CN203645975U - Heat dissipation structure applied to mobile devices - Google Patents

Abstract

The utility model relates to a heat dissipation structure applied to a mobile device, the heat dissipation structure applied to the mobile device comprises: a heat-conducting body, the heat-conducting body having a heat dissipation side and a heat absorption side, the heat dissipation side is formed with a radiation heat dissipation layer, and the heat dissipation structure is arranged in the mobile device, which can generate excellent natural radiation convection heat dissipation for the enclosed space in the mobile device, thereby greatly increasing the overall heat dissipation efficiency of the mobile device.

Description

Heat dissipation structure applied to mobile devices

technical field

The invention relates to a heat dissipation structure applied to a mobile device, in particular to a heat dissipation structure applied to a mobile device which can improve heat dissipation performance through natural radiation radiation in a closed space of the mobile device.

Background technique

Current mobile devices (such as thin notebooks, tablets, smart phones, etc.) with faster computing speed, the heat generated by the internal computing execution unit is also relatively greatly increased, and in order to be portable and convenient, the These devices are becoming thinner and thinner; in addition, in order to prevent foreign matter and moisture from entering the interior, these mobile devices rarely have open holes and outside air except for the earphone hole or the hole for connecting the connector. Convection is formed, so due to the congenital factor of thinning, the heat generated by the calculation execution unit and battery inside this type of mobile device cannot be quickly discharged to the outside, and because the interior of the mobile device is a closed space, it is difficult to generate convective heat dissipation. Furthermore, it is easy to generate heat accumulation or heat accumulation inside the mobile device, seriously affecting the working efficiency of the mobile device or generating heat.

Furthermore, due to the above-mentioned problems, there are also passive cooling elements installed inside this type of mobile device: passive cooling elements such as hot plates, vapor chambers, radiators, etc. , so that the internal space of the device is limited and narrow, so the heat dissipation elements placed in this space must be reduced to an ultra-thin size and thickness, so that they can be placed in a narrow and limited internal space, but as the size is limited and reduced For hot plates and vapor chambers, the internal capillary structure and steam channels are also limited and reduced due to the ultra-thin requirements, which greatly reduces the overall heat conduction efficiency of these heat plates and vapor chambers. It cannot effectively improve the heat dissipation performance; therefore, when the power of the internal computing unit of the mobile device is too high, the existing hot plate and vapor chamber cannot effectively respond to the heat dissipation or heat dissipation, so how to install it in a narrow airtight space An effective heat dissipating element is a technology that those skilled in the art need to improve at present.

Contents of the invention

Therefore, in order to effectively solve the above problems, the main purpose of the present invention is to provide a heat dissipation structure applied to a mobile device.

The secondary purpose of the present invention is to provide a method for manufacturing a heat dissipation structure applied to a mobile device.

To achieve the above object, the present invention provides a heat dissipation structure applied to a mobile device, comprising: a heat conduction body; a heat dissipation structure applied to a mobile device, comprising: a heat conduction body having a heat dissipation side and a heat absorption side, The heat dissipation side forms a radiation heat dissipation layer.

Preferably, the heat conduction body is composed of a copper plate and an aluminum plate, the heat-absorbing side is arranged on the opposite side of the copper plate and the aluminum plate, and the heat dissipation The side is arranged on the opposite side of the aluminum plate body and the aforementioned copper plate body.

Preferably, the heat conducting body is a composite material composed of copper and aluminum.

Preferably, the heat-conducting body is an aluminum plate, and a copper plating is coated on the heat-absorbing side.

Preferably, the heat-conducting body is a ceramic plate, and a copper plating layer is coated on the heat-absorbing side.

Preferably, the radiation heat dissipation layer is any one of a porous structure or a nanostructure.

Preferably, the radiation heat dissipation layer is formed by micro arc oxidation (Micro Arc Oxidation, MAO) or plasma electrolytic oxidation (Plasma Electrolytic Oxidation, PEO), anode spark deposition (Anodic Spark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by Spark Deposition, ANOF) any one of them forms a porous structure on the heat dissipation side of the heat conduction body.

Preferably, the radiation heat dissipation layer is a concave-convex structure produced by bead peening.

Preferably, the radiation heat dissipation layer is any one of a porous ceramic structure or a porous graphite structure.

Preferably, the radiation heat dissipation layer is black or sub-black or any of dark colors.

Preferably, the copper plate body and the aluminum plate body are attached to each other by any means of glue bonding or medium-free diffusion bonding.

The present invention mainly provides a radiation heat dissipation layer on the heat dissipation side of the heat conduction body to provide the heat conduction body with natural radiation and convection heat dissipation in the closed accommodation space of the mobile device, thereby greatly increasing the overall heat dissipation performance of the mobile device.

Description of drawings

FIG. 1 is an exploded perspective view of a first embodiment of a heat dissipation structure applied to a mobile device of the present invention;

2 is a combined cross-sectional view of the first embodiment of the heat dissipation structure applied to the mobile device of the present invention;

3 is a combined cross-sectional view of the second embodiment of the heat dissipation structure applied to the mobile device of the present invention;

4 is a combined cross-sectional view of a third embodiment of the heat dissipation structure applied to a mobile device of the present invention;

5 is a combined cross-sectional view of a fourth embodiment of a heat dissipation structure applied to a mobile device according to the present invention;

FIG. 6 is a flow chart of the steps of the first embodiment of the manufacturing method of the heat dissipation structure applied to the mobile device according to the present invention.

Symbol Description

Heat dissipation structure applied to mobile devices1

Thermal body 11

Cooling side 111

Heat-absorbing side 112

Radiation heat dissipation layer 113

Copper plate body 11a

Aluminum plate body 11b

Copper Plating 11c

Detailed ways

Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 and 2, which are three-dimensional exploded and combined sectional views of the first embodiment of the heat dissipation structure applied to mobile devices of the present invention. As shown in the figure, the heat dissipation structure 1 applied to mobile devices of the present invention includes: a Heat conduction body 11;

Wherein the heat conduction body 11 can be a metal material or alloy with high heat conduction efficiency and its composition or composite material; it has a heat dissipation side 111 and a heat absorption side 112, and the heat dissipation side 111 can be directly formed or coated A radiation heat dissipation layer 113 is provided; the heat conducting body 11 in this embodiment is selected to be composed of a copper plate body 11a and an aluminum material plate body 11b superimposed on each other, and the heat-absorbing side 112 is arranged on the copper plate body 11a One side of the material plate body 11a is the opposite side where the copper material plate body 11a and the aluminum material plate body 11b are attached to each other, and the heat dissipation side 111 is arranged on one side of the aluminum material plate body 11b, namely It is the opposite side where the aluminum plate 11b and the copper plate 11a are attached to each other, and the copper plate and the aluminum plate are combined with each other by glue bonding or media-free diffusion bonding.

The radiation heat dissipation layer 113 is any one of a porous structure or a nanostructure or a high-radiation ceramic structure or a high-hardness ceramic structure or a porous ceramic structure or a porous graphite structure, and is formed by evaporation or sputtering or electroplating or Either printing coating or baking varnish or nano-coating spraying or surface anodic oxidation etc. are formed on the heat dissipation side 111 of the heat-conducting body 11. In this preferred embodiment, the nano-structure is used for radiation Structural layer, through micro arc oxidation (Micro Arc Oxidation, MAO) or plasma electrolytic oxidation (Plasma Electrolytic Oxidation, PEO), anodic spark deposition (Anodic Spark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by Spark Deposition, ANOF ) in any way to form ceramics on the heat dissipation side 111 of the heat conduction body 11 (with surface hardening and enhanced radiation effect), and in order to obtain better radiation benefits for the radiation heat dissipation layer 113, the radiation heat dissipation layer is set If it is black or sub-black or any of the dark colors, the effect of radiation heat dissipation will be greatly improved. In this embodiment, black is used as an illustration but not limited to it. The characteristics of rapid conduction heat dissipation through ceramics and graphite are even better. Contributes to the improvement of natural radiation cooling performance.

Please refer to FIG. 3, which is a combined cross-sectional view of the second embodiment of the heat dissipation structure applied to mobile devices of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. The only difference between this embodiment and the aforementioned first embodiment is that the heat-conducting body 11 is a composite material composed of copper and aluminum, and the structural strength and thermal conductivity of the heat-conducting body 11 are improved by selecting the composite material of copper and aluminum. effectiveness.

Please refer to FIG. 4, which is a combined cross-sectional view of the third embodiment of the heat dissipation structure applied to mobile devices of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. , but the difference between this embodiment and the aforementioned first embodiment is that the heat-conducting body 11 is a plate 11b of any one of aluminum or ceramic material, and a copper plating layer 11c is coated on the heat-absorbing side 112, so that The heat conducting body 11 uses an aluminum plate body 11b as the base structure, which has the advantages of better structural strength and can reduce production costs, and a copper plating layer 11c made of copper is attached to the heat absorbing side 112 to enhance the heat conducting body 11 heat transfer efficiency.

Please refer to FIG. 5, which is a combined cross-sectional view of the fourth embodiment of the heat dissipation structure applied to mobile devices of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here. , but the difference between this embodiment and the aforementioned first embodiment is that the radiation heat dissipation layer 113 is a concavo-convex structure produced by bead peening, so as to increase the contact area of heat dissipation, and it is coated or coated on its surface A black pigment is attached to the surface of the radiation heat dissipation layer 113 .

The heat dissipation structure applied to the mobile device of the present invention mainly aims to solve the problem of heat accumulation or heat accumulation in the mobile device, and improve the lack of effective heat dissipation in the closed space inside the existing mobile device.

In the present invention, the heat-absorbing efficiency of the heat-conducting body is improved by partially pasting or partially attaching copper metal on the heat-absorbing side, and a black radiation heat-dissipating layer is arranged on the heat-dissipating side to increase its heat-dissipating contact area and improve the heat-radiating heat-dissipating efficiency.

Please refer to FIG. 6, which is a flow chart of the steps of the first embodiment of the method for manufacturing a heat dissipation structure applied to a mobile device according to the present invention, and refer to the aforementioned FIGS. 1 to 5 together. The manufacturing method of the heat dissipation structure comprises the following steps:

S1: Provide a heat conduction body, and define a heat dissipation side and a heat absorption side;

A heat conduction body 11 is provided, and two sides of the heat conduction body 11 are respectively defined as a heat dissipation side 111 and a heat absorption side 112 .

The selection of the heat conduction body 11 of the present invention, the present invention reveals the following several types of appearances:

One of the heat-conducting body 11 can be a body made of an aluminum or ceramic plate 11b coated with a copper plating layer 11c on the heat-absorbing side (as shown in FIG. 4 ).

Second, the heat-conducting body 11 can also be composed of a copper plate 11a and an aluminum plate 11b, and the heat-absorbing side 112 is arranged on the opposite side of the copper plate 11a and the aluminum plate 11b. The heat dissipation side 111 is arranged on the opposite side of the aluminum plate body 11b and the aforementioned copper plate body 11a, and the copper material plate body 11a and the aluminum material plate body 11b are bonded by gluing or Any of the media-free diffusion bonding methods are attached to each other (as shown in Figures 1 and 2).

Thirdly, the heat conducting body 11 can be a composite material composed of copper and aluminum (as shown in FIG. 3 ).

The structure and description of the heat conduction body 11 mentioned in this embodiment and its diagrams can also refer to the first to fourth embodiments and diagrams of the heat dissipation structure applied to mobile devices.

S2: forming a radiation heat dissipation layer on the heat dissipation side of the heat conduction body.

A radiation heat dissipation layer 113 is formed on the heat dissipation side 111 of the aforementioned heat conduction body 11, and the radiation heat dissipation layer 113 is any one of a porous structure or a nanostructure or a porous ceramic structure or a porous graphite structure. , and set the radiation heat dissipation layer 113 to be any of black or sub-black or dark colors.

And the radiation heat dissipation layer 113 of the porous structure can be oxidized by micro arc oxidation (Micro Arc Oxidation, MAO) or plasma electrolytic oxidation (Plasma Electrolytic Oxidation, PEO), anode spark deposition (Anodic Spark Deposition, ASD), spark deposition anodic oxidation (Anodic Oxidation by Spark Deposition, ANOF) any one of the methods, and the present invention forms the radiation heat dissipation layer 113 on the heat dissipation side 111 of the heat conduction body 11 by means of micro-arc oxidation.

In addition, the radiation heat dissipation layer can also be a surface concave-convex structure produced by bead peening (as shown in Figure 5).

The present invention mainly uses thermal radiation conduction of heat as the application of heat dissipation, and both heat conduction and convection must rely on material as a medium to transmit heat energy. Thermal radiation does not require a medium, that is, it can directly transmit heat energy, so in the confined space, heat can be transferred to the casing of the mobile device in the only small space left, and then exchange heat with the outside world through the casing.

Thermal radiation is the propagation of matter in the form of electromagnetic waves, but electromagnetic waves propagate at the speed of light and require a medium for propagation. Objects will continue to generate thermal radiation and absorb thermal radiation from the outside world. The ability of an object to emit heat is related to its surface temperature, color and roughness. Therefore, the radiation heat dissipation layer provided by the present invention is based on the relevant application principles to set up a natural heat dissipation radiation heat dissipation layer that can improve the surface heat dissipation area and heat dissipation efficiency. The intensity of thermal radiation is not only related to temperature, but also related to the characteristics of its surface. For example, objects with a black surface are easy to absorb and emit thermal radiation. Therefore, the radiation heat dissipation layer of the present invention is set to black or its surface is black. It can further improve its thermal radiation efficiency.

Although the present invention is disclosed above in terms of implementation, it is not intended to limit the present invention. Any person familiar with the art may make various modifications and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of protection of the invention should be determined by the claims.

Claims (11)

1. a radiator structure that is applied to mobile device, is characterized in that, comprising:

One heat conduction body, has a heat radiation side and a heat absorbing side, and described heat radiation side forms a heat loss through radiation layer.

2. the radiator structure that is applied to mobile device as claimed in claim 1, it is characterized in that, described heat conduction body is by a copper material plate body and aluminium material plate body is superimposed forms, described heat absorbing side is located at this copper material plate body and this aluminium material plate body contrary side of fitting, and described heat radiation side is located at a contrary side of this aluminium material plate body and aforementioned copper material plate body laminating.

3. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, the composite material that described heat conduction body is made up of copper and aluminium.

4. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, described heat conduction body is an aluminium material plate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.

5. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, described heat conduction body is a ceramic laminate body, and drapes over one's shoulders an attached copper coating in this heat absorbing side.

6. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, described heat loss through radiation layer is a kind of loose structure or how rice structure is wherein arbitrary.

7. the radiator structure that is applied to mobile device as claimed in claim 1, it is characterized in that, described heat loss through radiation layer is starched electrolytic oxidation, anodic spark deposition by differential arc oxidation or electricity, and spark deposition anodic oxidation wherein arbitrary heat radiation side in this heat conduction body forms a cellular structure.

8. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, described heat loss through radiation layer is for hitting produced concaveconvex structure by pearl.

9. the radiator structure that is applied to mobile device as claimed in claim 1, is characterized in that, described heat loss through radiation layer is that a porous ceramic structure or a porousness graphite-structure are wherein arbitrary.

10. the radiator structure that is applied to mobile device as described in claim 1 or 9, is characterized in that, described heat loss through radiation layer is that to be the color of black or sub-black or dark system wherein arbitrary.

11. radiator structures that are applied to mobile device as claimed in claim 2, is characterized in that, described copper material plate body and aluminium material plate body engage by gummed or engage without Medium Diffusion that wherein either type is bonded to each other.

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