CN1681113A - heat pipe radiator - Google Patents
heat pipe radiator Download PDFInfo
- Publication number
- CN1681113A CN1681113A CN 200410032541 CN200410032541A CN1681113A CN 1681113 A CN1681113 A CN 1681113A CN 200410032541 CN200410032541 CN 200410032541 CN 200410032541 A CN200410032541 A CN 200410032541A CN 1681113 A CN1681113 A CN 1681113A
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- CN
- China
- Prior art keywords
- heat pipe
- heat
- bottom plate
- shaped
- pipe
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- 239000007769 metal material Substances 0.000 claims 3
- 238000012545 processing Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- JOHZPMXAZQZXHR-UHFFFAOYSA-N pipemidic acid Chemical compound N1=C2N(CC)C=C(C(O)=O)C(=O)C2=CN=C1N1CCNCC1 JOHZPMXAZQZXHR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat pipe type radiator which comprises a U-shaped heat pipe, radiating fins and a bottom plate. The middle part of the U-shaped heat pipe is coupled on the bottom plate to receive the heat from the bottom plate and respectively transmitted to the radiating fins through the two end parts of the U-shaped heat pipe, so that the radiating efficiency of the heat pipe type radiator is effectively improved. The U-shaped heat pipe is combined with the bottom plate by the fixing plate, and the fixing plate absorbs heat, transmits the heat to the two end parts through the middle part of the U-shaped heat pipe and then transmits the heat to the radiating fins. Therefore, the heat dissipation efficiency of the heat pipe type radiator can be effectively improved, the volume can be effectively reduced, and the occupied space can be further saved.
Description
Technical field
The present invention relates to a kind of radiator, particularly a kind of radiator with U type heat pipe.
Background technology
Along with the high development of Information technology, the application of computer industry is day by day popularized.Because computer equipment has the power of handling a large amount of digital informations, and is subjected to liking and extensive use of society.Because the improvement of the technology of integrated circuit, and the requirement of integrate circuit function specification raise day by day, the design of integrated circuit now has been that exquisiteness very is with complicated.
With central processing unit (Central Processing Unit; CPU) be example,, therefore cause its circuit layout to seem complicated many more in early days because present user and various application software all have powerful demand to it.Though the integrated circuit (IC) chip of these central processing units provides many strong functions, yet some new problems have also been produced.For example, problem is the consumption of the huge electric energy that complex circuit design causes, and the electric energy of these consumption will cause the rising of chip temperature, and forms a serious problem on using.Generally speaking, can bring into play maximum usefulness in order to make computer, it is very important that heat removes fast, because inner and can't dissipate immediately the time at computer when heat accumulation, will make the electronic component can't operate as normal, even make whole computer system deadlock.
Traditional computer radiator when the central processing unit of handle high power, generally speaking, can adopt the radiator that directly is installed on the central processing unit, and its fan directly blows to the radiating fin of central processing unit top, and heat is discharged computer inside.In order effectively the heat that central processing unit produced to be discharged computer inside, adopt the heats that guide central processing unit in the mode of heat pipe and radiating fin at present more, the air-flow by fan removes heat again.
Yet along with the heat that central processing unit produced is more and more higher, the required volume of radiator is also just increasing, removes the ability of heat with raising.How can further improve sink-efficiency, especially can improve the radiating efficiency of heat pipe and radiating fin more further, by computer producer and user are paid close attention to.
Summary of the invention
In view of the heat of computer radiator traditional in the above-mentioned background of invention owing to the central processing unit generation increases, thereby must do the volume of radiator more big.How can further improve the radiating efficiency of radiator,, not only can make the work of computer more stable, and can effectively reduce the required volume that takies of radiator to reduce the working temperature of central processing unit.
One of purpose of the present invention is to utilize U type heat pipe to improve the radiating efficiency of radiator, reduces the temperature on central processing unit surface effectively.
Another purpose of the present invention is to utilize U type heat pipe to improve the radiating efficiency of radiator, reduces the volume of radiator effectively.
According to above-described purpose, the invention provides a kind of heat-pipe type radiator, be used for removing the heat that a thermal source is produced, the heat that is specially adapted to integrated circuit removes, and for example is applicable to the heat radiation of the central processing unit of computer.This heat-pipe type radiator comprises a base plate, at least one U type heat pipe, and a plurality of radiating fin.Wherein U type heat pipe is coupled on the base plate, to improve the radiating efficiency of heat-pipe type radiator.Also comprise at least one groove in the base plate, be coupled with U type heat pipe being used for.
And above-mentioned base plate also utilizes a fixed head, so that U type heat pipe is fixed in the base plate.Wherein fixed head is that material by high heat-conduction coefficient is constituted, and for example is that the copper metal constitutes.The heat that thermal source produced then absorbs via base plate and fixed head, is resent to the mid portion of U type heat pipe, and the two ends by U type heat pipe are sent to radiating fin then, and this heat is got rid of.
Above-mentioned base plate also is that the material by high heat-conduction coefficient is constituted, and for example is that aluminum metal constitutes.Fixed head also can be coupled itself and base plate by a plurality of fixtures, for example is screw etc.And U type heat pipe also can utilize method and base plate couplings such as welding or adhesion.
U type heat pipe can increase the area that heat pipe contacts with base plate effectively with base plate, the heat that is come by the thermal source absorption can be sent on the radiating fin via U type heat pipe easily, to get rid of, utilize the made fixed head of copper metal more effectively to improve heat conduction efficiency simultaneously.Therefore, heat-pipe type radiator of the present invention can improve radiating efficiency effectively, and reduces the volume of radiator effectively, to save required occupation space.
Description of drawings
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, especially exemplified by preferred embodiment, and cooperate following accompanying drawing to do to be described in more detail, wherein:
Fig. 1 is the schematic perspective view of U type heat-pipe radiator of the present invention;
Fig. 2 A is the schematic side view of U type heat-pipe radiator of the present invention;
Fig. 2 B is the schematic rear view of U type heat-pipe radiator of the present invention; And
Fig. 2 C be U type heat-pipe radiator of the present invention on look schematic diagram.
Description of reference numerals:
100 heats inks, 102 central processing units
110 base plates, 120 U type heat pipes
130 radiating fins, 140 fans
210 base plates, 212 fixed heads
214 fixtures, 216 grooves
220 U type heat pipes, 222 two end portions
224 mid portions, 230 radiating fins
240 fans
Embodiment
The present invention has improved the radiating efficiency of radiator effectively, the temperature of central processing unit can be reduced effectively, and reduce the volume of radiator.Below will clearly demonstrate spirit of the present invention with accompanying drawing and detailed description, the person skilled in the art is after understanding the preferred embodiments of the present invention, and when technology change and the modification that can be instructed according to the present invention, it does not break away from spirit of the present invention and scope.
Fig. 1 is the schematic perspective view of U type heat-pipe radiator of the present invention.As shown in FIG., radiator 100 comprises base plate 110, and U type heat pipe 120 and radiating fin 130 are installed on the base plate 110.Wherein the below of base plate 110 and central processing unit 102 or any thermal source are coupled, to absorb the heat that it is produced, and this heat is sent to the two end portions of U type heat pipe 120 by the mid portion of U type heat pipe 120, be resent on the radiating fin 130 with base plate 110 parallel installations.The air-flow that is produced by the fan 140 that is installed on radiator 100 sides effectively removes this heat then.
Have than large contact surface owing to U type heat pipe 120 mid portions because with base plate 110 simultaneously and amass, so can absorb the heats that come from base plate 110 more, therefore, compare with the heat pipe of the radiator of prior art, U type heat pipe 120 can be sent to radiating fin 130 fully with heat, so radiator 100 can be is significantly had higher radiating efficiency than the radiator of prior art, takies less spatial volume simultaneously.
Fig. 2 A is the schematic side view of U type heat-pipe radiator of the present invention, and Fig. 2 B is a schematic rear view, and Fig. 2 C looks schematic diagram on being.As shown in FIG.,, make heat pipe fully guide heat to radiating fin, via the air-flow of fan 240 heat is effectively got rid of again for giving full play to the heat-sinking capability of radiator of the present invention.The mid portion 224 and the base plate 210 of U type heat pipe 220 are coupled, and its two end portions 222 then is coupled with radiating fin 230.Wherein U type heat pipe 220 preferably is vertical direction installation with the airflow direction of fan 240.As shown in FIG., the two end portions 222 of U type heat pipe 220 touches the cooling blast that comes from fan 240 in about identical time.
Yet, the U type heat pipe 220 of radiator of the present invention does not limit with the airflow direction of fan 240 and is vertical direction installation, it also can form an angle with the airflow direction of fan 240 and install, for example be that the direction parallel with fan airstream installed, its heat that can utilize the two end portions 222 of U type heat pipe 220 to transmit thermal source simultaneously equally to be produced is to radiating fin 230.Wherein radiating fin 230 is made of the high heat-conduction coefficient material, preferably adopts a sheet metal to constitute, for example aluminum metal or copper sheet metal etc., then have aperture on it so that heat pipe by wherein passing.Then utilize welding between U type heat pipe 220 and the radiating fin 230, or the mode of adhesion is with fixedly U type heat pipe 220 and radiating fin 230, and can improves capacity of heat transmission between the two.And above-mentioned aperture is for cooperating the appearance and modeling made of U type heat pipe 220, it does not limit only for circular, as U type heat pipe 220 are moulding for one square, oval or other shapes, and then radiating fin 230 also can cooperate the hole with the moulding that forms corresponding square, oval or other shapes.
Because U type heat pipe 220 can will be sent on the radiating fin 230 by the heat that U type heat pipe mid portion 224 is absorbed via two end portions 222 simultaneously, and the mid portion 224 of U type heat pipe 220 increases effectively and the heat transfer area of base plate 210.Also can form groove 216 on the base plate 210 and be coupled, also utilize as modes such as welding or adhesion, with further raising heat conduction efficiency with U type heat pipe mid portion 224.Therefore, the radiating efficiency of radiator of the present invention can be improved effectively, makes that the volume of radiator can be reduced effectively.
Fixed head 212 among Fig. 2 C is to utilize fixture 214 or other fixed form, for example is the method for welding or adhesion, and the mid portion 224 of U type heat pipe is fixing effectively with base plate 210 and fixed head 212.Wherein fixed head 212 also has the function that contacts with thermal source, it absorbs the heat that thermal source produced, also be sent to the mid portion 224 of U type heat pipe 220, the two end portions 222 via U type heat pipe 220 is sent to radiating fin 230 again, further improves the radiating efficiency of radiator.Base plate 210 is that the material by high heat-conduction coefficient is constituted, and for example is aluminum metal or copper metal etc.Being constituted and fixed head 212 also is a material by high heat-conduction coefficient, for example is aluminum metal or copper metal etc.
Because U type heat pipe 220 mid portions 224 are horizontally installed among the base plate 210, and utilize fixed head 212 and/or groove 216 combination with it, make further increase heat transfer area between the two, and then make U type heat pipe 220 absorb more heat and be sent on the radiating fin 230 with 222 couplings of U type heat pipe 220 two end portions by thermal source.
Therefore, the radiating efficiency of radiator of the present invention can be enhanced effectively, each radiating fin also can provide the ability of eliminating heat simultaneously more uniformly, even if also can transmit and effective ability of eliminating heat of bringing into play owing to the heat of high efficiency heat pipe at the radiating fin of heat pipe end.So the outward appearance volume of radiator of the present invention is Be Controlled effectively also, and bigger heat-sinking capability is provided.
As the person skilled in the art understood, the above only was the preferred embodiments of the present invention, was not in order to limit protection scope of the present invention.All equivalences that other is finished under the situation that does not break away from disclosed spirit change or modify, and all should be included among the appending claims.
Claims (21)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410032541 CN1681113A (en) | 2004-04-08 | 2004-04-08 | heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410032541 CN1681113A (en) | 2004-04-08 | 2004-04-08 | heat pipe radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1681113A true CN1681113A (en) | 2005-10-12 |
Family
ID=35067617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410032541 Pending CN1681113A (en) | 2004-04-08 | 2004-04-08 | heat pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1681113A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102074532A (en) * | 2009-11-11 | 2011-05-25 | 富士通株式会社 | Heat sink |
| CN103429047A (en) * | 2013-02-27 | 2013-12-04 | 上海理工大学 | Radiating device |
| CN105758237A (en) * | 2016-04-07 | 2016-07-13 | 同度能源科技(江苏)股份有限公司 | Heat radiator with longitudinal and transverse heat tubes |
| CN106090840A (en) * | 2016-08-24 | 2016-11-09 | 广州市格崃格照明电器有限公司 | A kind of LED radiator |
| CN106324027A (en) * | 2016-10-14 | 2017-01-11 | 东莞市迈泰热传科技有限公司 | Adjustable angle thermal resistance test fixture for heat pipe radiator |
| CN107448916A (en) * | 2016-03-31 | 2017-12-08 | 豪雅冠得股份有限公司 | Heat abstractor and the light irradiation device with the heat abstractor |
-
2004
- 2004-04-08 CN CN 200410032541 patent/CN1681113A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102074532A (en) * | 2009-11-11 | 2011-05-25 | 富士通株式会社 | Heat sink |
| CN103429047A (en) * | 2013-02-27 | 2013-12-04 | 上海理工大学 | Radiating device |
| CN107448916A (en) * | 2016-03-31 | 2017-12-08 | 豪雅冠得股份有限公司 | Heat abstractor and the light irradiation device with the heat abstractor |
| CN107448916B (en) * | 2016-03-31 | 2020-01-31 | 豪雅冠得股份有限公司 | Heat dissipation device and light irradiation device with same |
| CN105758237A (en) * | 2016-04-07 | 2016-07-13 | 同度能源科技(江苏)股份有限公司 | Heat radiator with longitudinal and transverse heat tubes |
| CN106090840A (en) * | 2016-08-24 | 2016-11-09 | 广州市格崃格照明电器有限公司 | A kind of LED radiator |
| CN106324027A (en) * | 2016-10-14 | 2017-01-11 | 东莞市迈泰热传科技有限公司 | Adjustable angle thermal resistance test fixture for heat pipe radiator |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |