CN2699363Y - heat sink - Google Patents

Abstract

The utility model discloses a radiator, it sets up on computer central processing unit or heating element, including radiator and heat pipe, wherein, the radiator is piled up the range by multi-disc heat radiation fins aslope and forms, is formed with the runner between per two adjacent heat radiation fins, is equipped with corresponding through hole on these heat radiation fins respectively, the through hole be used for with the heat pipe is connected, the heat pipe has heat absorption portion and radiating part, heat absorption portion is used for contacting with the source that generates heat, the radiating part with heat radiation fins is connected. By utilizing the inclined arrangement of the radiating fins, the downward-blown vortex airflow can be introduced into the radiating body, so that hot airflow is prevented from being sucked into an air inlet area, and the radiating effect of the radiator is improved.

Description

heat sink

technical field

The utility model relates to a radiator, in particular to a radiator installed on a central processing unit of a computer and a heating element, which can introduce downward blown vortex airflow into a radiator, so as to prevent hot airflow from being sucked into an air intake area, thereby improving Radiator with improved cooling effect.

technical background

Nowadays, computers have powerful calculation functions and fast execution speed, and their shape and structure are developing in the direction of "light, thin, short, and small". more heat is generated. Therefore, how to use a good heat conduction and heat dissipation system to make the central processing unit operate normally at an allowable operating temperature has become an important research topic for those skilled in the art.

As shown in FIG. 1 , the conventional radiator and fan assembly mainly includes a radiator 10a, a fixing frame 20a and a fan 30a. Wherein the bottom surface of the radiator 10a is flatly attached to the surface of the central processing unit (CPU), and its exterior can be covered with a fixing frame 20a, and then fixedly connected with components such as screws. A circular hole and a plurality of screw holes (not shown) are arranged on the top surface of the fixed frame 20a. The circular hole corresponds to the center of the fan 30a, and the fan 30a is fixedly connected to the fixed frame 20a with screws. A radiator assembly is formed.

However, the known cooling body and fan assembly still have the following disadvantages: because the fan blade of the fan 30a is too far away from the bottom surface of the cooling body 10a, the airflow blown by the fan 30a is not easy to blow into the bottom of the cooling body 10a, and because These hot airflows are not far away from the air intake area of the fan 30a, so that these uncooled hot airflows are sucked by the fan 30a again. Therefore, the heat dissipation efficiency of these heat dissipation devices is not high. Therefore, the continuous cycle will make the temperature of the airflow blown into the cooling body 10a higher and higher, resulting in poor heat dissipation efficiency of the radiator. In addition, the airflow blown by the fan 30a is in a vortex shape, and the cooling body 10a is vertically arranged on the fan 30a, so that the airflow directly hits the cooling body 10a, thus greatly reducing the flow velocity of the airflow and further reducing the The cooling efficiency of the radiator.

Therefore, aim at the various problems of above-mentioned known technology, the designer of the utility model combines the experience of being engaged in this industry for many years, studies with great concentration, in the spirit of keeping improving, has designed the utility model.

Utility model content

The main purpose of the utility model is to provide a heat sink, which uses the inclined setting of the heat dissipation fins to introduce the downward blowing vortex airflow into the heat dissipation body, so as to prevent the hot air flow from being sucked into the intake area, thereby improving the heat dissipation of the heat sink. efficiency.

In order to achieve the above object, the utility model provides a radiator, which is arranged on the central processing unit of the computer or the heating element, and includes a radiator and a heat pipe, wherein the radiator is formed by stacking and stacking a plurality of cooling fins obliquely. A flow channel is formed between every two adjacent heat dissipation fins, and corresponding through holes are respectively provided in these heat dissipation fins, and the through holes are used to connect with the heat pipe, and the heat pipe has heat absorption The heat sink part is used to contact the heat source, and the heat sink part is connected to the heat dissipation fins, so that the above purpose can be achieved.

Description of drawings

FIG. 1 is a schematic structural view of a known radiator and fan assembly;

Fig. 2 is a three-dimensional exploded view of a radiator according to an embodiment of the present invention;

Fig. 3 is a three-dimensional exploded view of a radiator according to another embodiment of the present invention;

Fig. 4 is a combined schematic diagram of a radiator according to another embodiment of the present invention;

Fig. 5 is a combined sectional view of a radiator according to another embodiment of the present invention;

Fig. 6 is a view of the use state of the radiator according to another embodiment of the present invention.

The list of representative symbols of components in accompanying drawing 1 is as follows:

Radiator 10a

Fixed frame 20a

fan 30a

The list of representative symbols of components in accompanying drawings 2 to 6 is as follows:

Radiator 10

The first radiator 11 The second radiator 12

Radiating fins 13 Runners 14

through hole 15 protruding ring 16

Heat pipe 20 Heat absorbing part 21

Heat dissipation part 22 heat conduction plate 30

Groove 31 Fixed block 40

Heat sink 41 Channel 42

Screw hole 43 fan 50

Frame 51 Fan blade group 52

Through hole 53 seat body 54

Guide part 55 Support plate 56

Notch 57 Through Hole 58

Detailed ways

The features and technical contents of the present utility model will be described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference and description only, and are not intended to limit the utility model.

Fig. 2 is a three-dimensional exploded view of a radiator according to an embodiment of the present invention. As shown in Figure 2, the utility model provides a radiator, which mainly includes a radiator 10 and a plurality of heat pipes 20, wherein:

The radiator 10 can be made of aluminum, copper or other materials with good thermal conductivity, and includes a first radiator 11 and a second radiator 12 . The first radiating body 11 and the second radiating body 12 are arranged corresponding to each other, and each of the radiating bodies is formed by a plurality of heat radiating fins 13 stacked obliquely, and these radiating fins 13 are gradually inclined from the center to both sides, each A flow channel 14 is formed between two adjacent cooling fins 13 . In addition, corresponding through-holes 15 are provided on the cooling fins 13 , and protruding rings 16 are provided around the through-holes 15 to increase the contact surface area.

The heat pipe 20 has a capillary structure and a working fluid inside, and utilizes the heat conduction of the gas-liquid phase to realize rapid heat transfer. The heat pipe 20 has a heat absorption portion 21 and a heat dissipation portion 22 , the heat absorption portion 21 is in direct or indirect contact with the heat source, and the heat dissipation portion 22 is formed in the through hole 15 of each heat dissipation fin 13 and contacts the protruding ring 16 . The inner shape of the through hole 15 corresponds to the outer shape of the heat dissipation portion 22 , and a heat conducting medium (such as solder paste, etc.) can be applied between the through hole 15 and the heat dissipation portion 22 to increase its heat conduction capacity.

The radiator further includes a heat conducting plate 30 and a fixing block 40 . The fixing block 40 and the heat conducting plate 30 are arranged above and below the heat absorbing portion 21 of the heat pipe 20 respectively, so as to protect and stably fix the heat pipe 20 . The heat conducting plate 30 can be made of copper and other materials, and a groove 31 is arranged on its top surface. The groove 31 is used for setting the heat absorbing portion 21 of the heat pipe 20 . A fixing block 40 is arranged above the heat absorbing portion 21, and the fixing block 40 may be extruded from aluminum and other materials. A plurality of cooling fins 41 extend from the top surface of the fixing block 40 , and a channel 42 is formed in the middle of the cooling fins 41 , through which connecting elements such as buckles can be connected to the heat source. Screw holes 43 are provided on both ends of the fixing block 40 for threaded connection with screws and other components.

FIG. 3 , FIG. 4 , and FIG. 5 are a three-dimensional exploded view, a combined schematic view and a combined sectional view of a radiator according to another embodiment of the present invention, respectively. As shown in FIG. 3 , FIG. 4 , and FIG. 5 , the radiator of the present invention further includes a fan 50 . The fan 50 includes a frame 51 and fan blades 52 fixed on the frame 51 . The frame 51 can be a plate-shaped arc-shaped shell, a conical shell with a diameter at the bottom larger than that at the top, or other shells with different geometric shapes. In this embodiment, it is a plate-shaped arc-shaped shell. A through hole 53 is arranged on the top of the frame 51 , and a base 54 is connected under the through hole 53 . In addition, two guide parts 55 are formed on the frame 51 , and the guide parts 55 extend obliquely downward from the through hole 53 along the arc of the frame 51 . In addition, on the front and rear peripheral edges of the frame 51 are provided corresponding supporting plates 56 extending downward. A downward notch 57 is formed in the center of the support plate 56 , and the notch 57 corresponds to the channel 42 of the fixing block 40 . Two sides of the support plate are provided with through holes 58 corresponding to the screw holes 43 on the fixing block 40 .

Fig. 6 is a diagram of the usage status of the preferred embodiment of the present invention. As shown in FIG. 6 , the bottom surface of the heat conducting plate 30 is flatly attached to the heat source (such as CPU). When the fan blade group 52 of the fan 50 is in operation, the cold air flow will be sucked in from the top of the fan blade group 52, and the cold air flow will flow along the direction of the flow channel 14 formed by the guide part 55 of the frame 51 and each of the cooling fins 13, In order to take away the heat collected on the surface of each heat dissipation fin 13 and blow it down to the heating elements around the heat source. Because these hot air flows have a longer cooling time, they can be fully cooled, thereby improving the heat dissipation capacity of the radiator.

As mentioned above, according to the radiator of the present utility model, it has at least the following advantages:

1. Utilizing the oblique setting of the heat dissipation fins of the present invention, the downward blowing vortex airflow can be smoothly introduced into the heat dissipation body, preventing the hot airflow from being sucked into the air intake area, thereby improving the heat dissipation effect of the heat sink. In addition, the airflow blown from the radiator can also dissipate heat to the electronic components around the heat source.

2. Since the heat conducting plate and the fixing block of the utility model can protect the surface of the heat pipe, it can avoid the damage and deformation of the heat pipe due to the pressure of the buckle.

3. Since the frame of the fan of the present invention is integrated with the fan blade group, the assembly process of the heat sink and the fan can be simplified, and the distance between the fan blade group and the heat sink can be shortened, which effectively reduces the assembly cost and improves the heat dissipation efficiency.

To sum up, it can be known that the heat dissipation device of the present invention can indeed achieve the above-mentioned effects through the structure disclosed above. And the utility model has not been publicly used, nor disclosed by various publications, and has practicality, novelty and creativity, and fully meets the application requirements of the utility model.

The above is only a preferred embodiment of the utility model, and is not a limitation of the patent scope of the utility model. All equivalent changes made by using the description and drawings of the utility model are directly or indirectly used in other related technical fields. All are covered within the scope of the present utility model, declare hereby.

Claims (10)

1. A radiator, comprising a radiator and a heat pipe, characterized in that the radiator includes a plurality of radiating fins stacked obliquely, a flow channel is arranged between two adjacent radiating fins, and the Corresponding through holes are respectively provided on the heat dissipation fins, and the through holes are used to connect the heat pipe. Connected to the cooling fins. 2. The radiator according to claim 1, wherein the radiator comprises a first radiator and a second radiator, the first radiator and the second radiator correspond to each other, and the central Lean to the sides. 3 . The heat sink according to claim 1 , wherein a protruding ring is provided around the through hole of the heat dissipation fin to increase the contact surface area with the heat pipe. 4 . 4. The heat sink according to claim 1, characterized in that, the heat absorbing portion of the heat pipe is semicircular. 5 . The heat sink according to claim 1 , further comprising a heat conduction plate and a fixing block, the fixation block and the heat conduction plate are respectively located above and below the heat absorbing portion of the heat pipe. 6 . The heat sink according to claim 5 , wherein the heat conducting plate is provided with a groove, and the groove is used for setting the heat absorbing portion of the heat pipe. 7 . The heat sink according to claim 5 , wherein the fixing block is provided with cooling fins and passages, the cooling fins are used to assist the heat pipe to dissipate heat, and the buckle can be fixed through the passages. 8. The heat sink according to claim 5, further comprising a fan, the fan is located above the heat sink and includes a frame and a set of fan blades fixedly arranged on the frame, the frame is used to communicate with The fixed blocks are connected. 9 . The radiator according to claim 8 , wherein the frame of the fan is a rectangular arc-shaped casing, and a corresponding support plate extending downward is provided on the frame. 10 . The heat sink according to claim 8 , wherein two air guides are formed on the frame, and the air guides extend obliquely downward from the center of the frame. 11 .

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