JP2014110301A - Light-emitting device and illumination light source - Google Patents

Abstract

The present invention provides a light emitting device and a light source for illumination that have a configuration in which light from a light emitting element is wavelength-converted and emitted to the outside, and generation of color unevenness is suppressed.
A light-transmitting substrate, an LED disposed on a main surface of the substrate, and a sealing member for sealing the LED, the first wavelength converting the wavelength of light emitted by the LED. A recess 24 provided in a concave shape at a position facing the LED 22 on the back surface, which is the surface opposite to the main surface of the substrate 21, including the conversion member 23 a, and is a substrate emitted from the LED 22 And a recess 24 that houses a second wavelength conversion material 25 that converts the wavelength of light that has passed through the inside of 21.
[Selection] Figure 4

Description

  The present invention relates to a light emitting device including a light emitting element such as a semiconductor light emitting element and an illumination light source.

  Semiconductor light emitting devices such as LEDs (Light Emitting Diodes) are expected to be new light sources for various lamps because of their high efficiency and long life, and research and development of LED lamps using LEDs as light sources are being promoted.

  As an LED lamp, a bulb-type LED lamp (bulb-shaped LED lamp) that replaces a bulb-type fluorescent lamp and an incandescent bulb, or a straight-tube LED lamp (straight-tube LED lamp) that replaces a straight-tube fluorescent lamp Etc. For example, Patent Document 1 discloses a conventional bulb-type LED lamp. Patent Document 2 discloses a conventional straight tube LED lamp.

  In the LED lamp, an LED module (light emitting device) in which a plurality of LEDs are mounted on a substrate is used as a light source.

JP 2006-313717 A JP 2009-043447 A

  In recent years, a light bulb-type LED lamp having a configuration simulating an incandescent bulb in light emission characteristics and appearance has been studied. For example, a bulb-type LED lamp having a configuration in which an LED module is held in a hollow state at a central position in the globe using a globe (glass bulb) used in an incandescent bulb has been proposed.

  More specifically, the LED module is fixed to the top of the column using a column (stem) extending from the globe opening toward the center of the globe. The LED module includes, for example, a substrate, a plurality of LED chips mounted on the surface of the substrate in a plurality of rows, and a sealing member that collectively seals the LED chips for each row. As the sealing member, for example, a phosphor-containing resin is used.

  In the LED module having such a structure, for example, blue light from each LED chip is wavelength-converted by the phosphor of the sealing member, and as a result, white light is emitted from the sealing member.

  At this time, even if the substrate is not transparent, for example, if the entire back surface of the substrate is not covered with a support or the like, a part of the blue light from each LED chip is transmitted through the substrate and outward from the back surface of the substrate. May be released. In this case, color unevenness in light emission from the LED module is observed.

  In consideration of the above-described conventional problems, the present invention provides a light-emitting device and a light source for illumination that have a configuration in which light from a light-emitting element is wavelength-converted and emitted to the outside, and color unevenness can be suppressed. With the goal.

  In order to achieve the above object, a light-emitting device according to one embodiment of the present invention includes a light-transmitting substrate, a light-emitting element disposed on a main surface of the substrate, and a sealing member that seals the light-emitting element. And the sealing member containing the 1st wavelength conversion material which converts the wavelength of the light which the said light emitting element emits opposes the said light emitting element of the back surface which is a surface on the opposite side to the said main surface of the said board | substrate. A concave portion provided in a concave shape at a position, the concave portion accommodating a second wavelength conversion material for converting the wavelength of light emitted from the light emitting element and transmitted through the inside of the substrate.

  In the light-emitting device according to one embodiment of the present invention, the size of the opening of the recess in a plane perpendicular to the thickness direction of the substrate is determined when the substrate is seen through from the direction of the main surface. It is good also as a magnitude | size containing.

  Further, in the light bulb shaped lamp according to one aspect of the present invention, a plurality of the light emitting elements are arranged on the main surface of the substrate, and the recesses are a plurality of the light emitting elements on the back surface of the substrate. It is good also as being provided in the position facing each of these.

  In the light-emitting device according to one embodiment of the present invention, a plurality of the light-emitting elements are disposed on the main surface of the substrate, and the recess includes at least two of the light-emitting elements among the plurality of light-emitting elements. Along the arrangement direction of the elements, the back surface may be provided in a long shape.

  In the light-emitting device according to one embodiment of the present invention, the first wavelength conversion material and the second wavelength conversion material are the same material, and the sealing member includes a wavelength conversion that includes the first wavelength conversion material. The wavelength conversion material-containing resin may be accommodated in the concave portion.

  In the light-emitting device according to one embodiment of the present invention, an uneven portion formed by arranging a plurality of concave shapes or convex shapes may be formed on the inner surface of the concave portion.

  An illumination light source according to an aspect of the invention includes the light-emitting device according to any one of the above aspects, a translucent glove, and a support column provided so as to extend inward of the glove. The light emitting device is fixed to the column so as to be disposed in the globe.

  Moreover, the illumination light source which concerns on 1 aspect of this invention WHEREIN: The said support | pillar is good also as having translucency.

  Further, in the illumination light source according to one aspect of the present invention, the column is configured such that the end surface of the column is connected to a region including at least one of the recesses on the back surface of the substrate. May be fixed.

  According to the present invention, it is possible to provide a light-emitting device and an illumination light source that have a configuration in which light from a light-emitting element is wavelength-converted and emitted to the outside, and generation of color unevenness can be suppressed.

FIG. 1 is a front view of a light bulb shaped lamp according to an embodiment. FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment. FIG. 3 is a cross-sectional view of the light bulb shaped lamp according to the embodiment. FIG. 4 is a diagram illustrating a configuration of the LED module according to the embodiment. FIG. 5 is a diagram illustrating a configuration of an LED module according to the first modification of the embodiment. FIG. 6 is a diagram illustrating a configuration of the LED module according to the second modification of the embodiment. FIG. 7 is a diagram illustrating a correspondence relationship between the LED module and the support according to the third modification of the embodiment. FIG. 8 is a diagram illustrating an example of a cross-sectional shape of a recess having an uneven portion on the inner surface. FIG. 9 is a diagram illustrating an example of a cross-sectional shape including a curve of the concave portion.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each figure is a schematic diagram and is not necessarily illustrated exactly.

  The embodiment described below shows a specific example of the present invention. The numerical values, shapes, materials, constituent elements, arrangement positions and connecting forms of the constituent elements shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims are described as arbitrary constituent elements.

[Overall configuration of bulb-type lamp]
First, the whole structure of the light bulb shaped lamp 1 according to the embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a front view of a light bulb shaped lamp 1 according to an embodiment. FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the embodiment. FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the embodiment.

  In FIG. 1, the alternate long and short dash line drawn along the vertical direction of the drawing indicates the lamp axis J (center axis) of the bulb-type lamp 1. The lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base 30.

  The light bulb shaped lamp 1 is an example of a light source for illumination, and is a light bulb shaped LED lamp that is a substitute for a light bulb shaped fluorescent light or an incandescent light bulb.

  In FIG. 3, the lighting circuit 80 is not a cross-sectional view but a front view.

  The light bulb shaped lamp 1 includes a translucent globe 10, an LED module 20 that is a light source, a base 30 that receives electric power from the outside of the lamp, a support column 40, a support plate 50, a resin case 60, and lead wires 70. And a lighting circuit 80.

  The bulb-shaped lamp 1 includes an envelope formed by the globe 10, the resin case 60, and the base 30.

  Hereinafter, each component of the light bulb shaped lamp 1 according to the present embodiment will be described.

[Glove]
The globe 10 is a translucent cover that houses the LED module 20 and transmits light from the LED module 20 to the outside of the lamp. The light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10.

  The globe 10 in the present embodiment is made of a material that is transparent to the light from the LED module 20. As such a globe 10, for example, a glass valve (clear valve) made of silica glass that is transparent to visible light is employed.

  In this case, the LED module 20 housed in the globe 10 can be viewed from the outside of the globe 10.

  The globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function. For example, a milky white light diffusing film may be formed by applying a resin or a white pigment containing a light diffusing material such as silica or calcium carbonate to the entire inner surface or outer surface of the globe 10. Further, the material of the globe 10 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.

[LED module]
The LED module 20 includes an LED (LED chip) 22 that is an example of a light emitting element, and is a light emitting module (light emitting device) that emits light when electric power is supplied to the LED 22 via a lead wire 70.

  The LED module 20 is held in the globe 10 by the support column 40.

  The LED module 20 is preferably disposed at a spherical center position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large).

  Thus, by arranging the LED module 20 at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil. .

  The LED module 20 of the present embodiment includes a light-transmitting substrate 21, an LED 22 disposed on the main surface of the substrate 21, and a first wavelength conversion material 23 a, and a sealing member that seals the LED 22. 23 and a recess 24 for receiving the second wavelength conversion material 25 provided in a recessed shape on the back surface opposite to the main surface of the substrate 21.

  The substrate 21 is a substrate having a thickness of about 1 mm, for example. In the present embodiment, a white alumina substrate having a relatively high light reflectance (for example, 70% or more) is employed as the substrate 21.

  The material of the substrate 21 provided in the LED module 20 is not limited to alumina. For example, a translucent ceramic substrate made of aluminum nitride, a transparent glass substrate, a substrate made of crystal, a sapphire substrate, or a resin substrate can be adopted as the substrate 21.

  Further, instead of the rigid substrate, a flexible substrate or a rigid flexible substrate may be employed as the substrate 21.

  Further, in this embodiment, as shown in FIGS. 1 and 2, a plurality of LEDs 22 are arranged in four rows on the main surface of the substrate 21, and correspondingly, four rows are sealed on the main surface side. A stop member 23 is provided.

  Note that the number of rows of the sealing members 23 is not limited to two. For example, one or three or more rows of sealing members 23 may be disposed on the substrate 21 corresponding to the LEDs 22 arranged in one or three or more rows.

  Each of the first wavelength conversion material 23 a included in the sealing member 23 and the second wavelength conversion material 25 accommodated in the recess 24 is a material that converts the wavelength of light emitted from the LED 22.

  The LED module 20 of the present embodiment suppresses the occurrence of color unevenness in light emission from the LED module 20 by arranging the sealing member 23 and the recess 24.

  Details of the configuration of the LED module 20 will be described later with reference to FIG.

[Base]
The base 30 is a power receiving unit that receives power for causing the LEDs of the LED module 20 to emit light from the outside of the light bulb shaped lamp 1. The base 30 receives AC power through two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 via a lead wire.

  For example, AC power is supplied to the base 30 from a commercial power supply (AC 100 V). Specifically, the base 30 is attached to a socket of a lighting fixture (lighting device) and receives AC power from the socket. Thereby, the light bulb shaped lamp 1 (LED module 20) is turned on.

  The type of the base 30 is not particularly limited, but in the present embodiment, a screwed type Edison type (E type) base is used. Examples of the E-type base adopted as the base 30 include an E26 type, an E17 type, and an E16 type.

[Support]
The column 40 is a metal stem (metal column) provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10.

  The support column 40 functions as a support member that supports the LED module 20 in the globe 10. One end of the column 40 is connected to the LED module 20, and the other end is connected to the support plate 50.

  The support column 40 also functions as a heat radiating member for radiating heat generated in the LED module 20 to the base 30 side. Therefore, by configuring the support column 40 as a main component of a metal material having a high thermal conductivity, for example, aluminum (Al) having a thermal conductivity of about 237 [W / m · K], the heat dissipation efficiency of the support column 40 can be improved. it can.

  As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LED 22 due to a temperature rise.

  As a metal material of the support column 40, copper (Cu), iron (Fe), or the like may be employed in addition to the aluminum alloy. Further, a resin instead of metal may be employed as the material of the support column 40.

  For example, when a highly transparent material such as acrylic or transparent ceramics is used as the material of the support column 40, the light emitted from the LED module 20 is transmitted through the support column 40 and emitted to the outside of the globe 10. Is also possible.

  Further, as the support column 40, a support column made of a resin or the like and having a metal film formed thereon may be employed.

  The column 40 is a cylindrical member having a constant cross-sectional area in the present embodiment. The support column 40 has an end surface 45 to which the LED module 20 is fixed. The end surface 45 abuts on the back surface of the substrate 21 of the LED module 20 to support the LED module 20.

  Specifically, the LED module 20 and the end surface 45 of the support column 40 are bonded to each other with a resin adhesive such as silicone resin.

  Thus, in the present embodiment, the LED module 20 is supported by the support column 40 in a state where the back surface of the substrate 21 is in contact with the end surface 45 of the support column 40. Thereby, the heat dissipation efficiency of the LED module 20 is enhanced, and as a result, it is possible to suppress the decrease in the light emission efficiency and the lifetime of the LED 22 due to the temperature rise.

  In addition, the shape of the support | pillar 40 is not limited to column shape, For example, prism shape may be sufficient. Further, for example, the end of the support column 40 on the LED module 20 side may have a shape in which the cross-sectional area increases as it approaches the LED module 20.

[Support plate]
The support plate 50 is a member that supports the support column 40 and is fixed to the resin case 60. The support plate 50 is connected to the opening end of the opening 11 of the globe 10 so as to close the opening 11 of the globe 10.

  Specifically, the support plate 50 is a disk-shaped member having a stepped portion on the periphery, and the opening end of the opening 11 of the globe 10 is in contact with the stepped portion. And in this level | step-difference part, the support plate 50, the resin case 60, and the opening end of the opening part 11 of the globe 10 are adhere | attached with the adhesive agent.

  Similarly to the support column 40, the support plate 50 is made of a metal material having high thermal conductivity such as aluminum, so that the heat radiation efficiency of the LED module 20 that conducts the support column 40 by the support plate 50 is increased. As a result, it is possible to further suppress the decrease in the light emission efficiency and the lifetime of the LED due to the temperature rise. In addition, the support plate 50 and the support | pillar 40 may be integrally shape | molded by the same metal mold | die.

[Resin case]
The resin case 60 is an insulating case (circuit holder) for insulating the support column 40 and the base 30 and accommodating the lighting circuit 80. The resin case 60 is composed of a large-diameter cylindrical first case portion 61 and a small-diameter cylindrical second case portion 62. The resin case 60 is formed by, for example, polybutylene terephthalate (PBT).

  Since the outer surface of the first case portion 61 is exposed to the outside air, the heat conducted to the resin case 60 is mainly radiated from the first case portion 61. The second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30, and a screwing portion for screwing with the base 30 is formed on the outer peripheral surface of the second case portion 62. ing.

[Lead]
The two lead wires 70 are a pair of lead wires for supplying power for lighting the LED module 20 from the lighting circuit 80 to the LED module 20. As the lead wire 70, for example, an electric wire in which a wire metal wire such as a copper wire is covered with an insulating resin is employed.

  Each lead wire 70 is disposed in the globe 10, one end is electrically connected to the external terminal of the LED module 20, and the other end is electrically connected to the power output unit of the lighting circuit 80. In other words, the other end is electrically connected to the base 30.

[Lighting circuit]
The lighting circuit 80 is a drive circuit (circuit unit) for lighting the LEDs of the LED module 20 and is covered with a resin case 60. The lighting circuit 80 converts AC power fed from the base 30 into DC power, and supplies the converted DC power to the LEDs of the LED module 20 via the two lead wires 70.

  The lighting circuit 80 includes, for example, a circuit board and a plurality of circuit elements (electronic components) mounted on the circuit board. The circuit board is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements mounted on the circuit board. In the present embodiment, the circuit board is arranged such that the main surface on which the plurality of circuit elements are arranged is perpendicular to the lamp axis.

  The plurality of circuit elements include, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, or integrated circuit elements.

  The light bulb shaped lamp 1 does not necessarily need to include the lighting circuit 80. For example, when direct-current power is directly supplied to the light bulb shaped lamp 1 from a lighting fixture or a battery, the light bulb shaped lamp 1 may not include the lighting circuit 80. The lighting circuit 80 is not limited to a smoothing circuit, and can be configured by appropriately selecting and combining a dimming circuit and a booster circuit.

[Details of LED module configuration]
Next, a characteristic configuration of the LED module 20 according to the present embodiment will be described with reference to FIG.

  FIG. 4 is a diagram illustrating a configuration of the LED module 20 according to the embodiment.

  4A is a top view of the LED module 20 (a view of the LED module 20 viewed from the main surface side (Z-axis positive side)). FIG. 4B is a diagram showing an AA cross section of the LED module 20 in FIG. (C) of FIG. 4 is a figure which shows the BB cross section in (a) of FIG. 4 of the LED module 20. FIG.

  In the LED module 20, the plurality of LEDs 22 arranged in a row are connected in series, for example, with a wiring (not shown), and emit light when energized through electrodes provided at both ends thereof.

  Each of these LEDs 22 is a bare chip that emits monochromatic visible light, and is die-bonded to the main surface of the substrate 21 with a light-transmitting die attach agent (die bond agent). That is, the LED module 20 according to the present embodiment has a COB (Chip On Board) structure.

  As each LED 22, for example, a blue LED chip that emits blue light is employed. As the blue LED chip, for example, a gallium nitride based semiconductor light emitting element having a center wavelength of 440 nm to 470 nm, which is made of an InGaN based material, is used.

  The sealing member 23 includes a first wavelength conversion material 23 a that collectively seals the plurality of LEDs 22 arranged in one row and converts the wavelength of light emitted from the LEDs 22.

  In the present embodiment, the sealing member 23 is formed of a phosphor-containing resin in which predetermined phosphor particles are contained as the first wavelength conversion material 23a in a predetermined resin.

  In addition, as predetermined resin, translucent materials, such as a silicone resin, are employ | adopted, for example. As the predetermined phosphor particles, for example, YAG (yttrium, aluminum, garnet) yellow phosphor particles are employed.

  The yellow phosphor particles emit yellow light when excited by blue light from the LED 22. As a result, white light obtained by the yellow light and the blue light from the LED 22 is emitted.

  Here, as described above, when a white alumina substrate is adopted as the substrate 21 as the substrate 21, the substrate 21 is not transparent but has translucency and a thickness of about 1 mm.

  Therefore, the blue light from the LEDs 22 arranged on the main surface passes through the substrate 21 and is emitted from the back surface. Specifically, light traveling from the LED 22 toward the substrate 21 and light diffused or reflected in the sealing member 23 enters the substrate 21.

  For example, in the case of a white alumina substrate having a thickness of 1 mm and a light reflectance of 94%, the ratio of the light flux on the main surface side to the light flux on the back surface side is about 95: 5. For example, in the case of a white alumina substrate having a thickness of 0.635 mm and a light reflectance of 88%, the ratio of the light flux on the main surface side to the light flux on the back surface side is about 93: 7.

  Further, the light that has entered the substrate 21 is scattered, for example, at the crystal grain boundary of the alumina polycrystal constituting the substrate 21, and is emitted to the outside from the back surface of the substrate 21. As a result, when it is assumed that no countermeasure is taken on the back surface of the substrate 21, the blue light leaking from the back surface of the substrate 21 is mixed with the white light emitted through the sealing member 23. Color unevenness in light emission from 20 is observed.

  However, in the LED module 20 of the present embodiment, the recess 24 is disposed on the back surface of the substrate 21.

  The recess 24 is provided on the back surface of the substrate 21 at a position facing the LED 22, and houses a second wavelength conversion material 25 that converts the wavelength of light emitted from the LED 22 and transmitted through the substrate 21. .

  In the recess 24 in the present embodiment, a phosphor-containing resin in which predetermined phosphor particles are contained as the second wavelength conversion material 25 is accommodated in a predetermined resin.

  Specifically, in the present embodiment, in the recess 24, as in the sealing member 23, for example, a phosphor-containing resin in which YAG-based yellow phosphor particles are contained in a translucent material such as a silicone resin. Contained.

  That is, the blue light that has reached the recess 24 via the inside of the substrate 21 is converted into white light by the yellow phosphor particles that are the second wavelength conversion material 25, and is emitted to the outside from the opening of the recess 24. As a result, occurrence of color unevenness in light emission from the LED module 20 is suppressed.

  Moreover, in this Embodiment, as shown to (a)-(c) of FIG. 2 and FIG. 4, the recessed part 24 is provided in the position facing each of several LED22 in the back surface of the board | substrate 21. FIG. .

  That is, in the substrate 21, the recesses 24 are provided on the back surface corresponding to the plurality of LEDs 22 on the main surface.

  As a result, for example, the wavelength conversion is performed rather than arranging the material including the second wavelength conversion material 25 (the wavelength conversion material-containing material) so as to collectively cover the positions on the back side of the plurality of LEDs 22 arranged in a matrix. Light loss inside the material-containing material is reduced, and the light extraction efficiency on the back surface of the substrate 21 is improved.

  Further, the amount and thickness of the wavelength conversion material-containing material disposed corresponding to each of the plurality of LEDs 22 are regulated by the shape and size of the inner surface of the recess 24. That is, the amount of the wavelength conversion material-containing material in each of the plurality of recesses 24 is made uniform. As a result, the color of the light emitted from each recess 24 is made uniform.

  Moreover, since the part in which the recessed part 24 of the board | substrate 21 was formed becomes thinner than another part, the transmittance | permeability of light improves rather than the said other part. Therefore, even when a relatively inexpensive white alumina substrate is employed as the substrate 21, the light flux on the back side of the substrate 21 can be increased.

  That is, it can be expressed that the effect of disposing the concave portion 24 in which the second wavelength conversion material 25 is accommodated on the substrate 21 can suppress the leakage of blue light from the back surface of the substrate 21. It can also be expressed that the luminous flux of white light emitted from the back surface of the substrate 21 can be increased.

  Further, since the wavelength conversion material-containing material can be completely embedded in the recess 24 provided in a recessed shape on the back surface of the substrate 21, the wavelength conversion material-containing material is arranged in a state where it does not protrude from the back surface of the substrate 21. can do. Simply put, it is possible to keep the back surface of the substrate 21 substantially flat.

  Therefore, it is possible to attach the LED module 20 to the support column 40 having the relatively large end surface 45. In this case, since the contact area between the LED module 20 and the column 40 increases, for example, the heat radiation efficiency by the column 40 is further improved.

  Note that the material forming the sealing member 23 and the material accommodated in the recess 24 do not have to be the same. For example, the types or concentrations of phosphors or resins contained in these materials may be different.

  Moreover, adjusting the density | concentration of the fluorescent substance particle contained in fluorescent substance containing resin accommodated in the recessed part 24, or adjusting the volume (amount of fluorescent substance containing resin accommodated in the recessed part 24) etc. For example, the color of the light emitted from the recess 24 can be adjusted.

  For example, in the case of using the same phosphor-containing resin as the material for forming the sealing member 23 and the material to be disposed in the recess 24 from the viewpoint of suppressing the production cost, the recess 24 can be adjusted by adjusting the volume of the recess 24. The color of the light emitted through the can be adjusted. For example, by adjusting the depth of the recess 24, the color of light emitted from the back surface side of the substrate 21 can be made closer to the color of light emitted from the main surface side of the substrate 21.

  Moreover, as a part of the material of the material accommodated in the sealing member 23 and the recess 24, an organic material such as a fluorine resin may be used instead of the above-described translucent material such as a silicone resin. Alternatively, an inorganic material such as sol-gel glass may be used. Further, a light diffusing material such as silica particles may be dispersed inside the material accommodated in the sealing member 23 and the recess 24.

  Furthermore, in the present embodiment, as shown in FIG. 4A, the opening of the recess 24 (represented by a dotted rectangle in FIG. 4A) is orthogonal to the thickness direction of the substrate 21. The size in the plane (XY plane) is a size including the LED 22 when the substrate 21 is seen through from the direction of the main surface.

  That is, the recess 24 is provided on the back surface of the substrate 21 so as to cover a region corresponding to the lower side of the LED 22. Therefore, the leakage of blue light from the back surface of the substrate 21 is more reliably suppressed.

  As described above, the LED module 20 according to the present embodiment includes the light-transmitting substrate 21, the LED 22 disposed on the main surface of the substrate 21, the sealing member 23 that seals the LED 22, and the substrate 21. And a recess 24 provided at a position facing the sealing member 23 on the back surface of the substrate.

  The sealing member 23 includes a first wavelength conversion material 23 a that converts the wavelength of light emitted from the LED 22, and the recess 24 is a second wavelength conversion material that converts the wavelength of light emitted from the LED 22 and transmitted through the inside of the substrate 21. 25 is accommodated.

  The LED module 20 adopts the above-described configuration to change the color of light emitted from the back surface side of the substrate 21 to light emitted from the main surface side of the substrate 21, that is, light emitted from the sealing member 23. It becomes possible to match to the color of. As a result, occurrence of color unevenness in light emission from the LED module 20 is suppressed.

  Further, by using an inexpensive white substrate such as a white alumina substrate as the substrate 21, it is possible to obtain the LED module 20 that realizes cost reduction and suppresses the occurrence of color unevenness.

  Further, when the material forming the sealing member 23 and the material accommodated in the recess 24 are made common (for example, the above-described phosphor-containing resin), for example, the production cost of the LED module 20 is reduced or the production efficiency is improved. Etc. are planned.

  Further, since the material including the second wavelength conversion material 25 is accommodated in the recess 24 on the back surface of the substrate 21, the size and shape of the end surface of the column connected to the back surface of the substrate 21 and the degree of freedom regarding the connection position. It is possible to provide the LED module 20 having a high value.

  The light bulb shaped lamp 1 of the present embodiment includes an LED module 20, a translucent globe 10, and a support column 40 provided so as to extend inward of the globe 10, and the LED module 20 includes: , Fixed to the support column 40 so as to be disposed in the globe 10.

  With this configuration, for example, a light bulb shaped lamp 1 having light distribution characteristics similar to an incandescent light bulb is realized.

(Modification 1)
Next, a first modification of the embodiment will be described with reference to FIG.

  FIG. 5 is a diagram illustrating a configuration of the LED module 20a according to the first modification of the embodiment.

  5 (a) is a partial top view of the LED module 20a, and FIG. 5 (b) is a view showing a CC cross section in FIG. 5 (a).

  Unlike the LED module 20 according to the embodiment, the LED module 20a according to the first modification shown in FIG. 5 has a recess 24a provided in a long shape on the back surface of the substrate 21 along the direction in which the plurality of LEDs 22 are arranged. It has been.

  That is, a long concave portion 24 a is provided in the same direction as the sealing member 23 at a position facing the sealing member 23 that collectively seals the plurality of LEDs 22 arranged in a row. In this case, the recess 24 a can also be expressed as a groove provided on the back surface of the substrate 21.

  By providing the recess 24a shown in FIG. 5 on the back surface of the substrate 21, for example, light that diffuses or reflects in the sealing member 23 and enters the substrate 21 is emitted from the back surface of the substrate 21 without being converted in wavelength. Is suppressed.

(Modification 2)
Next, Modification 2 of the embodiment will be described with reference to FIG.

  FIG. 6 is a diagram illustrating a configuration of an LED module 20b according to the first modification of the embodiment.

  6 (a) is a partial top view of the LED module 20b, and FIG. 6 (b) is a diagram showing a DD cross section in FIG. 6 (a).

  In the LED module 20b according to Modification 2 shown in FIG. 6, when the substrate 21 is seen through from the upper surface, the recess 24b is disposed on the back surface of the substrate 21 so as to straddle the two adjacent sealing members 23.

  That is, in the LED module 20b according to Modification 2, the recess 24b is provided on the back surface of the substrate 21 in a long shape along the alignment direction of the two LEDs 22 aligned in the Y-axis direction. Thereby, the light which diffused or reflected in the sealing member 23 and entered the substrate 21 is suppressed from being emitted from the back surface of the substrate 21 without being wavelength-converted.

  In addition, the recessed part 24b may be provided in the elongate shape in the back surface of the board | substrate 21 along the arrangement direction of four LED22 arranged in the Y-axis direction. That is, when the substrate 21 is seen through from the upper surface, the recess 24 b may be disposed on the back surface of the substrate 21 so as to straddle the four sealing members 23.

  Even when the recess 24b is arranged in this way, the back surface of the substrate 21 can be maintained substantially flat. Therefore, the end surface 45 of the support column 40 is bonded to, for example, the central portion of the back surface of the substrate 21. It is possible to connect by an agent or the like.

  As described above, as described in Modifications 1 and 2 of the embodiment, the recesses (24a, 24b) arranged on the back surface of the substrate 21 are arranged along the alignment direction of at least two LEDs 22 of the plurality of LEDs 22. The back surface of the substrate 21 may be provided in a long shape.

  That is, on the back surface of the substrate 21, it is not necessary to provide one recess corresponding to each of the plurality of LEDs 22, and one recess may be provided corresponding to two or more LEDs 22.

  Thereby, for example, since the second wavelength conversion material 25 is also disposed on the back side of the region between the two adjacent LEDs 22, the leakage of blue light from the back surface of the substrate 21 is more reliably suppressed. Moreover, the work efficiency concerning arrangement | positioning of the 2nd wavelength conversion material 25 to the back surface side of the board | substrate 21 is improved.

(Modification 3)
Next, Modification 3 of the embodiment will be described with reference to FIG.

  FIG. 7 is a diagram illustrating a correspondence relationship between the LED module 20 and the column 40a according to the third modification of the embodiment.

  7A is a bottom view of the LED module 20 (a view of the LED module 20 viewed from the back side (Z-axis negative side)), and FIG. 7B is a diagram of FIG. It is a figure which shows the EE cross section in (a).

  The LED module 20 according to the modified example 3 shown in FIG. 7 is connected to a column 40a having a diameter d larger than the column 40 in the embodiment.

  Therefore, as shown in FIG. 7A, one or more recesses 24 are included in the column contact area 21 a that is in contact with the end surface of the column 40 a on the back surface of the substrate 21. That is, the column 40 a fixes the LED module 20 in a state where the end surface of the column 40 a is connected to the column contact region 21 a including at least one recess 24 on the back surface of the substrate 21.

  That is, as described above, since the material including the second wavelength conversion material 25 is accommodated in the concave portion 24, even when the column contact region 21 a includes one or more concave portions 24, It is possible to connect the column 40a having a planar end surface and the substrate 21 with an adhesive or the like.

  Here, when the support | pillar 40a has translucency, the case where highly transparent materials, such as an acryl or transparent ceramics, are employ | adopted as a raw material of the support | pillar 40a specifically, is assumed. In this case, light emitted from the one or more recesses 24 included in the support column contact region 21a enters the support column 40a from the end surface of the support column 40a and is emitted from the peripheral surface of the support column 40a.

  That is, in this case, the support column 40a can function as a light guide. As a result, for example, the total luminous flux in the light bulb shaped lamp 1 including the LED module 20 and the support column 40a can be improved.

  In addition, the effect by the support | pillar 40a which has translucency is exhibited even if the LED modules 20a and 20b which concern on said modification 1 and 2 are connected to the support | pillar 40a.

(Other)
Although the LED module and the light bulb shaped lamp according to the present invention have been described based on the embodiments and the modifications thereof, the present invention is not limited to these embodiments and modifications.

  For example, fine unevenness may be formed on the inner surface of the recess 24 included in the LED module 20 in the above embodiment.

  FIG. 8 is a diagram illustrating an example of a cross-sectional shape of a recess 24 c having an uneven portion 26 on the inner surface.

  As shown in FIG. 8, the concave / convex portion 26 is formed on the inner surface of the concave portion 24c and formed by arranging a plurality of fine concave shapes or convex shapes.

  As described above, the uneven portion 26 is arranged on the inner surface of the concave portion 24c, so that the total reflection amount of the light emitted from the LED 22 and transmitted through the inside of the substrate 21 at the boundary surface where the uneven portion 26 is arranged is reduced. As a result, the light extraction efficiency in the recess 24c is improved.

  That is, the light fluxes on the back surface side of the substrate 21 can be increased by disposing the uneven portions 26 on the inner surface of each recess 24 c disposed on the back surface of the substrate 21.

  The shape of the concavo-convex portion 26 is not particularly limited. For example, the concavo-convex portion 26 may be formed by arranging a plurality of hemispherical holes or hemispherical protrusions.

  Moreover, the effect by this uneven | corrugated | grooved part 26 is exhibited even when the uneven | corrugated | grooved part 26 is arrange | positioned on the inner surface of the recessed parts 24a and 24b in the modification 1 and 2 of embodiment.

  Moreover, as for the recessed parts, such as the recessed part 24, all have a rectangular cross section (refer FIGS. 4-6). However, the cross-sectional shape of the recess may be other than a rectangle.

  FIG. 9 is a diagram illustrating an example of a cross-sectional shape including a curve of the concave portion.

  Specifically, FIG. 9 shows a recess 24d having a semi-elliptical cross section. That is, the inner surface of the concave portion 24d is a curved surface.

  As described above, since the inner surface of the recess 24d is formed of a curved surface, the total reflection amount at the inner surface boundary of the recess 24d of the light emitted from the LED 22 and transmitted through the substrate 21 is reduced. As a result, the light in the recess 24d is reduced. The extraction efficiency is improved.

  It should be noted that fine unevenness such as the uneven portion 26 shown in FIG. 8 may be formed on the inner surface of the recess 24d.

  In addition, the entire inner surface of the recess 24d does not have to be a curved surface, and the inner surface of the recess 24d may be configured by a combination of a flat surface and a curved surface.

  In addition, various shapes are adopted as the shape of the recesses provided in the substrate 21 of the LED modules 20, 20a, and 20b (hereinafter referred to as “LED module 20 etc.”), such as recesses having a polygonal shape other than a rectangle. Can do. The shape of the opening need not be a rectangle like the recess 24 (see, for example, FIG. 4A), and the substrate 21 has various shapes such as a polygon, an ellipse, or a perfect circle other than the rectangle. It can be adopted as the opening shape.

  In the LED module 20 or the like, a plurality of LEDs 22 are arranged on the main surface of the substrate 21. However, the LED module 20 or the like may include at least one LED 22 and at least one concave portion (concave portion 24 or the like) disposed on the back surface of the substrate 21 corresponding to the at least one LED 22.

  Further, for example, as in the LED module 20 in the embodiment, when the contact area of the back surface of the substrate 21 with the end surface 45 of the support column 40 does not overlap with the area where the recess 24 is disposed, the second wavelength conversion material 25. The material containing may not be completely accommodated in the recess 24.

  That is, a part of the phosphor-containing resin may be exposed to the outside from the opening of the recess 24 as a result of pouring the phosphor-containing resin into the recess 24.

  Moreover, in said embodiment and modification, it was supposed that LED module 20 grade | etc., Was equipped with LED22 which is a blue LED chip.

  In addition, each of the sealing member 23 and the recess 24 included in the LED module 20 and the like includes yellow phosphor particles as a wavelength conversion material. That is, in the LED module 20 or the like, white light is emitted by a combination of a blue LED chip (LED 22) and yellow phosphor particles.

  However, the combination of the emission color of the LED 22 and the type of wavelength conversion material is not limited to this.

  For example, the LED module 20 or the like may employ a red phosphor and a green phosphor as wavelength conversion materials, and emit white light by combining this with the LED 22 that is a blue LED chip.

  Further, as the LED 22, an LED chip that emits a color other than blue may be employed. For example, when an LED chip that emits ultraviolet rays is used as the LED 22, a combination of phosphor particles that emit light in three primary colors (red, green, and blue) is employed as the phosphor particles that are employed as the wavelength conversion material.

  Furthermore, materials other than the phosphor particles may be employed as the wavelength conversion material. For example, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, may be used as the wavelength conversion material.

  Moreover, in said embodiment and modification, LED22 does not need to be LED chip itself. The LED 22 may be, for example, an SMD (Surface Mount Device) type LED including a package having an upper surface opened and an LED chip disposed in the package.

  Moreover, in said embodiment and modification, it was supposed that LED chip (LED22) was employ | adopted as a light emitting element which is light sources, such as LED module 20. FIG. However, a semiconductor light emitting element such as a semiconductor laser, an organic EL (Electro Luminescence), an inorganic EL, or the like may be employed as the light emitting element included in the LED module 20 or the like.

  In the above embodiment, the size of the globe 10 is larger than the size of the resin case 60 (see, for example, FIG. 1). However, for example, the above-described LED module 20 or the like can be employed as a light emitting device for a light bulb shaped lamp in which the size of the globe 10 is smaller than the size of the resin case 60.

  In the above-described embodiment, the light bulb shaped lamp 1 employing the LED module 20 as a light emitting device has been described. However, the LED module 20 according to the embodiment and the modified example includes a straight tube lamp, a round lamp, or the like. It may be employed as a light emitting device in the illumination light source. Further, the LED module 20 or the like may be used as a light emitting device in equipment other than the lamp.

  Moreover, this invention can also be implement | achieved not only as an illumination light source provided with either of LED module 20 grade | etc., But as an illuminating device provided with the said light source for illumination.

  For example, this invention can be comprised as an illuminating device provided with said lightbulb-shaped lamp 1 and the lighting fixture to which the said lightbulb-shaped lamp 1 is attached.

  In this case, the lighting fixture is a fixture that turns off and turns on the illumination light source, and includes, for example, a fixture body attached to the ceiling and a cover that covers the illumination light source. Of these, the appliance main body has a socket for powering the illumination light source as well as a base for the illumination light source.

  In addition, as long as it does not deviate from the gist of the present invention, various modifications conceived by those skilled in the art are applied to the present embodiment and the modified examples, or a form constructed by combining the constituent elements in the embodiments and modified examples, It is included within the scope of the present invention.

  INDUSTRIAL APPLICABILITY The present invention is useful as a lamp having a light emitting element such as an LED, in particular, a light bulb shaped lamp that replaces a conventional incandescent light bulb or the like, and can be widely used as a light source of equipment in a lighting device or the like.

DESCRIPTION OF SYMBOLS 1 Light bulb-shaped lamp 10 Globe 11 Opening part 20, 20a, 20b LED module 21 Board | substrate 21a Support | pillar contact area 23 Sealing member 23a First wavelength conversion material 24, 24a, 24b, 24c, 24d Concavity 25 Second wavelength conversion material 26 Concavity and convexity Part 30 Base 40, 40a Post 45 End face 50 Support plate 60 Resin case 61 First case part 62 Second case part 70 Lead wire 80 Lighting circuit

Claims (9)

A light emitting device disposed on a main surface of the substrate;
A sealing member that seals the light emitting element, and includes a first wavelength conversion material that converts a wavelength of light emitted from the light emitting element; and
Light that is emitted from the light emitting element and transmitted through the inside of the substrate is a concave portion provided in a concave shape at a position facing the light emitting element on the back surface that is the surface opposite to the main surface of the substrate. A light-emitting device comprising: a recess that houses a second wavelength conversion material that converts the wavelength of the light. 2. The light emitting device according to claim 1, wherein a size of the opening of the recess in a plane perpendicular to the thickness direction of the substrate is a size including the light emitting element when the substrate is seen through from the direction of the main surface. . A plurality of the light emitting elements are disposed on the main surface of the substrate,
The light emitting device according to claim 1, wherein the concave portion is provided at a position facing each of the plurality of light emitting elements on the back surface of the substrate. A plurality of the light emitting elements are disposed on the main surface of the substrate,
The light emitting device according to claim 1, wherein the concave portion is provided in a long shape on the back surface along an arrangement direction of at least two of the plurality of light emitting elements. The first wavelength conversion material and the second wavelength conversion material are the same material,
The sealing member is formed of a wavelength conversion material-containing resin including the first wavelength conversion material,
The light emitting device according to claim 1, wherein the wavelength conversion material-containing resin is accommodated in the recess. The light emitting device according to any one of claims 1 to 5, wherein an uneven portion formed by arranging a plurality of concave shapes or convex shapes is formed on an inner surface of the concave portion. The light emitting device according to any one of claims 1 to 6,
Translucent gloves,
A post provided to extend inward of the globe,
The light emitting device is fixed to the support so as to be disposed in the globe. The illumination light source according to claim 7, wherein the column has translucency. The illumination light source according to claim 8, wherein the support column fixes the light emitting device in a state where an end surface of the support column is connected to an area including at least one of the recesses on the back surface of the substrate.

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