbers of such intermediate images in the x and y directions x, y are known from US 2018/0074303 A1 .

Each of the second facets 23 is assigned to exactly one of the first facets 21 to form a respective illumination channel for illuminating the object field 5. This can result in particular in illumination according to the Köhler principle. The far field is broken down into a plurality of object fields 5 using the first facets 21. The first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 assigned to them.

The first facets 21 are each imaged onto the reticle 7 by an associated second facet 23, superimposing one another, to illuminate the object field 5. The illumination of the object field 5 is in particular as homogeneous as possible. It preferably has a uniformity error of less than 2%. The field uniformity can be achieved by superimposing different illumination channels.

By arranging the second facets 23, the illumination of the entrance pupil of the projection optics 10 can be defined geometrically. By selecting the illumination channels, in particular the subset of the second facets 23 that guide light, the intensity distribution in the entrance pupil of the projection optics 10 can be set. This intensity distribution is also referred to as the illumination setting or illumination pupil filling.

A likewise preferred pupil uniformity in the area of defined illuminated sections of an illumination pupil of the illumination optics 4 can be achieved by a redistribution of the illumination channels.

In the following, further aspects and details of the illumination of the object field 5 and in particular of the entrance pupil of the projection optics 10 are described.

The projection optics 10 can in particular have a homocentric entrance pupil. This can be accessible. It can also be inaccessible.

The entrance pupil of the projection optics 10 cannot usually be illuminated precisely with the second facet mirror 22. When the projection optics 10 images the center of the second facet mirror 22 telecentrically onto the wafer 13, the aperture rays often do not intersect at a single point. However, a surface can be found in which the pairwise determined distance of the aperture rays is minimal. This surface represents the entrance pupil or a surface conjugated to it in spatial space. In particular, this surface shows a finite curvature.

It is possible that the projection optics 10 have different positions of the entrance pupil for the tangential and the sagittal beam path. In this case, an imaging element, in particular an optical component of the transmission optics, should be provided between the second facet mirror 22 and the reticle 7. With the help of this optical element, the different positions of the tangential entrance pupil and the sagittal entrance pupil can be taken into account.

At the 1 In the arrangement of the components of the illumination optics 4 shown, the second facet mirror 22 is arranged in a surface conjugated to the entrance pupil of the projection optics 10. The first facet mirror 20 is arranged tilted to the object plane 6. The first facet mirror 20 is arranged tilted to an arrangement plane that is defined by the deflection mirror 19. The first facet mirror 20 is arranged tilted to an arrangement plane that is defined by the second facet mirror 22.

2 shows a schematic view of an embodiment of an optical system 100 for the projection exposure apparatus 1. 3 shows a schematic plan view of the optical system 100. The following is the 2 and 3 simultaneously referred to.

The optical system 100 can be a projection optics 4 as previously explained or part of such a projection optics 4. Therefore, the optical system 100 can also be referred to as a projection optics. However, the optical system 100 can also be an illumination system 2 as previously explained or part of such an illumination system 2. Therefore, the optical system 100 can alternatively also be referred to as an illumination system. However, it is assumed below that the optical system 100 is a projection optics 4 or part of such a projection optics 4. The optical system 100 is suitable for EUV lithography. However, the optical system 100 can also be suitable for DUV lithography.

The optical system 100 may comprise a plurality of optical elements 102, of which in the 2 and 3 however, only one is shown. Therefore, only one optical element 102 is discussed below. The optical element 102 can be one of the mirrors M1 to M6. The optical element 102 comprises a substrate 104 and an optically effective surface 106, for example a mirror surface. The substrate 104 can also be referred to as a mirror substrate. The substrate 104 can comprise glass, ceramic, glass ceramic or other suitable materials.

The optically effective surface 106 is provided on a front side 108 of the substrate 104. The optically effective surface 106 can be realized with the aid of a coating applied to the front side 108. The optically effective surface 106 is a mirror surface. The optically effective surface 106 is suitable for reflecting illumination radiation 16, in particular EUV radiation, during operation of the optical system 100. The optically effective surface 106 can be seen in plan view according to 3 have an oval or elliptical geometry. The optical element 102 or the substrate 104 can have a triangular geometry. In principle, however, the geometry is arbitrary.

The optical element 102 has a rear side 110 facing away from the optically effective surface 106 or the front side 108. The rear side 110 has no defined optical properties. This means in particular that the rear side 110 is not a mirror surface and therefore does not have any reflective properties.

A plurality of mirror sockets 112, 114, 116 are provided on the rear side 110. A first mirror socket 112, a second mirror socket 114 and a third mirror socket 116 are provided. In other words, the optical element 102 comprises exactly three mirror sockets 112, 114, 116. The mirror sockets 112, 114, 116 can be geometrically be constructed identically. The mirror bushings 112, 114, 116 are cylindrical and extend in the orientation of the 2 from the bottom of the rear side 110. The mirror bushings 112, 114, 116 form corners of an imaginary triangle.

The optical element 102 or the optically effective surface 106 has six degrees of freedom, namely three translational degrees of freedom along the first spatial direction or x-direction x, the second spatial direction or y-direction y and the third spatial direction or z-direction z as well as three rotational degrees of freedom about the x-direction x, the y-direction y and the z-direction z. This means that a position and an orientation of the optical element 102 or the optically effective surface 106 can be determined or described using the six degrees of freedom.

The “position” of the optical element 102 or the optically effective surface 106 is to be understood in particular as its coordinates or the coordinates of a measuring point provided on the optical element 102 with respect to the x-direction x, the y-direction y and the z-direction z. The “orientation” of the optical element 102 or the optically effective surface 106 is to be understood in particular as its tilt with respect to the three spatial directions x, y, z. This means that the optical element 102 or the optically effective surface 106 can be tilted about the x-direction x, the y-direction y and/or the z-direction z.

This results in six degrees of freedom for the position and/or orientation of the optical element 102 or the optically effective surface 106. A "position" of the optical element 102 or the optically effective surface 106 includes both its position and its orientation. The term "position" can therefore be replaced by the wording "position and orientation" and vice versa.

In 2 an actual position IL of the optical element 102 or the optically effective surface 106 is shown with solid lines and a desired position SL of the optical element 102 or the optically effective surface 106 is shown with dashed lines and the reference symbol 102' or 106'. The optical element 102 can be moved from its actual position IL to the desired position SL and vice versa. For example, the optical element 102 in the desired position SL meets certain optical specifications or requirements that the optical element 102 in the actual position IL does not meet.

In order to move the optical element 102 from the actual position IL to the desired position SL, the optical system 100 comprises an adjusting device 118. The adjusting device 118 is designed to adjust the optical element 102. In the present case, “adjusting” or “aligning” is to be understood in particular as changing the position of the optical element 102. For example, the optical element 102 can be moved from the actual position IL to the desired position SL and vice versa with the aid of the adjusting device 118. The adjustment or alignment of the optical element 102 can thus be carried out with the aid of the adjusting device 118 in all six aforementioned degrees of freedom.

The adjustment device 118 comprises several manipulator arrangements 120, 122, 124, which are arranged in 2 are only shown very schematically. The manipulator arrangements 120, 122, 124 can also be referred to as actuating element arrangements. Each mirror bushing 112, 114, 116 is assigned a manipulator arrangement 120, 122, 124. This means in particular that exactly three manipulator arrangements 120, 122, 124 are provided. Each manipulator arrangement 120, 122, 124 can be assigned two of the aforementioned degrees of freedom. With the three manipulator arrangements 120, 122, 124, an adjustment of the optical element 102 in all six degrees of freedom is thus possible.

A first manipulator arrangement 120 is assigned to the first mirror bushing 112. A second manipulator arrangement 122 is assigned to the second mirror bushing 114. A third manipulator arrangement 124 is assigned to the third mirror bushing 116. The manipulator arrangements 120, 122, 124 are constructed identically. Therefore, only the first manipulator arrangement 120 and the first mirror bushing 112 are discussed below, which are referred to simply as the manipulator arrangement 120 and the mirror bushing 112, respectively. All of the following statements regarding the manipulator arrangement 120 are applicable to the manipulator arrangements 122, 124 and vice versa.

The manipulator arrangement 120 is coupled to the mirror socket 112 via a connection point 126. Furthermore, the manipulator arrangement 120 is coupled to a fixed world 132 via two further connection points 128, 130. The fixed world 132 can be a support frame (English: force frame) or another immovable structure.

The manipulator arrangement 120 has two manipulators 134, 136, in particular a first manipulator 134 and a second manipulator 136. With the help of all manipulators 134, 136 of all manipulator arrangements 120, 122, 124, the six degrees of freedom of the optical element 102 can be adjusted. The manipulators 134, 136 can also be referred to as adjusting elements, actuators or actuators.

In particular, the manipulators 134, 136 are so-called voice coil manipulators (VCM) or voice coil actuators (VCA) or can be referred to as such.

Both manipulators 134, 136 are connected to the mirror socket 112 at the connection point 126. Furthermore, the manipulators 134, 136 are connected to the solid world 132 via the connection points 128, 130. The manipulators 134, 136 can be controlled using a control and regulating unit 138 of the adjustment device 118 in order to adjust the optical element 102. All manipulators 134, 136 of all manipulator arrangements 120, 122, 124 are operatively connected to the control and regulating unit 138, so that the control and regulating unit 138 can adjust the optical element 102 in all six degrees of freedom with the aid of suitable control of the manipulators 134, 136. This can be done based on sensor signals from a sensor system (not shown), which can detect the actual position IL and the target position SL of the optical element 102.

4 shows a schematic sectional view of an embodiment of a first manipulator 134 as mentioned above. The second manipulator 136 can be designed identically to the first manipulator 134, but this is not absolutely necessary.

The first manipulator 134 has a manipulator housing 140 that is connected to the fixed world 132. For example, the manipulator housing 140 can be connected to the fixed world 132 at the connection point 128. A magnet assembly 142 is coupled to the manipulator housing 140 via two spring elements 144, 146. The spring elements 144, 146 can be designed as leaf springs, for example. The magnet assembly 142 has a tubular magnet assembly housing and a magnet attached to the outside of the magnet assembly housing. The magnet can be designed as a permanent magnet, for example. The magnet assembly housing is connected to the manipulator housing 140 by means of the spring elements 144, 146. The optical element 102 is coupled to the magnet assembly 142 by means of a spring element 148.

An annular coil assembly 152 runs around the magnet assembly housing. The magnet assembly housing is thus guided through the coil assembly 152. The coil assembly 152 has a coil and a reaction mass, as will be explained later. The coil assembly 152 can move relative to the magnet assembly housing or vice versa. A manipulator pin is connected to the magnet assembly housing, which in turn is coupled to the mirror socket 112 via the connection point 126. The manipulator pin lies obliquely in a plane spanned by the y-direction y and the z-direction z. In particular, the manipulator pin is inclined obliquely to the y-direction y and the z-direction z. The manipulator pin is inclined in particular at an inclination angle α relative to the z-direction z. The inclination angle α can be 60°.

The coil assembly 152 is connected to the manipulator housing 140 by means of a spring element 156. Furthermore, the coil assembly 152 is coupled to the manipulator housing 140 by means of a damper 158. The damper 158 can be implemented by an eddy current brake. The coil assembly 152, the spring element 156 and the damper 158 form a spring-mass-damper system 160 of the first manipulator 134.

The coil assembly 152 is therefore connected to the manipulator housing 140, wherein the manipulator housing 140 serves to dissipate heat from the coil assembly.

Furthermore, the manipulator 134 has a mass element 166, which serves to adjust or vary the dynamic decoupling. The mass element 166 is connected to the coil assembly 152 via a connecting section 168. In 4 It can also be seen that the mass element 166 has a first component 166a connected to the manipulator housing 140 via the connecting section 168 and a second component 166b connected to the first component 166a connected to the manipulator housing 140. In this way, the mass element 166 can be adapted very flexibly to the respective requirements, for example in order to adjust the mass m of the spring-mass-damper system 160 and thus its natural frequency ω or its dynamic behavior. For this purpose, the second component 166b connected to the first component 166a of the mass element 166 can be replaced.

The manipulator housing 140 has the connecting section 168 which serves to connect the coil assembly 152 to the mass element 166.

Preferably, the coil assembly 152 is detachably connected to the connecting portion 168. This connection of the coil assembly 152 to the connecting portion 168 can be realized by screwing the coil assembly 152 to the connecting portion 168 by means of screws (not shown).

Furthermore, the coil assembly 152 can be received on the connecting portion 168 via a fit.

The mass element 166 is also preferably detachably connected to the connecting section 168. The connection of the mass element 166 to the connecting section 168 can also be realized by means of screws.

The damper 158 is preferably also arranged by means of a detachable or non-permanent connection between the manipulator housing 140 and the coil assembly 152.

During operation of the first manipulator 134, Lorentz forces act between the coil assembly 152 and the magnet assembly 142, as indicated by an arrow 162. The manipulator pin connected to the magnet assembly housing thereby moves in a first direction of movement 164. The first direction of movement 164 is arranged in the plane spanned by the y-direction y and the z-direction z and is oriented obliquely to the y-direction y and the z-direction z. The first direction of movement 164 runs along the manipulator pin.

list of reference symbols

1

projection exposure system

2

lighting system

3

light source

4

lighting optics

5

object field

6

object level

7

reticle

8

reticle holder

9

reticle displacement drive

10

projection optics

11

image field

12

image plane

13

wafer

14

wafer holder

15

wafer relocation drive

16

illumination radiation

17

collector

18

intermediate focal plane

19

deflecting mirror

20

first faceted mirror

21

first facet

22

second facet mirror

23

second facet

100

optical system

102

optical element

102'

optical element

104

substrate

106

optically effective surface

106'

optically effective surface

108

front

110

back

112

mirror socket

114

mirror socket

116

mirror socket

118

adjustment device

120

manipulator arrangement

122

manipulator arrangement

124

manipulator arrangement

126

connection point

128

connection point

130

connection point

132

solid world

134

manipulator

136

manipulator

138

control and regulation unit

140

manipulator housing

142

magnet assembly

144

spring element

146

spring element

148

spring element

152

coil assembly

156

spring element

158

mute

160

spring-mass-damper system

162

Arrow

164

direction of movement

166

mass element

166a

first component

166b

second component

168

connecting section

IL

current situation

M1

Mirror

M2

Mirror

M3

Mirror

M4

Mirror

M5

Mirror

M6

Mirror

SL

target position

x

x-direction

y

y-direction

z

z-direction

α

angle of inclination

ω

natural frequency

QUOTES INCLUDED IN THE DESCRIPTION

This list of documents listed by the applicant was generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions.

Cited patent literature

• DE 10 2022 211 799 A1 [0005]
• DE 10 2008 009 600 A1 [0040, 0044]
• US 2006/0132747 A1 [0042]
• EP 1 614 008 B1 [0042]
• US 6,573,978 [0042]
• DE 10 2017 220 586 A1 [0047]
• US 2018/0074303 A1 [0061]

Claims (11)

Manipulator (134) for adjusting an optical element (102), with a magnet assembly (142) that can be coupled to the optical element (102), with a coil assembly (152) that can be linearly displaced by means of the magnet assembly (142) in order to adjust the optical element (102), with a manipulator housing (140) to which the coil assembly (152) is connected and which serves to dissipate heat from the coil assembly (152), and with a mass element (166), wherein the coil assembly (152) is connected to the mass element (166) via a connecting section (168). Manipulator (134) after claim 1 , characterized in that the manipulator housing (140) has the connecting portion (168) for connecting the coil assembly (152) to the mass element (166). Manipulator (134) after claim 1 or 2 , characterized in that the coil assembly (152) is detachably connected to the connecting portion (168). Manipulator (134) after claim 3 , characterized in that the coil assembly (152) is connected to the connecting portion (168) by means of screws. Manipulator (134) according to one of the Claims 1 until 4 , characterized in that the coil assembly (152) is received on the connecting portion (168) via a fit. Manipulator (134) according to one of the Claims 1 until 5 , characterized in that the mass element (166) is detachably connected to the connecting portion (168). Manipulator (134) after claim 6 , characterized in that the mass element (166) is connected to the connecting portion (168) by means of screws. Manipulator (134) according to one of the Claims 1 until 7 , characterized in that the mass element (166) has a first component (166a) connected to the manipulator housing (140) and a second component (166b) connected to the first component (166a) connected to the manipulator housing (140). Optical system (100) for a semiconductor technology system (1), with an optical element (102) and with a manipulator (134) according to one of the Claims 1 until 8 , wherein the magnet assembly (142) is coupled to the optical element (102). Installation for semiconductor technology (1) with at least one manipulator (134) according to one of the Claims 1 until 8 and/or an optical system (100) according to claim 9 . Electronic component, characterized in that the component is manufactured using a semiconductor technology system (1) according to claim 10 is manufactured, wherein the component preferably has structures in the micrometer and/or nanometer range.

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