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CN203032018U - Adhesive film-free metal foil-graphite heat-conducting composite - Google Patents

Adhesive film-free metal foil-graphite heat-conducting composite Download PDF

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Publication number
CN203032018U
CN203032018U CN201220434648.6U CN201220434648U CN203032018U CN 203032018 U CN203032018 U CN 203032018U CN 201220434648 U CN201220434648 U CN 201220434648U CN 203032018 U CN203032018 U CN 203032018U
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graphite
copper foil
aluminum foil
foil substrate
adhesive film
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Chinese (zh)
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吴志高
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Heng Lang Technology (tianjin) Co Ltd
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Heng Lang Technology (tianjin) Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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Abstract

The utility model discloses an adhesive film-free metal foil-graphite heat-conducting composite. An aluminum foil substrate or a copper foil substrate and a graphite coating formed by coating graphite powder paint on the bottom surface or the surface layer of the aluminum foil substrate or the copper foil substrate constitute an aluminum foil-graphite heat-conducting composite or a copper foil-graphite heat-conducting composite. The graphite coating is formed by coating the graphite powder paint on the bottom surface or the surface layer of the aluminum foil substrate or the copper foil substrate. The graphite coating is 3-30 micrometers in thickness. The aluminum foil substrate and the copper foil substrate are 7-100 micrometers and 15-100 micrometers in thickness. The heat conductivity of the aluminum foil substrate is 230W/M*K. The heat conductivity of the copper foil substrate is 380W/M*K. The composite is easy to manufacture, can be cut and stamped into any shape, and can be smoothly attached to any plane and bent surface. The aluminum foil substrate or the copper foil substrate is composited with the graphite coating, so that the heat-conducting property is improved.

Description

无胶膜的金属箔石墨导热复合材料Metal foil graphite thermally conductive composite without adhesive film

技术领域 technical field

本实用新型属于界面导热材料技术领域,涉及一种无胶膜的金属箔石墨导热复合材料。  The utility model belongs to the technical field of interface heat-conducting materials, and relates to a metal foil graphite heat-conducting composite material without an adhesive film. the

背景技术 Background technique

随着电子产品的升级换代的加速和迷你、高集成以及高性能电子设备的日益增长,电子产品导热或散热技术日新月异。导热材料的散热效果成为整机小型化设计的关键。为了保证电子器件或设备稳态运转,需将产生的热量及时散出,清除热点区域。因而对导热材料的质量,导热性能提出了更高要求。  With the acceleration of the upgrading of electronic products and the increasing number of miniature, highly integrated and high-performance electronic devices, the heat conduction or heat dissipation technology of electronic products is changing with each passing day. The heat dissipation effect of heat-conducting materials becomes the key to the miniaturization design of the whole machine. In order to ensure the steady-state operation of electronic devices or equipment, it is necessary to dissipate the generated heat in time and remove hot spots. Therefore, higher requirements are put forward for the quality and thermal conductivity of thermal conductive materials. the

现有技术中,中国发明专利申请公布号CN102039716A,申请公布日2011年05月04日《导电导热石墨带制造方法》披露了导电导热石墨带由石墨粉通过喷粉机喷洒在带有基膜的膜胶上,将石墨粉与胶膜通过碾压整平制成的产品。所述基膜为聚酰亚胺薄膜或聚酯薄膜;所述胶膜为丙烯酸酯橡胶压敏胶。  In the prior art, Chinese Invention Patent Application Publication No. CN102039716A, application publication date May 04, 2011, "Method for Manufacturing Conductive and Thermally Conductive Graphite Strips" discloses that the conductive and thermally conductive graphite strips are sprayed by graphite powder on the substrate with the base film through a powder spraying machine. On the film glue, the graphite powder and the film are rolled and flattened. The base film is polyimide film or polyester film; the adhesive film is acrylate rubber pressure-sensitive adhesive. the

其不足之处:聚酰亚胺薄膜或聚酯薄膜基膜的导热率较低,两种材料的导热率都在0.4 W/M·K 以下。由于使用了丙烯酸酯橡胶压敏胶胶膜作为胶粘剂,增加了热阻。基膜与胶膜的使用降低了这种产品的导热效果。  Its disadvantages: the thermal conductivity of polyimide film or polyester film base film is low, and the thermal conductivity of both materials is below 0.4 W/M K. The thermal resistance is increased due to the use of an acrylate rubber pressure-sensitive adhesive film as an adhesive. The use of base film and adhesive film reduces the thermal conductivity of this product. the

市售的金属箔-铝箔、铜箔,以其轻、薄、良好的导热性能而被广泛使用。但在实际应用中,暴露于空气的铝箔和铜箔,容易氧化,从而降低其导热性能。如何保持铝箔和铜箔的良好的导热性能,使导热复合材料具有高的导热性能,是界面导热材料工程技术领域亟待解决的问题。  Commercially available metal foils - aluminum foil and copper foil are widely used for their lightness, thinness and good thermal conductivity. However, in practical applications, aluminum foil and copper foil exposed to the air are easily oxidized, thereby reducing their thermal conductivity. How to maintain the good thermal conductivity of aluminum foil and copper foil, so that the thermal conductive composite material has high thermal conductivity, is an urgent problem to be solved in the field of interface thermal conductive material engineering technology. the

实用新型内容 Utility model content

本实用新型目的是针对现有技术中存在的技术缺陷,而提供一种无胶膜的金属箔石墨导热复合材料,该导热材料导热效率高,不易被氧化,重量轻,具有抗折弯性能,能平滑贴附在任何平面和弯曲的表面。  The purpose of the utility model is to aim at the technical defects existing in the prior art, and to provide a metal foil graphite heat-conducting composite material without an adhesive film. The heat-conducting material has high heat conduction efficiency, is not easily oxidized, is light in weight, and has bending resistance. Attaches smoothly to any flat and curved surface. the

为实现本实用新型的目的,所采用的技术方案是:  For realizing the purpose of this utility model, the technical scheme adopted is:

一种无胶膜的金属箔石墨导热复合材料,其特征在于:所述金属箔为铝箔材料和铜箔材料,所述铝箔材料和铜箔材料,分别作为铝箔基材和铜箔基材,所述无胶膜的金属箔石墨导热复合材料,分别由铝箔基材或铜箔基材与分别在铝箔基材的底面或面层上,或铜箔基材的底面或面层上涂覆的石墨粉涂料成型的石墨涂层构成 A metal foil graphite heat-conducting composite material without an adhesive film, characterized in that: the metal foil is an aluminum foil material and a copper foil material, and the aluminum foil material and the copper foil material are respectively used as an aluminum foil base material and a copper foil base material, and the The metal foil graphite heat-conducting composite material without adhesive film is composed of aluminum foil base material or copper foil base material and graphite coated on the bottom surface or surface layer of aluminum foil base material or the bottom surface or surface layer of copper foil base material respectively. Powder paint molding graphite coating composition .

所述石墨涂层,其厚度设计为3μm~30 μm。  The graphite coating is designed to have a thickness of 3 μm to 30 μm. the

所述铝箔基材,其厚度设计为7μm~100μm。  The thickness of the aluminum foil substrate is designed to be 7 μm to 100 μm. the

所述铜箔基材,其厚度设计为15μm~100μm。  The thickness of the copper foil substrate is designed to be 15 μm to 100 μm. the

所述铝箔基材,其导热率为230 W/M·K。  The aluminum foil base material has a thermal conductivity of 230 W/M·K. the

所述铜箔基材,其导热率为380 W/M·K。  The copper foil base material has a thermal conductivity of 380 W/M·K. the

优点和有益效果  Advantages and beneficial effects

与现有技术相比,本实用新型具有以下的优点和有益效果: Compared with the prior art, the utility model has the following advantages and beneficial effects:

优点 advantage

易于制作,重量轻,可裁切冲压成任意形状,可多次弯折,具有良好的抗折弯性能,能平滑贴附在任何平面和弯曲的表面,外观美观。 Easy to make, light in weight, can be cut and punched into any shape, can be bent multiple times, has good bending resistance, can be smoothly attached to any flat or curved surface, and has a beautiful appearance.

有益效果  Beneficial effect

1、铝箔或铜箔基材与石墨涂层复合,强化了导热性能。  1. Aluminum foil or copper foil base material is compounded with graphite coating to enhance thermal conductivity. the

2、减少了粉尘污染。  2. Reduce dust pollution. the

附图说明 Description of drawings

图1是本实用新型无胶膜的铝箔石墨导热复合材料结构示意图;  Fig. 1 is the structural representation of the aluminum foil graphite heat-conducting composite material without adhesive film of the present invention;

图2是本实用新型无胶膜的铜箔石墨导热复合材料结构示意图。 Fig. 2 is a schematic structural view of the copper foil graphite heat-conducting composite material without an adhesive film of the present invention.

图1中:1-石墨涂层;2-铝箔基材。  In Figure 1: 1-graphite coating; 2-aluminum foil substrate. the

图2中:1-石墨涂层;3-铜箔基材。  In Fig. 2: 1 - graphite coating; 3 - copper foil substrate. the

具体实施方式 Detailed ways

下面结合实施例对本实用新型作进一步描述。  Below in conjunction with embodiment the utility model is further described. the

实施例1  Example 1

一种无胶膜的金属箔石墨导热复合材料,所述金属箔为铝箔材料作为铝箔基材2,所述铝箔基材2与在铝箔基材2的底面或面层上涂覆的石墨粉涂料成型的石墨涂层1构成铝箔石墨导热复合材料,如图1所示,所述石墨涂层1,是由石墨粉涂料涂布在铝箔基材2的底面或面层上成型的石墨涂层1。  A metal foil graphite heat-conducting composite material without an adhesive film, the metal foil is an aluminum foil material as an aluminum foil base material 2, the aluminum foil base material 2 and the graphite powder coating coated on the bottom surface or surface layer of the aluminum foil base material 2 The formed graphite coating 1 constitutes an aluminum foil graphite heat-conducting composite material. As shown in FIG. . the

所述石墨涂层1,其厚度设计为3μm~30 μm,本实用新型设计为5μm。  The graphite coating 1 is designed to have a thickness of 3 μm to 30 μm, and the utility model is designed to be 5 μm. the

所述铝箔基材2,其厚度设计为7μm~100μm,本实用新型设计为12μm。  The thickness of the aluminum foil substrate 2 is designed to be 7 μm to 100 μm, and the thickness of the utility model is designed to be 12 μm. the

所述铝箔基材2,其导热率为230 W/M·K 。  The aluminum foil substrate 2 has a thermal conductivity of 230 W/M·K. the

实施例2  Example 2

一种无胶膜的金属箔石墨导热复合材料,所述金属箔为铜箔材料作为铜箔基材3,所述铜箔基材3与在铜箔基材3的底面或面层上涂覆的石墨粉涂料成型的石墨涂层1构成铜箔石墨导热复合材料,如图2所示,所述石墨涂层1,是由石墨粉涂料涂布在铜箔基材3的底面或面层上成型的石墨涂层1。  A metal foil graphite heat-conducting composite material without an adhesive film, the metal foil is a copper foil material as a copper foil base material 3, and the copper foil base material 3 is coated on the bottom surface or the surface layer of the copper foil base material 3 The graphite coating 1 formed by the graphite powder coating constitutes a copper foil graphite heat-conducting composite material. As shown in Figure 2, the graphite coating 1 is coated on the bottom surface or surface layer of the copper foil substrate 3 by the graphite powder coating Formed graphite coating 1. the

所述石墨涂层1,其厚度设计为3μm~30 μm,本实用新型设计为5μm。  The graphite coating 1 is designed to have a thickness of 3 μm to 30 μm, and the utility model is designed to be 5 μm. the

所述铜箔基材3,其厚度设计为15μm~100μm,本实用新型设计为20μm。  The thickness of the copper foil substrate 3 is designed to be 15 μm to 100 μm, and the thickness of the utility model is designed to be 20 μm. the

所述铜箔基材3,其导热率为380 W/M·K。  The copper foil substrate 3 has a thermal conductivity of 380 W/M·K. the

本实用新型中的铝箔,铜箔,石墨粉均为市售产品。  Aluminum foil in the utility model, copper foil, graphite powder are all commercially available products. the

在本实用新型中,由于以纯铝压延的铝箔作为导热材料的基材,其导热率为230 W/M·K,铝箔的导热性能仅次于银、金和铜, 约相当于铜的60%。在铝箔基材2底面或面层上涂覆石墨粉涂料成型的石墨涂层1构成导热材料,或在导热率为380 W/M·K 的铜箔基材3底面或面层上涂覆石墨粉涂料成型的石墨涂层1组成导热材料,从而优化了铝箔-石墨导热材料或铜箔-石墨导热材料的导热性能,为电子产品的薄型化发展提供了可能。  In the utility model, since the aluminum foil rolled by pure aluminum is used as the base material of the heat-conducting material, its thermal conductivity is 230 W/M K, and the thermal conductivity of the aluminum foil is second only to silver, gold and copper, which is about 60% of that of copper. . Graphite coating 1 formed by coating graphite powder paint on the bottom or surface of aluminum foil substrate 2 constitutes a thermally conductive material, or coating graphite on the bottom or surface of copper foil substrate 3 with a thermal conductivity of 380 W/M K The graphite coating 1 formed by the powder coating constitutes a thermally conductive material, thereby optimizing the thermal conductivity of the aluminum foil-graphite thermally conductive material or the copper foil-graphite thermally conductive material, and providing the possibility for the thinning development of electronic products. the

本实用新型的无胶膜的金属箔石墨导热复合材料,应用于笔记本电脑,大功率LED照明灯,平板显示器,移动电话等电子产品。  The metal foil graphite heat-conducting composite material without adhesive film of the utility model is applied to electronic products such as notebook computers, high-power LED lighting lamps, flat panel displays, and mobile phones. the

以上所述,仅是本实用新型的较佳实施例而已,并非对本实用新型的结构作任何形式上的限制。凡是依据本实用新型的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属本实用新型的技术方案内的范围。  The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the structure of the present utility model in any form. Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present utility model still belong to the scope of the technical solution of the present utility model. the

Claims (6)

1.一种无胶膜的金属箔石墨导热复合材料,其特征在于:所述金属箔为铝箔材料和铜箔材料,所述铝箔材料和铜箔材料,分别作为铝箔基材(1)和铜箔基材(3),所述无胶膜的金属箔石墨导热复合材料,分别由铝箔基材(1)或铜箔基材(3)与分别在铝箔基材(1)的底面或面层上,或铜箔基材(3)的底面或面层上涂覆的石墨粉涂料成型的石墨涂层(2)构成。 1. A metal foil graphite heat-conducting composite material without an adhesive film, characterized in that: the metal foil is an aluminum foil material and a copper foil material, and the aluminum foil material and the copper foil material are used as the aluminum foil base material (1) and the copper foil material respectively The foil base material (3), the metal foil graphite heat-conducting composite material without an adhesive film, is composed of an aluminum foil base material (1) or a copper foil base material (3) and the bottom surface or surface layer of the aluminum foil base material (1) The graphite coating (2) formed by graphite powder coating on the bottom surface or the surface layer of the copper foil substrate (3). 2.根据权利要求1所述无胶膜的金属箔石墨导热复合材料,其特征在于:所述石墨涂层(2),其厚度设计为3μm~30 μm。 2. The film-free metal foil graphite heat-conducting composite material according to claim 1, characterized in that: the thickness of the graphite coating (2) is designed to be 3 μm to 30 μm. 3.根据权利要求1所述无胶膜的金属箔石墨导热复合材料,其特征在于:所述铝箔基材(1),其厚度设计为7μm~100μm。 3. The metal foil-graphite heat-conducting composite material without adhesive film according to claim 1, characterized in that: the thickness of the aluminum foil substrate (1) is designed to be 7 μm-100 μm. 4.根据权利要求1所述无胶膜的金属箔石墨导热复合材料,其特征在于:所述铜箔基材(3),其厚度设计为15μm~100μm。 4. The metal foil-graphite heat-conducting composite material without adhesive film according to claim 1, characterized in that: the thickness of the copper foil substrate (3) is designed to be 15 μm-100 μm. 5.根据权利要求1所述无胶膜的金属箔石墨导热复合材料,其特征在于:所述铝箔基材(1),其导热率为230 W/M·K。 5. The metal foil graphite thermally conductive composite material without adhesive film according to claim 1, characterized in that: the aluminum foil substrate (1) has a thermal conductivity of 230 W/M·K. 6.根据权利要求1所述无胶膜的金属箔石墨导热复合材料,其特征在于:所述铜箔基材(3),其导热率为380 W/M·K。 6. The metal foil-graphite thermally conductive composite material without adhesive film according to claim 1, characterized in that: the thermal conductivity of the copper foil substrate (3) is 380 W/M·K.  the
CN201220434648.6U 2012-08-29 2012-08-29 Adhesive film-free metal foil-graphite heat-conducting composite Expired - Fee Related CN203032018U (en)

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CN105062432A (en) * 2015-08-06 2015-11-18 天津唯能环境科技有限公司 Penetrating heat conduction material, preparation method and special equipment thereof
WO2017045232A1 (en) * 2015-09-14 2017-03-23 奇华光电(昆山)股份有限公司 Natural graphite/aluminum composite heat sink
US9709348B2 (en) 2015-10-27 2017-07-18 Chang Chun Petrochemical Co., Ltd. Heat-dissipating copper foil and graphene composite
CN107660100A (en) * 2016-07-26 2018-02-02 现代自动车株式会社 Graphite member and its manufacture method
WO2018215664A1 (en) * 2017-05-26 2018-11-29 Graphitene Ltd. Heat spreader and method of manufacture thereof
CN110167324A (en) * 2019-06-21 2019-08-23 Oppo广东移动通信有限公司 Shell assembly, preparation method thereof and electronic equipment

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105062432A (en) * 2015-08-06 2015-11-18 天津唯能环境科技有限公司 Penetrating heat conduction material, preparation method and special equipment thereof
CN105062432B (en) * 2015-08-06 2018-10-26 泉州方寸新材料科技有限公司 A kind of penetrability Heat Conduction Material and preparation method thereof and special equipment
WO2017045232A1 (en) * 2015-09-14 2017-03-23 奇华光电(昆山)股份有限公司 Natural graphite/aluminum composite heat sink
US9709348B2 (en) 2015-10-27 2017-07-18 Chang Chun Petrochemical Co., Ltd. Heat-dissipating copper foil and graphene composite
CN107660100A (en) * 2016-07-26 2018-02-02 现代自动车株式会社 Graphite member and its manufacture method
CN107660100B (en) * 2016-07-26 2020-03-13 现代自动车株式会社 Graphite member and method for producing same
US10598445B2 (en) 2016-07-26 2020-03-24 Hyundai Motor Company Graphite component and manufacturing method thereof
WO2018215664A1 (en) * 2017-05-26 2018-11-29 Graphitene Ltd. Heat spreader and method of manufacture thereof
US11421139B2 (en) 2017-05-26 2022-08-23 Graphitene Ltd. Heat spreader and method of manufacture thereof
CN110167324A (en) * 2019-06-21 2019-08-23 Oppo广东移动通信有限公司 Shell assembly, preparation method thereof and electronic equipment

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