CN2864795Y - Cooling module for notebook computer - Google Patents

Abstract

The utility model relates to a heat dissipation module of notebook computer, it is with the heat dissipation fin group, the card is established the opening that is fixed in the fan casing of body, and cover the upper cover of body on setting up the fan flabellum in the fan casing, and this upper cover corresponds its top and has seted up a hole, and the both ends of heat pipe set up respectively on the heat dissipation fin and the card establishes fixed slot and its curb plate, be fixed in the second surface of upper cover with the heat conduction piece again, finally, will press the firmware to be fixed in on the curb plate of draw-in groove, in order to accomplish heat dissipation module's equipment, when heat dissipation module applies to the source that generates heat of notebook computer, when it attaches in the heat conduction piece of upper cover, this heat dissipation module can not only reach the source that generates heat of notebook computer and the purpose of heat dissipation and heat extraction, and more is a heat dissipation module of gaining in.

Description

Cooling module for notebook computer

technical field

The utility model relates to a heat dissipation module, in particular to a heat dissipation module which can effectively eliminate the high temperature and heat generated during the operation of a notebook computer, and in particular to a heat dissipation module with increased strength and reduced weight.

Background technique

With the development of electronic industry technology, the transistor density of various chips, especially the central processing unit (CPU) is increasing day by day. Although the speed of data processing is accelerated, the power consumption and heat generated are also relatively increasing. In order for the central processing unit to operate stably, the cooling effect of the host computer becomes an extremely important design, especially for notebook computers that require thin, light and small size, it is a very difficult and challenging design.

At present, most notebook computer heat dissipation modules use a combination of heat pipes, heat sinks, and a fan to dissipate heat. That is, the fan is used to drive air flow to exchange heat with the heat-collecting fins to bring The heat of the fins is used to achieve the purpose of cooling down. However, with the rapid development of the central processing unit, the transistor density of the central processing unit mentioned above is increasing day by day, and the corresponding fans and radiators must also be increased accordingly. However, the notebook computer can hardly accommodate the increasingly larger cooling modules, and does not meet the requirements of thin, light and small notebook computers.

Please refer to FIG. 1, which is a schematic diagram of a known heat dissipation module. In addition to using the above-mentioned components, the known heat dissipation module is also made of copper material to improve its heat dissipation efficiency. However, the heat dissipation module is made of copper material, and the weight is insufficient Effectively alleviate and increase the problem of manufacturing cost, so please refer to FIG. 2, which is a schematic diagram of another known heat dissipation module. This known heat dissipation module 1' includes a heat sink 10' and a copper sheet 20', and the heat sink 10' A hole 12' is opened on the surface of the upper cover 11', and the copper sheet 20' is welded and fixed to the hole 12' of the cover 11' on the radiator 10'. Although the radiator 10' is made of aluminum, Compared with the known technology, the weight problem is effectively reduced. However, due to the way of connecting the copper sheet 20' to the hole 12' of the upper cover body 11' of the heat sink, its strength is not good, and the joint gap of welding will also affect its heat dissipation. Effect.

Therefore, when the conventional heat dissipation module is applied to a notebook computer, the strength of the heat dissipation module is not good, so how to redesign a heat dissipation module and a heat sink that can improve heat dissipation efficiency is the research goal of relevant technical personnel.

Utility model content

In view of the above-mentioned problems in the known technology, the present invention provides a heat dissipation module for a notebook computer to solve the defects that the weight of the known heat dissipation module cannot be effectively reduced and the strength cannot be increased.

In order to achieve the above-mentioned purpose, the utility model designs a cooling module for a notebook computer, which is used to reduce the temperature of the notebook computer during operation. Constructed, the body further includes a fan casing, fan blades, an upper cover and a heat conduction sheet, and it has an accommodating space and an opening. In addition, a card slot is opened on the first surface of the upper cover of the body, and the card There is a hole in the center of the slot, and side plates are formed on the sides of the hole of the slot to fix the heat pipe.

Moreover, this heat dissipation module is to first fix the heat dissipation fin group on the opening of the fan casing of the main body, and then install the fan blades in the accommodation space of the fan casing, and cover the upper cover on the fan casing On the body, and the first surface of the upper cover is provided with a hole corresponding to the top of the fan blade, and the two ends of the heat pipe are respectively arranged on the accommodating part of the heat dissipation fin, and arranged on the first surface of the upper cover. The card slot on the surface is fixed by its side plate, and then the heat conduction sheet is fixed on the second surface of the upper cover, and finally, the pressing piece is pressed and fixed on the side plate of the first surface of the upper cover to complete the heat dissipation module Assembled, when the heat dissipation module is applied to the heat source of the notebook computer, the heat source and the heat conduction sheet on the second surface of the upper cover are closely attached to effectively achieve the purpose of heat dissipation and heat dissipation of the heat source of the notebook computer.

The heat conduction sheet of the heat dissipation module is made of copper, and at the same time, the body of the heat dissipation module is made of aluminum. The redesign of the heat dissipation module can effectively increase its strength and reduce the weight of the heat dissipation module.

The side plate of the heat dissipation module is formed on the side of the hole of the card slot in an approximately inverted L shape or in an approximately I shape on the side of the hole of the card slot.

In order to achieve the above-mentioned purpose, the more detailed content and specific feasible implementation modes of the utility model will be described as follows with reference to the accompanying drawings.

Description of drawings

Fig. 1 is a schematic diagram of a known cooling module

Fig. 2 is a schematic diagram of another known cooling module

Figure 3A is a schematic diagram of the heat dissipation module and side panels of the present invention

Figure 3B is a schematic diagram of the heat dissipation module assembly and heat source of the utility model

Figure 3C is a schematic diagram of the heat dissipation module of the present invention stacked on the heat source

Figure 4 is a schematic diagram of another style of the side plate of the heat dissipation module of the present invention

Description of main component marking

(known technology)

1′ cooling module

10' Radiator

11' upper cover body 12' hole

20'copper sheet

(this utility model)

1 cooling module

10 cooling fins group

11 storage part

20 heat pipes

21 One end of the heat pipe 22 The other end of the heat pipe

30 body

31 fan housing

311 Accommodating space 312 Opening

32 fan blades 33 upper cover

331 first surface 332 second surface

333 card slot Hole for 3331 card slot

334 side plate 335 holes

34 thermal pad

40 press firmware

2 heat source

Detailed ways

The following are the assembly methods and implementation steps of the preferred embodiments of the present utility model, and are now described in detail in conjunction with the accompanying drawings.

The present invention is a heat dissipation module of a notebook computer. Now, the preferred embodiment of the heat dissipation module that reduces weight and provides a good heat dissipation effect is disclosed as an implementation mode of implementing characteristics for exporting heat generated by a heat source of a notebook computer. illustrate.

First of all, please refer to Fig. 3A and Fig. 3B, the utility model designs a kind of heat dissipation module of notebook computer, in order to reduce the temperature when notebook computer is running, this heat dissipation module 1 is composed of heat dissipation fin group 10, heat pipe 20, body 30 and a pressing member 40, wherein the heat dissipation fin 10 has an accommodating portion 11, and it is a block composed of a plurality of heat dissipation fins. Therefore, its function or structure will not be described in detail here. Furthermore, the main body 30 further includes a fan casing 31, fan blades 32, upper cover 33 and heat conducting fins 34. The fan casing 31 of the main body 30 is Approximate U-shaped shape, and it has accommodating space 311 and opening 312, in addition, the upper cover 33 of this body 30 is approximately D-shaped shape, and it has first surface 331 and second surface 332, the first surface of upper cover 33 The surface 331 is provided with a card slot 333 , and a hole 3331 is opened in the center of the card slot 333 , and side plates 334 are respectively formed on the sides of the hole 3331 of the card slot 333 . , and to prevent the pressing member 40 from crushing the heat pipe 20 during assembly as described later, wherein the side plate 334 is formed on the side of the hole 3331 of the slot 333 in an approximately inverted L shape, but it is not used to limit the utility model. The side plate 334 of the utility model is another style, that is, an approximately I-shaped shape is formed on the side of the hole of the slot, as shown in FIG. 4 .

Furthermore, please refer to Fig. 3A and Fig. 3B again, the utility model designs a kind of heat dissipation module of notebook computer, in order to reduce the temperature when notebook computer is running, this heat dissipation module 1 first sets heat dissipation fin group 10, clamps and fixes on The opening 312 of the fan housing 31 of the main body 30, and then the fan blade 32 is arranged in the accommodation space 311 of the fan housing 31, and the upper cover 33 is covered on the fan housing 31, and the upper cover 33 The first surface 331 of the fan casing 31 is correspondingly provided with a hole 335 above the fan blade 32, and one end 21 of the heat conduction pipe 20 is disposed on the accommodating portion 11 of the heat dissipation fin 10, and the other end of the heat conduction pipe 20 22 is carried by the card slot 333 of the first surface 331 of the upper cover 33. More specifically, the other end 22 of the heat pipe 20 is fixed by the side plate 334 on the side of the hole 3331 of the card slot 333, and then the The heat conducting sheet 34 is fixed on the second surface 332 of the upper cover 33 , and finally, the pressing member 40 is fixed on the first surface 331 of the upper cover 33 , and pressed and fixed on the side of the slot 333 on the first surface 331 of the upper cover 33 board 334 to complete the assembly of the heat dissipation module.

Please refer to Fig. 3A, Fig. 3B and Fig. 3C, when a heat dissipation module of a notebook computer of the present invention is applied to the heat source 2 (mainly the central processing unit) of the notebook computer, it is attached to the body 30 of the heat dissipation module 1 When the upper cover 33 is used, more specifically, the heat source 2 and the heat conduction sheet 34 of the second surface 332 of the upper cover 33 are closely attached. At this time, the heat generated by the heat source 2 will be absorbed by the heat conduction sheet 34 in real time, and Conducted to the upper cover 33 of the main body 30 and the other end 22 of the heat dissipation pipe 20, and then through the upper cover 33 and the heat dissipation pipe 20, the heat is conducted to the heat dissipation fins 10 and one end 21 of the heat dissipation pipe 20, and finally, the heat is applied to the fan case The rotation of the fan blade 32 in the accommodation space 311 of the body 31 effectively blows the heat from the heat dissipation fins 10 and the heat dissipation pipe 20 to the outside of the notebook computer. When the fan blade 32 is running, it can pass through the upper hole 335 and the outside world The cold air is used for heat exchange to effectively achieve the purpose of heat dissipation and heat dissipation of the heat source of the notebook computer.

The utility model designs a heat dissipation module of a notebook computer. The heat conduction sheet of the heat dissipation module is made of copper material, and the body 30 of the heat dissipation module is made of aluminum material. Through the redesign of the heat dissipation module 1, its strength can be effectively increased, and the The weight of the cooling module is reduced, thereby reducing the manufacturing cost.

Although the utility model is disclosed above with preferred embodiments, it is not intended to limit the utility model. Any person skilled in the art can make some changes without departing from the spirit and scope of the utility model. and improvements, so the scope of protection of the present utility model should be defined by the claims as the criterion.

Claims (10)

1. the radiating module of a notebook computer, temperature when turning round in order to reduce notebook computer, it is characterized in that this radiating module comprises radiating fin group, heat pipe and body, this radiating fin group has holding part, hold on this holding part in order to fix one of this heat pipe, this body further comprises:

Blower-casting, this blower-casting has accommodation space and peristome, and this peristome of this blower-casting is established fixing for this radiating fin card;

Electric fan, this electric fan are arranged in this accommodation space of this blower-casting;

Loam cake, this loam cake is covered on this blower-casting, and this loam cake this electric fan top of this blower-casting relatively offers a hole, and this loam cake has first surface and second surface, this first surface of this loam cake offers draw-in groove, in order to the other end of this heat pipe of bearing; And

Conducting strip, this conducting strip are fixed in this second surface of this loam cake.

2. the radiating module of notebook computer according to claim 1 is characterized in that this conducting strip is a copper material.

3. the radiating module of notebook computer according to claim 1 is characterized in that this body is an aluminium material.

4. the radiating module of notebook computer according to claim 1 is characterized in that this draw-in groove central part of this first surface of this loam cake offers a hole.

5. the radiating module of notebook computer according to claim 4 is characterized in that this hole side of this draw-in groove forms side plate respectively, establishes the other end of fixing this heat pipe in order to card.

6. the radiating module of notebook computer according to claim 5 is characterized in that this side plate is formed at this hole side of this draw-in groove with the inverted "L" shaped shape.

7. the radiating module of notebook computer according to claim 5 is characterized in that this side plate is formed at this hole side of this draw-in groove with " I " shape.

8. the radiating module of notebook computer according to claim 1 or 5 is characterized in that this radiating module further comprises to press solidly part that this presses solidly, and part is fixed and pressure holding is fixed on this side plate.

9. the radiating module of notebook computer according to claim 1 is characterized in that this blower-casting is " U " shape.

10. the radiating module of notebook computer according to claim 1 is characterized in that this loam cake is " d " shape.

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