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CN203176803U - Light source for illumination and illumination device - Google Patents

Light source for illumination and illumination device Download PDF

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Publication number
CN203176803U
CN203176803U CN201320072600XU CN201320072600U CN203176803U CN 203176803 U CN203176803 U CN 203176803U CN 201320072600X U CN201320072600X U CN 201320072600XU CN 201320072600 U CN201320072600 U CN 201320072600U CN 203176803 U CN203176803 U CN 203176803U
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China
Prior art keywords
opening
glove
light
light source
led module
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CN201320072600XU
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Chinese (zh)
Inventor
王军
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

A light source for illumination comprises a spherical cover (10) provided with a main body part (11) and an opening part (12), an LED module (20) arranged inside the spherical cover (10) in a matched mode, and a frame body (50) provided with a first opening part (50a) used for surrounding the opening part (12) of the spherical cover (10), wherein the spherical cover (10) is connected with the edge of the first opening part (50a) in an abutting mode through part of the spherical cover (10). Therefore, the spherical cover (10) is supported by the frame body (50).

Description

照明用光源以及照明装置Light source for lighting and lighting device

技术领域technical field

本实用新型涉及照明用光源以及照明装置,尤其涉及使用了发光二极管(LED:Light Emitting Diode)的LED灯泡(灯泡形灯)以及使用了该LED灯泡的照明装置。The utility model relates to a light source for illumination and a lighting device, in particular to an LED bulb (bulb-shaped lamp) using a light emitting diode (LED: Light Emitting Diode) and a lighting device using the LED bulb.

背景技术Background technique

LED等半导体发光元件由于具有小型、高效以及寿命长的特点,期待着能够作为各种产品的光源。其中作为替代以往周知的灯泡形荧光灯以及白炽灯等照明用光源的LED灯泡的研究开发也在不断地进展(专利文献1)。Semiconductor light-emitting elements such as LEDs are expected to be used as light sources for various products due to their small size, high efficiency, and long life. Among them, research and development of LED light bulbs as light sources for lighting such as conventionally known light bulb-shaped fluorescent lamps and incandescent lamps are also progressing (Patent Document 1).

LED灯泡例如具备:成为光源的LED模块、覆盖LED模块的球形罩、支承LED模块的支承部件、向LED模块供给电力的驱动电路、围住驱动电路而被构成的外围框体、以及用于接受电力的灯头。For example, an LED light bulb includes: an LED module as a light source, a spherical cover covering the LED module, a supporting member for supporting the LED module, a drive circuit for supplying power to the LED module, a peripheral frame formed to surround the drive circuit, and a Electric lamp holder.

(现有技术文献)(Prior art literature)

(专利文献)(patent documents)

专利文献1  日本  特开2006-313717号公报Patent Document 1 Japanese Patent Application Publication No. 2006-313717

然而,在以往的LED灯泡中所存在的问题是,在LED灯泡彼此之间LED模块(发光模块)与球形罩的相对位置关系不均一。However, there is a problem in conventional LED bulbs that the relative positional relationship between the LED module (light emitting module) and the globe cover is not uniform among LED bulbs.

实用新型内容Utility model content

本实用新型为了解决上述的问题,目的在于提供一种能够抑制发光模块与球形罩的相对位置关系不均一的照明用光源以及照明装置。In order to solve the above problems, the present invention aims to provide a light source for illumination and an illumination device capable of suppressing non-uniform relative positional relationship between the light emitting module and the spherical cover.

为了达成上述的目的,本实用新型所涉及的照明用光源的一个实施方式为,具备:球形罩,具有主体部以及开口部;发光模块,被配置在所述球形罩内;以及框体,具有开口部,该框体的开口部圈围所述球形罩的所述开口部;其中该照明用光源的所述球形罩通过自身的一部分与所述框体的所述开口部的边缘相抵接,从而该球形罩由所述框体支承。In order to achieve the above object, one embodiment of the light source for illumination according to the present invention includes: a spherical cover having a main body and an opening; a light emitting module arranged in the spherical cover; and a frame body having an opening, the opening of the frame surrounds the opening of the spherical cover; wherein the spherical cover of the light source for illumination abuts against the edge of the opening of the frame through a part of itself, Thus, the glove is supported by the frame.

并且,也可以是,在本实用新型所涉及的照明用光源的一个实施方式中,该照明用光源还具备闭塞部件,该闭塞部件以堵塞所述球形罩的所述开口部的开口的状态而被设置;所述球形罩的所述开口部的开口边缘与所述闭塞部件不接触。Furthermore, in one embodiment of the light source for illumination according to the present invention, the light source for illumination may further include a closing member that closes the opening of the opening of the spherical cover. It is provided that the opening edge of the opening of the spherical cover is not in contact with the blocking member.

并且,也可以是,本实用新型所涉及的照明用光源的一个实施方式中,所述主体部的最大外径比所述球形罩的所述开口部的最大外径大;所述球形罩具有因所述主体部的最大外径与所述球形罩的所述开口部的最大外径差而产生的颚部;由所述框体支承的所述球形罩的所述一部分为所述颚部的底部。In addition, in one embodiment of the light source for illumination according to the present invention, the maximum outer diameter of the main body is larger than the maximum outer diameter of the opening of the spherical cover; the spherical cover has A jaw portion generated by a difference between the maximum outer diameter of the main body portion and the maximum outer diameter of the opening of the glove; the part of the glove supported by the frame is the jaw portion bottom of.

并且,也可以是,本实用新型所涉及的照明用光源的一个实施方式中,至少在所述球形罩的所述开口部的外面与所述框体的内面之间设置有粘合剂,用于粘合所述球形罩与所述框体。In addition, in one embodiment of the light source for illumination according to the present invention, an adhesive may be provided at least between the outer surface of the opening of the spherical cover and the inner surface of the frame, and For bonding the spherical cover and the frame.

并且,也可以是,本实用新型所涉及的照明用光源的一个实施方式中,所述球形罩的所述主体部的外面与所述框体的外面成为同一个面。Furthermore, in one embodiment of the light source for illumination according to the present invention, the outer surface of the main body portion of the glove may be the same surface as the outer surface of the housing.

并且,也可以是,本实用新型所涉及的照明用光源的一个实施方式中,该照明用光源还具备驱动电路,该驱动电路用于将电力供给到所述发光模块;所述框体以圈围所述驱动电路的状态而被构成。In addition, in one embodiment of the light source for illumination according to the present invention, the light source for illumination may further include a drive circuit for supplying power to the light emitting module; is constructed around the state of the drive circuit.

并且,本实用新型所涉及的照明装置的一个实施方式为,具备以上所述的任一个照明用光源。Moreover, one Embodiment of the illuminating device which concerns on this invention is equipped with any one of the light sources for illumination mentioned above.

通过本实用新型,能够抑制发光模块与球形罩的相对位置关系的不均一。According to the present invention, the inhomogeneity of the relative positional relationship between the light emitting module and the spherical cover can be suppressed.

附图说明Description of drawings

图1是本实用新型的实施方式1所涉及的灯泡形灯的外观透视图。FIG. 1 is an external perspective view of a light bulb-shaped lamp according to Embodiment 1 of the present invention.

图2是本实用新型的实施方式1所涉及的灯泡形灯的剖面图。2 is a cross-sectional view of the light bulb-shaped lamp according to Embodiment 1 of the present invention.

图3的(a)是本实用新型的实施方式1所涉及的灯泡形灯中的LED模块的平面图,图3的(b)是图3的(a)的A-A’线上的该LED模块的剖面图,图3的(c)是图3的(b)的B-B’线上的该LED模块的剖面图,图3的(d)是图3的(a)的C-C’线上的该LED模块的剖面图。3( a ) is a plan view of the LED module in the light bulb-shaped lamp according to Embodiment 1 of the present invention, and FIG. 3( b ) is the LED on the line AA' of FIG. 3( a ). The sectional view of the module, Fig. 3 (c) is the sectional view of the LED module on the BB' line of Fig. 3 (b), Fig. 3 (d) is the CC of Fig. 3 (a) 'A cutaway view of the LED module on the line.

图4是以往的灯泡形灯的侧面图。Fig. 4 is a side view of a conventional bulb-shaped lamp.

图5A是图4的点线圈出的区域B的放大剖面图。FIG. 5A is an enlarged cross-sectional view of a region B encircled by a dotted line in FIG. 4 .

图5B是图4的点线圈出的区域B的放大侧面图。FIG. 5B is an enlarged side view of a region B encircled by a dotted line in FIG. 4 .

图6A是图2的点线圈出的区域A的放大剖面图。FIG. 6A is an enlarged cross-sectional view of a region A encircled by a dotted line in FIG. 2 .

图6B是图2的点线圈出的区域A的放大侧面图。FIG. 6B is an enlarged side view of a region A encircled by a dotted line in FIG. 2 .

图7A是本实用新型的实施方式2所涉及的灯泡形灯的侧面图。Fig. 7A is a side view of the light bulb-shaped lamp according to Embodiment 2 of the present invention.

图7B是图7A的点线圈出的区域C的放大剖面图。FIG. 7B is an enlarged cross-sectional view of a region C encircled by a dotted line in FIG. 7A .

图8A是本实用新型的实施方式3所涉及的灯泡形灯的侧面图。8A is a side view of the light bulb-shaped lamp according to Embodiment 3 of the present invention.

图8B是图8A的点线圈出的区域D的放大剖面图。FIG. 8B is an enlarged cross-sectional view of a region D encircled by a dotted line in FIG. 8A .

图9是本实用新型的实施方式4所涉及的照明装置的外观透视图。Fig. 9 is an external perspective view of a lighting device according to Embodiment 4 of the present invention.

符号说明Symbol Description

1,1A,101  灯泡形灯;1, 1A, 101 bulb-shaped lamp;

2  照明装置;2 lighting devices;

10,10A,110  球形罩;10, 10A, 110 spherical cover;

10a,10Ba  颚部;10a, 10Ba Jaws;

11,11B  主体部;11, 11B main body;

12,12B,112  开口部;12, 12B, 112 openings;

20  LED模块;20 LED modules;

21  基板;21 substrate;

22  LED;22 LEDs;

23  密封部件;23 sealing parts;

24  金属配线;24 metal wiring;

25  导线;25 wires;

26a,26b  端子;26a, 26b terminals;

27a,27b  贯通孔;27a, 27b through holes;

30,30B  支座;30, 30B support;

31,31B  支柱;31, 31B pillar;

32,32B  台座;32, 32B pedestal;

40  驱动电路;40 drive circuit;

41  电路基板;41 circuit substrate;

42  电路元件;42 circuit components;

43a,43b,43c,43d  引线;43a, 43b, 43c, 43d leads;

50  框体;50 frames;

50a  第一开口部;50a first opening;

50a1  斜面部;50a1 bevel;

50b  第二开口部;50b second opening;

51  外围部;51 peripheral part;

51a  突出部;51a protrusion;

51b  卡止部;51b locking part;

52  连接部;52 connection part;

55  散热器;55 Radiator;

60  灯头;60 lamp caps;

61  壳部;61 Shell;

62  绝缘部;62 insulation part;

63  接触片部;63 contact piece part;

70  电路盖;70 circuit cover;

70a  凸缘部;70a flange portion;

80  螺丝;80 screws;

90  粘合剂;90 adhesive;

130  支承部件。130 Supporting parts.

具体实施方式Detailed ways

以下,参照附图对本实用新型的实施方式所涉及的照明用光源以及照明装置进行说明。并且,以下所说明的实施方式均为本实用新型的一个优选的具体例子。因此,以下的实施方式中所示的数值、形状、材料、构成要素、构成要素的设置位置以及连接形态等均是本实用新型的一个例子,本实用新型并非受这些所限。并且,对于以下的实施方式中的构成要素之中的、示出本实用新型的最上位概念的独立权利要求所没有记载的构成要素,能够作为任意的构成要素来说明。并且,各个图均为模式图,并非是严谨的图示。并且,在各个图中对于相同的构成部件赋予相同的符号。在以下的实施方式中,作为照明用光源的一个例子,对灯泡形LED灯(LED灯泡)进行说明。Hereinafter, a light source for illumination and a lighting device according to an embodiment of the present invention will be described with reference to the drawings. In addition, the embodiments described below are all preferred specific examples of the present invention. Therefore, the numerical values, shapes, materials, components, installation positions and connection forms of the components shown in the following embodiments are all examples of the present invention, and the present invention is not limited thereto. Moreover, among the components in the following embodiments, components not described in the independent claims showing the highest concept of the present invention can be described as arbitrary components. In addition, each figure is a schematic figure, and is not a strict illustration. In addition, the same symbols are assigned to the same components in the respective drawings. In the following embodiments, a light bulb-shaped LED lamp (LED light bulb) will be described as an example of a light source for illumination.

(实施方式1)(Embodiment 1)

首先,利用图1对本实用新型的实施方式1所涉及的灯泡形灯1的全体构成进行说明。图1是本实用新型的实施方式1所涉及的灯泡形灯的外观透视图。First, the overall structure of the lightbulb-shaped lamp 1 which concerns on Embodiment 1 of this invention is demonstrated using FIG. 1. FIG. FIG. 1 is an external perspective view of a light bulb-shaped lamp according to Embodiment 1 of the present invention.

如图1所示,灯泡形灯1是成为白炽灯的替代品的灯泡形灯,该灯泡形灯1具备:球形罩10、作为光源的LED模块20、支座30、驱动电路40、框体50、以及灯头60。本实施方式中的灯泡形灯1由球形罩10、框体50、以及灯头60构成外围器。As shown in FIG. 1 , a lightbulb-shaped lamp 1 is a lightbulb-shaped lamp used as a substitute for an incandescent lamp. 50, and lamp holder 60. The lightbulb-shaped lamp 1 in this embodiment comprises a glove 10 , a frame body 50 , and a base 60 to form an enclosure.

接着,参照图1并利用图2,对灯泡形灯1的各个构成要素进行说明。图2是本实用新型的实施方式1所涉及的灯泡形灯的剖面图。并且,在图2中沿着纸面上下方向描画的点划线表示灯泡形灯的灯轴J(中心轴),在本实施方式中,灯轴J与球形罩轴一致。并且,灯轴J是在将灯泡形灯1安装到照明装置(未图示)的灯座时成为旋转中心的轴,与灯头60的旋转轴一致。Next, each component of the light bulb-shaped lamp 1 will be described using FIG. 2 with reference to FIG. 1 . 2 is a cross-sectional view of the light bulb-shaped lamp according to Embodiment 1 of the present invention. In addition, the dashed-dotted line drawn along the paper plane vertical direction in FIG. 2 represents the lamp axis J (central axis) of the bulb-shaped lamp, and in this embodiment, the lamp axis J coincides with the globe axis. Furthermore, the lamp axis J is an axis serving as the center of rotation when the light bulb-shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base 60 .

[球形罩][dome cover]

如图1以及图2所示,球形罩10是覆盖LED模块20的透光罩,能够将从LED模块20放出的光取出到灯的外部。因此,入射到球形罩10的内面的LED模块20的光,透过球形罩10被取出到球形罩10的外部。As shown in FIGS. 1 and 2 , the glove 10 is a translucent cover that covers the LED module 20 and can take out the light emitted from the LED module 20 to the outside of the lamp. Therefore, the light of the LED module 20 incident on the inner surface of the glove 10 is taken out to the outside of the glove 10 through the glove 10 .

球形罩10是具有开口的中空部件,该球形罩10呈与开口相反一侧的顶部为封闭的形状。球形罩10例如是以灯轴J为轴的旋转体。本实施方式中的球形罩10在与开口部12的开口面垂直的方向上(灯轴J的方向)呈细长状。具体而言,球形罩10呈蜡烛形(JIS(日本工业标准)的C7710所规定的C形),球形罩10的外面成为纵长的略圆锥面。The glove 10 is a hollow member having an opening, and the glove 10 has a closed top portion opposite to the opening. The glove 10 is, for example, a rotating body with the lamp axis J as its axis. The glove 10 in this embodiment has an elongated shape in a direction perpendicular to the opening surface of the opening 12 (the direction of the lamp axis J). Specifically, the glove 10 has a candle shape (C-shape defined by JIS (Japanese Industrial Standard) C7710), and the outer surface of the glove 10 is a vertically elongated slightly conical surface.

球形罩10的构成包括:露出在外面,并且能够从外部目视到的主体部(球形罩主体部)11;以及由框体50的第一开口部50a圈围,并且不能够从外部目视到的开口部(球形罩开口部)12。LED模块20被设置在主体部11内的规定的位置。The structure of the glove 10 includes: a main body (globe main body) 11 exposed outside and visible from the outside; to the opening (globe opening) 12. The LED module 20 is installed at a predetermined position in the main body 11 .

主体部11的最大外径比开口部12的最大外径要大。也就是说,开口部12的外径比主体部11的外径窄。在球形罩10设计有因该主体部11与开口部12的最大外径差而产生的颚部10a。该颚部10a被设置在主体部11与开口部12的连接部分,在本实施方式中被设计成台阶状。The maximum outer diameter of the main body portion 11 is larger than the maximum outer diameter of the opening portion 12 . That is, the outer diameter of the opening portion 12 is narrower than that of the main body portion 11 . The glove 10 is provided with a jaw portion 10 a due to the maximum outer diameter difference between the main body portion 11 and the opening portion 12 . This jaw part 10a is provided in the connection part of the main-body part 11 and the opening part 12, and is designed in the shape of a step in this embodiment.

颚部10a的底部(灯头一侧的面)与框体50的第一开口部50a的边缘相抵接。球形罩10通过将其颚部10a载置于框体50的第一开口部50a的边缘,从而由框体50支承。并且,开口部12的开口边缘不与支座30、框体50以及电路盖70之中的任一个部件相接触,开口部12为悬浮状态。如图2所示,在开口部12的外面与框体50的内面之间被涂敷有硅树脂等粘合剂90。这样,球形罩10与框体50被固定。The bottom (surface on the base side) of the jaw 10 a abuts against the edge of the first opening 50 a of the frame 50 . The glove 10 is supported by the frame body 50 by placing its jaw portion 10 a on the edge of the first opening portion 50 a of the frame body 50 . In addition, the opening edge of the opening 12 does not contact any one of the support 30 , the frame body 50 and the circuit cover 70 , and the opening 12 is in a floating state. As shown in FIG. 2 , an adhesive 90 such as silicone resin is applied between the outer surface of the opening 12 and the inner surface of the frame body 50 . In this way, the glove 10 and the frame body 50 are fixed.

球形罩10是针对可见光为透明的透明硅石玻璃制的玻璃灯泡(透明灯泡)。因此,能够从球形罩10的外侧目视到被收纳于球形罩10内的LED模块20。The globe 10 is a glass bulb (transparent bulb) made of transparent silica glass that is transparent to visible light. Therefore, the LED module 20 housed in the glove 10 can be visually observed from the outside of the glove 10 .

并且,作为球形罩10的材料不仅限于玻璃材料,也可以采用由丙烯(PMMA)或聚碳酸脂(PC)等树脂材料等。并且,球形罩10也可以不必是透明的,只要球形罩10具有光扩散功能即可。例如,也可以通过将含有硅石或碳酸钙等光扩散材料的树脂或者白色颜料等涂敷到球形罩10的整个内面或外面,来形成乳白色的光扩散膜。这样,通过使球形罩10具有光扩散功能,从而能够使从LED模块20入射到球形罩10的光扩散,因此能够扩大灯的配光角。In addition, the material of the glove 10 is not limited to glass, and a resin material such as acrylic (PMMA) or polycarbonate (PC) may be used. Also, the glove 10 does not need to be transparent, as long as the glove 10 has a light diffusing function. For example, a milky-white light-diffusing film can also be formed by applying a resin containing a light-diffusing material such as silica or calcium carbonate, or a white pigment to the entire inner or outer surface of the glove 10 . In this way, by giving the glove 10 a light diffusing function, the light incident on the glove 10 from the LED module 20 can be diffused, and thus the light distribution angle of the lamp can be widened.

[LED模块][LED module]

LED模块20是具有发光元件的发光模块,能够放出白色等规定的颜色(波长)的光。被配置在球形罩10内的LED模块20,由支座30被保持在球形罩10内的空间中,由通过引线43a以及43b而从驱动电路40供给来的电力发光。The LED module 20 is a light emitting module having a light emitting element, and can emit light of a predetermined color (wavelength) such as white. The LED module 20 arranged in the glove 10 is held in the space in the glove 10 by the holder 30 , and emits light by power supplied from the drive circuit 40 through the lead wires 43 a and 43 b.

这样,在本实施方式的灯泡形灯1中,采用了将LED模块20配置到球形罩10内的空间中心的构成(CMT:Center Mount Technology(中心安装技术))。Thus, in the lightbulb-shaped lamp 1 of this embodiment, the structure which arrange|positions the LED module 20 in the space center in the globe 10 is adopted (CMT: Center Mount Technology (Center Mount Technology)).

并且,本实施方式中的LED模块20为细长形,被配置成其长度方向与支柱31的轴(灯轴J)正交。具体而言,细长形的基板21以其长度方向与支柱31的轴方向正交的状态由支柱31支承。In addition, the LED module 20 in this embodiment has an elongated shape, and is arranged such that its longitudinal direction is perpendicular to the axis of the support 31 (lamp axis J). Specifically, the elongated substrate 21 is supported by the pillar 31 in a state where its longitudinal direction is perpendicular to the axial direction of the pillar 31 .

如图2所示,LED模块20虽然被配置在球形罩10的中心GCNT与球形罩10的顶点GTOP之间,不过并非受此所限。LED模块20的位置可以按照所需的配光特性来调整,例如,LED模块20可以配置在球形罩10的中心GCNT,也可以配置在比球形罩10的中心GCNT更接近灯头一侧。并且,LED模块20的位置(高度)能够通过变更支柱31的高度来调整。As shown in FIG. 2 , although the LED module 20 is disposed between the center G CNT of the glove 10 and the apex G TOP of the glove 10 , it is not limited thereto. The position of the LED module 20 can be adjusted according to the required light distribution characteristics. For example, the LED module 20 can be arranged at the center G CNT of the spherical cover 10 , or it can be arranged at the side closer to the lamp head than the center G CNT of the spherical cover 10 . In addition, the position (height) of the LED module 20 can be adjusted by changing the height of the pillar 31 .

在此,利用图3对LED模块20的详细构成进行说明。图3的(a)是本实用新型的实施方式1所涉及的灯泡形灯中的LED模块的平面图,图3的(b)是图3的(a)的A-A’线处的该LED模块的剖面图。图3的(c)是图3的(a)的B-B’线处的该LED模块的剖面图,图3的(d)是图3的(a)的C-C’线处的该LED模块的剖面图。Here, the detailed structure of the LED module 20 is demonstrated using FIG. 3. FIG. 3( a ) is a plan view of the LED module in the light bulb-shaped lamp according to Embodiment 1 of the present invention, and FIG. 3( b ) is the LED at the line AA' of FIG. 3( a ). Sectional view of the module. (c) of Fig. 3 is a sectional view of the LED module at the BB' line of Fig. 3 (a), and Fig. 3 (d) is the sectional view of the LED module at the line CC' of Fig. Cutaway view of the LED module.

如图3的(a)至(d)所示,LED模块20具有:基板21、LED22、密封部件23、金属配线24、导线25、端子26a以及26b。本实施方式中的LED模块20为裸芯片被直接安装在基板21上的COB(Chip On Board:板上芯片)结构。以下,对LED模块20的各个构成要素进行详细说明。As shown in (a) to (d) of FIG. 3, the LED module 20 has the board|substrate 21, LED22, the sealing member 23, the metal wiring 24, the lead wire 25, and terminal 26a and 26b. The LED module 20 in this embodiment has a COB (Chip On Board: chip on board) structure in which a bare chip is directly mounted on a substrate 21 . Hereinafter, each component of the LED module 20 will be described in detail.

首先,对基板21进行说明。基板21是用于安装LED22的安装基板,具有:作为安装LED22的面的第一主面(表面),以及与该第一主面相对的第二主面(背面)。如图3的(a)所示,例如在俯视(从球形罩10的顶点GTOP来看时)基板21时,该基板21为长方形的矩形板状的基板。并且,作为基板21的形状,除了长方形以外也可以是正方形或圆形。并且,也可以是六角形、八角形等四角形以外的多角形。First, the substrate 21 will be described. The board|substrate 21 is a mounting board|substrate for mounting LED22, and has the 1st main surface (front surface) which is a surface on which LED22 is mounted, and the 2nd main surface (back surface) which opposes this 1st main surface. As shown in (a) of FIG. 3 , for example, the substrate 21 is a rectangular plate-shaped substrate when viewed from above (viewed from the vertex G TOP of the glove 10 ). In addition, the shape of the substrate 21 may be a square or a circle other than the rectangle. In addition, polygons other than tetragons such as hexagons and octagons may be used.

并且,基板21是针对可见光为具有透光性的透光性基板。作为基板21最好是采用针对可见光的全透射率高的材料。通过采用具有这种透光性的基板,从而LED22的光以及由密封部件23被变换了波长的光能够透过基板21的内部,并从没有安装LED22的面(第二主面)射出。据此,即使在LED22仅被安装在基板21的第一主面的情况下,也能够从第二主面放出白色光。因此,能够以LED模块20为中心,容易地向全方位放出光。Furthermore, the substrate 21 is a translucent substrate having translucency with respect to visible light. As the substrate 21, it is preferable to use a material with a high total transmittance for visible light. By using such a translucent substrate, light from LED 22 and light whose wavelength has been converted by sealing member 23 can pass through substrate 21 and be emitted from the surface (second main surface) on which LED 22 is not mounted. Thereby, even when LED22 is mounted only in the 1st main surface of the board|substrate 21, white light can be emitted from the 2nd main surface. Therefore, it is possible to easily emit light in all directions centering on the LED module 20 .

作为透光性基板,例如能够采用针对可见光的全透射率为80%以上的基板,或者采用针对可见光为透明的(即透射率非常高,能够从相反一侧透视的状态)透明基板。作为这种透光性的基板能够采用:由多晶体的氧化铝或氮化铝构成的透光性陶瓷基板、由玻璃构成的透明玻璃基板、由水晶构成的水晶基板、由蓝宝石构成的蓝宝石基板、由树脂材料构成的树脂基板或柔性基板等。具体而言,能够采用全透射率为96%的呈矩形的多晶体氧化铝基板。As the translucent substrate, for example, a substrate having a total transmittance of 80% or more for visible light, or a transparent substrate for visible light (that is, a state in which the transmittance is very high and can be seen from the opposite side) can be used. As such a translucent substrate, a translucent ceramic substrate composed of polycrystalline alumina or aluminum nitride, a transparent glass substrate composed of glass, a crystal substrate composed of crystal, and a sapphire substrate composed of sapphire can be used. , A resin substrate or a flexible substrate made of a resin material. Specifically, a rectangular polycrystalline alumina substrate having a total transmittance of 96% can be used.

基板21的第二主面以与支座30(支柱31)的固定面为面接触的状态,与支座30相连接。并且,在基板21被设置有两个贯通孔27a以及27b,用于与两条引线43a以及43b进行电连接。引线43a(43b)的前端部贯穿贯通孔27a(27b),被焊接于被形成在基板21上的端子26a(26b)。The second main surface of the substrate 21 is connected to the holder 30 in surface contact with the fixed surface of the holder 30 (pillar 31 ). In addition, two through-holes 27a and 27b are provided in the substrate 21 for electrically connecting to the two lead wires 43a and 43b. The tip portion of the lead wire 43a ( 43b ) penetrates through the through hole 27a ( 27b ) and is soldered to the terminal 26a ( 26b ) formed on the substrate 21 .

接着,对LED22进行说明。LED22是发光元件的一个例子,是由规定的电力来发光的半导体发光元件。各个LED22均为发出单色可见光的裸芯片。在本实施方式中采用在通电时发出蓝色光的蓝色发光LED芯片。作为蓝色LED芯片例如能够采用由InGaN系的材料构成的、中心波长为440nm至470nm的氮化镓系的半导体发光元件。Next, LED22 is demonstrated. LED22 is an example of a light emitting element, and is a semiconductor light emitting element that emits light with predetermined electric power. Each LED 22 is a bare chip emitting monochromatic visible light. In this embodiment, a blue light-emitting LED chip that emits blue light when energized is used. As the blue LED chip, for example, a gallium nitride-based semiconductor light-emitting element with a central wavelength of 440 nm to 470 nm, which is made of an InGaN-based material, can be used.

并且,LED22仅被安装在基板21的第一主面,以沿着基板21的长边方向被排列成多列的状态而被安装有多个。在本实施方式中排列为两列,以成为两条元件列。Moreover, LED22 is mounted only in the 1st main surface of the board|substrate 21, and is mounted in the state arranged in multiple rows along the longitudinal direction of the board|substrate 21, and is mounted. In this embodiment, they are arranged in two rows to form two element rows.

并且,LED22的安装数量可以按照灯泡形灯的用途而做适当的改变。例如,在替代微型灯泡等的低功率型的LED灯的情况下,也可以采用一个LED22。并且,也可以对一个元件列内的LED22的安装数量进行增加或减少。并且,LED22的元件列也可以不必是两列,而可以是一列。In addition, the number of LEDs 22 to be mounted can be appropriately changed according to the application of the bulb-shaped lamp. For example, one LED 22 may be used instead of a low-power LED lamp such as a micro light bulb. Moreover, you may increase or decrease the number of mounting of LED22 in one element row. In addition, the element rows of LED22 may not necessarily be two rows, but may be one row.

接着,对密封部件23进行说明。密封部件23例如由树脂构成,并覆盖LED22。密封部件23以对多个LED22的列的每一列进行整体密封的方式而被形成。在本实施方式中,LED22的元件列由于被设置成两列,因此密封部件23被形成为两条。两条密封部件23的每一条,沿着多个LED22的排列方向(列方向),在基板21的第一主面上被设置成直线状。密封部件23主要由透光性材料构成,在需要将LED22的光的波长变换为规定的波长的情况下,可以将波长变换材料混入到透光性材料。Next, the sealing member 23 will be described. The sealing member 23 is made of resin, for example, and covers LED22. The sealing member 23 is formed so as to seal the whole every row of some LED22. In this embodiment, since the element rows of LED22 are provided in two rows, the sealing member 23 is formed in two rows. Each of the two sealing members 23 is provided linearly on the first main surface of the substrate 21 along the arrangement direction (column direction) of the plurality of LEDs 22 . The sealing member 23 is mainly composed of a translucent material, and when it is necessary to convert the wavelength of the light of the LED 22 to a predetermined wavelength, a wavelength conversion material may be mixed into the translucent material.

本实施方式中的密封部件23包含有作为波长变换材料的荧光体,对LED22所发出的光的波长(颜色)进行变换的波长变换部件。作为这样的密封部件23,例如能够由含有荧光体粒子的绝缘性的树脂材料(含荧光体树脂)构成。荧光体粒子由LED22所发出的光激发,从而发出所希望的颜色(波长)的光。The sealing member 23 in this embodiment contains the phosphor as a wavelength conversion material, and is a wavelength conversion member which converts the wavelength (color) of the light which LED22 emits. As such a sealing member 23 , for example, it can be formed of an insulating resin material (phosphor-containing resin) containing phosphor particles. Phosphor particles are excited by light emitted from LED 22 to emit light of a desired color (wavelength).

作为构成密封部件23的透光性树脂材料,例如能够采用硅树脂。并且,也可以使光扩散材料分散到密封部件23。并且,密封部件23也可以不必由树脂材料形成,也可以由氟系树脂等有机材料、或者低熔点玻璃、溶胶凝胶法制成的玻璃等无机材料来形成。As the translucent resin material constituting the sealing member 23, for example, silicone resin can be used. In addition, the light diffusing material may be dispersed in the sealing member 23 . Furthermore, the sealing member 23 does not have to be formed of a resin material, and may be formed of an organic material such as a fluorine-based resin, or an inorganic material such as low-melting glass or sol-gel glass.

作为密封部件23中含有的荧光体粒子,例如在LED22为发出蓝色光的蓝色发光LED的情况下,为了得到白色光,例如能够采用YAG系的黄色荧光体粒子。据此,LED22所发出的蓝色光的一部分,由密封部件23中所包含的黄色荧光体粒子被波长变换为黄色光。于是,没有被黄色荧光体粒子吸收的蓝色光与由黄色荧光体粒子被进行了波长变换的黄色光混合在一起,从而成为白色光从密封部件23射出。并且,作为光扩散材料能够采用硅石等粒子。As the phosphor particles contained in the sealing member 23, for example, when the LED 22 is a blue light-emitting LED that emits blue light, in order to obtain white light, for example, YAG-based yellow phosphor particles can be used. Accordingly, part of the blue light emitted by the LED 22 is wavelength-converted into yellow light by the yellow phosphor particles contained in the sealing member 23 . Then, the blue light not absorbed by the yellow phosphor particles is mixed with the yellow light whose wavelength has been converted by the yellow phosphor particles, and is emitted from the sealing member 23 as white light. In addition, particles such as silica can be used as the light diffusing material.

本实施方式中的密封部件23为将规定的荧光体粒子分散到硅树脂的含荧光体树脂,能够由分配器被涂敷在基板21的第一主面,并通过硬化而被形成。在这种情况下,与密封部件23的长度方向垂直的截面的形状为略半圆形。The sealing member 23 in this embodiment is a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin, and can be formed by applying a dispenser to the first main surface of the substrate 21 and curing. In this case, the shape of the section perpendicular to the longitudinal direction of the sealing member 23 is substantially semicircular.

并且,为了对透过基板21并朝向第二主面(背面)的光(泄漏的光)进行波长变换,也可以在LED22与基板21之间或者基板21的第二主面上形成第二波长变换部件,作为第二波长变换部件可以采用由荧光体粒子和玻璃等无机接合材料(粘合剂)构成的烧结体膜等荧光体膜(荧光体层),或者采用与在基板21的第一主面形成的密封部件23相同的部件。这样,通过在基板21的第二主面进一步形成第二波长变换部件,从而也能够对透过基板21并从第二主面射出的光进行波长变换。据此,能够从基板21的两面放出白色光。And, in order to carry out wavelength conversion to the light (leakage light) that passes through the substrate 21 and toward the second main surface (back surface), a second wavelength light can also be formed between the LED 22 and the substrate 21 or on the second main surface of the substrate 21. As the second wavelength conversion member, a phosphor film (phosphor layer) such as a sintered body film made of phosphor particles and an inorganic bonding material (binder) such as glass can be used, or a first The sealing member 23 formed on the main surface is the same member. In this way, by further forming the second wavelength conversion member on the second main surface of the substrate 21 , it is also possible to perform wavelength conversion on light transmitted through the substrate 21 and emitted from the second main surface. Accordingly, white light can be emitted from both surfaces of the substrate 21 .

接着,对金属配线24进行说明。金属配线24是使LED22发光的电流流过的导电性配线,以规定的形状,被图案形成于基板21的表面上。如图3的(a)所示,金属配线24被形成在基板21的第一主面。通过金属配线24,从引线43a以及43b供给到LED模块20的电力被供给到各个LED22。Next, the metal wiring 24 will be described. The metal wiring 24 is a conductive wiring through which a current for emitting light from the LED 22 flows, and is pattern-formed in a predetermined shape on the surface of the substrate 21 . As shown in FIG. 3( a ), metal wiring 24 is formed on the first main surface of substrate 21 . The electric power supplied to the LED module 20 from the lead wires 43 a and 43 b is supplied to each LED 22 through the metal wiring 24 .

金属配线24被形成为,能够使每个元件列的多个LED22彼此串联连接。例如,金属配线24以散在于相邻的LED22之间的状态而被形成。并且,金属配线24被形成为,能够使各个元件列彼此为并联连接。各个LED22通过导线25而与金属配线24电连接。另外,也可以不使金属配线24散在于LED22之间。在这种情况下,彼此相邻的LED22为,在芯片与芯片(chip-to-chip)之间以引线接合。The metal wiring 24 is formed so that several LED22 may be connected in series for each element column. For example, the metal wiring 24 is formed in the state scattered between adjacent LED22. And the metal wiring 24 is formed so that each element row may be connected in parallel with each other. Each LED22 is electrically connected to the metal wiring 24 by the wire 25. As shown in FIG. In addition, it is not necessary to scatter the metal wiring 24 between LED22. In this case, LED22 adjacent to each other is wire-bonded between a chip and a chip (chip-to-chip).

金属配线24例如是通过对由金属材料构成的金属膜进行图案化并印刷来形成的。作为金属配线24的金属材料例如能够使用银(Ag)、钨(W)、铜(Cu)或金(Au)等。Metal wiring 24 is formed, for example, by patterning and printing a metal film made of a metal material. As the metal material of the metal wiring 24, for example, silver (Ag), tungsten (W), copper (Cu), gold (Au), or the like can be used.

并且,对于从密封部件23露出的金属配线24,除了端子26a以及26b以外,最好是由玻璃材料构成的玻璃膜(玻璃涂层膜)或由树脂材料构成的树脂膜(树脂涂层膜)覆盖。这样,能够提高LED模块20的绝缘性,并且能够提高基板21的表面的反射率。导线25例如是金导线等电线。如图3的(b)所示,导线25与LED22和金属配线24连接。And, for the metal wiring 24 exposed from the sealing member 23, except for the terminals 26a and 26b, it is preferable to use a glass film (glass coating film) made of a glass material or a resin film (resin coating film) made of a resin material. )cover. In this way, the insulation of the LED module 20 can be improved, and the reflectance of the surface of the substrate 21 can be improved. The wire 25 is, for example, an electric wire such as a gold wire. As shown in FIG.3(b), the lead wire 25 is connected to LED22 and the metal wiring 24. As shown in FIG.

并且,在本实施方式中,导线25不从密封部件23露出,导线25全体被埋入到密封部件23中。这样,能够防止因露出的导线25而造成的光被吸收或被反射。In addition, in the present embodiment, the lead wire 25 is not exposed from the sealing member 23 , and the entirety of the lead wire 25 is buried in the sealing member 23 . In this way, it is possible to prevent light from being absorbed or reflected due to the exposed wire 25 .

接着,对端子26a以及26b进行说明。端子26a以及26b是用于从LED模块20的外部,接受用于使LED22发光的直流电的外部连接端子。在本实施方式中,端子26a以及26b与引线43a以及43b焊接。Next, the terminals 26a and 26b will be described. Terminals 26 a and 26 b are external connection terminals for receiving direct current for causing LED 22 to emit light from the outside of LED module 20 . In this embodiment, the terminals 26a and 26b are soldered to the lead wires 43a and 43b.

端子26a以及26b以能够围住贯通孔27a以及27b的规定的状态被形成在基板21的第一主面。端子26a以及26b与金属配线24相连接而被形成,与金属配线24电连接。并且,端子26a以及26b使用与金属配线24相同的金属材料,该端子26a以及26b的图案与金属配线24的图案同时被形成。Terminals 26 a and 26 b are formed on the first main surface of substrate 21 in a predetermined state capable of surrounding through holes 27 a and 27 b. The terminals 26 a and 26 b are formed to be connected to the metal wiring 24 , and are electrically connected to the metal wiring 24 . Furthermore, the same metal material as that of the metal wiring 24 is used for the terminals 26 a and 26 b , and the patterns of the terminals 26 a and 26 b are formed simultaneously with the pattern of the metal wiring 24 .

并且,端子26a以及26b是LED模块20的供电部,将从引线43a以及43b接受的直流电,经由金属配线24和导线25,供给到各个LED22。And the terminals 26a and 26b are the power supply part of the LED module 20, and supply the direct current received from the lead wires 43a and 43b to each LED22 via the metal wiring 24 and the lead wire 25.

[支座][support]

支座30是支承LED模块20的支承部件。并且,支座30也作为用于对在LED模块20(LED22)发生的热进行散热的散热部件(散热器)来发挥作用。支座30由支柱31和台座32构成。The stand 30 is a supporting member that supports the LED module 20 . Moreover, the holder 30 also functions as a heat radiation member (radiator) for dissipating heat generated in the LED module 20 (LED22). The stand 30 is composed of a pillar 31 and a pedestal 32 .

如图2所示,支柱31是从球形罩10的开口部12的近旁向球形罩10的内部延伸而被设置的细长形部件。在本实施方式中,支柱31是以自身的轴沿着灯轴J的方式而被延伸设置的。也就是说,支柱31的轴与灯轴J同轴。As shown in FIG. 2 , the strut 31 is an elongated member provided to extend from the vicinity of the opening 12 of the glove 10 toward the inside of the glove 10 . In the present embodiment, the pillar 31 is extended so that its own axis is along the lamp axis J. As shown in FIG. That is, the axis of the pillar 31 is coaxial with the lamp axis J. As shown in FIG.

支柱31作为保持LED模块20的保持部件来发挥作用,在支柱31的一端连接有LED模块20,支柱31的另一端与台座32连接。具体而言,在支柱31的顶部形成有用于固定LED模块20的基板21的固定面。The pillar 31 functions as a holding member for holding the LED module 20 , the LED module 20 is connected to one end of the pillar 31 , and the other end of the pillar 31 is connected to the pedestal 32 . Specifically, a fixing surface for fixing the substrate 21 of the LED module 20 is formed on the top of the pillar 31 .

并且,支柱31也作为用于使在LED模块20(LED22)发生的热发散的散热部件(散热器)来发挥作用。因此,支柱31最好是由以铝(Al)、铜(Cu)或铁(Fe)等为主要成份的金属材料或者热传导率高的树脂材料来构成。因此,在LED模块20发生的热能够经由支柱31,效率良好地被传导到台座32。在本实施方式中,支柱31是采用铝而被形成的。Moreover, the support|pillar 31 also functions as a heat radiation member (heat sink) for dissipating the heat which generate|occur|produced in the LED module 20 (LED22). Therefore, the pillar 31 is preferably composed of a metal material mainly composed of aluminum (Al), copper (Cu), or iron (Fe), or a resin material with high thermal conductivity. Therefore, the heat generated in the LED module 20 can be efficiently conducted to the pedestal 32 via the support 31 . In this embodiment, the pillar 31 is formed using aluminum.

像具有以上这种构成的支柱31,能够通过改变长度方向上的长度(高度),来改变LED模块20相对于球形罩10的位置。即,通过改变支柱31的高度,能够变更灯泡形灯1的配光特性。The position of the LED module 20 with respect to the glove 10 can be changed by changing the length (height) of the length direction like the support|pillar 31 which has the above-mentioned structure. That is, by changing the height of the pillar 31, the light distribution characteristic of the lightbulb-shaped lamp 1 can be changed.

台座32是用于支承支柱31的支承部件。支柱31被固定于台座32的表面。并且,台座32与电路盖70一起构成闭塞部件,以堵塞球形罩10的开口部12以及框体50的第一开口部50a的开口。The pedestal 32 is a supporting member for supporting the pillar 31 . The pillar 31 is fixed to the surface of the pedestal 32 . Furthermore, the pedestal 32 constitutes a closing member together with the circuit cover 70 to close the opening 12 of the glove 10 and the opening of the first opening 50 a of the housing 50 .

在台座32的背面固定有电路盖70,并且由于电路盖70被固定在框体50,因此台座32(支座30)也被固定在框体50。A circuit cover 70 is fixed to the back surface of the pedestal 32 , and since the circuit cover 70 is fixed to the frame body 50 , the pedestal 32 (stand 30 ) is also fixed to the frame body 50 .

台座32与支柱31同样,作为用于对在LED模块20(LED22)发生的热进行散热的散热部件(散热器)来发挥作用。因此,台座32最好是由以铝(Al)、铜(Cu)或铁(Fe)等为主要成份的金属材料或热传导率高的树脂材料构成。这样,能够将来自支柱31的热高效率地传导到框体50。在本实施方式中,台座32使用铝来形成。并且,支柱31与台座32可以被分开构成,也可以被形成为一体。The pedestal 32 functions as a heat radiation member (radiator) for dissipating heat generated in the LED module 20 (LED 22 ), similarly to the pillar 31 . Therefore, the pedestal 32 is preferably made of a metal material mainly composed of aluminum (Al), copper (Cu), or iron (Fe), or a resin material with high thermal conductivity. In this way, the heat from the pillar 31 can be efficiently conducted to the frame body 50 . In this embodiment, the pedestal 32 is formed using aluminum. In addition, the pillar 31 and the pedestal 32 may be formed separately or integrally.

[驱动电路][Drive circuit]

如图2所示,驱动电路(电路单元)40是使LED模块20(LED22)发光(点灯)的点灯电路(电源电路),将规定的电力供给到LED模块20。例如,驱动电路40将经由一对引线43c以及43d从灯头60供给来的交流电变换为直流电,并将该直流电经由一对引线43a以及43b供给到LED模块20。驱动电路40由电路基板41和被安装在电路基板41上的多个电路元件(电子元件)52构成。As shown in FIG. 2 , the drive circuit (circuit unit) 40 is a lighting circuit (power supply circuit) that causes the LED module 20 (LED 22 ) to emit light (lighting), and supplies predetermined power to the LED module 20 . For example, the drive circuit 40 converts the AC power supplied from the base 60 through the pair of lead wires 43c and 43d into DC power, and supplies the DC power to the LED module 20 through the pair of lead wires 43a and 43b. The drive circuit 40 is composed of a circuit board 41 and a plurality of circuit elements (electronic elements) 52 mounted on the circuit board 41 .

电路基板41是金属配线被图案化而形成的印刷电路板,被安装在该电路基板41的多个电路元件42彼此电连接。电路基板41例如以主面与灯轴J正交的状态而被配置。The circuit board 41 is a printed circuit board formed by patterning metal wiring, and a plurality of circuit elements 42 mounted on the circuit board 41 are electrically connected to each other. The circuit board 41 is arranged such that its principal surface is perpendicular to the lamp axis J, for example.

电路元件42例如是电解电容器、陶瓷电容器等电容元件、电阻元件、整流电路元件、线圈元件、扼流线圈(扼流变压器)、噪声滤波器、二极管或集成电路元件等半导体元件等。电路元件42大多被安装在电路基板41的灯头一侧的主面。The circuit elements 42 are, for example, capacitive elements such as electrolytic capacitors and ceramic capacitors, resistive elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, semiconductor elements such as diodes, and integrated circuit elements. The circuit element 42 is often mounted on the cap-side main surface of the circuit board 41 .

具有以上这种构成的驱动电路40被收纳于框体50内。在本实施方式中,电路基板41被载置于在框体50的内面设置的突出部51a。并且,在驱动电路40中也可以恰当地选择并组合调光电路或升压电路。The drive circuit 40 having the above configuration is housed in the housing 50 . In the present embodiment, the circuit board 41 is placed on the protruding portion 51 a provided on the inner surface of the housing 50 . In addition, in the drive circuit 40, a dimming circuit or a boosting circuit may be appropriately selected and combined.

驱动电路40与LED模块20经由一对引线43a以及43b而被电连接。并且,驱动电路40与灯头60经由一对引线43c以及43d而被电连接。这四条引线43a-43d例如是合金铜引线,由芯线和包覆该芯线的绝缘性的树脂被覆构成,所述芯线由合金铜构成。The drive circuit 40 and the LED module 20 are electrically connected via a pair of lead wires 43a and 43b. Furthermore, the drive circuit 40 and the base 60 are electrically connected via a pair of lead wires 43c and 43d. These four lead wires 43a-43d are alloy copper lead wires, for example, and are comprised by the core wire and the insulating resin coating which covers this core wire, and the said core wire is comprised by alloy copper.

在本实施方式中,引线43a是从驱动电路40将正的电压供给到LED模块20的导线(正极输出端子线),引线43b是从驱动电路40将负的电压供给到LED模块20的导线(负极输出端子线)。引线43a以及43b贯穿被设置在台座32的贯通孔,被引出到LED模块一侧(球形罩10内)。In this embodiment, the lead wire 43a is a wire (positive output terminal wire) for supplying a positive voltage from the drive circuit 40 to the LED module 20, and the lead wire 43b is a wire for supplying a negative voltage from the drive circuit 40 to the LED module 20 ( Negative output terminal wire). The lead wires 43a and 43b pass through the through holes provided in the base 32, and are led out to the LED module side (inside the glove 10).

并且,引线43a(43b)各自的一端(芯线)贯穿LED模块20的基板21的贯通孔27a(27b),与端子26a以及26b焊接。并且,引线43a以及43b各自的另一端(芯线)与电路基板41的金属配线焊接。And one end (core wire) of lead wire 43a (43b) penetrates through hole 27a (27b) of board|substrate 21 of LED module 20, and is soldered to terminal 26a and 26b. Further, the other ends (core wires) of the lead wires 43 a and 43 b are soldered to the metal wiring of the circuit board 41 .

并且,引线43c以及43d是将用于使LED模块20点灯的电力从灯头60供给到驱动电路40的电线。引线43c以及43d各自的一端(芯线)与灯头60(壳部61或接触片部63)电连接,并且另一端(芯线)通过焊接等与电路基板41的电力输入部(金属配线)电连接。Furthermore, the lead wires 43c and 43d are electric wires for supplying electric power for lighting the LED module 20 from the base 60 to the drive circuit 40 . One end (core wire) of each of the lead wires 43c and 43d is electrically connected to the lamp cap 60 (shell portion 61 or contact piece portion 63), and the other end (core wire) is connected to the power input portion (metal wiring) of the circuit board 41 by soldering or the like. electrical connection.

[框体][framework]

如图2所示,框体50既是用于收纳驱动电路40的电路外壳,又是构成灯泡形灯1的外围的外围部件。因此,框体50最好是由绝缘材料构成,例如能够利用聚对苯二甲酸丁二酯(PBT)等绝缘性树脂材料等来构成。As shown in FIG. 2 , the housing 50 is not only a circuit case for accommodating the drive circuit 40 but also a peripheral member constituting the periphery of the light bulb-shaped lamp 1 . Therefore, the frame body 50 is preferably made of an insulating material, and can be made of, for example, an insulating resin material such as polybutylene terephthalate (PBT).

并且,框体50为筒状,具有在球形罩一侧的第一开口部50a和在灯头一侧的第二开口部50b。第一开口部50a以圈围球形罩10的开口部12的状态而被形成。也就是说,以球形罩10的开口部12能够被插入到第一开口部50a内的状态而被形成。并且,第一开口部50a的环状边缘与球形罩10的颚部10a的底部抵接。通过这种构成,球形罩10由框体50支承。并且,第一开口部50a的内面与球形罩10的开口部12的外面不接触,在第一开口部50a与开口部12之间设计有空隙。Furthermore, the frame body 50 has a cylindrical shape and has a first opening 50a on the globe side and a second opening 50b on the base side. The first opening 50 a is formed to surround the opening 12 of the glove 10 . That is, it is formed in a state where the opening 12 of the glove 10 can be inserted into the first opening 50a. Furthermore, the annular edge of the first opening 50 a is in contact with the bottom of the jaw 10 a of the glove 10 . With this configuration, the glove 10 is supported by the frame body 50 . Furthermore, the inner surface of the first opening 50 a does not contact the outer surface of the opening 12 of the glove 10 , and a gap is designed between the first opening 50 a and the opening 12 .

并且,在本实施方式中,框体50由外围部51和连接部52构成,该外围部51被形成为其外面露出在灯的外部(大气中),该连接部52与灯头60连接。外围部51具有第一开口部50a,并且外围部51被形成为从第一开口部50a朝向第二开口部50b,其内径以及外径逐渐变小。In addition, in this embodiment, the frame body 50 is constituted by a peripheral portion 51 formed so that its outer surface is exposed to the outside of the lamp (atmosphere) and a connection portion 52 connected to the base 60 . The peripheral portion 51 has a first opening portion 50a, and is formed such that its inner diameter and outer diameter gradually become smaller from the first opening portion 50a toward the second opening portion 50b.

在外围部51的内面被设置有突出部(基板保持部)51a,用于载置电路基板41。突出部51a在外围部51的内面被设置有多处(例如三处)。A protruding portion (substrate holding portion) 51 a for placing the circuit board 41 is provided on the inner surface of the peripheral portion 51 . The protruding portion 51 a is provided in multiple places (for example, three places) on the inner surface of the peripheral portion 51 .

而且,在外围部51的内面设置有卡止部51b,用于卡止电路盖70的凸缘部70a。卡止部51b在外围部51的内面被设置有多处(例如三处)。卡止部51b例如能够由一对爪部构成,通过使凸缘部70a被夹在爪部,从而电路盖70被保持在框体50。Furthermore, a locking portion 51 b for locking the flange portion 70 a of the circuit cover 70 is provided on the inner surface of the peripheral portion 51 . The locking portion 51b is provided at multiple places (for example, three places) on the inner surface of the peripheral portion 51 . The locking portion 51 b can be constituted by, for example, a pair of claw portions, and the circuit cover 70 is held by the frame body 50 by sandwiching the flange portion 70 a between the claw portions.

并且,灯头60外嵌于连接部52。这样,框体50的第二开口部50b被堵塞。在连接部52的外周面形成有用于拧合灯头60的拧合部,通过将灯头60拧入连接部52,从而被固定在框体50。In addition, the base 60 is externally fitted in the connecting portion 52 . Thus, the second opening 50b of the housing 50 is closed. A screwing portion for screwing the base 60 is formed on the outer peripheral surface of the connection portion 52 , and the base 60 is fixed to the frame body 50 by screwing the base 60 into the connection portion 52 .

[灯头][lamp holder]

灯头60是用于从灯的外部接受使LED模块20(LED22)发光的电力的受电部。灯头60例如被安装在照明器具的灯座。据此,在使灯泡形灯1点灯之时,灯头60能够从照明器具的灯座接受电力。灯头60被供给有例如来自商用电源的交流电。在本实施方式中,灯头60由两个接点来接受交流电,在灯头60接受的电力经由一对引线43c以及43b被输入到驱动电路40的电力输入部。The base 60 is a power receiving unit for receiving electric power for causing the LED module 20 (LED22) to emit light from the outside of the lamp. The base 60 is attached to, for example, a socket of a lighting fixture. Accordingly, when the light bulb-shaped lamp 1 is turned on, the base 60 can receive electric power from the socket of the lighting fixture. The base 60 is supplied with AC power from, for example, a commercial power supply. In this embodiment, the base 60 receives AC power through two contacts, and the electric power received by the base 60 is input to the power input part of the drive circuit 40 via a pair of lead wires 43c and 43b.

灯头60为金属制的有底筒体状,具有外周面为公螺丝的壳部61以及通过绝缘部62被安装在壳部61的接触片部63。在灯头60的外周面形成有用于拧合到照明器具的灯座的拧合部。并且,在灯头60的内周面形成有用于与框体50的连接部52拧合的拧合部。The base 60 is a bottomed cylinder made of metal, and has a case portion 61 whose outer peripheral surface is a male screw, and a contact piece portion 63 attached to the case portion 61 via an insulating portion 62 . A screwing portion for screwing to a socket of a lighting fixture is formed on the outer peripheral surface of the base 60 . Furthermore, a screwing portion for screwing with the connection portion 52 of the frame body 50 is formed on the inner peripheral surface of the base 60 .

灯头60的种类没有特殊的限定,在本实施方式中采用螺纹型的爱迪生螺纹(E型)灯头。例如,作为灯头60可以列举出E14形或E27形等。The type of the base 60 is not particularly limited, but in this embodiment, a screw-type Edison screw (E-type) base is used. For example, as the base 60, an E14 shape, an E27 shape, etc. are mentioned.

[电路盖][circuit cover]

电路盖70是被形成为盖状的绝缘性的略有底圆筒部件。电路盖70例如能够使用PBT等绝缘性树脂材料等来构成。The circuit cover 70 is an insulating, slightly bottomed cylindrical member formed in a cover shape. The circuit cover 70 can be comprised using insulating resin materials, such as PBT, etc., for example.

电路盖70的上面形状是沿着支座30的台座32的背面形状而被形成的。从而,电路盖70被嵌入到台座32的背面侧。并且,电路盖70与支座30由螺丝80来拧紧固定。The shape of the upper surface of the circuit cover 70 is formed along the shape of the back surface of the pedestal 32 of the holder 30 . Thus, the circuit cover 70 is fitted into the back side of the pedestal 32 . Moreover, the circuit cover 70 and the support 30 are fastened and fixed by screws 80 .

并且,在电路盖70被设计有呈帽檐状的凸缘部70a。凸缘部70a以从支座30的台座32露出的状态而被形成,凸缘部70a通过由被设置在框体50(外围部51)的卡止部51b卡止,从而电路盖70被固定在框体50。Furthermore, the circuit cover 70 is provided with a brim-shaped flange portion 70a. The flange portion 70a is formed in a state exposed from the pedestal 32 of the holder 30, and the flange portion 70a is locked by the locking portion 51b provided on the frame body 50 (peripheral portion 51), whereby the circuit cover 70 is fixed. In box 50.

并且,在本实施方式中,虽然是以电路盖70的凸缘部70a以及支座30为闭塞部件,用于堵塞球形罩10的开口部12的开口的,不过也可以仅由支座30来堵塞开口部12的开口。And, in the present embodiment, although the flange portion 70a of the circuit cover 70 and the support 30 are used as closing members to block the opening of the opening 12 of the spherical cover 10, it may be closed only by the support 30. The opening of the opening portion 12 is blocked.

[本实用新型的特征性构成][Characteristic constitution of the present invention]

以下,对本实施方式所涉及的灯泡形灯1的特征性构成以及效果,以致于考虑到本实用新型的经纬进行说明。图4是以往的灯泡形灯的侧面图。并且,图5A是图4的点线所圈出的区域B的放大剖面图,图5B是该区域B的放大侧面图。Hereinafter, the characteristic structure and effect of the lightbulb-shaped lamp 1 which concerns on this embodiment are demonstrated considering the latitude and longitude of this invention. Fig. 4 is a side view of a conventional bulb-shaped lamp. 5A is an enlarged cross-sectional view of a region B circled by a dotted line in FIG. 4 , and FIG. 5B is an enlarged side view of the region B. As shown in FIG.

在图4以及图5A所示的以往的灯泡形灯101中,在灯泡彼此之间存在LED模块(不图示)与球形罩110的相对位置关系不均一的问题。In the conventional light bulb-shaped lamp 101 shown in FIG. 4 and FIG. 5A , there is a problem that the relative positional relationship between the LED module (not shown) and the glove 110 is not uniform among bulbs.

针对这些问题,本实用新型的技术人员经过探讨得知,原因在于球形罩110的开口部112的长度(灯轴方向的长度)存在不均一的问题。In view of these problems, the technicians of the present invention have learned through discussion that the reason is that the length of the opening 112 of the spherical cover 110 (the length in the direction of the lamp axis) is not uniform.

即,在以往的灯泡形灯101中,在规定球形罩110的位置时,如图5A所示,将球形罩110的开口部112抵接到了支承部件130的台阶部的表面。此时,若球形罩110的开口部112的长度存在不均一的问题,则在每个灯泡形灯101中,球形罩110相对于支承部件130的位置都会出现不同。这样就会在球形罩110与其他的部件(LED模块、支承部件130、框体50等)之间的相对关系上发生不均一的问题。That is, in the conventional bulb-shaped lamp 101 , when the position of the glove 110 is defined, the opening 112 of the glove 110 abuts on the surface of the stepped portion of the supporting member 130 as shown in FIG. 5A . At this time, if the length of the opening 112 of the glove 110 is uneven, the position of the glove 110 relative to the supporting member 130 will vary for each light bulb-shaped lamp 101 . In this way, a problem of non-uniformity occurs in the relative relationship between the glove 110 and other components (the LED module, the support member 130 , the housing 50 , etc.).

尤其是在当球形罩110由玻璃制成时,每个球形罩110中的开口部112的长度的不均一就会变得非常显著,因此可知LED模块与球形罩110之间的相对位置关系的不均一也会增大。Especially when the spherical cover 110 is made of glass, the inhomogeneity of the length of the opening 112 in each spherical cover 110 will become very significant, so it can be known that the relative positional relationship between the LED module and the spherical cover 110 Inhomogeneity also increases.

而且,在球形罩110与框体50之间的相对位置关系发生不均一时,会有球形罩110与框体50之间的空隙增大的情况。在这种情况下,在使用粘合剂90来固定球形罩110与框体50时,则会出现图5B所示的情况,粘合剂90从该空隙中露出到球形罩110或框体50的表面,导致影响美观的问题。Furthermore, when the relative positional relationship between the glove 110 and the frame body 50 is not uniform, the gap between the glove cover 110 and the frame body 50 may increase. In this case, when using the adhesive 90 to fix the dome cover 110 and the frame body 50, the situation shown in FIG. surface, causing aesthetic problems.

本实用新型鉴于上述的这些问题,本实用新型的技术人员通过专心探讨,从而想到了在对球形罩的位置进行规定时,不是将球形罩抵接于支承部件,而是使其抵接于框体的开口部。In view of the above-mentioned problems, the technicians of the present invention conceived that when specifying the position of the spherical cover, the spherical cover does not abut against the support member, but makes it abut against the frame. body opening.

以下,利用图6A以及图6B,对本实用新型的实施方式1所涉及的灯泡形灯1的特征性构成进行详细说明。图6A是图2的点线所圈出的区域A的放大剖面图,图6B是该区域A的放大侧面图。Hereinafter, the characteristic structure of the lightbulb-shaped lamp 1 which concerns on Embodiment 1 of this invention is demonstrated in detail using FIG.6A and FIG.6B. FIG. 6A is an enlarged cross-sectional view of a region A circled by a dotted line in FIG. 2 , and FIG. 6B is an enlarged side view of the region A. FIG.

如图6A所示,在本实施方式的灯泡形灯1中,球形罩10的颚部10a的底部与框体50的第一开口部50a的边缘抵接。即,在对球形罩10的位置进行规定时,不是使开口部12的边缘抵接于支座30,而是使颚部10a的底部抵接于框体50的第一开口部50a的边缘。As shown in FIG. 6A , in the lightbulb-shaped lamp 1 of this embodiment, the bottom of the jaw portion 10 a of the glove 10 abuts against the edge of the first opening 50 a of the housing 50 . That is, when specifying the position of the glove 10 , the bottom of the jaw 10 a is not brought into contact with the edge of the first opening 50 a of the frame 50 , instead of the edge of the opening 12 being in contact with the holder 30 .

并且,球形罩10的除颚部10a以外的部分,不与支座30、框体50以及电路盖70等其他的任何部件接触。因此,球形罩10的开口部12的边缘与支座30不接触,而为开放状态,该开口部12成为悬浮在框体50与支座30之间的空间区域的状态。In addition, the portion of the glove 10 other than the jaw portion 10 a does not come into contact with any other components such as the stand 30 , the housing 50 , and the circuit cover 70 . Therefore, the edge of the opening 12 of the glove 10 is not in contact with the base 30 , but is in an open state, and the opening 12 is suspended in the space region between the frame body 50 and the base 30 .

根据以上所说明的构成,通过本实施方式所涉及的灯泡形灯1,即使球形罩10的开口部12的长度存在不均一,也能够以颚部10a来规定球形罩10的位置。从而,能够抑制球形罩10与其他的部品(LED模块20、支座30、框体50等)之间的相对位置关系的不均一。即,通过以上的构成,能够克服因球形罩10的开口部12的长度的不均一而造成的问题。According to the configuration described above, the position of the glove 10 can be defined by the jaws 10 a even if the length of the opening 12 of the glove 10 is uneven in the lightbulb-shaped lamp 1 according to the present embodiment. Accordingly, it is possible to suppress unevenness in the relative positional relationship between the glove 10 and other components (the LED module 20 , the holder 30 , the housing 50 , and the like). That is, with the above configuration, it is possible to overcome the problem caused by the non-uniform length of the opening 12 of the glove 10 .

并且,通过球形罩10的颚部10a的底部与框体50的第一开口部50a的边缘抵接,从而如图6A所示,在颚部10a与框体50之间不会产生空隙。即,能够密封球形罩10与框体50。In addition, since the bottom of the jaw 10a of the glove 10 abuts against the edge of the first opening 50a of the frame 50, as shown in FIG. 6A , there is no gap between the jaw 10a and the frame 50 . That is, the glove 10 and the housing 50 can be sealed.

据此,如图6A以及图6B所示,在以粘合剂90对球形罩10与框体50进行固定时,能够抑制粘合剂90露出到球形罩10或框体50的表面。因此,能够抑制因粘合剂90的露出而影响到灯泡形灯1的美观,从而实现了优美的外观。Accordingly, as shown in FIGS. 6A and 6B , when the dome cover 10 and the housing 50 are fixed with the adhesive 90 , it is possible to suppress the adhesive 90 from protruding to the surface of the dome cover 10 or the housing 50 . Therefore, it is possible to prevent the appearance of the lightbulb-shaped lamp 1 from being affected by the exposure of the adhesive 90 , thereby achieving a beautiful appearance.

并且,如图6A以及图6B所示,在本实施方式中,在将球形罩10载置于框体50的第一开口部50a时,球形罩10的主体部11的外面与框体50的外面被形成为处于一个面上。In addition, as shown in FIGS. 6A and 6B , in this embodiment, when the spherical cover 10 is placed on the first opening 50 a of the frame 50 , the outer surface of the main body 11 of the spherical cover 10 and the outer surface of the frame 50 are connected. The outer face is formed to be on one face.

据此,能够使包括球形罩10以及框体50的灯泡形灯全体的轮廓变得平滑,从而实现了外观优美的灯泡形灯。Accordingly, the outline of the entire lightbulb-shaped lamp including the glove 10 and the frame body 50 can be smoothed, thereby realizing a lightbulb-shaped lamp with an elegant appearance.

并且,如图6A所示,在本实施方式中,在框体50的第一开口部50a的边缘设计有斜面部50a1。具体而言,在第一开口部50a的端部的球形罩一侧的角部被斜切。Furthermore, as shown in FIG. 6A , in the present embodiment, an inclined portion 50a1 is designed on the edge of the first opening portion 50a of the frame body 50 . Specifically, the corner portion on the glove side at the end portion of the first opening portion 50a is chamfered.

这样,在将球形罩10载置到框体50之时,由于能够使颚部10a与框体50的第一开口部50a之处进行良好的处理,从而能够将球形罩10与框体50的对准位置的精确度提高。因此,能够进一步抑制球形罩10与其他的部品(LED模块20、支座30、框体50等)之间的相对位置关系的不均一。并且,通过设计斜面部50a1,从而能够缓解因框体50的第一开口部50a的边缘(端缘)而给球形罩10的应力。据此,能够抑制球形罩10发生变形,并且能够抑制球形罩10的破损。In this way, when the spherical cover 10 is placed on the frame body 50, since the position between the jaw portion 10a and the first opening portion 50a of the frame body 50 can be handled well, the contact between the spherical cover 10 and the frame body 50 can be achieved. The accuracy of the alignment position is improved. Therefore, unevenness in the relative positional relationship between the glove 10 and other components (the LED module 20 , the holder 30 , the housing 50 , etc.) can be further suppressed. Furthermore, by designing the inclined portion 50a1, the stress applied to the glove 10 due to the edge (end edge) of the first opening portion 50a of the frame body 50 can be relieved. Accordingly, deformation of the glove 10 can be suppressed, and damage of the glove 10 can be suppressed.

(实施方式2)(Embodiment 2)

接着,利用图7A以及图7B对本实用新型的实施方式2所涉及的灯泡形灯1A进行说明。图7A是本实用新型の实施方式2所涉及的灯泡形灯的侧面图,图7B是图7A的点线所圈出的区域C的放大剖面图。本实施方式所涉及的灯泡形灯1A与实施方式1所涉及的灯泡形灯1的不同之处是球形罩的构成。Next, the light bulb-shaped lamp 1A which concerns on Embodiment 2 of this invention is demonstrated using FIG. 7A and FIG. 7B. 7A is a side view of a light bulb-shaped lamp according to Embodiment 2 of the present invention, and FIG. 7B is an enlarged cross-sectional view of a region C circled by a dotted line in FIG. 7A . The lightbulb-shaped lamp 1A which concerns on this embodiment differs from the lightbulb-shaped lamp 1 which concerns on Embodiment 1 in the structure of a globe.

如图7A所示,本实施方式中的球形罩10A的形状为,在实施方式1的球形罩10的基础上,球形罩10的顶部(前端)延伸变尖的形状(JIS的C7710所规定的CA形)。并且,在图7A中虽然是对球形罩10A进行扩散处理,球形罩10A也可以为透明。As shown in FIG. 7A , the shape of the glove 10A in this embodiment is a shape in which the top (tip) of the glove 10 is extended and tapered in addition to the glove 10 of the first embodiment (defined in JIS C7710). CA shape). In addition, although the dome cover 10A is diffused in FIG. 7A , the dome cover 10A may be transparent.

如图7B所示,在本实施方式的灯泡形灯1A中,也具有与实施方式1同样的特征结构。因此,本实施方式所涉及的灯泡形灯1A也能够得到与实施方式1相同的效果。As shown in FIG. 7B , also in the lightbulb-shaped lamp 1A of this embodiment, it has the same characteristic structure as Embodiment 1. As shown in FIG. Therefore, the lightbulb-shaped lamp 1A according to the present embodiment can also obtain the same effect as that of the first embodiment.

(实施方式3)(Embodiment 3)

接着,利用图8A以及图8B对本实用新型的实施方式3所涉及的灯泡形灯1B进行说明。图8A是本实用新型的实施方式3所涉及的灯泡形灯的侧面图,图8B是图8A的点线所圈出的区域D的放大剖面图。本实施方式所涉及的灯泡形灯1B与实施方式1所涉及的灯泡形灯1的不同之处是球形罩以及支座的构成。Next, the light bulb-shaped lamp 1B which concerns on Embodiment 3 of this invention is demonstrated using FIG.8A and FIG.8B. 8A is a side view of a light bulb-shaped lamp according to Embodiment 3 of the present invention, and FIG. 8B is an enlarged cross-sectional view of a region D circled by a dotted line in FIG. 8A . The lightbulb-shaped lamp 1B according to the present embodiment differs from the lightbulb-shaped lamp 1 according to Embodiment 1 in the configurations of the glove and the holder.

如图8B所示,本实施方式的球形罩10B具有:球状的主体部11B以及比主体部11B的直径小的开口部12B。也就是说,如图8A所示,球形罩10B的形状为,中空的球的一部分从球的中心部向远方延伸变窄的形状(JIS的C7710所规定的A形),并且在离球的中心部远的位置上形成有开口部12B。在本实施方式中,球形罩10B也设计有主体部11B以及与开口部12B的连接部分的颚部10Ba。在剖视颚部10Ba时,该颚部10Ba的形状为具有规定的弯曲。As shown in FIG. 8B , the glove 10B of this embodiment has a spherical main body 11B and an opening 12B smaller in diameter than the main body 11B. That is to say, as shown in FIG. 8A , the shape of the dome cover 10B is a shape in which a part of the hollow ball extends and narrows from the center of the ball to the distance (A shape specified in JIS C7710), and the distance from the ball An opening 12B is formed at a position far from the center. In this embodiment, the glove 10B is also designed with a main body 11B and a jaw 10Ba of a connection portion to the opening 12B. When the jaw portion 10Ba is viewed in section, the shape of the jaw portion 10Ba has a predetermined curvature.

并且,支座30B由支柱31B和台座32B构成。支柱31B与实施方式1中的支柱31的构成相同。台座32B是用于支承支柱31B的部件,被构成为能够堵塞球形罩10B的开口部12B。台座32B是具有台阶部的圆盘状部件,具有直径小的径小部和直径大的径大部构成。台座32B与支柱31B相同,能够由铝等金属构成。并且,在台座32B上设计有用于使引线43a以及43b贯穿的两个贯通孔。Furthermore, the support 30B is comprised from the support|pillar 31B and the base 32B. The strut 31B has the same configuration as the strut 31 in the first embodiment. The pedestal 32B is a member for supporting the pillar 31B, and is configured to close the opening 12B of the glove 10B. The pedestal 32B is a disk-shaped member having a stepped portion, and is constituted by a small-diameter portion with a small diameter and a large-diameter portion with a large diameter. The pedestal 32B can be made of metal such as aluminum, similarly to the pillar 31B. In addition, two through-holes for passing the lead wires 43a and 43b are designed in the base 32B.

在本实施方式中,进一步在框体50(第一框体)的内侧设置有筒状的散热器55(第二框体)。散热器55最好由热传导率高的材料构成,例如由铝等金属构成。通过设置散热器55,从而能够高效率地对在LED模块20发生的热进行散热。并且,在利用金属制的散热器55的情况下,驱动电路40与散热器55之间最好是采用具有绝缘性的电路外壳。In this embodiment, a cylindrical heat sink 55 (second housing) is further provided inside the housing 50 (first housing). The heat sink 55 is preferably made of a material with high thermal conductivity, for example, metal such as aluminum. By providing the heat sink 55, heat generated in the LED module 20 can be efficiently dissipated. Furthermore, when using the heat sink 55 made of metal, it is preferable to use an insulating circuit case between the drive circuit 40 and the heat sink 55 .

如图8B所示,在本实施方式中也是球形罩10B的颚部10Ba的底部与框体50的第一开口部50a的边缘抵接。这样,与实施方式1同样,即使球形罩10B的开口部12B的长度不均一,也能够抑制球形罩10B与其他的部件(LED模块20、支座30B、框体50等)的相对位置关系的不均一。并且,由于能够抑制粘合剂90从球形罩10B或框体50的表面露出,因此能够使灯泡形灯1B具有优美的外观。As shown in FIG. 8B , also in this embodiment, the bottom of the jaw portion 10Ba of the glove 10B abuts against the edge of the first opening portion 50 a of the housing 50 . In this way, similarly to Embodiment 1, even if the length of the opening 12B of the glove 10B is not uniform, it is possible to suppress the discrepancy in the relative positional relationship between the glove 10B and other components (LED module 20 , holder 30B, frame 50 , etc.). uneven. Furthermore, since the adhesive agent 90 can be suppressed from protruding from the surface of the globe 10B or the housing 50, the lightbulb-shaped lamp 1B can be made to have an elegant appearance.

并且,在本实施方式中虽然设置了散热器55,不过也可以不必设置散热器55。并且,也可以在实施方式1和2中设置散热器55以及电路外壳。In addition, although the heat sink 55 is provided in this embodiment, it is not necessary to provide the heat sink 55 . In addition, the heat sink 55 and the circuit case may be provided in the first and second embodiments.

(实施方式4)(Embodiment 4)

接着,利用图9对本实用新型的实施方式4所涉及的照明装置2进行说明。图9是本实用新型的实施方式4所涉及的照明装置的外观透视图。Next, the illuminating device 2 which concerns on Embodiment 4 of this invention is demonstrated using FIG. 9. FIG. Fig. 9 is an external perspective view of a lighting device according to Embodiment 4 of the present invention.

如图9所示,本实施方式的照明装置2为枝形吊灯型的照明装置,具备实施方式1中的灯泡形灯1。As shown in FIG. 9 , the lighting device 2 of the present embodiment is a chandelier-type lighting device and includes the light bulb-shaped lamp 1 in the first embodiment.

这样,本实用新型不仅可以作为灯泡形灯来实现,而且可以作为具备灯泡形灯的照明装置来实现。In this way, the present invention can be realized not only as a bulb-shaped lamp, but also as a lighting device equipped with a bulb-shaped lamp.

并且,作为照明装置也并非受图9所示的构成所限。作为照明装置只要是至少具备用于保持灯泡形灯1并且将电力供给给灯泡形灯1的灯座即可。Moreover, it is not limited to the structure shown in FIG. 9 as an illumination device. What is necessary is just to be provided with the lamp socket for holding the lightbulb-shaped lamp 1 at least as an illuminating device, and supplying electric power to the lightbulb-shaped lamp 1.

(変形例等)(Changes, etc.)

以上,基于实施方式对本实用新型所涉及的灯泡形灯以及照明装置进行了说明,不过,本实用新型并非受这些实施方式所限。As mentioned above, although the light bulb-shaped lamp and lighting device which concern on this invention were demonstrated based on embodiment, this invention is not limited to these embodiment.

例如,球形罩的形状不仅限于实施方式1至3所述的形状,也能够采用一般的白炽灯所使用的形状。例如,作为球形罩能够采用G形或E形(JISC7710)等形状。For example, the shape of the glove is not limited to the shapes described in Embodiments 1 to 3, and shapes used in general incandescent lamps can also be adopted. For example, shapes such as G-shape and E-shape (JISC7710) can be adopted as the dome cover.

并且,在上述的实施方式中,虽然在支座30设置了支柱31,不过也可以不设置支柱31。在这种情况下,例如支座30仅为台座32,LED模块20只要被载置并固定于台座32的表面即可。Moreover, in the above-mentioned embodiment, although the support|pillar 31 was provided in the base 30, the support|pillar 31 may not be provided. In this case, for example, the holder 30 is only the pedestal 32 , and the LED module 20 may be mounted and fixed on the surface of the pedestal 32 .

并且,在上述的实施方式中,LED模块20作为在基板21上的发光元件,采用了直接安装LED芯片的COB型的构成,不过,并非受此所限。例如作为发光元件,也可以采用SMD型的LED模块,具体是利用由具有凹部(空腔)的树脂制的容器、安装于凹部之中的LED芯片、被封入到凹部内的密封部件(含荧光体树脂)构成的封装体型的LED元件(SMD型LED元件),将这样的LED元件在由金属配线形成的基板21上安装多个的构成。In addition, in the above-mentioned embodiment, the LED module 20 adopts a COB type structure in which an LED chip is directly mounted as a light-emitting element on the substrate 21 , but the present invention is not limited thereto. For example, as a light-emitting element, an SMD-type LED module can also be used. Specifically, a container made of resin with a recess (cavity), an LED chip installed in the recess, and a sealing member (including fluorescent light) sealed in the recess can be used. A package-type LED element (SMD-type LED element) made of bulk resin) is configured by mounting a plurality of such LED elements on a substrate 21 formed of metal wiring.

并且,在上述的实施方式中,作为LED模块20的基板21虽然采用了一块基板,也可以采用在表面形成有LED22以及密封部件23的两块基板,通过将该基板彼此的背面贴和在一起,来构成一个LED模块20。这样能够实现双面发光的LED模块。In addition, in the above-mentioned embodiment, although one substrate is used as the substrate 21 of the LED module 20, two substrates having the LED 22 and the sealing member 23 formed on the surface may be used, and the back surfaces of the substrates may be pasted together. , to form an LED module 20. In this way, a double-sided LED module can be realized.

并且,在上述的实施方式中,LED模块20的构成是通过蓝色LED芯片和黄色荧光体而放出白光的,但并非受此所限。例如为了提高演色性除了加入黄色荧光体之外,还可以混入红色荧光体或绿色荧光体。并且,也可以不使用黄色荧光体,而是采用含有红色荧光体或绿色荧光体的含荧光体树脂,通过与蓝色LED芯片组合从而放出白光。In addition, in the above-mentioned embodiment, the LED module 20 is configured to emit white light through the blue LED chip and the yellow phosphor, but the present invention is not limited thereto. For example, a red phosphor or a green phosphor may be mixed in addition to the yellow phosphor in order to improve color rendering. In addition, instead of using a yellow phosphor, a phosphor-containing resin containing a red phosphor or a green phosphor may be used to emit white light by combining it with a blue LED chip.

并且,在上述的实施方式中,LED芯片也可以采用发出蓝色以外的颜色的光的LED芯片。例如,在使用发出紫外线光的LED芯片的情况下,作为荧光体粒子,能够对发出三原色(红色、绿色、蓝色)光的各种颜色的荧光体粒子进行组合利用。而且,也可以使用荧光体粒子以外的波长转换材料,作为波长转换材料,例如可以采用含有半导体、金属络合物、有机染料、颜料等能够吸收某种波长的光,并发出与吸収的光的波长不同的光的物质的材料。Furthermore, in the above-mentioned embodiment, an LED chip that emits light of a color other than blue may be used as the LED chip. For example, when using an LED chip that emits ultraviolet light, phosphor particles of various colors that emit light of three primary colors (red, green, blue) can be used in combination as phosphor particles. Moreover, wavelength conversion materials other than phosphor particles can also be used. As the wavelength conversion material, for example, materials containing semiconductors, metal complexes, organic dyes, pigments, etc. that can absorb light of a certain wavelength and emit and absorb light can be used. A material that contains light of different wavelengths.

并且,在上述的实施方式中,作为发光元件虽然举例示出了LED,不过也可以采用半导体激光等其他的半导体发光元件、有机EL(ElectroLuminescence:电致发光)或无机EL等固体发光元件。In addition, in the above-mentioned embodiment, although LED was shown as an example of the light-emitting element, other semiconductor light-emitting elements such as semiconductor lasers, and solid light-emitting elements such as organic EL (ElectroLuminescence: electroluminescence) or inorganic EL may also be used.

另外,在不脱离本实用新型的主旨的情况下,将本领域技术人员所能够想到的各种変形执行于本实施方式以及变形例的构成,或者对实施方式以及变形例中的构成要素进行组合后的构成均包含在本实用新型的范围内。In addition, without departing from the gist of the present invention, various modifications conceivable by those skilled in the art may be implemented in the configurations of the present embodiment and modifications, or components in the embodiments and modifications may be combined. The latter configurations are all included within the scope of the present utility model.

本实用新型能够作为替代以往的白炽灯等灯泡形灯来利用,并且能够广泛利用于照明装置等。The present invention can be used as a substitute for light bulb-shaped lamps such as conventional incandescent lamps, and can be widely used in lighting devices and the like.

Claims (7)

1.一种照明用光源,具备:1. A light source for lighting, comprising: 球形罩,具有主体部以及开口部;The spherical cover has a main body and an opening; 发光模块,被配置在所述球形罩内;以及a light emitting module configured in the spherical cover; and 框体,具有开口部,该框体的开口部圈围所述球形罩的所述开口部;a frame body having an opening, and the opening portion of the frame body surrounds the opening portion of the spherical cover; 该照明用光源的特征在于,The light source for illumination is characterized in that 所述球形罩通过自身的一部分与所述框体的所述开口部的边缘相抵接,从而该球形罩由所述框体支承。The glove is supported by the frame by abutting a part of the glove itself against the edge of the opening of the frame. 2.如权利要求1所述的照明用光源,其特征在于,2. The light source for illumination according to claim 1, wherein 该照明用光源还具备闭塞部件,该闭塞部件以堵塞所述球形罩的所述开口部的开口的状态而被设置;The light source for illumination further includes a closing member provided to close the opening of the opening of the glove; 所述球形罩的所述开口部的开口边缘与所述闭塞部件不接触。An opening edge of the opening of the glove does not contact the closing member. 3.如权利要求1所述的照明用光源,其特征在于,3. The light source for illumination according to claim 1, wherein 所述主体部的最大外径比所述球形罩的所述开口部的最大外径大;The maximum outer diameter of the main body part is larger than the maximum outer diameter of the opening part of the spherical cover; 所述球形罩具有因所述主体部的最大外径与所述球形罩的所述开口部的最大外径差而产生的颚部;The glove has a jaw resulting from a difference between a maximum outer diameter of the body portion and a maximum outer diameter of the opening of the glove; 由所述框体支承的所述球形罩的所述一部分为所述颚部的底部。The part of the glove supported by the frame is the bottom of the jaw. 4.如权利要求1所述的照明用光源,其特征在于,4. The light source for illumination according to claim 1, wherein 至少在所述球形罩的所述开口部的外面与所述框体的内面之间设置有粘合剂,用于粘合所述球形罩与所述框体。An adhesive is provided at least between the outer surface of the opening of the spherical cover and the inner surface of the frame for bonding the spherical cover and the frame. 5.如权利要求1所述的照明用光源,其特征在于,5. The light source for illumination according to claim 1, wherein 所述球形罩的所述主体部的外面与所述框体的外面成为同一个面。The outer surface of the main body of the glove is flush with the outer surface of the frame. 6.如权利要求1所述的照明用光源,其特征在于,6. The light source for illumination according to claim 1, wherein 该照明用光源还具备驱动电路,该驱动电路用于将电力供给到所述发光模块;The light source for illumination is further provided with a drive circuit for supplying power to the light emitting module; 所述框体以圈围所述驱动电路的状态而被构成。The housing is configured to surround the drive circuit. 7.一种照明装置,其特征在于,具备权利要求1至6的任一项所述的照明用光源。7. A lighting device comprising the light source for lighting according to any one of claims 1 to 6.
CN201320072600XU 2013-02-08 2013-02-08 Light source for illumination and illumination device Expired - Fee Related CN203176803U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103759160A (en) * 2014-02-11 2014-04-30 刘奇军 LED bulb and LED luminous body

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103759160A (en) * 2014-02-11 2014-04-30 刘奇军 LED bulb and LED luminous body

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