CN203367266U - Encapsulation structure for buffering chip surface solder dosage - Google Patents

Abstract

The utility model relates to a packaging structure for buffering the amount of solder on the surface of a chip. The supporting area at one end of the first lead bar is connected to the lower surface of the rectifier chip, and the lower surface of the rectifying chip is electrically connected to the supporting area of the first lead bar through solder paste. connection; the welding zone at one end of the second lead bar is connected to the first welding surface of the connecting piece; there is an intermediate zone between the first welding surface and the second welding surface of the connecting piece, and this intermediate zone is connected to the first welding surface and the second welding surface A first bend and a second bend are respectively provided between the two welding surfaces, the end surfaces on both sides opposite to the second welding surface of the connecting piece have strip-shaped notches, and a second through hole is located at the second bend On the second welding surface and the middle zone, the second through hole crosses the second bend and extends to the edge area of the second welding surface and the middle zone. The package structure of the utility model can self-adaptively absorb excess solder, which not only ensures that the welding area has a sufficient area of solder, but also avoids product failure caused by overflowing the solderable area due to the excessive amount of solder, and improves the electrical properties, reliability and goodness of the product. Rate.

Description

Package structure for buffering the amount of solder on the chip surface

technical field

The utility model relates to a semiconductor packaging device, in particular to a packaging structure for buffering the amount of solder on the surface of a chip.

Background technique

The rectifier uses the unidirectional conductivity of the diode to rectify alternating current, so it is widely used in circuits that convert alternating current into direct current.

When designing and developing semiconductor products with connecting sheet structure, in order to improve the conductivity of the chip surface of high-power devices and improve the key electrical characteristics of the device, it is necessary to design the area of the connecting sheet and the chip welding part to be large enough. The connecting sheet and the upper surface of the chip are welded together by solder. Limited by the matching of the bonding pad-chip bonding area and the surface area of the chip, the control of the amount of solder becomes a key process parameter. Too little solder can lead to poor electrical characteristics of the device, and too much solder can cause short circuits or early reliability failures in the device. In the prior art, various electrical properties tend to decline with the extension of time. especially

Therefore, how to develop a rectifier chip packaging structure that can solve the above problems has become the direction of efforts of those skilled in the art.

Contents of the invention

The purpose of the utility model is to provide a packaging structure for buffering the amount of solder on the surface of the chip. The packaging structure for buffering the amount of solder on the surface of the chip can self-adaptively absorb excess solder, which not only ensures that the welding area has a sufficient area of solder, It also avoids the failure of the product caused by overflowing the solderable area due to the excessive amount of solder, and improves the electrical properties, reliability and yield of the product.

In order to achieve the above purpose, the technical solution adopted by the utility model is: a packaging structure for buffering the amount of solder on the surface of the chip, including the first lead bar, the second lead bar, the connecting piece and the rectifier chip located in the epoxy package, The support area at one end of the first lead bar is connected to the lower surface of the rectifier chip, the lower surface of the rectifier chip is electrically connected to the support area of the first lead bar through solder paste, and the other end of the first lead bar is used as a lead for device current transmission. foot area;

The welding area located at one end of the second lead bar is connected to the first welding surface of the connecting sheet, and the other end of the second lead bar is used as a pin area for device current transmission; the second welding surface of the connecting sheet is connected to the upper surface of the rectifier chip Electrical connection via solder paste;

There is an intermediate area between the first welding surface and the second welding surface of the connecting piece, and a first bending position and a second bending area are respectively provided between the intermediate area and the first welding surface and the second welding surface , so that the height of the middle zone is higher than the first welding surface and the second welding surface, and the opposite end surfaces of the second welding surface of the connecting sheet have strip-shaped notches; the second welding surface is evenly distributed with several first welding surfaces. A through hole and a second through hole are located on the second bending position, the second welding surface and the middle area, and the second through hole crosses the second bending position and extends to the edge area of the second welding surface and the middle area.

The scheme of further improvement in above-mentioned technical scheme is as follows:

1. In the above scheme, the height of the first welding surface of the connecting piece is lower than the height of the second welding surface.

2. In the above scheme, the included angle between the first bend, the second bend and the middle area is 125°~145°.

Due to the application of the above-mentioned technical solutions, the utility model has the following advantages and effects compared with the prior art:

1. This utility model is used to buffer the packaging structure of the chip surface solder consumption. There is an intermediate area between the first welding surface and the second welding surface of the connecting piece. The first bend and the second bend are respectively provided in between, so that the height of the middle zone is higher than the first welding surface and the second welding surface, and the opposite side end surfaces of the second welding surface of the connecting piece have strips Shaped gap, under the condition of not reducing the contact area and increasing the resistance, it can adaptively absorb the excess solder, thereby preventing the solder from entering the non-soldering area, which not only ensures that the soldering area has a sufficient area of solder, but also avoids due to the amount of solder Too many and overflowing solderable areas cause product failure and short circuit, which improves the electrical properties and reliability of the product and greatly improves the yield rate.

2. The utility model is used to buffer the packaging structure of the chip surface solder consumption. There is an intermediate area between the first welding surface and the second welding surface of the connecting sheet, and the intermediate area is connected to the first welding surface and the second welding surface. The first bend and the second bend are respectively provided in between, so that the height of the middle zone is higher than the first welding surface and the second welding surface, and the opposite side end surfaces of the second welding surface of the connecting piece have strips There are a number of first through holes evenly distributed on the second welding surface; it can prevent the solder from entering the non-welding area, avoid product failure and short circuit caused by overflowing the weldable area due to a large amount of solder, and improve the electrical performance of the product. And the reliability greatly improves the yield rate. There are several first through holes evenly distributed on the second soldering surface. Since the first through hole covers the overflowing solder, it prevents the solder from overflowing at the edge of the soldering surface. The first through hole in the connecting piece is used. The side area reduces the contact resistance and response time, reduces power consumption, and also strengthens the connection strength between the connection piece and the rectifier chip.

3. This utility model is used to buffer the packaging structure of the chip surface solder consumption, and the two end faces of the connecting piece opposite to the second welding surface have strip-shaped gaps; the second welding surface is evenly distributed with a number of first through holes , a second through hole is located on the second bend, the second welding surface, and the middle area, and the second through hole spans the second bend and extends to the edge area of the second welding surface and the middle area; further prevents solder Entering the non-soldering area, avoiding product failure and short circuit caused by overflowing the solderable area due to a large amount of solder, improving the electrical properties and reliability of the product and greatly improving the yield rate. There are several first through holes evenly distributed on the second welding surface due to The through hole covers the overflowing solder, prevents the solder from overflowing at the edge of the soldering surface, reduces contact resistance and response time, and reduces power consumption.

Description of drawings

Accompanying drawing 1 is a schematic diagram 1 of the prior art packaging structure;

Accompanying drawing 2 is the second schematic diagram of the packaging structure of the prior art;

Accompanying drawing 3 is the package structure schematic diagram that the utility model is used for buffering the amount of solder on the surface of the chip;

Accompanying drawing 4 is the schematic diagram of A-A sectional structure in accompanying drawing 3.

In the above drawings: 1, the first lead bar; 11, the supporting area; 2, the second lead bar; 21, the welding area; 3, the connecting piece; 31, the first welding surface; 32, the second welding surface; 33, Middle area; 34, first bend; 35, second bend; 4, rectifier chip; 5, lead area; 6, strip notch; 7, first through hole; 8, solder; Two through holes.

Detailed ways

Below in conjunction with accompanying drawing and embodiment the utility model is further described:

Embodiment: A packaging structure for buffering the amount of solder on the chip surface, including a first lead bar 1, a second lead bar 2, a connecting piece 3 and a rectifier chip 4 located in an epoxy package, one end of the first lead bar 1 The support area 11 of the rectifier chip 4 is connected to the lower surface of the rectifier chip 4, and the lower surface of the rectifier chip 4 is electrically connected to the support area 11 of the first lead bar 1 through solder paste, and the other end of the first lead bar 1 is used as a lead for device current transmission. foot zone 5;

The welding area 21 located at one end of the second lead bar 2 is connected to the first welding surface 31 of the connecting piece 3, and the other end of the second lead bar 2 is used as the pin area 5 for device current transmission; the second connecting piece 3 The welding surface 32 is electrically connected to the upper surface of the rectifier chip 4 through solder paste;

There is an intermediate zone 33 between the first welding surface 31 and the second welding surface 32 of the connecting piece 3, and a first bend is respectively provided between the intermediate zone 33 and the first welding surface 31 and the second welding surface 32. 34 and the second bend 35, so that the height of the middle zone 33 is higher than the first welding surface 31 and the second welding surface 32, and the two side end surfaces opposite to the second welding surface of the connecting piece 3 have strip-shaped gaps 6. The second welding surface 32 is evenly distributed with a number of first through holes 7, and a second through hole 9 is located on the second bend 35, the second welding surface 32, and the middle area 33. The second through hole 9 crosses the second bend 35 and extends to the second welding surface 32 and the edge area of the middle zone 33 .

The height of the first welding surface 31 of the connecting piece 3 is lower than that of the second welding surface 32 .

The above-mentioned first bending position 34 , the second bending position 35 and the middle area 33 form an angle of 125°-145°.

When the above packaging structure for buffering the amount of solder on the surface of the chip is adopted, there is an intermediate zone between the first soldering surface and the second soldering surface of the connecting sheet, and the intermediate zone is separated from the first soldering surface and the second soldering surface. A first bend and a second bend are provided, so that the height of the middle zone is higher than the first welding surface and the second welding surface, and the end surfaces on both sides opposite to the second welding surface of the connecting piece have strip-shaped notches , under the condition of not reducing the contact area and increasing the resistance, it can adaptively absorb excess solder, thereby preventing the solder 8 from entering the non-soldering area, which not only ensures that the soldering area has a sufficient area of solder 8, but also avoids solder 8 A large amount overflows the weldable area, causing product failure and short circuit, which improves the electrical properties and reliability of the product and greatly improves the yield; secondly, there is an intermediate area between the first welding surface and the second welding surface of the connecting piece. A first bend and a second bend are respectively provided between the middle zone and the first welding surface and the second weld surface, so that the height of the middle zone is higher than the first weld surface and the second weld surface, and the connecting piece There are strip-shaped gaps on both sides of the second welding surface opposite to the second welding surface; several first through holes are evenly distributed on the second welding surface to prevent the solder 8 from overflowing at the edge of the welding surface, and the first through holes in the connecting piece are used. The side area is small, the contact resistance and response time are reduced, the power consumption is reduced, and the connection strength between the connection piece and the rectifier chip is also strengthened.

The above-mentioned embodiments are only to illustrate the technical concept and characteristics of the present utility model, and its purpose is to enable those familiar with this technology to understand the content of the present utility model and implement it accordingly, and not to limit the protection scope of the present utility model. All equivalent changes or modifications made according to the spirit of the utility model shall fall within the protection scope of the utility model.

Claims (3)

1. A packaging structure for buffering the amount of solder on the surface of the chip, including the first lead bar (1), the second lead bar (2), the connecting piece (3) and the rectifier chip (4) located in the epoxy package, The support area (11) at one end of the first lead bar (1) is connected to the lower surface of the rectifier chip (4), and the lower surface of the rectifier chip (4) is connected to the support area of the first lead bar (1) through solder paste (11) Electrical connection, the other end of the first lead bar (1) serves as the pin area (5) for device current transmission; The welding area (21) at one end of the second lead bar (2) is connected to the first welding surface (31) of the connecting piece (3), and the other end of the second lead bar (2) is used as a pin for device current transmission area (5); the second welding surface (32) of the connecting piece (3) is electrically connected to the upper surface of the rectifier chip (4) through solder paste; It is characterized in that: there is an intermediate area (33) between the first welding surface (31) and the second welding surface (32) of the connecting piece (3), and the intermediate area (33) and the first welding surface (31 ) and the second welding surface (32) are respectively provided with a first bend (34) and a second bend (35), so that the height of the middle zone (33) is higher than that of the first weld surface (31) and The second welding surface (32), the end surfaces on both sides opposite to the second welding surface of the connecting piece (3) have strip-shaped notches (6); the second welding surface (32) is evenly distributed with several first A through hole (7), a second through hole (9) is located on the second bend (35), the second welding surface (32), and the middle area (33), and the second through hole (9) spans the first The second bend (35) extends to the second welding surface (32) and the edge area of the middle zone (33). 2. The package structure according to claim 1, characterized in that: the height of the first soldering surface (31) of the connecting piece (3) is lower than the height of the second soldering surface (32). 3. The package structure according to claim 1, characterized in that: the included angle between the first bend (34), the second bend (35) and the middle area (33) is 125°-145°.

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