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CN203517403U - Light source for illumination and an illumination device - Google Patents

Light source for illumination and an illumination device Download PDF

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Publication number
CN203517403U
CN203517403U CN201320615148.7U CN201320615148U CN203517403U CN 203517403 U CN203517403 U CN 203517403U CN 201320615148 U CN201320615148 U CN 201320615148U CN 203517403 U CN203517403 U CN 203517403U
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substrate
light
light emitting
emitting component
led module
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薛永良
张玮
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

本实用新型涉及一种照明用光源以及照明装置。照明用光源(1),具备:透光性的球形罩(10)、具有向球形罩(10)的内部延伸设置的支柱(41)的支承部件(40)、由支承部件(40)支承而被配置在球形罩(10)内的基板(21)、以及被配置在基板(21)的第一发光元件(22)以及第二发光元件(22);第一发光元件(22)以朝向与支柱(41)相反一侧的方向的方式被配置在基板(21)的主面(21a),第二发光元件(22)以朝向与第一发光元件(22)不同的方向的方式被配置在基板(21),支承部件(40)以接触作为与基板(21)的主面(21a)相反一侧的面的背面(21b)的状态来支承基板(21),相对于基板(21)的背面(21b)的面积,支承部件(40)与背面(21b)接触面积所占的比率为5%以上。

Figure 201320615148

The utility model relates to a light source for lighting and a lighting device. The light source (1) for illumination is equipped with: a translucent spherical cover (10), a support member (40) having a pillar (41) extending to the inside of the spherical cover (10), and supported by the support member (40). The substrate (21) arranged in the spherical cover (10), and the first light-emitting element (22) and the second light-emitting element (22) arranged on the substrate (21); the first light-emitting element (22) faces The pillar (41) is disposed on the main surface (21a) of the substrate (21) in a direction opposite to the support (41), and the second light emitting element (22) is disposed on the main surface (21a) so as to face a direction different from that of the first light emitting element (22). The substrate (21), the supporting member (40) supports the substrate (21) in a state of contacting the back surface (21b) of the surface opposite to the main surface (21a) of the substrate (21), relative to the substrate (21) The ratio of the area of the back surface (21b) to the contact area of the support member (40) and the back surface (21b) is 5% or more.

Figure 201320615148

Description

照明用光源以及照明装置Light source for lighting and lighting device

技术领域technical field

本实用新型涉及具有被配置在基板的发光元件的照明用光源、以及具备该照明用光源的照明装置。The utility model relates to a light source for illumination having a light-emitting element arranged on a substrate, and an illumination device provided with the light source for illumination.

背景技术Background technique

发光二极管(Light Emitting Diode:LED)等半导体发光元件,由于能源效率高并且寿命长,因此期待着能够成为各种灯的新的光源,作为照明用光源,将LED作为光源的LED灯正在被研究开发。Semiconductor light-emitting elements such as light-emitting diodes (Light Emitting Diode: LED) are expected to become new light sources for various lamps due to their high energy efficiency and long life. As a light source for lighting, LED lamps using LEDs as light sources are being studied develop.

作为LED灯有替代灯泡形荧光灯以及白炽灯的灯泡形的LED灯(灯泡形LED灯),或者替代直管形荧光灯的直管形的LED灯(直管形LED灯)等。例如,专利文献1公开了以往的灯泡形LED灯。The LED lamp includes a bulb-shaped LED lamp (bulb-shaped LED lamp) replacing a bulb-shaped fluorescent lamp and an incandescent lamp, or a straight-tube LED lamp (straight-tube LED lamp) replacing a straight-tube fluorescent lamp. For example, Patent Document 1 discloses a conventional bulb-shaped LED lamp.

在LED灯中作为光源采用了在基板上安装有多个LED的LED模块(发光装置)。In an LED lamp, an LED module (light emitting device) in which a plurality of LEDs are mounted on a substrate is used as a light source.

(现有技术文献)(Prior art literature)

(专利文献)(patent documents)

专利文献1    日本    特开2006-313717号公报Patent Document 1 Japanese Patent Application Publication No. 2006-313717

近些年,正在研究在发光特性以及外观上模仿了白炽灯的构成的灯泡形LED灯。例如,公开了利用在白炽灯中所使用的球形罩(玻璃灯泡),在该球形罩内部的中心位置保持LED模块的构成的灯泡形LED灯。In recent years, research has been underway on bulb-shaped LED lamps that mimic the configuration of incandescent lamps in terms of light emission characteristics and appearance. For example, a bulb-shaped LED lamp is disclosed that utilizes a globe (glass bulb) used in an incandescent lamp, and holds an LED module at a central position inside the globe.

更具体而言,利用从球形罩的开口朝向球形罩的中心而延伸设置的支柱(芯棒),将LED模块固定到该支柱的顶部。More specifically, the LED module is fixed to the top of the pillar with a pillar (mandrel) extending from the opening of the globe toward the center of the globe.

在这样的灯泡形LED灯中,为了得到与利用了以往的灯丝线圈的一般的白炽灯近似的配光特性,不仅是LED模块的基板的主面(安装有多个LED芯片的、球形罩的顶点一侧的面)的方向,也希望从多方向放出光。In such a bulb-shaped LED lamp, in order to obtain a light distribution characteristic similar to that of a general incandescent lamp using a conventional filament coil, not only the main surface of the substrate of the LED module (the one on which a plurality of LED chips are mounted, the globe cover) The direction of the surface on the side of the vertex) also wants to emit light from multiple directions.

在此,LED模块所具有的LED在发光时,LED本身会发生热,据此造成LED的温度上升,从而导致光输出降低。即,LED会因本身所发出的热而使发光效率降低。Here, when the LEDs included in the LED module emit light, the LEDs themselves generate heat, which increases the temperature of the LEDs and reduces the light output. That is, the luminous efficiency of an LED decreases due to the heat emitted by itself.

因此,为了使LED模块向多方向放出光,在单纯地增加LED的数量的情况下,会产生各个LED的温度容易上升的环境,从而出现各个LED的发光效率降低的问题。Therefore, simply increasing the number of LEDs in order for the LED module to emit light in multiple directions creates an environment where the temperature of each LED tends to rise, resulting in a problem that the luminous efficiency of each LED decreases.

实用新型内容Utility model content

本实用新型考虑到上述的以往的课题,目的在于提供一种具有优良的配光特性的照明用光源以及照明装置。In consideration of the above-mentioned conventional problems, the present invention aims to provide a light source for illumination and an illumination device having excellent light distribution characteristics.

为了达成上述的目的,本实用新型的一个实施方式所涉及的照明用光源具备:透光性的球形罩;支承部件,具有向所述球形罩的内部延伸设置的支柱;基板,由所述支承部件支承,从而被配置在所述球形罩内;以及被配置在所述基板的第一发光元件以及第二发光元件,所述第一发光元件,以朝向与所述支柱相反一侧的方向的方式被配置在所述基板的主面,所述第二发光元件,以朝向与所述第一发光元件不同的方向的方式被配置在所述基板,所述支承部件,以与所述基板的背面相接触的状态来支承所述基板,所述基板的背面是与所述主面相反一侧的面,相对于所述基板的所述背面的面积,所述支承部件与所述背面相接触的面积所占的比率为5%以上。In order to achieve the above object, a light source for illumination according to an embodiment of the present invention includes: a light-transmitting spherical cover; a supporting member having a pillar extending inwardly of the spherical cover; The component is supported so as to be arranged in the spherical cover; and the first light emitting element and the second light emitting element arranged on the substrate, the first light emitting element is arranged in a direction opposite to the pillar. arranged on the main surface of the substrate, the second light-emitting element is arranged on the substrate in a direction different from that of the first light-emitting element, and the support member is arranged on the substrate with the The back surface of the substrate is a surface opposite to the main surface, and the support member is in contact with the back surface relative to the area of the back surface of the substrate. The proportion of the area is more than 5%.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,在从所述主面一侧来看所述基板的情况下,至少有三个所述第一发光元件以围着所述支柱的方式被配置在所述基板上。In addition, in the light source for illumination according to an embodiment of the present invention, when the substrate is viewed from the side of the main surface, at least three of the first light emitting elements may surround the substrate. It is arranged on the base plate in a manner of touching the pillars.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,所述基板具有至少三个延伸部,该至少三个延伸部在与所述支柱的轴方向交叉的方向上被延伸设置,所述至少三个延伸部的每一个上被配置有至少一个所述第一发光元件。Furthermore, in the light source for illumination according to an embodiment of the present invention, the substrate may have at least three extensions extending in a direction intersecting the axial direction of the support. Being extended, each of the at least three extensions is configured with at least one first light-emitting element.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,至少三个所述第一发光元件被配置在所述基板上,且位于以所述支柱的轴为中心的圆周上。In addition, in the light source for illumination according to an embodiment of the present invention, at least three of the first light emitting elements may be arranged on the substrate and positioned at the center of the pillar axis. on the circumference.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,至少一个所述第二发光元件被配置在所述基板的所述背面。Furthermore, in the light source for illumination according to one embodiment of the present invention, at least one of the second light emitting elements may be arranged on the back surface of the substrate.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,所述支承部件具有安装了所述基板的安装部,该安装部与所述支柱的在所述球形罩的内部一侧的端部相连接,所述基板具有被配置在所述安装部的上表面的第一基板以及被配置在所述安装部的下表面的第二基板,所述安装部的上表面是指与所述支柱相反一侧的面,所述安装部的下表面是指所述支柱一侧的面,所述第一发光元件被配置在所述第一基板,所述第二发光元件被配置在所述第二基板。In addition, in the light source for illumination according to an embodiment of the present invention, the support member may have a mounting portion on which the substrate is mounted, and the mounting portion may be connected to the spherical cover of the support. The ends on the inner side are connected, the substrate has a first substrate arranged on the upper surface of the installation part and a second substrate arranged on the lower surface of the installation part, and the upper surface of the installation part refers to the surface on the side opposite to the pillar, the lower surface of the mounting portion refers to the surface on the side of the pillar, the first light-emitting element is arranged on the first substrate, and the second light-emitting element configured on the second substrate.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,所述支承部件具有用于安装所述基板的安装部,该安装部与所述支柱在所述球形罩的内部一侧的端部相连接,所述基板具有被配置在所述安装部的上表面的第一基板以及被配置在所述安装部的侧面的第二基板,所述安装部的上表面是指与所述支柱相反一侧的面,所述安装部的侧面是指沿着与所述上表面交叉的方向的面,所述第一发光元件被配置在所述第一基板,所述第二发光元件被配置在所述第二基板。In addition, in the light source for illumination according to the embodiment of the present invention, the support member may have a mounting portion for mounting the substrate, and the mounting portion and the support may be placed on the spherical cover. The ends on the inner side are connected, the substrate has a first substrate arranged on the upper surface of the installation part and a second substrate arranged on the side surface of the installation part, and the upper surface of the installation part is refers to the surface opposite to the pillar, the side surface of the mounting portion refers to a surface along a direction intersecting the upper surface, the first light-emitting element is arranged on the first substrate, and the second light emitting element is disposed on the first substrate. Two light emitting elements are configured on the second substrate.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,所述基板以折弯的状态由所述支承部件支承,所述基板的所述主面具有:沿着所述支承部件的端面而被配置的第一主面、以及通过折弯所述基板而形成的与所述第一主面朝向不同的第二主面,所述第一发光元件被配置在所述第一主面,所述第二发光元件被配置在所述第二主面。In addition, in the light source for illumination according to an embodiment of the present invention, the substrate may be supported by the support member in a bent state, and the main surface of the substrate may have: The first main surface arranged on the end surface of the support member, and the second main surface formed by bending the substrate in a different direction from the first main surface, the first light emitting element is arranged on the The first main surface, the second light emitting element is arranged on the second main surface.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,所述第一发光元件以及所述第二发光元件分别是,具有容器以及被安装在所述容器内的LED芯片的表面贴装型LED元件。Furthermore, in the light source for illumination according to one embodiment of the present invention, the first light emitting element and the second light emitting element may each have a container and an LED mounted in the container. Chip surface mount type LED components.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,所述第一发光元件以及所述第二发光元件分别是,被安装在所述基板上的LED芯片。Furthermore, in the light source for illumination according to one embodiment of the present invention, each of the first light emitting element and the second light emitting element may be an LED chip mounted on the substrate.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,所述照明用光源还具备波长变换体,该波长变换体是预先规定了形状的部件,并且该波长变换体以覆盖所述第一发光元件以及所述第二发光元件的方式被配置在所述球形罩内,所述波长变换体通过所述波长变换体中含有的变换材料,将从所述第一发光元件以及所述第二发光元件入射的光的波长变换为规定的波长并放出。In addition, in the light source for illumination according to an embodiment of the present invention, the light source for illumination may further include a wavelength conversion body, the wavelength conversion body is a member of a predetermined shape, and the wavelength conversion body The wavelength conversion body is arranged in the spherical cover so as to cover the first light emitting element and the second light emitting element, and the wavelength conversion body converts light emitted from the first The wavelength of light incident on the element and the second light emitting element is converted into a predetermined wavelength and emitted.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,所述球形罩为蜡烛形的球形罩。Moreover, in the light source for illumination which concerns on one Embodiment of this invention, the said globe cover may be a candle-shaped globe cover.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,相对于所述基板的所述背面的面积,所述支承部件与所述背面相接触的面积所占的比率为10%以上。Furthermore, in the light source for illumination according to an embodiment of the present invention, the ratio of the area of the support member in contact with the back surface to the area of the back surface of the substrate may be more than 10%.

并且,也可以是,在本实用新型的一个实施方式所涉及的照明用光源中,相对于所述基板的所述背面的面积,所述支承部件与所述背面相接触的面积所占的比率为25%以上。Furthermore, in the light source for illumination according to an embodiment of the present invention, the ratio of the area of the support member in contact with the back surface to the area of the back surface of the substrate may be more than 25%.

并且,本实用新型的一个实施方式中的照明装置为,具备以上的任一个实施方式所涉及的照明用光源。Moreover, the illuminating device in one Embodiment of this invention is provided with the light source for illumination concerning any one of the above-mentioned embodiment.

通过本实用新型,能够提供一种具有优良的配光特性的照明用光源以及照明装置。According to the present invention, it is possible to provide a light source for illumination and an illumination device having excellent light distribution characteristics.

附图说明Description of drawings

图1是实施方式1所涉及的灯泡形灯的正面图。FIG. 1 is a front view of a light bulb-shaped lamp according to Embodiment 1. FIG.

图2是实施方式1所涉及的灯泡形灯的分解透视图。FIG. 2 is an exploded perspective view of the light bulb-shaped lamp according to Embodiment 1. FIG.

图3示出了实施方式1的灯泡形灯中的支承部件与基板的接触面积的大小的一个例子。FIG. 3 shows an example of the size of the contact area between the support member and the substrate in the light bulb-shaped lamp according to Embodiment 1. As shown in FIG.

图4(a)和图4(b)示出了实施方式1的变形例1所涉及的LED模块的构成概要。FIG.4(a) and FIG.4(b) have shown the outline|summary of the structure of the LED module which concerns on the modification 1 of Embodiment 1. As shown in FIG.

图5(a)和图5(b)示出了实施方式1的变形例2所涉及的LED模块的构成概要。FIG.5(a) and FIG.5(b) have shown the outline|summary of the structure of the LED module which concerns on the modification 2 of Embodiment 1. As shown in FIG.

图6(a)和图6(b)示出了实施方式1的变形例3所涉及的LED模块的构成概要。FIG.6(a) and FIG.6(b) have shown the outline|summary of the structure of the LED module which concerns on the modification 3 of Embodiment 1. As shown in FIG.

图7示出了实施方式1的变形例4所涉及的LED模块的构成概要。FIG. 7 shows an outline of the configuration of an LED module according to Modification 4 of Embodiment 1. As shown in FIG.

图8示出了实施方式1的变形例5所涉及的LED模块的构成概要。FIG. 8 shows a schematic configuration of an LED module according to Modification 5 of Embodiment 1. As shown in FIG.

图9示出了实施方式1的变形例6所涉及的LED模块的构成概要。FIG. 9 shows an outline of the configuration of an LED module according to Modification 6 of Embodiment 1. As shown in FIG.

图10示出了实施方式1的变形例7所涉及的LED模块的构成概要。FIG. 10 shows an outline of the configuration of an LED module according to Modification 7 of Embodiment 1. As shown in FIG.

图11示出了实施方式1的变形例8所涉及的LED模块的构成概要。FIG. 11 shows an outline of the configuration of an LED module according to Modification 8 of Embodiment 1. As shown in FIG.

图12是作为比较例子的灯泡形灯的正面图。Fig. 12 is a front view of a light bulb-shaped lamp as a comparative example.

图13是示出图12所示的灯泡形灯的配光特性的配光曲线图。FIG. 13 is a light distribution graph showing the light distribution characteristics of the light bulb-shaped lamp shown in FIG. 12 .

图14是示出具备变形例1所涉及的LED模块的灯泡形灯的配光特性的配光曲线图。14 is a light distribution graph showing light distribution characteristics of a light bulb-shaped lamp including an LED module according to Modification 1. FIG.

图15示出了支承部件与基板的接触面积相对于基板面积的比率、与发光元件的温度之间的关系。FIG. 15 shows the relationship between the ratio of the contact area between the support member and the substrate to the substrate area, and the temperature of the light emitting element.

图16是实施方式2所涉及的灯泡形灯的一部分的剖面图。FIG. 16 is a cross-sectional view of a part of the light bulb-shaped lamp according to Embodiment 2. FIG.

图17是实施方式3所涉及的灯泡形灯的外观透视图。FIG. 17 is an external perspective view of a light bulb-shaped lamp according to Embodiment 3. FIG.

图18是实施方式4所涉及的照明装置的概略剖面图。FIG. 18 is a schematic cross-sectional view of a lighting device according to Embodiment 4. FIG.

图19是实施方式5所涉及的照明装置的外观透视图。FIG. 19 is an external perspective view of a lighting device according to Embodiment 5. FIG.

具体实施方式Detailed ways

以下,参照附图对本实用新型的实施方式进行说明。并且,各个图为模式图,并非是严谨的图示。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, each figure is a schematic figure, and is not a strict illustration.

并且,以下所说明的实施方式为本实用新型的概括的例子或者是具体例子。以下的实施方式所示的数值、形状、材料、构成要素、构成要素的配置位置以及连接方式等为一个例子,并非是限定本实用新型的主旨。并且,在以下的实施方式的构成要素中,对于独立权利要求中所没有记载的构成要素,作为任意的构成要素来进行说明。In addition, the embodiment described below is a general example or a specific example of the present invention. Numerical values, shapes, materials, components, arrangement positions and connection modes of the components shown in the following embodiments are examples, and do not limit the gist of the present invention. In addition, among the constituent elements of the following embodiments, constituent elements not described in the independent claims are described as arbitrary constituent elements.

(实施方式1)(Embodiment 1)

首先,参照图1以及图2对本实用新型的实施方式1所涉及的灯泡形灯1的全体构成进行说明。First, the overall configuration of the light bulb-shaped lamp 1 according to Embodiment 1 of the present invention will be described with reference to FIGS. 1 and 2 .

图1是本实用新型的实施方式1所涉及的灯泡形灯1的正面图。图2是实施方式1所涉及的灯泡形灯1的分解透视图。FIG. 1 is a front view of a light bulb-shaped lamp 1 according to Embodiment 1 of the present invention. FIG. 2 is an exploded perspective view of the light bulb-shaped lamp 1 according to the first embodiment.

并且,在图1中示出了,沿着纸面的上下方向描画的点划线为灯泡形灯1的灯轴J(中心轴)。灯轴J是指,在将灯泡形灯1安装到照明装置(图1以及图2中未示出)的灯座时成为旋转中心的轴,与灯头30的旋转轴一致。In addition, in FIG. 1 , the dashed-dotted line drawn along the vertical direction of the paper is the lamp axis J (central axis) of the light bulb-shaped lamp 1 . The lamp axis J refers to an axis serving as the center of rotation when the lightbulb-shaped lamp 1 is attached to a socket of a lighting device (not shown in FIGS. 1 and 2 ), and coincides with the rotation axis of the base 30 .

灯泡形灯1是照明用光源的一个例子,是成为灯泡形荧光灯或者白炽灯的替代品的灯泡形LED灯。The lightbulb-shaped lamp 1 is an example of a light source for illumination, and is a lightbulb-shaped LED lamp as a substitute for a lightbulb-shaped fluorescent lamp or an incandescent lamp.

灯泡形灯1具备:透光性的球形罩10、支承部件40、被配置在球形罩10的内部并由支承部件40支承的基板21、以及被配置在基板21的多个发光元件22。The bulb-shaped lamp 1 includes a translucent glove 10 , a support member 40 , a substrate 21 arranged inside the glove 10 and supported by the support member 40 , and a plurality of light emitting elements 22 arranged on the substrate 21 .

支承部件40具有向球形罩10的内部延伸设置的支柱41。并且,支承部件40以与基板21的背面21b接触的状态来支承基板21。The supporting member 40 has a support column 41 extending toward the inside of the glove 10 . Furthermore, the support member 40 supports the substrate 21 in a state of being in contact with the back surface 21 b of the substrate 21 .

并且,在本实施方式中,LED模块20由基板21与多个发光元件22构成。Furthermore, in the present embodiment, the LED module 20 is composed of a substrate 21 and a plurality of light emitting elements 22 .

并且,多个发光元件22之中的、以朝向与支柱41相反一侧的方向而被配置在基板21的主面21a上的发光元件22是第一发光元件的一个例子。Furthermore, among the plurality of light emitting elements 22 , the light emitting element 22 disposed on the main surface 21 a of the substrate 21 in a direction opposite to the pillar 41 is an example of a first light emitting element.

并且,在本实施方式中,与基板21的主面21a相反一侧的面为背面21b,被配置在该背面21b的发光元件22是第二发光元件的一个例子。即,第二发光元件以与第一发光元件的朝向不同的方式而被配置在基板21。In addition, in this embodiment, the surface opposite to the main surface 21a of the substrate 21 is the back surface 21b, and the light emitting element 22 arranged on the back surface 21b is an example of a second light emitting element. That is, the second light emitting element is arranged on the substrate 21 in a direction different from that of the first light emitting element.

在具有这种构成的灯泡形灯1中所具有的特点是,相对于基板21的背面21b的面积,支承部件40与背面21b的接触面积(支承部件40与基板21的接触面积)所占的比率为5%以上。The lightbulb-shaped lamp 1 having such a structure is characterized in that, relative to the area of the back surface 21b of the substrate 21, the contact area between the support member 40 and the back surface 21b (the contact area between the support member 40 and the substrate 21) occupies The rate is above 5%.

根据该特点,灯泡形灯1能够通过多个发光元件22而向多方向放出光,并且能够提高多个发光元件22每一个的散热效率。以后将利用图3对支承部件40与基板21的接触面积进行详细说明。According to this feature, the light bulb-shaped lamp 1 can emit light in multiple directions through the plurality of light emitting elements 22, and the heat dissipation efficiency of each of the plurality of light emitting elements 22 can be improved. The contact area between the support member 40 and the substrate 21 will be described in detail later using FIG. 3 .

本实施方式的灯泡形灯1还具备:从灯的外部接受电力的灯头30、与支承部件40连接的台座50、树脂外壳60、引线70a和70b、以及驱动电路80。The lightbulb-shaped lamp 1 of this embodiment further includes a base 30 receiving electric power from the outside of the lamp, a base 50 connected to a support member 40 , a resin case 60 , lead wires 70 a and 70 b , and a drive circuit 80 .

灯泡形灯1由球形罩10、树脂外壳60、灯头30构成了外围器。以下对本实施方式所涉及的灯泡形灯1的各个构成要素进行说明。The lightbulb-shaped lamp 1 includes a globe 10 , a resin case 60 , and a base 30 to form an enclosure. Each component of the lightbulb-shaped lamp 1 which concerns on this embodiment is demonstrated below.

[球形罩][dome cover]

球形罩10是既能够收纳LED模块20又能够使来自LED模块20的光透过到灯的外部的透光罩。入射到该球形罩10的内面的LED模块20的光透过球形罩10,被取出到球形罩10的外部。The glove 10 is a translucent cover capable of accommodating the LED module 20 and allowing light from the LED module 20 to pass through to the outside of the lamp. The light of the LED module 20 incident on the inner surface of the glove 10 passes through the glove 10 and is extracted to the outside of the glove 10 .

本实施方式中的球形罩10由针对来自LED模块20的光为透明的材料构成。作为这样的球形罩10例如能够采用针对可见光为透明的硅石玻璃制的玻璃灯泡(透明灯泡)。The glove 10 in this embodiment is made of a material that is transparent to light from the LED module 20 . As such a glove 10 , for example, a glass bulb (transparent bulb) made of silica glass that is transparent to visible light can be used.

在这种情况下,能够从球形罩10的外侧目视到被收纳于球形罩10内的LED模块20。In this case, the LED module 20 housed in the glove 10 can be visually observed from the outside of the glove 10 .

并且,球形罩10也可以不必是针对可见光为透明,球形罩10只要具有光扩散功能即可。即,可以在球形罩10的内面或者外面形成用于扩散来自LED模块20的光的扩散区域。In addition, the glove 10 does not need to be transparent with respect to visible light, and the glove 10 only needs to have a light diffusing function. That is, a diffusion region for diffusing light from the LED module 20 may be formed on the inner surface or the outer surface of the glove 10 .

这样,通过使球形罩10具有光扩散功能,从而能够对从LED模块20入射到球形罩10的光得到扩散。In this way, by giving the glove 10 a light diffusing function, it is possible to diffuse the light incident on the glove 10 from the LED module 20 .

并且,作为球形罩10的材料并非限于玻璃材料,也可以采用由丙烯(PMMA:Poly Methyl Methacrylate)或聚碳酸脂(PC:Poly Carbonate)等合成树脂等构成的树脂材料。In addition, the material of the glove 10 is not limited to glass, and a resin material made of synthetic resin such as acrylic (PMMA: Poly Methyl Methacrylate) or polycarbonate (PC: Poly Carbonate) may be used.

[LED模块][LED module]

LED模块20具有基板21和被配置在基板21的多个发光元件22,是通过引线70a以及70b提供来的电力来发光的发光模块(发光装置)。The LED module 20 has a substrate 21 and a plurality of light-emitting elements 22 arranged on the substrate 21, and is a light-emitting module (light-emitting device) that emits light by electric power supplied from lead wires 70a and 70b.

并且,在本实施方式中,作为LED模块20所具有的发光元件22,采用了表面贴装(SMD:Surface Mount Device)型LED元件。In addition, in this embodiment, a surface mount (SMD: Surface Mount Device) type LED element is used as the light emitting element 22 included in the LED module 20 .

基板21由支承部件40支承,而被配置在上述的球形罩10内。即,LED模块20由支承部件40被保持在球形罩10内。The substrate 21 is supported by the supporting member 40 and arranged inside the above-mentioned glove 10 . That is, the LED module 20 is held within the glove 10 by the supporting member 40 .

LED模块20被配置在由球形罩10形成的球形状的中心位置(例如,球形罩10的内径大的径大部分的内部)。The LED module 20 is arranged at the center of the spherical shape formed by the glove 10 (for example, inside the globule 10 having a large inner diameter).

即,本实施方式中的灯泡形灯1所采用的构成是,在球形罩10的中心位置配置LED模块20(CMT:Center Mount Technology)。That is, the lightbulb-shaped lamp 1 in this embodiment adopts a configuration in which an LED module 20 (CMT: Center Mount Technology) is arranged at the center position of the glove 10 .

这样,通过将LED模块20配置到球形罩10的中心位置,灯泡形灯1的配光特性能够成为接近于以往的利用了灯丝线圈的一般的白炽灯的配光特性。Thus, by arranging the LED module 20 at the center of the glove 10, the light distribution characteristic of the bulb-shaped lamp 1 can be made close to that of a conventional general incandescent lamp using a filament coil.

并且,在本实施方式的LED模块20中,在基板21的主面21a上配置有四个发光元件22,在基板21的背面21b配置有两个发光元件22。即,LED模块20共有六个发光元件22。但是,LED模块20中的发光元件22的个数以及配置方式并非受此所限。Furthermore, in the LED module 20 of this embodiment, four light emitting elements 22 are arranged on the main surface 21 a of the substrate 21 , and two light emitting elements 22 are arranged on the back surface 21 b of the substrate 21 . That is, the LED module 20 has six light emitting elements 22 in total. However, the number and arrangement of the light emitting elements 22 in the LED module 20 are not limited thereto.

例如,也可以是,在基板21的主面21a以及背面21b分别仅配置一个发光元件22。For example, only one light emitting element 22 may be arranged on each of the main surface 21 a and the rear surface 21 b of the substrate 21 .

即,也可以是,灯泡形灯1所具备的多个发光元件22之中至少有一个发光元件22被配置在基板21的主面21a,其他的也至少有一个发光元件22被配置成,所朝的方向与被配置在主面21a的发光元件22的朝向不同。据此,光能够向多方向放出(配光角的扩大)。That is, at least one of the plurality of light emitting elements 22 included in the bulb-shaped lamp 1 may be arranged on the main surface 21a of the substrate 21, and at least one of the other light emitting elements 22 may also be arranged so that The direction to face is different from the direction of the light emitting elements 22 arranged on the main surface 21a. Accordingly, light can be emitted in multiple directions (expansion of the light distribution angle).

基板21例如是厚度为1mm左右的基板。在本实施方式中例如采用对光的反射率为70%以上的白色氧化铝基板来作为基板21。The substrate 21 is, for example, a substrate with a thickness of about 1 mm. In this embodiment, for example, a white alumina substrate having a light reflectance of 70% or more is used as the substrate 21 .

并且,LED模块20所具备的基板21的材料并非受氧化铝所限。例如,能够采用氮化铝构成的透光性陶瓷基板、透明的玻璃基板、由水晶构成的基板、蓝宝石基板、或者树脂制成的基板等来作为基板21。Moreover, the material of the substrate 21 included in the LED module 20 is not limited to alumina. For example, a translucent ceramic substrate made of aluminum nitride, a transparent glass substrate, a substrate made of crystal, a sapphire substrate, or a resin substrate can be used as the substrate 21 .

并且,可以不是硬质基板,而是采用柔性基板、或者硬质柔性基板来作为基板21。In addition, instead of a rigid substrate, a flexible substrate or a rigid flexible substrate may be used as the substrate 21 .

并且,基板21也可以具有透光性。作为具有透光性的基板21,例如可以采用可见光的透过率(从基板21的主面21a向背面21b放出的光束之中,透过基板21的光束的比率)为5%以上的基板。In addition, the substrate 21 may also have translucency. As the light-transmitting substrate 21, for example, a substrate having a visible light transmittance (ratio of light beams emitted from the main surface 21a to the back surface 21b and passing through the substrate 21) of 5% or more can be used.

并且,作为基板21也可以采用以金属为主的基板,该以金属为主的基板是通过对铝等金属的基础材料上施加绝缘被膜而得到的。通过采用以金属为主的基板来用作基板21,例如能够针对多个发光元件22提高散热效率。Furthermore, as the substrate 21 , a substrate mainly composed of a metal obtained by applying an insulating coating to a base material of a metal such as aluminum may be used. By using a metal-based substrate as the substrate 21 , for example, heat dissipation efficiency can be improved for the plurality of light emitting elements 22 .

作为SMD型LED元件的发光元件22,如图2所示,具有:容器22a、安装在容器22a内的LED芯片22b、以及对来自LED芯片22b的光的波长进行变换的波长变换材料22d。Light emitting element 22 as an SMD type LED element, as shown in FIG.

在本实施方式中,作为LED芯片22b例如采用发出蓝色光的蓝色LED芯片。作为蓝色LED芯片,例如能够采用由InGaN系的材料构成的、中心波长为440nm至470nm的氮化镓系的半导体发光元件。In this embodiment, for example, a blue LED chip that emits blue light is used as the LED chip 22b. As the blue LED chip, for example, a gallium nitride-based semiconductor light emitting element having a central wavelength of 440 nm to 470 nm, which is made of an InGaN-based material, can be used.

波长变换材料22d在本实施方式中为荧光体粒子,包含该荧光体粒子的密封部件22c位于发光元件22内。The wavelength conversion material 22 d is phosphor particles in this embodiment, and the sealing member 22 c including the phosphor particles is located inside the light emitting element 22 .

通过具有波长变换材料22d的密封部件22c,LED芯片22b发出的光的波长(色彩)被变换。作为这样的密封部件22c,例如可以举例示出含有荧光体粒子的绝缘性的树脂材料(含荧光体树脂)。荧光体粒子由LED芯片22b所发出的光激发,从而放出所希望的色彩(波长)的光。The wavelength (color) of light emitted from the LED chip 22b is converted by the sealing member 22c having the wavelength conversion material 22d. As such a sealing member 22c, for example, an insulating resin material containing phosphor particles (phosphor-containing resin) can be exemplified. The phosphor particles are excited by the light emitted from the LED chip 22b to emit light of a desired color (wavelength).

作为构成密封部件22c的透光性树脂材料,例如采用硅树脂。并且,也可以使硅石等光扩散材料分散到密封部件22c。并且,密封部件22c也可以不必由树脂材料形成,也可以由氟系树脂等有机材料、或者低熔点玻璃、溶胶凝胶法制成的玻璃等无机材料来形成。As a translucent resin material which comprises the sealing member 22c, a silicone resin is used, for example. Moreover, you may disperse light-diffusion materials, such as silica, in the sealing member 22c. Furthermore, the sealing member 22c does not have to be formed of a resin material, and may be formed of an organic material such as a fluorine-based resin, or an inorganic material such as low-melting glass or sol-gel glass.

例如,在LED芯片22b为蓝色LED芯片的情况下,为了得到白色光,密封部件22c中所含有的作为波长变换材料22d的荧光体粒子,例如采用YAG(钇、铝、石榴石)系的黄色荧光体粒子。For example, when the LED chip 22b is a blue LED chip, in order to obtain white light, phosphor particles as the wavelength conversion material 22d contained in the sealing member 22c are, for example, YAG (yttrium, aluminum, garnet)-based phosphor particles. Yellow phosphor particles.

据此,LED芯片22b所发出的蓝色光的一部分,由密封部件22c中所包含的黄色荧光体粒子被波长变换为黄色光。于是,没有被黄色荧光体粒子吸收的蓝色光与由黄色荧光体粒子被进行了波长变换的黄色光混合在一起,从而成为白色光从密封部件22c射出。Accordingly, part of the blue light emitted by the LED chip 22b is wavelength-converted into yellow light by the yellow phosphor particles contained in the sealing member 22c. Then, the blue light not absorbed by the yellow phosphor particles is mixed with the yellow light whose wavelength has been converted by the yellow phosphor particles, and is emitted as white light from the sealing member 22c.

并且,容器22a的材料以及形状等没有特殊的限定。作为容器22a的材料例如也可以采用对可见光的透射率高的树脂。在这种情况下,例如从容器22a的侧面也能够取出许多光,从而扩大了发光元件22的配光角。因此,具备一个以上这样的发光元件22的LED模块20的配光角得到了扩大。In addition, the material, shape, etc. of the container 22a are not particularly limited. As the material of the container 22a, for example, a resin having a high transmittance to visible light may be used. In this case, for example, a lot of light can be taken out from the side surface of the container 22a, and the light distribution angle of the light emitting element 22 is enlarged. Therefore, the light distribution angle of the LED module 20 including one or more such light emitting elements 22 is expanded.

具有这种构成的六个发光元件22在本实施方式中以串联的方式被电连接。Six light emitting elements 22 having such a configuration are electrically connected in series in the present embodiment.

具体而言,在本实施方式中,引线70a是用于将正电压从驱动电路80供给到LED模块20的导线(正侧输出端子线)。引线70b是用于将负电压从驱动电路80供给到LED模块20的导线(负侧输出端子线)。Specifically, in the present embodiment, the lead wire 70 a is a wire (positive-side output terminal wire) for supplying a positive voltage from the drive circuit 80 to the LED module 20 . The lead wire 70b is a wire (negative-side output terminal wire) for supplying a negative voltage from the driving circuit 80 to the LED module 20 .

即,来自引线70a的直流电例如以图1中的基板21的背面21b的左侧的发光元件22、基板21的主面21a的四个发光元件、以及、基板21的背面21b的右侧的发光元件22的顺序而被提供,并流入到引线70b。That is, the direct current from the lead wire 70a is, for example, the light emitting element 22 on the left side of the back surface 21b of the substrate 21 in FIG. The sequence of elements 22 is provided and flows into lead 70b.

这样,在LED模块20所具有的六个发光元件22中被供给有发光所需要的直流电,据此,六个发光元件22分别发光。In this way, the six light-emitting elements 22 included in the LED module 20 are supplied with direct current necessary for light emission, whereby the six light-emitting elements 22 each emit light.

并且,被设置在基板21的与各个发光元件22相连接的布线图案没有特殊的限定,如以上所述,只要能够将发光所需要的电力供给到LED模块20所具有的多个发光元件22,可以采用任意的布线图案。In addition, the wiring pattern connected to each light emitting element 22 provided on the substrate 21 is not particularly limited, as long as the power required for light emission can be supplied to the plurality of light emitting elements 22 included in the LED module 20 as described above, Any wiring pattern can be used.

即,在LED模块20中,根据LED模块20所具有的发光元件22的个数、配置的方式以及连接的方式(串联、并联、以及串联与并联混合等),能够采用各种各样的布线图案。这与后述的各个变形例所涉及的LED模块相同。That is, in the LED module 20, various types of wiring can be adopted depending on the number of light-emitting elements 22 included in the LED module 20, the manner of arrangement, and the manner of connection (series connection, parallel connection, mixed series and parallel connection, etc.). pattern. This is the same as that of the LED modules according to the modified examples described later.

[灯头][lamp holder]

灯头30是受电部,从灯泡形灯1的外部接受用于使LED模块20的LED发光的电力。灯头30通过两个接点来接受电力,以灯头30接受的电力经由引线,被输入到驱动电路80的电力输入部。The base 30 is a power receiving unit, and receives power for causing the LEDs of the LED module 20 to emit light from the outside of the light bulb-shaped lamp 1 . The base 30 receives electric power through two contacts, and the electric power received by the base 30 is input to the power input part of the drive circuit 80 via lead wires.

例如,灯头30被供给有来自商用电源的交流电。具体而言,灯头30被安装在照明器具(照明装置)的灯座,从灯座接受交流电。据此,灯泡形灯1(LED模块20)点灯。For example, the base 30 is supplied with AC power from a commercial power supply. Specifically, the base 30 is attached to a socket of a lighting fixture (illumination device), and receives alternating current from the socket. Accordingly, the light bulb-shaped lamp 1 (LED module 20 ) is turned on.

并且,灯头30的种类没有特殊的限定,在本实施方式中采用螺纹型的爱迪生螺纹(E型)的灯头。并且,作为灯头30所采用的E型的灯头例如有E26形、E17形、或E16形等。In addition, the type of the base 30 is not particularly limited, but in this embodiment, a screw-type Edison screw (E-type) base is used. In addition, the E-type base used as the base 30 includes, for example, an E26 type, an E17 type, or an E16 type.

[支承部件][support parts]

支承部件40具有被设置成从球形罩10的开口部11的近旁向球形罩10的内部延伸的金属制的支柱41。The support member 40 has a metal support post 41 provided to extend from the vicinity of the opening 11 of the glove 10 to the inside of the glove 10 .

在本实施方式中,支承部件40具有安装部42,该安装部42与支柱41的球形罩10的内部一侧的端部相连接。在安装部42被安装有基板21。In the present embodiment, the support member 40 has a mounting portion 42 connected to an end portion of the strut 41 on the inner side of the glove 10 . The substrate 21 is mounted on the mounting portion 42 .

即,支承部件40的一端与LED模块20连接,另一端与台座50连接。也就是说,LED模块20由支承部件40固定,以被配置在球形罩10内。That is, one end of the support member 40 is connected to the LED module 20 , and the other end is connected to the pedestal 50 . That is, the LED module 20 is fixed by the supporting member 40 so as to be arranged in the glove 10 .

支承部件40也可以作为用于将在LED模块20发生的热散热到灯头30一侧的散热部件来发挥作用。因此,通过将热传导率高的金属材料作为构成支承部件40的主成分,从而能够提高支承部件40的散热效率,热传导率高的金属材料例如有热传导率约为237[W/m·K]的铝(Al)。The support member 40 can also function as a heat dissipation member for dissipating heat generated in the LED module 20 to the base 30 side. Therefore, by using a metal material with high thermal conductivity as the main component constituting the support member 40, the heat dissipation efficiency of the support member 40 can be improved. The metal material with high thermal conductivity has a thermal conductivity of about 237 [W/m·K], for example. Aluminum (Al).

这样,能够抑制因温度上升而造成的发光元件22(LED芯片22b)的发光效率以及寿命的降低。In this way, it is possible to suppress reductions in the luminous efficiency and lifetime of the light emitting element 22 (LED chip 22 b ) due to temperature rise.

作为支承部件40的金属材料除了铝合金以外,也可以采用铜(Cu)或铁(Fe)等。并且,支承部件40的材料也可以不是金属而采用树脂。As the metal material of the support member 40, copper (Cu), iron (Fe), or the like may be used other than aluminum alloy. In addition, the material of the support member 40 may be resin instead of metal.

并且,作为支柱40也可以采用的构成是在由树脂等构成的支柱的表面形成金属膜。In addition, a structure that can also be adopted as the pillar 40 is to form a metal film on the surface of the pillar made of resin or the like.

支承部件40具有支柱41以及连接于该支柱41的端部的安装部42,所述支柱41在本实施方式中为,截面面积在轴方向(本实施方式中的Z轴方向)上不发生变化的圆柱状,安装部42具有固定LED模块20的端面45。The supporting member 40 has a strut 41 whose cross-sectional area does not change in the axial direction (the Z-axis direction in this embodiment) in this embodiment, and a mounting portion 42 connected to the end of the strut 41 . The mounting part 42 has an end surface 45 for fixing the LED module 20 in a cylindrical shape.

并且,安装部42与支柱41既可以成为一体,也可以是彼此分离的个体。例如,支柱41的端部可以作为安装部42来使用。并且,作为与支柱41分离的部件的安装部42,例如通过螺钉、焊接、熔接、或者粘着剂等连接在支柱41的端部。In addition, the mounting part 42 and the support column 41 may be integrated or may be separate entities. For example, the end portion of the support column 41 can be used as the mounting portion 42 . In addition, the mounting portion 42 , which is a component separate from the support 41 , is connected to the end of the support 41 by, for example, screws, welding, welding, or an adhesive.

在本实施方式中,支承部件40以端面45与LED模块20的基板21的背面21b相接触的状态来支承LED模块20。In this embodiment, the support member 40 supports the LED module 20 in the state where the end surface 45 is in contact with the back surface 21b of the board|substrate 21 of the LED module 20. As shown in FIG.

具体而言,LED模块20的背面21b与支承部件40的端面45例如由硅树脂等树脂粘合剂来粘着在一起。Specifically, the back surface 21b of the LED module 20 and the end surface 45 of the supporting member 40 are adhered together with a resin adhesive such as silicone resin, for example.

这样,在本实施方式中,LED模块20以基板21的背面21b与支承部件40的端面45相抵接的状态而被支承在支承部件40。据此,LED模块20的散热效率被提高,从而能够抑制因温度上升而造成的LED芯片22b的发光效率的低下以及寿命的降低。Thus, in this embodiment, the LED module 20 is supported by the support member 40 in the state which the back surface 21b of the board|substrate 21 and the end surface 45 of the support member 40 contact|abut. Accordingly, the heat radiation efficiency of the LED module 20 is improved, and it is possible to suppress a decrease in the luminous efficiency of the LED chip 22b and a decrease in lifetime due to a rise in temperature.

图3示出了实施方式1的灯泡形灯1中的支承部件40与基板21的接触面积的大小的一个例子。FIG. 3 shows an example of the size of the contact area between the support member 40 and the substrate 21 in the light bulb-shaped lamp 1 according to Embodiment 1. As shown in FIG.

图3是从基板21的主面21a一侧来看LED模块20时的透视图,发光元件22以虚线的矩形来表示,支承部件40的端面45以具有圆点图案的矩形来表示。并且,图3的透视图中所采用的圆点图案等表示方法,在后述的图4(b)、图5(b)、以及图6(b)中也被采用。3 is a perspective view of the LED module 20 viewed from the main surface 21a side of the substrate 21. The light emitting element 22 is shown as a dotted rectangle, and the end surface 45 of the supporting member 40 is shown as a rectangle with a dot pattern. In addition, the representation methods such as the dot pattern adopted in the perspective view of FIG. 3 are also adopted in FIGS. 4( b ), 5 ( b ), and 6 ( b ), which will be described later.

并且,在本说明书中,也有以“上”来表现基板的主面一侧,以“下”来表现基板的背面一侧的情况,这些均为说明上的方便。即,“上”以及“下”等表现并非对例如灯泡形灯1被安装到照明器具时的状态进行限定。In addition, in this specification, the main surface side of the substrate may be expressed as "upper", and the rear side of the substrate may be expressed as "lower", and these are for convenience of description. That is, expressions such as "up" and "down" are not limited to, for example, the state when the light bulb-shaped lamp 1 is attached to a lighting fixture.

在本实施方式中,相对于背面21b的面积,支承部件40与基板21的接触面积所占的比率为5%以上,所述背面21b是基板21的与支承部件40相接触的面。并且,在本实施方式中,基板21是平板状的部件,基板21的主面21a的面积与背面21b的面积实质上相同。以下将基板的背面的面积简单记作“基板的面积”。In this embodiment, the ratio of the contact area between the support member 40 and the substrate 21 is 5% or more with respect to the area of the back surface 21 b , which is the surface of the substrate 21 in contact with the support member 40 . Furthermore, in the present embodiment, the substrate 21 is a flat member, and the area of the main surface 21 a of the substrate 21 is substantially the same as the area of the rear surface 21 b. Hereinafter, the area of the back surface of the substrate is simply referred to as "the area of the substrate".

即,支承部件40的端面45的面积占图3中的基板21的面积(实线的矩形的面积)的比率为5%以上。具体而言,图3中的该比率约为27%。That is, the ratio of the area of the end surface 45 of the support member 40 to the area of the substrate 21 in FIG. 3 (the area of the rectangle in the solid line) is 5% or more. Specifically, the ratio in Figure 3 is about 27%.

这样,在本实施方式中,为了使相对于基板21的面积,支承部件40的接触面积所占的比率成为规定的值以上,从而确保基板21与支承部件40的接触面积,并且也确保了向基板21的背面21b配置发光元件22的区域。In this way, in this embodiment, in order to make the ratio of the contact area of the support member 40 to the area of the substrate 21 more than a predetermined value, the contact area between the substrate 21 and the support member 40 is ensured, and the contact area to the support member 40 is also ensured. On the rear surface 21b of the substrate 21 is a region where the light emitting element 22 is disposed.

这样,既能够使来自LED模块20的光向多方向放出,又能够提高对在LED模块20发生的热进行散热的效果。In this way, while emitting light from the LED module 20 in multiple directions, the effect of dissipating heat generated in the LED module 20 can be enhanced.

并且,对于支承部件40占基板21的面积的接触面积的比率、与发光元件22的发光时的温度的关系,将利用图15来说明。Furthermore, the relationship between the ratio of the contact area of the support member 40 to the area of the substrate 21 and the temperature at the time of light emission of the light emitting element 22 will be described with reference to FIG. 15 .

并且,支承部件40中的支柱41的形状并非受圆柱状所限,例如可以是角柱状。并且,支柱41的断面形状以及截面面积在支柱41的轴方向上也可以不必是固定不变的,在该轴方向的中途,断面形状或者截面面积也可以发生变化。In addition, the shape of the pillar 41 in the supporting member 40 is not limited to the columnar shape, and may be a prism shape, for example. Furthermore, the cross-sectional shape and cross-sectional area of the pillar 41 do not have to be constant in the axial direction of the pillar 41 , and the cross-sectional shape or cross-sectional area may change in the middle of the axial direction.

[台座][Pedestal]

台座50是用于对支承部件40进行支承的部件,被固定在树脂外壳60。台座50被配置成与球形罩10的开口部11的开口端接触,用以堵塞球形罩10的开口部11。The pedestal 50 is a member for supporting the supporting member 40 and is fixed to the resin case 60 . The pedestal 50 is arranged to be in contact with the opening end of the opening 11 of the glove 10 so as to close the opening 11 of the glove 10 .

具体而言,台座50是边缘具有台阶部的圆盘状部件,该台阶部与球形罩10的开口部11的开口端相抵接。并且,在该台阶部,台座50、树脂外壳60、以及球形罩10的开口部11的开口端由粘着剂固定。Specifically, the pedestal 50 is a disk-shaped member having a stepped portion on the edge, and the stepped portion is in contact with the opening end of the opening portion 11 of the glove 10 . And, at the stepped portion, the pedestal 50 , the resin case 60 , and the opening end of the opening 11 of the glove 10 are fixed with an adhesive.

台座50与支承部件40同样,通过由铝等热传导率高的金属材料来构成,从而能够使通过台座50热传导到支承部件40的LED模块20的热的散热效率提高。这样,能够抑制因温度上升而造成的发光元件22(LED芯片22b)的发光効率的低下以及寿命的降低。并且,台座50与支承部件40也可以由同一个金属模而形成为一体。Like the support member 40 , the pedestal 50 is made of a metal material with high thermal conductivity such as aluminum, so that the heat radiation efficiency of the LED module 20 that is heat-conducted to the support member 40 through the pedestal 50 can be improved. In this way, it is possible to suppress a decrease in the luminous efficiency of the light emitting element 22 (LED chip 22 b ) and a decrease in lifetime due to temperature rise. Furthermore, the pedestal 50 and the supporting member 40 may be integrally formed by the same mold.

[树脂外壳][resin case]

树脂外壳60除了能够使支承部件40与灯头30绝缘以外,而且是用于收纳驱动电路80的绝缘外壳(电路支持器)。树脂外壳60如图3的(a)所示,由大径圆筒状的第一外壳部61和小径圆筒状的第二外壳部62构成。树脂外壳60例如由聚对苯二甲酸丁二酯(PBT:Poly Butylene Terephthalate)来成形。The resin case 60 is an insulating case (circuit holder) for accommodating the drive circuit 80 in addition to insulating the support member 40 and the base 30 . As shown in FIG. 3( a ), the resin case 60 is composed of a large-diameter cylindrical first case portion 61 and a small-diameter cylindrical second case portion 62 . The resin case 60 is formed of, for example, polybutylene terephthalate (PBT: Poly Butylene Terephthalate).

由于第一外壳部61的外表面露出到外部,因此,传导到树脂外壳60的热主要由第一外壳部61散热。第二外壳部62被构成为外周面与灯头30的内周面接触,在第二外壳部62的外周面形成有用于与灯头30拧合的拧合部。Since the outer surface of the first case portion 61 is exposed to the outside, the heat conducted to the resin case 60 is mainly dissipated by the first case portion 61 . The second casing part 62 is configured such that its outer peripheral surface is in contact with the inner peripheral surface of the cap 30 , and a screwing part for screwing with the cap 30 is formed on the outer peripheral surface of the second casing part 62 .

[引线][lead]

引线70a以及70b是用于从驱动电路80将用于使LED模块20点灯的电力供给到LED模块20的引线对。引线70a以及70b例如采用以绝缘性树脂来包覆铜线等金属丝状的金属电线的绝缘包覆电线。The lead wires 70 a and 70 b are lead wire pairs for supplying power for lighting the LED module 20 from the drive circuit 80 to the LED module 20 . The lead wires 70 a and 70 b are, for example, insulation-coated wires in which wire-like metal wires such as copper wires are covered with an insulating resin.

引线70a(70b)被配置在球形罩10内,如以上所述,一端与LED模块20的正极(负极)端子电连接,另一端与驱动电路80的电力输出部电连接。The lead wires 70a ( 70b ) are arranged in the glove 10 , and as described above, one end is electrically connected to the positive (negative) terminal of the LED module 20 , and the other end is electrically connected to the power output part of the driving circuit 80 .

[驱动电路][Drive circuit]

驱动电路80是用于使LED模块20的各个发光元件22点灯的电路单元,由树脂外壳60覆盖。驱动电路80将从灯头30供给来的交流电变换为直流电,经由两条引线70a以及70b,将变换后的直流电供给到LED模块20的各个发光元件22。The drive circuit 80 is a circuit unit for lighting each light emitting element 22 of the LED module 20 and is covered by the resin case 60 . The drive circuit 80 converts the AC power supplied from the base 30 into DC power, and supplies the converted DC power to each light emitting element 22 of the LED module 20 through the two lead wires 70a and 70b.

驱动电路80例如由电路基板以及被安装在电路基板的多个电路元件(电子部件)构成。电路基板是金属布线被图案形成的印刷电路板,被安装在该电路基板的多个电路元件彼此被电连接。在本实施方式中,电路基板的被配置有多个电路元件的主面,以与灯轴J正交的状态被配置。The drive circuit 80 is constituted by, for example, a circuit board and a plurality of circuit elements (electronic components) mounted on the circuit board. The circuit board is a printed circuit board on which metal wiring is patterned, and a plurality of circuit elements mounted on the circuit board are electrically connected to each other. In the present embodiment, the main surface of the circuit board on which the plurality of circuit elements are arranged is arranged in a state perpendicular to the lamp axis J. As shown in FIG.

并且,多个电路元件例如由各种电容器、电阻元件、整流电路元件、线圈元件、扼流线圈(扼流变压器)、静噪滤波器、二极管、或者集成电路元件等构成。Furthermore, the plurality of circuit elements are constituted by, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise suppression filters, diodes, or integrated circuit elements.

并且,灯泡形灯1也可以不必具备驱动电路80。例如在从照明器具或电池等直接向灯泡形灯1供给直流电的情况下,灯泡形灯1也可以不具备驱动电路80。并且,驱动电路80并非受限于平滑电路,也可以通过适当地选择调光电路以及升压电路等,并进行组合来构成。In addition, the light bulb-shaped lamp 1 does not need to include the drive circuit 80 . For example, when direct-current power is directly supplied to the lightbulb-shaped lamp 1 from a lighting fixture, a battery, etc., the lightbulb-shaped lamp 1 does not need to be equipped with the drive circuit 80. In addition, the drive circuit 80 is not limited to a smoothing circuit, and may be configured by appropriately selecting and combining a dimming circuit, a boosting circuit, and the like.

如以上说明,本实施方式的灯泡形灯1具有被配置在基板21的多个发光元件22,多个发光元件22至少包括所朝的方向彼此不同的两个发光元件22(第一发光元件以及第二发光元件)。而且,支承部件40与基板21的接触面积占基板21的面积的比率为5%以上。As described above, the light bulb-shaped lamp 1 of this embodiment has a plurality of light emitting elements 22 arranged on the substrate 21, and the plurality of light emitting elements 22 includes at least two light emitting elements 22 facing in different directions (the first light emitting element and the first light emitting element). second light-emitting element). Furthermore, the ratio of the contact area between the support member 40 and the substrate 21 to the area of the substrate 21 is 5% or more.

根据该构成,在灯泡形灯1中既能够实现向多方向放出光,又能够抑制因多个发光元件22的每一个在发光时产生的热而造成的发光效率的降低。即,本实施方式的灯泡形灯1是具有优良的配光特性的照明用光源。According to this configuration, in the lightbulb-shaped lamp 1 , while emitting light in multiple directions, it is possible to suppress a decrease in luminous efficiency due to heat generated by each of the plurality of light-emitting elements 22 when emitting light. That is, the light bulb-shaped lamp 1 of the present embodiment is a light source for illumination having excellent light distribution characteristics.

以上根据实施方式1对本实用新型所涉及的照明用光源进行了说明,本实用新型并非受实施方式1所限。The light source for illumination according to the present invention has been described above based on the first embodiment, but the present invention is not limited by the first embodiment.

因此,利用图4(a)和图4(b)至图11针对与照明用光源(灯泡形灯相关的各种变形例,以与上述的实施方式1的不同之处为中心进行说明。即,在以下的各个变形例中,会有省略对已经说明过的发光元件22等的构成要素进行说明的情况。Therefore, referring to FIG. 4( a ) and FIG. 4( b ) to FIG. 11 , various modification examples related to the light source for illumination (bulb-shaped lamp) will be described focusing on the differences from the first embodiment described above. That is , in each of the following modified examples, the description of the components such as the light emitting element 22 already described may be omitted.

以下利用变形例1至8对发光装置(LED模块)的各种变形例进行说明。Various modifications of the light emitting device (LED module) will be described below using modifications 1 to 8. FIG.

即,变形例1至8所涉及的LED模块的每一个例如能够取代图1所示的灯泡形灯1的LED模块20,是能够作为发光装置来利用的LED模块。That is, each of the LED modules according to Modifications 1 to 8 is an LED module that can be used as a light emitting device instead of, for example, the LED module 20 of the light bulb-shaped lamp 1 shown in FIG. 1 .

[变形例1][Modification 1]

图4(a)和图4(b)示出了实施方式1的变形例1所涉及的LED模块120的构成概要。FIG.4(a) and FIG.4(b) have shown the outline|summary of the structure of the LED module 120 which concerns on the modification 1 of Embodiment 1. As shown in FIG.

如图4(a)所示,在变形例1所涉及的LED模块120中,在从主面25a一侧来看基板25时,至少三个发光元件22以围着支柱141的状态而被配置在主面25a。As shown in FIG. 4( a ), in the LED module 120 according to Modification 1, at least three light emitting elements 22 are arranged so as to surround the pillar 141 when the substrate 25 is viewed from the main surface 25 a side. on the main face 25a.

具体而言,本变形例中的基板25具有在与支柱141的轴方向交叉的方向上延伸设置的三个延伸部25c,在这三个延伸部25c的每一个的主面25a上至少被配置有一个发光元件22。Specifically, the base plate 25 in this modified example has three extensions 25c extending in a direction intersecting the axial direction of the pillar 141, and is arranged at least on the main surface 25a of each of the three extensions 25c. There is a light emitting element 22 .

更具体而言,在三个延伸部25c的每一个主面25a上被配置有两个发光元件22(第一发光元件),并且,在三个延伸部25c的每一个的背面25b被配置有一个发光元件22(第二发光元件)。合计为9个的发光元件22以串联的方式电连接。More specifically, two light-emitting elements 22 (first light-emitting elements) are arranged on each main surface 25a of the three extensions 25c, and a rear surface 25b of each of the three extensions 25c is arranged. One light emitting element 22 (second light emitting element). A total of nine light emitting elements 22 are electrically connected in series.

在本变形例中,支承LED模块120的支承部件140被连接于支柱141的端部,具有与基板25相对应的形状的安装部142。In this modified example, the supporting member 140 supporting the LED module 120 is connected to the end of the support 141 and has a mounting portion 142 having a shape corresponding to the board 25 .

图4(b)示出了在俯视LED模块120时的构成概要。在图4(b)中,发光元件22以虚线的矩形来表示,支承部件140的端面145(安装部142的上表面)以带有圆点的矩形来表示。FIG. 4( b ) shows an outline of the configuration of the LED module 120 when viewed from above. In FIG. 4( b ), the light emitting element 22 is represented by a dotted rectangle, and the end surface 145 of the support member 140 (the upper surface of the mounting portion 142 ) is represented by a dotted rectangle.

安装部142与三个延伸部25c相对应地具有三个部分,这三个部分向与支柱141的轴方向交叉的方向突出。据此,既能够实现对基板25(LED模块120)进行稳定的固定,又能够确保恰当的安装部142(支承部件140)与基板25的接触面积。The attachment part 142 has three parts corresponding to the three extension parts 25c, and these three parts protrude in the direction intersecting the axial direction of the support|pillar 141. As shown in FIG. Accordingly, while stably fixing the substrate 25 (LED module 120 ) can be achieved, an appropriate contact area between the mounting portion 142 (support member 140 ) and the substrate 25 can be ensured.

具体而言,相对于基板25的面积,支承部件140与基板25的接触面积所占的比率为5%以上。Specifically, the ratio of the contact area between the support member 140 and the substrate 25 to the area of the substrate 25 is 5% or more.

即,LED模块120的基板25具有在与支柱141的轴方向交叉的方向上呈放射状延伸的三个延伸部25c,在各个延伸部25c上被配置有一个以上的发光元件22。更详细而言,各个延伸部25c的主面25a以及背面25b分别被配置有至少一个发光元件22。据此,能够实现向多方向放出光。That is, the substrate 25 of the LED module 120 has three extensions 25c extending radially in a direction intersecting the axial direction of the pillar 141, and one or more light emitting elements 22 are arranged on each extension 25c. More specifically, at least one light emitting element 22 is disposed on the main surface 25a and the rear surface 25b of each extension portion 25c. Accordingly, it is possible to emit light in multiple directions.

并且,来自具有这种配置的多个发光元件22的热,能够通过以与基板25的形状向对应的形状的端面145来支承基板25的支承部件140来高效率的放出。这样,能够抑制因多个发光元件22的每一个所发出的热而造成的发光效率的降低。Furthermore, the heat from the plurality of light emitting elements 22 arranged in this way can be efficiently released by the support member 140 supporting the substrate 25 with the end surface 145 having a shape corresponding to the shape of the substrate 25 . In this way, it is possible to suppress reduction in luminous efficiency due to heat emitted by each of the plurality of light emitting elements 22 .

因此,具备LED模块120的灯泡形灯1是具有优良的配光特性的照明用光源。Therefore, the light bulb-shaped lamp 1 including the LED module 120 is a light source for illumination having excellent light distribution characteristics.

[变形例2][Modification 2]

图5(a)和图5(b)示出了实施方式1的变形例2所涉及的LED模块121的构成概要。FIG.5(a) and FIG.5(b) have shown the outline|summary of the structure of the LED module 121 which concerns on the modification 2 of Embodiment 1. As shown in FIG.

如图5(a)所示,在变形例2所涉及的LED模块121中,在从主面26a一侧来看基板26时,至少三个发光元件22以围着支柱151的方式而被配置在主面26a。As shown in FIG. 5( a ), in the LED module 121 according to Modification 2, when the substrate 26 is viewed from the main surface 26 a side, at least three light emitting elements 22 are arranged so as to surround the pillar 151 on the main face 26a.

具体而言,本变形例中的基板26具有在与支柱151的轴方向交叉的方向上延伸设置的四个延伸部26c,在这四个延伸部26c的每一个的主面26a上分别配置有一个发光元件22(第一发光元件)。而且,在四个延伸部26c的每一个的背面26b分别配置有一个发光元件22(第二发光元件)。Specifically, the base plate 26 in this modified example has four extensions 26c extending in a direction intersecting the axial direction of the support 151, and each of the main surfaces 26a of the four extensions 26c is respectively arranged with One light emitting element 22 (first light emitting element). Furthermore, one light emitting element 22 (second light emitting element) is disposed on each of the back surfaces 26b of the four extensions 26c.

在本变形例中,支承LED模块121的支承部件150具有与支柱151的端部连接的安装部152,该安装部152的形状与基板26相对应。In this modified example, the support member 150 supporting the LED module 121 has a mounting portion 152 connected to the end of the support 151 , and the shape of the mounting portion 152 corresponds to the substrate 26 .

图5(b)示出了俯视LED模块121时的构成要素。在图5(b)中,发光元件22以虚线的矩形来表示,支承部件150的端面155(安装部152的上表面)以具有圆点的矩形来表示。FIG.5(b) has shown the component when the LED module 121 is seen from above. In FIG. 5( b ), the light emitting element 22 is represented by a dotted rectangle, and the end surface 155 of the supporting member 150 (the upper surface of the mounting portion 152 ) is represented by a dotted rectangle.

安装部152与四个延伸部26c相对应地具有向与支柱151的轴方向交叉的方向突出的四个部分。据此,既能够稳定地对基板26(LED模块121)进行固定,又能够确保恰当的安装部152(支承部件150)与基板26的接触面积。The mounting portion 152 has four portions protruding in a direction intersecting the axial direction of the pillar 151 corresponding to the four extending portions 26c. Accordingly, while stably fixing the substrate 26 (LED module 121 ), an appropriate contact area between the mounting portion 152 (support member 150 ) and the substrate 26 can be ensured.

具体而言,相对于基板26的面积,支承部件150与基板26的接触面积所占的比率为5%以上。Specifically, the ratio of the contact area between the support member 150 and the substrate 26 to the area of the substrate 26 is 5% or more.

即,LED模块121具有向与支柱151的轴方向交叉的方向呈放射状延伸的四个延伸部26c,在各个延伸部26c上被配置有一个以上的发光元件22。更具体而言,各个延伸部26c的主面26a以及背面26b分别被配置有至少一个发光元件22。据此,能够实现使光向多方向放出。That is, the LED module 121 has four extensions 26 c extending radially in a direction intersecting the axial direction of the support 151 , and one or more light emitting elements 22 are arranged on each extension 26 c. More specifically, at least one light emitting element 22 is disposed on the main surface 26a and the rear surface 26b of each extension portion 26c, respectively. Accordingly, it is possible to emit light in multiple directions.

并且,从具有这种配置的多个发光元件22发生的热,能够通过与基板26的形状相对应的形状的端面155来支承基板26的支承部件150,而被高效率地放出。这样,能够抑制因多个发光元件22每一个所发出的热而造成的发光效率的降低。In addition, the heat generated from the plurality of light emitting elements 22 arranged in this way can be efficiently released by the supporting member 150 supporting the substrate 26 through the end surface 155 having a shape corresponding to the shape of the substrate 26 . In this way, it is possible to suppress reduction in luminous efficiency due to heat emitted by each of the plurality of light emitting elements 22 .

因此,具备LED模块121的灯泡形灯1是具有优良的配光特性的照明用光源。Therefore, the light bulb-shaped lamp 1 including the LED module 121 is a light source for illumination having excellent light distribution characteristics.

并且,配置有多个发光元件22的基板上的延伸部的数量并非受三个或者四个所限。即,也可以采用具有五个以上的延伸部的基板,来用作配置多个发光元件22的基板。Moreover, the number of extensions on the substrate on which a plurality of light emitting elements 22 are disposed is not limited to three or four. That is, a substrate having five or more extending portions may be used as a substrate on which a plurality of light emitting elements 22 are arranged.

[变形例3][Modification 3]

图6(a)和图6(b)示出了实施方式1的变形例3所涉及的LED模块122的构成概要。FIG.6(a) and FIG.6(b) have shown the outline|summary of the structure of the LED module 122 which concerns on the modification 3 of Embodiment 1. As shown in FIG.

如图6(a)所示,在俯视变形例3所涉及的LED模块122时,该LED模块122的外形具有圆形的基板27。并且,在以支柱171的轴为中心的圆周上配置有至少三个发光元件22。As shown in FIG. 6( a ), when an LED module 122 according to Modification 3 is viewed from above, the outer shape of the LED module 122 has a circular substrate 27 . In addition, at least three light emitting elements 22 are arranged on a circumference centered on the axis of the pillar 171 .

具体而言,在本变形例中,基板27的主面27a上被配置有八个发光元件22(第一发光元件)。并且,虽然没有全部进行图示,基板27的背面27b例如也配置有八个发光元件22(第二发光元件)。Specifically, in this modified example, eight light emitting elements 22 (first light emitting elements) are arranged on the main surface 27 a of the substrate 27 . In addition, although not all of them are shown in the figure, for example, eight light emitting elements 22 (second light emitting elements) are arranged on the back surface 27 b of the substrate 27 .

并且,这些多个发光元件22例如以以下的方式电连接。主面27a的八个发光元件22为串联连接,主面27b的八个发光元件22为串联连接,而且,主面27a的八个发光元件22与主面27b的八个发光元件22并联连接。And, these plurality of light emitting elements 22 are electrically connected as follows, for example. The eight light emitting elements 22 on the main surface 27a are connected in series, the eight light emitting elements 22 on the main surface 27b are connected in series, and the eight light emitting elements 22 on the main surface 27a are connected in parallel with the eight light emitting elements 22 on the main surface 27b.

这样,通过采用圆形的基板27来用作LED模块122的基板27,从而,例如能够在以支柱171(支承部件170)为中心的圆周上等间隔地排列三个以上的发光元件22。更具体而言,在圆形的基板27的主面27a以及背面27b,分别在以支柱171(支承部件170)为中心的圆周上等间隔地排列三个以上的发光元件22。这样,能够得到优良的配光特性。Thus, by using the circular substrate 27 as the substrate 27 of the LED module 122, for example, three or more light emitting elements 22 can be arranged at equal intervals on a circumference centered on the pillar 171 (support member 170). More specifically, three or more light emitting elements 22 are arranged at equal intervals on the circumference centered on the pillar 171 (support member 170 ) on the principal surface 27 a and the rear surface 27 b of the circular substrate 27 . In this way, excellent light distribution characteristics can be obtained.

并且,在本变形例中,支承LED模块122的支承部件170具有与支柱171的端部相连接的安装部172,该安装部172的形状与基板27相对应。Furthermore, in this modified example, the support member 170 supporting the LED module 122 has a mounting portion 172 connected to the end of the support 171 , and the shape of the mounting portion 172 corresponds to the substrate 27 .

图6(b)示出了俯视LED模块122时的构成概要。在图6(b)中,发光元件22以虚线的矩形来表示,支承部件170的端面175(安装部172的上表面)以具有圆点的矩形来表示。FIG. 6( b ) shows an outline of the configuration of the LED module 122 when viewed from above. In FIG. 6( b ), the light emitting element 22 is represented by a dotted rectangle, and the end surface 175 of the supporting member 170 (the upper surface of the mounting portion 172 ) is represented by a rectangle with dots.

安装部172具有与圆形的基板27相对应的形状,即在俯视安装部27时,其外形为圆形。据此,既能够实现稳定地对基板27(LED模块122)进行固定,又能够确保恰当的安装部172(支承部件170)与基板27的接触面积。The mounting portion 172 has a shape corresponding to the circular substrate 27 , that is, its outer shape is circular when the mounting portion 27 is viewed from above. Accordingly, while stably fixing the substrate 27 (LED module 122 ) can be achieved, an appropriate contact area between the mounting portion 172 (support member 170 ) and the substrate 27 can be ensured.

具体而言,相对于基板27的面积,支承部件170与基板27的接触面积所占的比率为5%以上。Specifically, the ratio of the contact area between the support member 170 and the substrate 27 to the area of the substrate 27 is 5% or more.

即,LED模块122的构成为,在基板27的主面27a至少配置有三个发光元件22,这些至少三个发光元件22以支柱171的轴为中心,被配置在基板27的圆周上。并且,基板27的背面27b也同样能够配置多个发光元件22。据此,能够实现使光向多方向放出。That is, the LED module 122 is configured such that at least three light emitting elements 22 are arranged on the main surface 27 a of the substrate 27 , and these at least three light emitting elements 22 are arranged on the circumference of the substrate 27 around the axis of the pillar 171 . Furthermore, a plurality of light emitting elements 22 can also be arranged on the back surface 27b of the substrate 27 in the same manner. Accordingly, it is possible to emit light in multiple directions.

并且,从这样配置的多个发光元件22发生的热,能够通过以与基板27的形状相对应的形状的端面175来支承基板27的支承部件170,而被高效率地放出。这样,能够抑制因多个发光元件22的每一个所发出的热而造成的发光效率的降低。Furthermore, the heat generated from the plurality of light emitting elements 22 arranged in this way can be efficiently released by the support member 170 supporting the substrate 27 with the end surface 175 having a shape corresponding to the shape of the substrate 27 . In this way, it is possible to suppress reduction in luminous efficiency due to heat emitted by each of the plurality of light emitting elements 22 .

因此,具备LED模块122的灯泡形灯1是具有优良的配光特性的照明用光源。Therefore, the light bulb-shaped lamp 1 including the LED module 122 is a light source for illumination having excellent light distribution characteristics.

并且,上述的“以支柱171的轴为中心的圆周上”的“圆”也可以不必是正圆。例如,也可以是,以设想的曲线来连接被配置在基板27的主面27a的三个以上的发光元件22,形成长圆或者椭圆来形成用于识别的形状。In addition, the above-mentioned "circle" "on the circumference centering on the axis of the support 171" does not need to be a perfect circle. For example, three or more light-emitting elements 22 arranged on the main surface 27a of the substrate 27 may be connected in an assumed curve to form an oval or an ellipse to form a shape for identification.

并且,基板27的俯视外形也可以不必是圆形。例如也可以是,在俯视外形为椭圆或多角形的基板27上,在以支柱171的轴为中心的圆周上配置三个以上的发光元件22。In addition, the planar shape of the substrate 27 does not need to be circular. For example, three or more light-emitting elements 22 may be arranged on a circumference centered on the axis of the pillar 171 on the substrate 27 having an elliptical or polygonal shape in plan view.

[变形例4][Modification 4]

图7示出了实施方式1的变形例4所涉及的LED模块125的构成概要。FIG. 7 shows an outline of the configuration of an LED module 125 according to Modification 4 of Embodiment 1. As shown in FIG.

如图7所示,变形例4所涉及的LED模块125具备:由支承部件180支承的基板28、以及被配置在基板28的多个发光元件22,基板28具有第一基板28a和第二基板28b。在本变形例中,第一基板28a和第二基板28b为矩形的基板。As shown in FIG. 7 , an LED module 125 according to Modification 4 includes a substrate 28 supported by a support member 180 and a plurality of light emitting elements 22 arranged on the substrate 28. The substrate 28 has a first substrate 28a and a second substrate. 28b. In this modified example, the first substrate 28a and the second substrate 28b are rectangular substrates.

即,在本变形例中,配置有多个发光元件22的基板28由相互分离的第一基板28a和第二基板28b构成。That is, in this modified example, the substrate 28 on which the plurality of light emitting elements 22 are arranged is composed of a first substrate 28 a and a second substrate 28 b that are separated from each other.

具体而言,第一基板28a被配置在安装部182的上表面182a,该上表面182a是安装部182上的与支柱181相反一侧的面。第二基板28b被配置在安装部182的下表面182b,该下表面182b是安装部182的支柱181一侧的面。并且,在本变形例中如图7所示,在下表面182b被配置有两张第二基板28b。Specifically, the first substrate 28 a is disposed on an upper surface 182 a of the mounting portion 182 , which is a surface on the mounting portion 182 opposite to the pillar 181 . The second substrate 28 b is disposed on the lower surface 182 b of the mounting portion 182 , which is the surface of the mounting portion 182 on the side of the pillar 181 . In addition, in this modified example, as shown in FIG. 7 , two second substrates 28 b are arranged on the lower surface 182 b.

第一基板28a以及第二基板28b例如由硅树脂等树脂类粘着剂被粘着在安装部182。并且,两张第二基板28b以及一张第一基板28a例如通过引线(未图示)以串联的方式而电连接。The first substrate 28 a and the second substrate 28 b are adhered to the mounting portion 182 by, for example, a resin-based adhesive such as silicone resin. In addition, the two second substrates 28b and one first substrate 28a are electrically connected in series, for example, by wires (not shown).

并且,在本变形例中,被配置在第一基板28a的四个发光元件22分别为第一发光元件的一个例子,在两张第二基板28b上分别被配置的一个发光元件22是第二发光元件的一个例子。In addition, in this modified example, the four light emitting elements 22 arranged on the first substrate 28a are each an example of a first light emitting element, and one light emitting element 22 arranged on each of the two second substrates 28b is an example of a second light emitting element. An example of a light emitting element.

并且,在图7中,第一基板28a以及第二基板28b的深度方向(即Y轴方向,以下相同)的宽度例如为安装部182的深度方向的宽度以下。在这种情况下,相对于基板28的面积(第一基板28a以及两张第二基板28b的面积的和),支承部件180与基板28的接触面积所占的比率为100%。In addition, in FIG. 7 , the widths of the first substrate 28 a and the second substrate 28 b in the depth direction (that is, the Y-axis direction, hereinafter the same) are, for example, equal to or less than the width of the mounting portion 182 in the depth direction. In this case, the ratio of the contact area between the support member 180 and the substrate 28 is 100% of the area of the substrate 28 (the sum of the areas of the first substrate 28 a and the two second substrates 28 b ).

这样,在本变形例中,支承部件180具有比较大的安装部182。据此,为了能够从不同的方向放出光,从而将作为仅在一个面上配置了发光元件22的单面安装基板的第一基板28a以及第二基板28b,安装到安装部182。Thus, in this modified example, the support member 180 has a relatively large attachment portion 182 . Accordingly, the first substrate 28 a and the second substrate 28 b , which are single-sided mounting substrates in which the light emitting element 22 is disposed on only one surface, are mounted on the mounting portion 182 so that light can be emitted from different directions.

即,本变形例所涉及的LED模块125具有多个发光元件22,该多个发光元件22至少包括彼此朝向不同方向的两个发光元件22(第一发光元件以及第二发光元件)。据此,能够使光向多方向放出。That is, the LED module 125 according to this modified example has a plurality of light emitting elements 22 including at least two light emitting elements 22 (a first light emitting element and a second light emitting element) facing in different directions from each other. Accordingly, light can be emitted in multiple directions.

并且,从这些多个发光元件22发生的热由支承部件180高效率地放出。这样,能够抑制因多个发光元件22的每一个所发出的热而造成的发光效率的降低。In addition, heat generated from these light emitting elements 22 is efficiently released from the support member 180 . In this way, it is possible to suppress reduction in luminous efficiency due to heat emitted by each of the plurality of light emitting elements 22 .

因此,具备LED模块125的灯泡形灯1是具有优良的配光特性的照明用光源。Therefore, the light bulb-shaped lamp 1 including the LED module 125 is a light source for illumination having excellent light distribution characteristics.

[变形例5][Modification 5]

图8示出了实施方式1的变形例5所涉及的LED模块126的构成概要。FIG. 8 shows an outline of the configuration of an LED module 126 according to Modification 5 of Embodiment 1. As shown in FIG.

如图8所示,变形例5所涉及的LED模块126与上述的变形例4所涉及的LED模块125相同,由具有比较大的安装部182的支承部件180支承。As shown in FIG. 8 , an LED module 126 according to Modification 5 is supported by a support member 180 having a relatively large mounting portion 182 , like the LED module 125 according to Modification 4 described above.

但是,在变形例5所涉及的LED模块126,光主要放出的方向与变形例4所涉及的LED模块125不同。However, the LED module 126 according to Modification 5 differs from the LED module 125 according to Modification 4 in the direction in which light is mainly emitted.

具体而言,LED模块126具备:由支承部件180支承的基板28、以及被配置在基板28的多个发光元件22,基板28具有第一基板28a和第二基板28c。即,本变形例中的基板28由彼此分离的第一基板28a和第二基板28c构成。在本变形例中,第一基板28a和第二基板28c为矩形的基板。Specifically, the LED module 126 includes a substrate 28 supported by a support member 180 and a plurality of light emitting elements 22 arranged on the substrate 28, and the substrate 28 has a first substrate 28a and a second substrate 28c. That is, the board|substrate 28 in this modification is comprised from the 1st board|substrate 28a and the 2nd board|substrate 28c which are separated from each other. In this modified example, the first substrate 28a and the second substrate 28c are rectangular substrates.

更具体而言,第一基板28a被配置在安装部182的上表面182a,第二基板28b被配置在安装部182的侧面182c,该安装部182的侧面182c是沿着与上表面182a交叉的方向的面。并且,在本变形例中,如图8所示,两个側面182c的每一个面上配置有一张第二基板28c。More specifically, the first substrate 28a is disposed on the upper surface 182a of the mounting portion 182, and the second substrate 28b is disposed on the side surface 182c of the mounting portion 182 along the direction intersecting the upper surface 182a. direction face. Furthermore, in this modified example, as shown in FIG. 8 , one second substrate 28c is arranged on each of the two side surfaces 182c.

第一基板28a以及第二基板28c例如由硅树脂等树脂粘着剂被粘着在安装部182。并且,两张第二基板28c以及一张第一基板28a例如通过引线(未图)以串联的方式电连接。The first substrate 28 a and the second substrate 28 c are adhered to the mounting portion 182 by, for example, a resin adhesive such as silicone resin. In addition, the two second substrates 28c and one first substrate 28a are electrically connected in series, for example, by wires (not shown).

并且,在本变形例中,被配置在第一基板28a的四个发光元件22的每一个是第一发光元件的一个例子,在两张第二基板28c被分别配置的一个发光元件22是第二发光元件的一个例子。In addition, in this modified example, each of the four light emitting elements 22 arranged on the first substrate 28a is an example of a first light emitting element, and one light emitting element 22 arranged on each of the two second substrates 28c is an example of a first light emitting element. An example of two light-emitting elements.

并且,图8中的第一基板28a以及第二基板28c的深度方向的宽度例如在安装部182的深度方向的宽度以下。在这种情况下,相对于基板28的面积(第一基板28a以及两张第二基板28c的面积的和),支承部件180与基板28的接触面积所占的比率为100%。In addition, the width in the depth direction of the first substrate 28 a and the second substrate 28 c in FIG. 8 is, for example, equal to or smaller than the width in the depth direction of the mounting portion 182 . In this case, the ratio of the contact area between the support member 180 and the substrate 28 is 100% of the area of the substrate 28 (the sum of the areas of the first substrate 28a and the two second substrates 28c).

这样,在本变形例中,与上述的变形例4同样,作为单面安装基板的第一基板28a以及第二基板28c以能够向不同的方向放出光的方式被配置在安装部182。Thus, in this modified example, as in the above-described fourth modified example, the first substrate 28 a and the second substrate 28 c , which are single-sided mounted substrates, are arranged on the mounting portion 182 so as to emit light in different directions.

即,本变形例所涉及的LED模块126具有多个发光元件22,该多个发光元件22至少包括彼此朝向不同的方向的两个发光元件22(第一发光元件以及第二发光元件)。据此,能够使光向多方向放出。That is, the LED module 126 according to this modified example has a plurality of light emitting elements 22 including at least two light emitting elements 22 (a first light emitting element and a second light emitting element) facing in different directions from each other. Accordingly, light can be emitted in multiple directions.

并且,从这些多个发光元件22发生的热由支承部件180高效率地放出。这样,能够抑制因多个发光元件22的每一个所发出的热而造成的发光效率的降低。In addition, heat generated from these light emitting elements 22 is efficiently released from the support member 180 . In this way, it is possible to suppress reduction in luminous efficiency due to heat emitted by each of the plurality of light emitting elements 22 .

因此,具备LED模块126的灯泡形灯1是具有优良的配光特性的照明用光源。Therefore, the light bulb-shaped lamp 1 including the LED module 126 is a light source for illumination having excellent light distribution characteristics.

[变形例6][Modification 6]

图9示出了实施方式1的变形例6所涉及的LED模块127的构成概要。FIG. 9 shows an outline of the configuration of an LED module 127 according to Modification 6 of Embodiment 1. As shown in FIG.

如图9所示,变形例6所涉及的LED模块127与上述的变形例4、5所涉及的LED模块125、126相同,由具有比较大的安装部182的支承部件180支承。As shown in FIG. 9 , an LED module 127 according to Modification 6 is supported by a support member 180 having a relatively large mounting portion 182 like LED modules 125 and 126 according to Modifications 4 and 5 described above.

但是,在变形例6所涉及的LED模块127中,根据作为单面安装基板的一张基板110,来实现使光向多方向放出之处与上述的变形例4以及5不同。However, the LED module 127 according to Modification 6 differs from Modifications 4 and 5 above in that light is emitted in multiple directions by one substrate 110 that is a single-sided mounting substrate.

具体而言,LED模块127具备:由支承部件180支承的基板110、以及被配置在基板110的多个发光元件22。Specifically, the LED module 127 includes a substrate 110 supported by a support member 180 , and a plurality of light emitting elements 22 arranged on the substrate 110 .

基板110以折弯的状态由支承部件180支承,基板110的主面具有沿着支承部件180的端面(安装部182的上表面182a)而被配置的第一主面110a、以及通过基板110折弯而被形成的与第一主面110a的朝向不同的第二主面110b。在本变形例中,基板110为矩形的基板。The substrate 110 is supported by the support member 180 in a bent state, and the main surface of the substrate 110 has a first main surface 110a arranged along the end surface (the upper surface 182a of the mounting portion 182 ) of the support member 180 , and the substrate 110 is folded by the substrate 110. The second main surface 110b is bent and formed in a direction different from that of the first main surface 110a. In this modified example, the substrate 110 is a rectangular substrate.

更具体而言,第一主面110a是基板110的主面(与安装部182相反一侧的面)中,与和支柱181的轴方向交叉的方向平行的部分,第二主面110b是不与通过基板弯折而形成的第一主面110a平行的部分。这种状态的基板110例如由柔性基板来实现。More specifically, the first main surface 110a is a part of the main surface (the surface on the opposite side to the mounting portion 182) of the substrate 110 that is parallel to the direction intersecting the axial direction of the pillar 181, and the second main surface 110b is a portion that is not A portion parallel to the first main surface 110a formed by bending the substrate. The substrate 110 in this state is realized by, for example, a flexible substrate.

并且,在本变形例中,如图9所示,在第一主面110a上配置有四个发光元件22,在两个第二主面110b上分别配置一个发光元件22。这些合计六个发光元件22由基板110所具有的布线图案例如被串联连接。Furthermore, in this modified example, as shown in FIG. 9 , four light emitting elements 22 are arranged on the first main surface 110 a, and one light emitting element 22 is arranged on each of the two second main surfaces 110 b. These six light emitting elements 22 in total are connected in series, for example, by a wiring pattern included in the substrate 110 .

并且,折弯状态的基板110例如由硅树脂等粘着剂被粘着在安装部182。In addition, the bent substrate 110 is adhered to the mounting portion 182 with an adhesive such as silicone resin, for example.

并且,在本变形例中,被配置在第一主面110a的四个发光元件22的每一个是第一发光元件的一个例子,两个第二主面110b上所分别配置的一个发光元件22是第二发光元件的一个例子。In addition, in this modified example, each of the four light emitting elements 22 arranged on the first main surface 110a is an example of a first light emitting element, and one light emitting element 22 arranged on each of the two second main surfaces 110b is an example of the second light emitting element.

并且,图9中的基板110的深度方向的宽度例如为安装部182的深度方向的宽度以下。在这种情况下,相对于基板110的面积,支承部件180与基板110的接触面积所占的比率为100%。In addition, the width of the substrate 110 in the depth direction in FIG. 9 is, for example, equal to or less than the width of the mounting portion 182 in the depth direction. In this case, the ratio of the contact area between the support member 180 and the substrate 110 to the area of the substrate 110 is 100%.

这样,在本变形例中,仅在片面配置有多个发光元件22的单面安装基板(基板110)以折弯的状态被安装在安装部182。这样,本变形例所涉及的LED模块127所具备的多个发光元件22至少包括彼此朝向不同方向的两个发光元件22(第一发光元件以及第二发光元件)。据此,能够使光向多方向放出。Thus, in this modified example, only the one-sided mounting substrate (substrate 110 ) on which the plurality of light emitting elements 22 are arranged is mounted on the mounting portion 182 in a bent state. In this way, the plurality of light emitting elements 22 included in the LED module 127 according to this modification includes at least two light emitting elements 22 (first light emitting element and second light emitting element) facing in different directions from each other. Accordingly, it is possible to emit light in multiple directions.

并且,从这些多个发光元件22放出的热由支承部件180高效率地放出。这样,能够抑制多个发光元件22每一个所发出的热造成的发光效率的降低。In addition, the heat released from the plurality of light emitting elements 22 is efficiently released by the support member 180 . In this way, it is possible to suppress a decrease in luminous efficiency due to heat emitted by each of the plurality of light emitting elements 22 .

因此,具备LED模块127的灯泡形灯1使具有优良的配光特性的照明用光源。Therefore, the light bulb-shaped lamp 1 including the LED module 127 is a light source for illumination having excellent light distribution characteristics.

并且,基板110例如也可以弯折在图9中所示的安装部182的深度方向的侧面,以配置一个以上的发光元件22。In addition, the substrate 110 may be bent, for example, on the side surface in the depth direction of the mounting portion 182 shown in FIG. 9 to arrange one or more light emitting elements 22 .

[变形例7][Modification 7]

图10示出了实施方式1的变形例7所涉及的LED模块128的构成概要。FIG. 10 shows an outline of the configuration of an LED module 128 according to Modification 7 of Embodiment 1. As shown in FIG.

如图10所示,变形例7所涉及的LED模块128与上述的变形例6所涉及的LED模块127相同,由一张单面安装基板(本变形例中为基板111)来实现使光向多方向放出。As shown in FIG. 10 , the LED module 128 related to Modification 7 is the same as the LED module 127 related to the above-mentioned Modification 6, and uses a single-sided mounting substrate (substrate 111 in this modification) to realize directing the light direction. Release in multiple directions.

即,变形例7所涉及的LED模块128所具备的基板111以折弯的状态由支承部件180支承。并且,基板111的主面具有第一主面111a和第二主面111c,该第一主面111a是沿着支承部件180的端面(安装部182的上表面182a)而被配置的面,该第二主面111c是通过基板111折弯而形成的、与第一主面111a朝向不同的面。在本变形例中,基板111为矩形的基板。That is, the substrate 111 included in the LED module 128 according to Modification 7 is supported by the supporting member 180 in a bent state. In addition, the main surface of the substrate 111 has a first main surface 111a and a second main surface 111c. The second main surface 111c is formed by bending the substrate 111 and has a different orientation from the first main surface 111a. In this modified example, the substrate 111 is a rectangular substrate.

但是,在变形例7所涉及的LED模块128中,光的主要放出方向与变形例6所涉及的LED模块127不同。However, in the LED module 128 according to Modification 7, the main emission direction of light is different from that of the LED module 127 according to Modification 6 .

具体而言,基板111的第一主面111a是朝向上方的(Z轴的正方向),第二主面111c是朝向下方的(Z轴的负方向)。具有这种状态的基板111例如由柔性基板实现。Specifically, the first main surface 111a of the substrate 111 is oriented upward (the positive direction of the Z axis), and the second main surface 111c is oriented downward (the negative direction of the Z axis). The substrate 111 having such a state is realized by a flexible substrate, for example.

并且,在本变形例中如图10所示,在第一主面111a配置有四个发光元件,两个第二主面111c分别被配置有一个发光元件22。这些合计六个发光元件22由基板111所具有的布线图案例如被串联连接。Furthermore, in this modified example, as shown in FIG. 10 , four light emitting elements are arranged on the first main surface 111 a, and one light emitting element 22 is arranged on each of the two second main surfaces 111 c. These six light-emitting elements 22 in total are connected in series, for example, by a wiring pattern included in the substrate 111 .

即,在变形例6所涉及的LED模块127中采用的构成是,光主要从上方以及侧方放出,在变形例7所涉及的LED模块128所采用的构成为,光主要从上方以及下方放出。That is, the LED module 127 according to Modification 6 has a configuration in which light is emitted mainly from above and sideways, and the LED module 128 according to Modification 7 has a configuration in which light is mainly emitted from above and below. .

并且,在本变形例中,被配置在第一主面111a的四个发光元件22的每一个是第一发光元件的一个例子,两个第二主面111c上所分别配置的一个发光元件22是第二发光元件的一个例子。In addition, in this modified example, each of the four light emitting elements 22 arranged on the first main surface 111a is an example of a first light emitting element, and each of the light emitting elements 22 arranged on the two second main surfaces 111c is an example of the second light emitting element.

并且,在图10中,基板111的深度方向的宽度例如是安装部182的深度方向的宽度以下。在这种情况下,相对于基板111的面积,支承部件180与基板111的接触面积所占的比率为100%。In addition, in FIG. 10 , the width of the substrate 111 in the depth direction is, for example, equal to or less than the width of the mounting portion 182 in the depth direction. In this case, the ratio of the contact area between the support member 180 and the substrate 111 to the area of the substrate 111 is 100%.

这样,在本变形例中,仅在单面被配置有多个发光元件22的单面安装基板(基板111)以折弯的状态被安装在安装部182。这样,本变形例所涉及的LED模块128所具备的多个发光元件22至少包括彼此朝向不同方向的两个发光元件22(第一发光元件以及第二发光元件)。这样,能够使光向多方向放出。In this way, in this modified example, the single-sided mounting substrate (substrate 111 ) on which the plurality of light emitting elements 22 are arranged only on one surface is mounted on the mounting portion 182 in a bent state. In this way, the plurality of light emitting elements 22 included in the LED module 128 according to this modification includes at least two light emitting elements 22 (first light emitting element and second light emitting element) facing in different directions from each other. In this way, light can be emitted in multiple directions.

并且,从这些多个发光元件22放出的热由支承部件180高效率地放出。这样,能够抑制因多个发光元件22的每一个所发出的热而造成的发光效率的降低。In addition, the heat released from the plurality of light emitting elements 22 is efficiently released by the support member 180 . In this way, it is possible to suppress reduction in luminous efficiency due to heat emitted by each of the plurality of light emitting elements 22 .

因此,具备LED模块128的灯泡形灯1是具有优良的配光特性的照明用光源。Therefore, the light bulb-shaped lamp 1 including the LED module 128 is a light source for illumination having excellent light distribution characteristics.

并且,在以上的变形例4至7中,图7至图10的每一个所示出的基板(28、110、111)的深度方向的宽度例如在安装部182的深度方向的宽度以下。Furthermore, in the above modified examples 4 to 7, the width in the depth direction of the substrate ( 28 , 110 , 111 ) shown in each of FIGS.

不过,基板(28、110、111)的深度方向的宽度也可以比安装部182的深度方向的宽度长。在这种情况下,相对于基板(28、110、111)的面积,支承部件180与基板(28、110、111)的接触面积所占的比率为5%以上。However, the width of the substrate ( 28 , 110 , 111 ) in the depth direction may be longer than the width of the mounting portion 182 in the depth direction. In this case, the ratio of the contact area between the support member 180 and the substrate ( 28 , 110 , 111 ) to the area of the substrate ( 28 , 110 , 111 ) is 5% or more.

[变形例8][Modification 8]

图11示出了实施方式1的变形例8所涉及的LED模块129的构成概要。FIG. 11 shows an outline of the configuration of an LED module 129 according to Modification 8 of Embodiment 1. As shown in FIG.

如图11所示,变形例8所涉及的LED模块129与上述的变形例6所涉及的LED模块127相同,采用的构成是以单面安装基板作为一张基板110,光主要从上方以及侧方放出。As shown in FIG. 11 , the LED module 129 according to Modification 8 is the same as the LED module 127 according to Modification 6 above, and adopts a structure in which a single-sided mounting substrate is used as a substrate 110, and the light is mainly emitted from the upper side and the side. Fang released.

但是,在变形例8所涉及的LED模块129被安装在,横宽比基板110的第一主面110a的横宽(X轴方向上的宽度)短的安装部183。However, the LED module 129 according to Modification 8 is mounted on the mounting portion 183 whose width is shorter than the width (the width in the X-axis direction) of the first main surface 110 a of the substrate 110 .

即,基板110以第二主面110b没有直接由支承部件180支承的状态(远离支承部件180的状态),由支承部件180支承。That is, the substrate 110 is supported by the support member 180 in a state where the second principal surface 110 b is not directly supported by the support member 180 (a state away from the support member 180 ).

这样,例如在将以柔性基板实现的基板110安装到支承部件180的情况下,可以采用基板110中存在与支承部件180不接触的部分的方式,将基板110安装到支承部件180。In this way, for example, when attaching substrate 110 implemented as a flexible substrate to support member 180 , substrate 110 can be attached to support member 180 so that there is a portion of substrate 110 that does not contact support member 180 .

具体而言,若相对于基板110的面积,支承部件180与基板110的接触面积所占的比率为5%以上,则可以将呈折弯状态的基板110,以存在不与支承部件180接触的部分的状态来安装到支承部件180。Specifically, if the ratio of the contact area between the support member 180 and the substrate 110 is 5% or more with respect to the area of the substrate 110, the substrate 110 in a bent state can be formed so that there is no contact with the support member 180. Partial state to install to the support member 180 .

据此,针对LED模块129发生的热而言,能够维持由支承部件180所进行的规定的散热效果,并且,例如能够提高第二主面110b的朝向的自由度。即,能够使第二主面110b的朝向成为,例如比图11所示的状态朝向外侧以及朝向内侧。Accordingly, while maintaining a predetermined heat dissipation effect by the support member 180 with respect to the heat generated by the LED module 129 , for example, the degree of freedom in the orientation of the second main surface 110 b can be increased. That is, the orientation of the second main surface 110 b can be, for example, directed outward and inward compared to the state shown in FIG. 11 .

因此,具备LED模块129的灯泡形灯1是具有优良的配光特性的照明用光源。Therefore, the light bulb-shaped lamp 1 including the LED module 129 is a light source for illumination having excellent light distribution characteristics.

[配光特性][Light distribution characteristics]

接着,利用比较举例的方式对本实用新型所涉及的照明用光源的配光特性进行说明。图12是作为比较例子的灯泡形灯200的正面图。Next, the light distribution characteristics of the light source for illumination according to the present invention will be described by way of comparative examples. FIG. 12 is a front view of a light bulb-shaped lamp 200 as a comparative example.

图12所示的灯泡形灯200具备:球形罩210、LED模块220、以及在球形罩210内支承LED模块220的支承部件240。The lightbulb-shaped lamp 200 shown in FIG. 12 is equipped with the glove|globe 210, the LED module 220, and the support member 240 which supports the LED module 220 in the glove|globe 210. As shown in FIG.

LED模块220具有基板221以及四个发光元件222。发光元件222与上述的发光元件22相同,是SMD型LED元件。并且,四个发光元件222被配置在基板221的主面221a,基板221的背面221b没有配置发光元件222。图13是示出图12所示的灯泡形灯200的配光特性的配光曲线图。The LED module 220 has a substrate 221 and four light emitting elements 222 . The light emitting element 222 is the same as the light emitting element 22 described above, and is an SMD type LED element. Furthermore, four light emitting elements 222 are arranged on the main surface 221 a of the substrate 221 , and no light emitting element 222 is arranged on the back surface 221 b of the substrate 221 . FIG. 13 is a light distribution graph showing the light distribution characteristics of the light bulb-shaped lamp 200 shown in FIG. 12 .

图13所示的配光曲线图示出了针对包括灯泡形灯200的上下方向的360°的各个方向的光度的大小。在该配光曲线图中,将沿着图12中的灯泡形灯200的灯轴J的上方侧的方向设为0°,沿着灯轴J下方侧的方向设为180°(-180°),在顺时针及逆时针方向上的刻度间隔为10°。The light distribution graph shown in FIG. 13 shows magnitudes of luminosity for each direction of 360° including the up and down directions of the bulb-shaped lamp 200 . In this light distribution graph, the direction along the upper side of the lamp axis J of the bulb-shaped lamp 200 in FIG. ), the scale intervals in the clockwise and counterclockwise directions are 10°.

配光曲线图的径方向上的刻度(0至100cd(坎德拉))表示光度。The scale (0 to 100 cd (candela)) in the radial direction of the light distribution graph represents the luminosity.

在此,“配光角”表示,照明用光源中的光度的最大值的一半以上的光度射出的角度范围的大小。即,在图13所示的配光曲线图中,配光角的角度范围大小为,光度的最大值(约60cd)的50%以上(约30cd以上)。Here, the "light distribution angle" indicates the size of an angular range in which luminosity equal to or more than half of the maximum value of luminosity in a light source for illumination is emitted. That is, in the light distribution graph shown in FIG. 13 , the angular range of the light distribution angle is 50% or more (about 30 cd or more) of the maximum luminosity (about 60 cd).

具体而言,在图13所示的配光曲线中,配光角所示出的配光特性为,以灯泡形灯200的中心轴为基准,约-40°至约+40°的范围。即,灯泡形灯200的配光角为约80°。并且,通过本实用新型所涉及的照明用光源能够实现更大的配光角。Specifically, in the light distribution curve shown in FIG. 13 , the light distribution characteristic represented by the light distribution angle is in the range of approximately −40° to approximately +40° with respect to the central axis of the light bulb-shaped lamp 200 . That is, the light distribution angle of the bulb-shaped lamp 200 is about 80°. Furthermore, a larger light distribution angle can be realized by the light source for illumination according to the present invention.

作为本实用新型所涉及的照明用光源的配光特性的一个例子,示出了具备上述的变形例1所涉及的LED模块120的灯泡形灯1的配光特性。As an example of the light distribution characteristic of the light source for illumination which concerns on this invention, the light distribution characteristic of the lightbulb-shaped lamp 1 provided with the LED module 120 which concerns on the said modification 1 is shown.

图14是示出具备变形例1所涉及的LED模块120的灯泡形灯1的配光特性的配光曲线图。FIG. 14 is a light distribution graph showing the light distribution characteristics of the light bulb-shaped lamp 1 including the LED module 120 according to Modification 1. As shown in FIG.

图14所示的配光曲线图表示,针对包括灯泡形灯1的上下方向的360°的各个方向的光度的大小。在该配光曲线图中,将沿着具备LED模块120的灯泡形灯1的灯轴J的上方侧(参照图1)的方向设为0°、沿着灯轴J下方侧的方向设为180°(-180°),在顺时针以及逆时针方向上的刻度间隔为10°。The light distribution graph shown in FIG. 14 shows the magnitude of luminosity in each direction of 360° including the vertical direction of the light bulb-shaped lamp 1 . In this light distribution graph, the direction along the upper side of the lamp axis J (see FIG. 1 ) of the light bulb-shaped lamp 1 including the LED module 120 is defined as 0°, and the direction along the lower side of the lamp axis J is defined as 180°(-180°), the scale interval in the clockwise and counterclockwise direction is 10°.

配光曲线图的径方向上的刻度(0至50cd(坎德拉))表示光度。The scale (0 to 50 cd (candela)) in the radial direction of the light distribution graph represents the luminosity.

即,在图14所示的配光曲线图中,光度为最大值(约50cd)的50%以上(约25cd以上)的角度范围的大小是灯泡形灯1的配光角。That is, in the light distribution graph shown in FIG. 14 , the angular range in which the luminosity is 50% or more (about 25 cd or more) of the maximum value (about 50 cd) is the light distribution angle of the bulb-shaped lamp 1 .

具体而言,在图14所示的配光曲线图中,配光角所示出的配光特性为,以灯泡形灯1的中心轴为基准,约-150°至约+150°的范围。即,具备LED模块120的灯泡形灯1的配光角为约300°。Specifically, in the light distribution graph shown in FIG. 14 , the light distribution characteristic shown by the light distribution angle is in the range of about -150° to about +150° with the central axis of the light bulb-shaped lamp 1 as a reference. . That is, the light distribution angle of the light bulb-shaped lamp 1 including the LED module 120 is about 300°.

这样,通过本实用新型所涉及的照明用光源(灯泡形灯1),比起具备仅朝向一个方向的多个发光元件的照明用光源(例如,图12所示的灯泡形灯200)而言,能够得到大的配光角。In this way, the light source for illumination (lightbulb-shaped lamp 1) according to the present invention is more effective than the light source for illumination (for example, the lightbulb-shaped lamp 200 shown in FIG. , a large light distribution angle can be obtained.

[支承部件的散热效果][radiation effect of supporting member]

接着,对本实用新型所涉及的支承部件的散热效果进行说明。图15示出了相对于基板的面积,支承部件与基板的接触面积所占的比率(以下称为“接触面积比”)、与发光元件的温度的关系。Next, the heat radiation effect of the support member which concerns on this invention is demonstrated. FIG. 15 shows the relationship between the ratio of the contact area of the supporting member and the substrate (hereinafter referred to as "contact area ratio") to the area of the substrate, and the temperature of the light emitting element.

具体而言,图15所示的图表示出了,在上述的变形例3所涉及的LED模块122中,接触面积比与发光元件22的结温(发光元件22的与基板27的接合部的温度)的关系。Specifically, the graph shown in FIG. 15 shows that in the LED module 122 according to Modification 3 described above, the contact area ratio and the junction temperature of the light emitting element 22 (the junction temperature of the light emitting element 22 and the substrate 27 temperature) relationship.

通过图15可知,随着接触面积比的増加,发光元件22的结温降低。这是因为,在与基板21接触的支承部件170的端面175(参照图6(a)和图6(b))的面积増加时,从基板27向支承部件170的每单位时间的热传导量增加的缘故。It can be seen from FIG. 15 that the junction temperature of the light emitting element 22 decreases as the contact area ratio increases. This is because, when the area of the end surface 175 (see FIG. 6(a) and FIG. 6(b)) of the support member 170 in contact with the substrate 21 increases, the amount of heat conduction per unit time from the substrate 27 to the support member 170 increases. for the sake.

并且,在详细探讨图15所示的图表时可知,随着接触面积比的増加,发光元件22的结温的降低率下降(图表的负的倾斜变小)。即,随着接触面积比的増加,因接触面积比的増加而造成的发光元件22的温度降低的效果变小。Further, when the graph shown in FIG. 15 is examined in detail, it can be seen that as the contact area ratio increases, the reduction rate of the junction temperature of the light emitting element 22 decreases (the negative slope of the graph becomes smaller). That is, as the contact area ratio increases, the effect of reducing the temperature of the light emitting element 22 due to the increase in the contact area ratio becomes smaller.

本实用新型的发明人员注意到该发光元件22的结温的变化以及结温的降低率的变化,得出的结论是,接触面积比最好在5%以上。具体而言,如以下的说明。The inventors of the present utility model noticed the change of the junction temperature of the light-emitting element 22 and the change of the reduction rate of the junction temperature, and concluded that the contact area ratio is preferably more than 5%. Specifically, it is as described below.

在灯泡形灯1所具备的驱动电路80中有各种电子部件,例如像电解电容器这种需要避开高温环境的部件。The drive circuit 80 included in the light bulb-shaped lamp 1 includes various electronic components, such as electrolytic capacitors, which need to be kept away from high-temperature environments.

并且,作为SMD型LED元件的发光元件22如以上所述,具有包含用于波长变换的荧光体粒子的密封部件22c。由该荧光体粒子进行波长变换的效率在高温的环境下会降低,对于密封部件22c也是同样,尽可能地不使其成为高温是比较重要的。Furthermore, the light emitting element 22 which is an SMD type LED element has the sealing member 22c containing the phosphor particle for wavelength conversion as mentioned above. The efficiency of wavelength conversion by the phosphor particles decreases in a high-temperature environment, and the same applies to the sealing member 22c, so it is important not to increase the temperature as much as possible.

因此,在考虑到电子部件的质量维持以及光的波长变换效率的维持等情况下,发光元件22的结温例如最好是低于120℃。Therefore, the junction temperature of the light-emitting element 22 is preferably lower than 120° C., for example, in consideration of maintaining the quality of electronic components and maintaining the wavelength conversion efficiency of light.

另外,接触面积比的増加会导致在基板的背面的能够配置发光元件22的区域(能够安装区域)的减少。即,例如上述的LED模块20以及120至122,在考虑到具备在主面以及背面上均配置一个以上的发光元件22的双面安装基板的情况下,会有不能使接触面积比变得过大的情况。In addition, an increase in the contact area ratio leads to a decrease in the area on the back surface of the substrate where the light emitting element 22 can be arranged (mountable area). That is, for example, in the above-mentioned LED modules 20 and 120 to 122, in the case of a double-sided mounting substrate having one or more light-emitting elements 22 arranged on the main surface and the back surface, there is a possibility that the contact area ratio cannot be made too high. big case.

因此,本实用新型的发明人员针对发光元件22的结温的上限120℃,考虑到留出10℃以上的余地,为了得到比120℃低10℃以上的值,从而得出的结论是,接触面积比的优选下限值为5%。Therefore, the inventors of the present invention considered leaving room for more than 10°C for the upper limit of the junction temperature of the light-emitting element 22 at 120°C, and in order to obtain a value lower than 120°C by more than 10°C, they concluded that contact The preferable lower limit of the area ratio is 5%.

即,在上述的实施方式1以及各个变形例的每一个中所采用的构成是,相对于LED模块所具有的基板的面积,支承部件与基板的接触面积所占的比率(接触面积比)为5%(0.05)以上。That is, in the configuration adopted in each of the first embodiment and each modification described above, the ratio of the contact area between the support member and the substrate (contact area ratio) to the area of the substrate included in the LED module is: More than 5% (0.05).

其结果是,既能够使具有这种LED模块的多个发光元件22实现大的配光角,又能够抑制因该多个发光元件22在发光时所产生的热造成的发光效率的降低。As a result, a large light distribution angle can be realized by the plurality of light emitting elements 22 having such an LED module, and a reduction in luminous efficiency due to heat generated when the plurality of light emitting elements 22 emit light can be suppressed.

并且,例如在图1所示的基板21等双面安装基板的情况下,按照应该被安装到基板的背面的发光元件22(或者23)的个数以及位置,来规定接触面积比的上限。And, for example, in the case of a double-sided mounting substrate such as the substrate 21 shown in FIG. 1 , the upper limit of the contact area ratio is defined according to the number and position of the light emitting elements 22 (or 23) to be mounted on the back surface of the substrate.

例如,像图1所示那样,在基板21的背面21b配置两个发光元件22的情况下,以该两个发光元件22的每一个不接触支承部件40的范围,来规定接触面积比的上限。For example, as shown in FIG. 1 , when two light emitting elements 22 are arranged on the back surface 21 b of the substrate 21 , the upper limit of the contact area ratio is defined in the range where each of the two light emitting elements 22 does not contact the support member 40 . .

即,接触面积比的上限的值为,比作为下限的5%(0.05)大,并且,是与应该被安装到基板的背面的发光元件的个数以及位置相对应的值。That is, the upper limit of the contact area ratio is greater than the lower limit of 5% (0.05), and is a value corresponding to the number and position of light emitting elements to be mounted on the back surface of the substrate.

并且,接触面积比的下限值也可以是,例如能够使发光元件22的结温成为100度以下的10%。也就是说,更为优选的接触面积比为10%以上。In addition, the lower limit of the contact area ratio may be, for example, 10% that enables the junction temperature of the light emitting element 22 to be 100 degrees or less. That is, a more preferable contact area ratio is 10% or more.

并且,接触面积比的下限值也可以是,例如能够使发光元件22的结温进一步降低,并且随着接触面积比的增加而发光元件22的温度降低的效果逐渐减小的25%。也就是说,更加优选的接触面积比为25%以上。In addition, the lower limit of the contact area ratio may be, for example, 25% that further reduces the junction temperature of the light emitting element 22 and gradually reduces the effect of reducing the temperature of the light emitting element 22 as the contact area ratio increases. That is, a more preferable contact area ratio is 25% or more.

并且,接触面积比可以为5%以上,也可以优选为10%以上,而且还可以进一步优选为25%,对于接触面积比的这一特点而言,不仅可以适用于实施方式1所涉及的灯泡形灯1,而且也可以适用于变形例1至8中所涉及的灯泡形灯1。In addition, the contact area ratio can be 5% or more, preferably 10% or more, and can be further preferably 25%. For this characteristic of the contact area ratio, it is not only applicable to the bulb related to Embodiment 1. shaped lamp 1, and can also be applied to the bulb-shaped lamp 1 according to Modifications 1 to 8.

(实施方式2)(Embodiment 2)

接着,对实施方式2所涉及的灯泡形灯1a,以与上述的实施方式1所涉及的灯泡形灯1的不同之处为中心来进行说明。即,在以下的说明中,对于已经说明过的球形罩10等的构成要素,省略图示以及说明。图16是本实用新型的实施方式2所涉及的灯泡形灯1a的部分剖面图。Next, the lightbulb-shaped lamp 1a according to Embodiment 2 will be described focusing on differences from the lightbulb-shaped lamp 1 according to Embodiment 1 described above. That is, in the following description, illustration and description of the constituent elements such as the glove 10 already described will be omitted. Fig. 16 is a partial sectional view of a light bulb-shaped lamp 1a according to Embodiment 2 of the present invention.

图16所示的灯泡形灯1a具备:球形罩10、LED模块20、以及在球形罩10内支承LED模块20的支承部件40。支承部件40被固定在台座50。The lightbulb-shaped lamp 1a shown in FIG. 16 is equipped with the glove|globe 10, the LED module 20, and the support member 40 which supports the LED module 20 in the glove|globe 10. As shown in FIG. The supporting member 40 is fixed to the base 50 .

实施方式2中的LED模块20具有基板21、以及被安装在基板的两个面(主面21a以及背面21b)上的发光元件23。The LED module 20 in Embodiment 2 has the board|substrate 21, and the light emitting element 23 mounted on both surfaces (the main surface 21a and the back surface 21b) of a board|substrate.

即,实施方式中的多个发光元件23至少包括彼此朝向不同方向的两个发光元件23(第一发光元件以及第二发光元件)。That is, the plurality of light emitting elements 23 in the embodiment includes at least two light emitting elements 23 (a first light emitting element and a second light emitting element) facing in different directions from each other.

并且,相对于基板21的面积,支承部件40与基板21的接触面积所占的比率与实施方式1相同,为5%以上。Furthermore, the ratio of the contact area of the support member 40 and the substrate 21 to the area of the substrate 21 is equal to or greater than 5% as in the first embodiment.

在此,实施方式2中的发光元件23与实施方式1中的发光元件22相同,为SMD型LED元件。但是,发光元件23与发光元件22不同,不具有包含荧光体粒子的密封部件22c。Here, the light emitting element 23 in Embodiment 2 is the same as the light emitting element 22 in Embodiment 1, and is an SMD type LED element. However, unlike the light emitting element 22, the light emitting element 23 does not have the sealing member 22c containing phosphor particles.

即,发光元件23对自身所具备的LED芯片发出的光不进行波长变换而直接放出。That is, the light emitting element 23 directly emits the light emitted from the LED chip included therein without performing wavelength conversion.

因此,在发光元件23具有蓝色LED芯片的情况下,从发光元件23直接放出蓝色光。Therefore, when the light emitting element 23 has a blue LED chip, blue light is directly emitted from the light emitting element 23 .

但是,在实施方式2所涉及的灯泡形灯1a中具备波长变换体90,该波长变换体90以覆盖被配置在基板21的多个发光元件23的方式被配置在球形罩10内,并且该波长变换体90是具有预先规定的形状的部件。However, the lightbulb-shaped lamp 1a according to Embodiment 2 includes the wavelength converter 90 arranged in the glove 10 so as to cover the plurality of light emitting elements 23 arranged on the substrate 21 , and the wavelength converter 90 The wavelength converter 90 is a member having a predetermined shape.

波长变换体90通过波长变换体90中所含有的变换材料91,将从这些多个发光元件23入射的光的波长变换为规定的波长后放出。The wavelength converter 90 converts the wavelength of light incident from the plurality of light emitting elements 23 into a predetermined wavelength by the conversion material 91 contained in the wavelength converter 90 and emits the light.

波长变换体90例如是含有作为变换材料91的黄色荧光体粒子的树脂的模制品。The wavelength converter 90 is, for example, a molded product of resin containing yellow phosphor particles as the conversion material 91 .

作为波长变换体90的材料的含荧光体树脂例如能够采用将YAG系的黄色荧光体粒子分散到硅树脂的含荧光体树脂。As the phosphor-containing resin as a material of the wavelength converter 90 , for example, a phosphor-containing resin in which YAG-based yellow phosphor particles are dispersed in a silicone resin can be used.

即,发光元件23在具有蓝色LED芯片的情况下,黄色荧光体粒子由蓝色LED芯片的蓝色光激励而放出黄色光。因此,被激励的黄色光与蓝色LED芯片的蓝色光混合而生成的白色光从波长变换体90放出。也就是说,从LED模块20放出的光的波长,通过波长变换体90中所含有的变换材料91而被变换为规定的波长。That is, when the light emitting element 23 has a blue LED chip, the yellow phosphor particles are excited by the blue light of the blue LED chip to emit yellow light. Therefore, white light generated by mixing the excited yellow light with the blue light of the blue LED chip is emitted from the wavelength converter 90 . That is, the wavelength of light emitted from the LED module 20 is converted to a predetermined wavelength by the conversion material 91 included in the wavelength conversion body 90 .

并且,通过变更发光元件23所具有的LED芯片的发光颜色、与波长变换体90所含有的荧光体的种类以及浓度等的组合,从而能够变更从波长变换体90放出的光的颜色以及亮度等。In addition, by changing the combination of the light emission color of the LED chip included in the light emitting element 23, and the type and concentration of the phosphor contained in the wavelength converter 90, it is possible to change the color, brightness, etc. of the light emitted from the wavelength converter 90. .

并且,在图16中虽然示出了,波长变换体90以覆盖支承部件40以及LED模块20的全体的方式而被配置,不过,例如也可以考虑到散热效率,而在波长变换体90上设置一个以上的孔。In addition, although it is shown in FIG. 16 that the wavelength conversion body 90 is arranged to cover the entire support member 40 and the LED module 20, for example, it may be provided on the wavelength conversion body 90 in consideration of heat radiation efficiency. more than one hole.

并且,波长变换体90没有被固定在台座50的必要。波长变换体90例如也可以是以被固定在基板21的状态,来覆盖多个发光元件23。In addition, the wavelength converter 90 does not need to be fixed to the base 50 . For example, the wavelength converter 90 may cover the plurality of light emitting elements 23 in a state of being fixed to the substrate 21 .

并且,波长变换体90也可以不必是树脂制成的。波长变换体90例如也可以作为,在内面或者外面形成包含有荧光体等变换材料91的被覆的玻璃制的部件来实现。In addition, the wavelength converter 90 does not need to be made of resin. The wavelength converter 90 may be realized, for example, as a member made of glass in which a coating including a conversion material 91 such as a phosphor is formed on the inside or outside.

如以上所述,本实施方式所涉及的灯泡形灯1a具备将来自多个发光元件23的光的波长变换为规定的波长的波长变换体90,并且具有与上述的实施方式1所涉及的灯泡形灯1共同的特征。As described above, the light bulb-shaped lamp 1a according to the present embodiment includes the wavelength conversion body 90 for converting the wavelength of light from the plurality of light emitting elements 23 into a predetermined wavelength, and has the same light bulb shape as the light bulb according to the above-mentioned first embodiment. Shaped lamp 1 common feature.

具体而言,灯泡形灯1a具备至少彼此的朝向互不相同的两个发光元件23,并且,相对于基板21的面积,支承部件40与基板21的接触面积所占的比率与实施方式1相同,为5%以上。Specifically, the light bulb-shaped lamp 1a includes at least two light emitting elements 23 whose orientations are different from each other, and the ratio of the contact area between the support member 40 and the substrate 21 with respect to the area of the substrate 21 is the same as that of the first embodiment. , is more than 5%.

因此,通过灯泡形灯1a,既能够实现使光向多方向放出,又能够抑制因多个发光元件23的每一个在发光时所产生的热而造成的发光效率的降低。Therefore, the light bulb-shaped lamp 1a can emit light in multiple directions while suppressing reduction in luminous efficiency due to heat generated by each of the plurality of light-emitting elements 23 when emitting light.

即,实施方式2所涉及的灯泡形灯1a是具有优良的配光特性的照明用光源。That is, the lightbulb-shaped lamp 1a according to Embodiment 2 is a light source for illumination having excellent light distribution characteristics.

并且,灯泡形灯1a作为发光装置,也可以采用图16所示的LED模块20以外的发光装置。例如,实施方式1的变形例1至8所涉及的LED模块(120至122、125至129)的任一个可以作为发光装置,而具备在灯泡形灯1a中。In addition, the light bulb-shaped lamp 1a may employ a light emitting device other than the LED module 20 shown in FIG. 16 as a light emitting device. For example, any of the LED modules ( 120 to 122 , 125 to 129 ) according to Modifications 1 to 8 of Embodiment 1 may be included in the light bulb-shaped lamp 1 a as a light emitting device.

(实施方式3)(Embodiment 3)

接着,针对实施方式3所涉及的灯泡形灯2,以与上述的实施方式1所涉及的灯泡形灯1的不同之处为中心进行说明。即,在以下的说明中,对于已经说明过的发光元件22等构成要素会有省略说明的情况。图17是本实用新型的实施方式3所涉及的灯泡形灯2的外观透视图。Next, the lightbulb-shaped lamp 2 which concerns on Embodiment 3 is demonstrated centering on the difference from the lightbulb-shaped lamp 1 which concerns on Embodiment 1 mentioned above. That is, in the following description, the description of components such as the light emitting element 22 already described may be omitted. FIG. 17 is an external perspective view of a light bulb-shaped lamp 2 according to Embodiment 3 of the present invention.

如图17所示,灯泡形灯2是成为替代白炽灯的灯泡形灯,具备:球形罩15、作为光源的LED模块120、支承部件140、台座52、树脂外壳63、以及灯头32。As shown in FIG. 17 , the bulb-shaped lamp 2 is a bulb-shaped lamp that replaces an incandescent lamp, and includes a globe 15 , an LED module 120 as a light source, a support member 140 , a base 52 , a resin case 63 , and a base 32 .

LED模块120被固定在支承部件140,从而被配置在球形罩15内。The LED module 120 is fixed to the support member 140 to be arranged inside the glove 15 .

即,灯泡形灯2是与实施方式1所涉及的灯泡形灯1相同的CMT结构的灯。That is, the lightbulb-shaped lamp 2 is a lamp having the same CMT structure as the lightbulb-shaped lamp 1 according to the first embodiment.

并且,虽然在图17中没有图示,在树脂外壳63内具备与上述的实施方式1所涉及的灯泡形灯1所具备的驱动电路80同样的驱动电路。即,从灯头32供给来的交流电由该驱动电路转换为直流电,经过两条引线72a以及72b,将转换后的直流电供给到LED模块120。In addition, although not shown in FIG. 17 , a drive circuit similar to the drive circuit 80 included in the light bulb-shaped lamp 1 according to Embodiment 1 described above is provided in the resin case 63 . That is, the AC power supplied from the base 32 is converted into DC power by the drive circuit, and the converted DC power is supplied to the LED module 120 through the two lead wires 72a and 72b.

并且,球形罩15是覆盖LED模块120的透光罩,其构成为能够将从LED模块120放出的光取出到灯的外部。因此,入射到球形罩15的内面的LED模块120的光透过球形罩15,而被取出到球形罩15的外部。In addition, the glove 15 is a translucent cover covering the LED module 120, and is configured to be able to take out the light emitted from the LED module 120 to the outside of the lamp. Therefore, the light of the LED module 120 incident on the inner surface of the glove 15 passes through the glove 15 and is extracted to the outside of the glove 15 .

在此,实施方式3所涉及的灯泡形灯2与实施方式1所涉及的灯泡形灯1的球形罩的形状大不相同。Here, the shape of the globe of the lightbulb-shaped lamp 2 according to Embodiment 3 is greatly different from that of the lightbulb-shaped lamp 1 according to Embodiment 1.

即,灯泡形灯1所具备的球形罩10的形状从整体上来看为球状,而灯泡形灯2的球形罩15的形状为,在与树脂外壳63相连接的开口部的开口面垂直的方向上呈细长状。That is, the shape of the glove 10 included in the lightbulb-shaped lamp 1 is spherical as a whole, while the shape of the glove 15 of the lightbulb-shaped lamp 2 is a direction perpendicular to the opening surface of the opening connected to the resin case 63. Slender on top.

具体而言,球形罩15为蜡烛形(JIS(日本工业标准)的C7710所规定的C形),球形罩15的外面形成有纵长的略呈圆锥形的面。Specifically, the glove 15 is in the shape of a candle (C-shape defined by JIS (Japanese Industrial Standard) C7710), and the glove 15 has a vertically long and slightly conical surface formed on its outer surface.

但是,灯泡形灯2作为发光装置,具备上述的实施方式1的变形例1所涉及的LED模块120以及支承部件140。因此,在实施方式3所涉及的灯泡形灯2中,即能够通过多个发光元件22实现大的配光角,又能够抑制因该多个发光元件22在发光中发出的热而造成的发光效率的降低。However, the light bulb-shaped lamp 2 includes the LED module 120 and the support member 140 according to Modification 1 of Embodiment 1 described above as a light emitting device. Therefore, in the lightbulb-shaped lamp 2 according to Embodiment 3, it is possible to realize a large light distribution angle by the plurality of light emitting elements 22 and suppress light emission due to heat emitted by the plurality of light emitting elements 22 during light emission. Reduced efficiency.

即,实施方式3所涉及的灯泡形灯2与实施方式1所涉及的灯泡形灯1相同,是能够得到优良的配光特性的照明用光源。That is, the lightbulb-shaped lamp 2 according to Embodiment 3 is, like the lightbulb-shaped lamp 1 according to Embodiment 1, a light source for illumination capable of obtaining excellent light distribution characteristics.

并且,在本实施方式中,作为灯泡形灯2所具备的发光装置,采用了实施方式1的变形例1所涉及的LED模块120。不过,灯泡形灯2所具备的发光装置并非受此所限,例如上述的实施方式1或者其变形例2至7所涉及的LED模块(20、121、122、125至129)的任一个,也可以具备在灯泡形灯2内。Furthermore, in the present embodiment, the LED module 120 according to Modification 1 of Embodiment 1 is employed as the light emitting device included in the light bulb-shaped lamp 2 . However, the light emitting device included in the bulb-shaped lamp 2 is not limited thereto, for example, any one of the LED modules (20, 121, 122, 125 to 129) involved in Embodiment 1 or its modified examples 2 to 7, It may also be provided in the bulb-shaped lamp 2 .

并且,球形罩15也可以不必是针对可见光为透明,也可以使球形罩15具有光扩散功能。即,也可以在球形罩15的内面形成对来自LED模块120的光进行扩散的扩散部。In addition, the glove 15 does not need to be transparent to visible light, and the glove 15 may have a light diffusion function. That is, a diffuser that diffuses light from the LED module 120 may be formed on the inner surface of the glove 15 .

并且,作为球形罩15的材料,并非受玻璃材料所限,也可以采用由丙烯或者聚碳酸脂等合成树脂等构成的树脂材料。Furthermore, the material of the glove 15 is not limited to the glass material, and a resin material made of synthetic resin such as acrylic or polycarbonate may be used.

并且,灯泡形灯2与实施方式2所涉及的灯泡形灯1a相同,可以具备具有包含荧光体粒子的密封部件22c的发光元件23,并且也可以具备波长变换体90。Further, the lightbulb-shaped lamp 2 may include the light-emitting element 23 having the sealing member 22c containing phosphor particles, and may also include the wavelength converter 90, similarly to the lightbulb-shaped lamp 1a according to Embodiment 2.

并且,在本实用新型中,不仅可以作为上述的灯泡形灯1、1a或者2来实现,而且可以作为具备灯泡形灯1、1a或者2的照明装置来实现。因此,作为实施方式4以及5,对具备灯泡形灯1、1a或2的照明装置进行说明。Moreover, in this invention, it can realize not only as the above-mentioned lightbulb-shaped lamp 1, 1a, or 2 but also as the lighting apparatus provided with the lightbulb-shaped lamp 1, 1a, or 2. Therefore, as Embodiments 4 and 5, a lighting device including the light bulb-shaped lamp 1, 1a, or 2 will be described.

(实施方式4)(Embodiment 4)

利用图18对本实用新型的实施方式4所涉及的照明装置8进行说明。图18是本实用新型的实施方式4所涉及的照明装置8的概略剖面图。The illuminating device 8 which concerns on Embodiment 4 of this invention is demonstrated using FIG. 18. FIG. FIG. 18 is a schematic cross-sectional view of an illuminating device 8 according to Embodiment 4 of the present invention.

如图18所示,实施方式4所涉及的照明装置8例如是被安装并用于室内的天花板的装置。照明装置8具备上述的实施方式1所涉及的灯泡形灯1和照明器具3。As shown in FIG. 18 , the lighting device 8 according to Embodiment 4 is mounted on, for example, an indoor ceiling. The lighting device 8 includes the light bulb-shaped lamp 1 and the lighting fixture 3 according to Embodiment 1 described above.

照明器具3用于使灯泡形灯1消灯以及点灯,具备被装配在天花板的器具主体4以及覆盖灯泡形灯1的透光性的灯盖5。The lighting fixture 3 is used for extinguishing and lighting the lightbulb-shaped lamp 1 , and includes a fixture main body 4 attached to the ceiling and a translucent lamp cover 5 that covers the lightbulb-shaped lamp 1 .

器具主体4具有灯座4a。灯泡形灯1的灯头30被拧入到灯座4a。通过该灯座4a将电力供给到灯泡形灯1。The device body 4 has a lamp socket 4a. The base 30 of the bulb-shaped lamp 1 is screwed into the socket 4a. Electric power is supplied to the light bulb-shaped lamp 1 through this socket 4a.

并且,也可以取代实施方式1所涉及的灯泡形灯1,而是照明装置8具备实施方式2或者3所涉及的灯泡形灯1a或者2。Moreover, instead of the lightbulb-shaped lamp 1 which concerns on Embodiment 1, the illuminating device 8 may be equipped with the lightbulb-shaped lamp 1a or 2 which concerns on Embodiment 2 or 3. As shown in FIG.

(实施方式5)(Embodiment 5)

接着,利用图19对本实用新型的实施方式5所涉及的照明装置9进行说明。图19是本实用新型的实施方式5所涉及的照明装置9的外观透视图。Next, the illuminating device 9 which concerns on Embodiment 5 of this invention is demonstrated using FIG. 19. FIG. FIG. 19 is an external perspective view of a lighting device 9 according to Embodiment 5 of the present invention.

如图19所示,本实施方式中的照明装置9为枝形吊灯型的照明装置9,具备实施方式3中的灯泡形灯2。As shown in FIG. 19 , the lighting device 9 in the present embodiment is a chandelier-type lighting device 9 and includes the light bulb-shaped lamp 2 in the third embodiment.

并且,作为照明装置9并非受图19所示的构成所限。作为照明装置9,只要是至少具备保持灯泡形灯2并且将电力供给到灯泡形灯2的灯座即可。In addition, the lighting device 9 is not limited to the configuration shown in FIG. 19 . As the illuminating device 9, what is necessary is just to have at least the socket which holds the lightbulb-shaped lamp 2, and supplies electric power to the lightbulb-shaped lamp 2.

并且,也可以取代实施方式3所涉及的灯泡形灯2,而是照明装置9具备实施方式1或2所涉及的灯泡形灯1或1a。Moreover, instead of the lightbulb-shaped lamp 2 which concerns on Embodiment 3, the illuminating device 9 may be equipped with the lightbulb-shaped lamp 1 or 1a which concerns on Embodiment 1 or 2. As shown in FIG.

(实施方式1至5的补充说明)(Supplementary Explanation of Embodiments 1 to 5)

以上,基于实施方式1至5对本实用新型所涉及的灯泡形灯以及照明装置进行了说明,不过,本实用新型并非受这些实施方式所限。As mentioned above, although the light bulb-shaped lamp and lighting device which concern on this invention were demonstrated based on Embodiment 1-5, this invention is not limited to these embodiment.

例如,在上述的实施方式1至3中,发光元件22以及23被视为SMD型的LED模块,但并非受此所限。例如,灯泡形灯1、1a以及2中也可以采用直接将裸芯片安装到基板上的COB(Chip On Board:板上芯片)型的LED模块。For example, in the above-mentioned Embodiments 1 to 3, the light emitting elements 22 and 23 are regarded as SMD type LED modules, but it is not limited thereto. For example, a COB (Chip On Board: Chip On Board) type LED module in which a bare chip is directly mounted on a substrate may be used in the light bulb-shaped lamps 1, 1a, and 2.

即,作为发光元件22以及23也可以采用LED芯片本身。即,第一发光元件以及所述第二发光元件分别可以作为被安装到基板上的LED芯片来实现。That is, LED chips themselves may be used as the light emitting elements 22 and 23 . That is, each of the first light emitting element and the second light emitting element can be realized as an LED chip mounted on a substrate.

在这种情况下,例如通过配置将多个多个LED芯片统一密封或者分别密封的密封部件,从而将来自多个LED芯片的光的波长变换为规定的波长,所述密封部件可以是包含上述的黄色荧光体等波长变换材料的密封部件。In this case, for example, the wavelength of light from a plurality of LED chips is converted into a predetermined wavelength by arranging a sealing member that collectively or individually seals a plurality of LED chips, and the sealing member may include the above-mentioned Sealing parts for wavelength conversion materials such as yellow phosphors.

并且,如实施方式1的变形例4以及5所示,分别被配置有一个以上的发光元件的多个基板,也可以被配置在实施方式1的变形例1至3所涉及的安装部142、152以及172。Furthermore, as shown in Modifications 4 and 5 of Embodiment 1, a plurality of substrates on which one or more light-emitting elements are respectively disposed may be disposed on the mounting portion 142, 152 and 172.

并且,如实施方式1的变形例6至8所示,被配置有多个发光元件并且呈折弯状态的柔性基板,也可以被配置在实施方式1的变形例1至3所涉及的安装部142、152以及172。Furthermore, as shown in Modifications 6 to 8 of Embodiment 1, a flexible substrate in which a plurality of light emitting elements are arranged and bent may be arranged in the mounting portion according to Modifications 1 to 3 of Embodiment 1. 142, 152 and 172.

并且,球形罩的形状并非受实施方式1以及3的记载所限,也能够采用一般的白炽灯所使用的形状。例如,球形罩能够采用G形或者E形(JISC7710)等形状。In addition, the shape of the glove is not limited to the description of Embodiments 1 and 3, and a shape used for a general incandescent lamp can also be adopted. For example, the glove can take a shape such as a G shape or an E shape (JISC7710).

并且,在上述的实施方式1以及2中,LED模块20等发光装置所具备的发光元件22等的构成虽然是,由蓝色LED芯片和黄色荧光体来放出白色光,但是并非受此所限。例如,为了提高演色性,除了黄色荧光体以外,还可以混入红色荧光体以及绿色荧光体。In addition, in Embodiments 1 and 2 described above, although the light-emitting element 22 and the like included in the light-emitting device such as the LED module 20 are configured to emit white light from a blue LED chip and a yellow phosphor, the present invention is not limited thereto. . For example, in order to improve color rendering, a red phosphor and a green phosphor may be mixed in addition to the yellow phosphor.

并且,也可以采用的构成是,不使用黄色荧光体,而是采用含有红色荧光体或绿色荧光体的含荧光体树脂,通过与蓝色LED芯片组合从而放出白光。Furthermore, instead of using a yellow phosphor, a phosphor-containing resin containing a red phosphor or a green phosphor may be employed to emit white light by combining it with a blue LED chip.

并且,例如也可以使从基板21的主面21a一侧放出的光的波长(色彩)与从基板21的背面21b一侧放出的光的波长(色彩)不同。Furthermore, for example, the wavelength (color) of light emitted from the main surface 21 a side of the substrate 21 may be different from the wavelength (color) of light emitted from the rear surface 21 b side of the substrate 21 .

并且,在上述的实施方式1至3中,LED芯片也可以使用发出蓝色以外的色彩的LED芯片。Furthermore, in the first to third embodiments described above, LED chips that emit colors other than blue may be used as the LED chips.

例如,在使用发出紫外线光的LED芯片的情况下,作为荧光体粒子,能够对发出三原色(红色、绿色、蓝色)光的各种颜色的荧光体粒子进行组合利用。For example, when using an LED chip that emits ultraviolet light, phosphor particles of various colors that emit light of three primary colors (red, green, blue) can be used in combination as phosphor particles.

而且,也可以使用荧光体粒子以外的波长变换材料,作为波长变换材料,例如可以采用含有半导体、金属络合物、有机染料、颜料等能够吸收某种波长的光,并发出与吸収的光的波长不同的光的物质的材料。Moreover, wavelength conversion materials other than phosphor particles can also be used. As the wavelength conversion material, for example, materials containing semiconductors, metal complexes, organic dyes, pigments, etc. that can absorb light of a certain wavelength and emit and absorb light can be used. A material that contains light of different wavelengths.

并且,在以上的说明中,作为发光元件举例示出了SMD型LED元件以及LED芯片。不过,也可以采用半导体激光等其他的半导体发光元件、有机EL(Electro Luminescence:电致发光)或无机EL等固体发光元件来用作LED模块20等发光装置所具备的发光元件。In addition, in the above description, the SMD-type LED element and the LED chip were shown as examples of the light-emitting element. However, other semiconductor light-emitting elements such as semiconductor lasers, solid light-emitting elements such as organic EL (Electro Luminescence: electroluminescence) or inorganic EL can also be used as light-emitting elements included in light-emitting devices such as the LED module 20.

另外,在不脱离本实用新型的主旨的情况下,将本领域技术人员所能够想到的各种变形执行于本实施方式以及变形例的构成,或者对实施方式以及变形例中的构成要素进行组合后的构成均包含在本实用新型的范围内。In addition, without departing from the gist of the present invention, various modifications conceivable by those skilled in the art may be implemented in the configurations of the present embodiment and modifications, or components in the embodiments and modifications may be combined. The latter configurations are all included within the scope of the present utility model.

符号说明Symbol Description

1、1a、2   灯泡形灯(照明用光源)1, 1a, 2 bulb-shaped lamp (light source for lighting)

3   照明器具3 Lighting fixtures

4   器具主体4 Appliance body

4a   灯座4a lamp holder

5   灯盖5 lamp cover

8、9   照明装置8, 9 Lighting device

10、15   球形罩10, 15 spherical cover

11   开口部11 opening

20、120、121、122、125、126、127、128、129   LED模块21、25、26、27、28、110、111、   基板20, 120, 121, 122, 125, 126, 127, 128, 129 LED modules 21, 25, 26, 27, 28, 110, 111, substrate

21a、25a、26a、27a   主面21a, 25a, 26a, 27a main face

21b、25b、26b、27b   背面21b, 25b, 26b, 27b back

22、23   发光元件22, 23 Light-emitting elements

22a   容器22a container

22b   LED芯片22b LED chip

22c   密封部件22c Sealing parts

22d   波长变换材料22d wavelength conversion material

25c、26c   延伸部25c, 26c extension

28a   第一基板28a First substrate

28b、28c   第二基板28b, 28c second substrate

30、32   灯头30, 32 lamp holder

40、140、150、170、180   支承部件40, 140, 150, 170, 180 Supporting parts

41、141、151、171、181   支柱41, 141, 151, 171, 181 pillars

42、142、152、172、182、183   安装部42, 142, 152, 172, 182, 183 Installation Department

45、145、155、175   端面45, 145, 155, 175 End faces

50、52   台座50, 52 Pedestal

60、63   树脂外壳60, 63 resin shell

61   第一外壳部61 The first shell part

62   第二外壳部62 Second shell part

70a、70b、72a、72b   引线70a, 70b, 72a, 72b leads

80   驱动电路80 drive circuit

90   波长变换体90 wavelength conversion body

91   变换材料91 Transform material

110a、111a   第一主面110a, 111a the first main surface

110b、111c   第二主面110b, 111c second main surface

182a   上表面182a upper surface

182b   下表面182b lower surface

182c   侧面182c side

Claims (15)

1. an illumination light source, is characterized in that,
This illumination light source possesses:
The enclosed globe shade of light transmission;
Support unit, has to the inside of described enclosed globe shade and extends the pillar arranging;
Substrate, is supported by described support unit, thereby is configured in described enclosed globe shade; And
Be configured in the first light-emitting component and second light-emitting component of described substrate,
Described the first light-emitting component, is configured in the interarea of described substrate in the mode of the direction towards a side contrary to described pillar,
Described the second light-emitting component, is configured in described substrate in the mode of the direction towards different from described the first light-emitting component,
Described support unit, supports described substrate with the state contacting with the back side of described substrate, and the back side of described substrate is the face of a side contrary to described interarea,
With respect to the area at the described back side of described substrate, the described support unit ratio shared with the area that the described back side contacts is more than 5%.
2. illumination light source as claimed in claim 1, is characterized in that,
From the described substrate of described interarea one side in the situation that, have at least three described the first light-emitting components to be configured on described substrate in the mode round described pillar.
3. illumination light source as claimed in claim 2, is characterized in that,
Described substrate has at least three extensions, in the direction that these at least three extensions intersect at the direction of principal axis with described pillar, is extended setting, is configured with the first light-emitting component described at least one in each of described at least three extensions.
4. illumination light source as claimed in claim 2, is characterized in that,
At least three described the first light-emitting components are configured on described substrate, and are positioned on the circumference centered by the axle of described pillar.
5. the illumination light source as described in any one of claim 1 to 4, is characterized in that,
Described at least one, the second light-emitting component is configured in the described back side of described substrate.
6. the illumination light source as described in any one of claim 1 to 4, is characterized in that,
Described support unit has the installation portion that described substrate has been installed, and this installation portion is connected with the end in the inside of described enclosed globe shade one side of described pillar,
The second substrate that described substrate has the first substrate of the upper surface that is configured in described installation portion and is configured in the lower surface of described installation portion, the upper surface of described installation portion refers to the face of a side contrary to described pillar, the lower surface of described installation portion refers to the face of described pillar one side
Described the first light-emitting component is configured in described first substrate,
Described the second light-emitting component is configured in described second substrate.
7. the illumination light source as described in any one of claim 1 to 4, is characterized in that,
Described support unit has for the installation portion of described substrate is installed, and this installation portion is connected with the end of described pillar in the inside of described enclosed globe shade one side,
The second substrate that described substrate has the first substrate of the upper surface that is configured in described installation portion and is configured in the side of described installation portion, the upper surface of described installation portion refers to the face of a side contrary to described pillar, the side of described installation portion refers to along the face of the direction of intersecting with described upper surface
Described the first light-emitting component is configured in described first substrate,
Described the second light-emitting component is configured in described second substrate.
8. the illumination light source as described in any one of claim 1 to 4, is characterized in that,
Described substrate is supported by described support unit with the state of bending,
The described interarea of described substrate has: along the end face of described support unit and the first interarea being configured and by substrate described in bending, form from described the first interarea towards the second different interareas,
Described the first light-emitting component is configured in described the first interarea,
Described the second light-emitting component is configured in described the second interarea.
9. the illumination light source described in any one of claim 1 to 4, is characterized in that,
Described the first light-emitting component and described the second light-emitting component respectively, the surface attaching type LED element that there is container and be installed in the LED chip in described container.
10. the illumination light source as described in any one of claim 1 to 4, is characterized in that,
Described the first light-emitting component and described the second light-emitting component respectively, are installed in the LED chip on described substrate.
11. illumination light sources as described in any one of claim 1 to 4, is characterized in that,
Described illumination light source also possesses wavelength conversion body, and this wavelength conversion body is the parts of having predetermined shape, and this wavelength conversion body is configured in described enclosed globe shade to cover the mode of described the first light-emitting component and described the second light-emitting component,
Described wavelength conversion body, by the coversion material containing in described wavelength conversion body, will be transformed to the wavelength of regulation and emit from the light wavelength of described the first light-emitting component and described the second light-emitting component incident.
12. illumination light sources as described in any one of claim 1 to 4, is characterized in that,
Described enclosed globe shade is the enclosed globe shade of candle.
13. illumination light sources as described in any one of claim 1 to 4, is characterized in that,
With respect to the area at the described back side of described substrate, the described support unit ratio shared with the area that the described back side contacts is more than 10%.
14. illumination light sources as described in any one of claim 1 to 4, is characterized in that,
With respect to the area at the described back side of described substrate, the described support unit ratio shared with the area that the described back side contacts is more than 25%.
15. 1 kinds of lighting devices, is characterized in that,
Described lighting device possesses:
Illumination light source described in any one of claim 1 to 14.
CN201320615148.7U 2013-09-30 2013-09-30 Light source for illumination and an illumination device Expired - Lifetime CN203517403U (en)

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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103982864A (en) * 2014-05-28 2014-08-13 昆山生态屋建筑技术有限公司 Reflector lamp provided with worm gear and worm and adjustable in angle
CN106287552A (en) * 2015-06-26 2017-01-04 松下知识产权经营株式会社 Illumination light source and illuminator

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103982864A (en) * 2014-05-28 2014-08-13 昆山生态屋建筑技术有限公司 Reflector lamp provided with worm gear and worm and adjustable in angle
CN106287552A (en) * 2015-06-26 2017-01-04 松下知识产权经营株式会社 Illumination light source and illuminator
CN106287552B (en) * 2015-06-26 2019-05-17 松下知识产权经营株式会社 Lighting source and lighting device

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