CN201700119U - Microporous plate for heat radiation - Google Patents

Abstract

The utility model discloses a micropore board for heat dissipation, including a plate body, this plate body includes relative first surface and second surface at least, is equipped with the micropore on this first surface, then is equipped with the depressed groove on this second surface again, and this depressed groove and this micropore link up mutually. The structure can effectively improve the heat dissipation efficiency of the heat dissipation device.

Description

Microporous sheet for heat dissipation

technical field

The utility model relates to a microporous plate for heat dissipation, in particular, a plate body is respectively provided with through recessed grooves and micropores, so as to effectively guide the external cold air to enter to generate heat convection and conduction, so as to improve its cooling efficiency.

Background technique

Currently common liquid crystal modules, LED lamps or other high-power electronic equipment will generate high temperature during use, which affects the use efficiency, and is prone to failure and shortens the service life. Therefore, it is necessary to install some cooling devices to reduce Due to the high temperature generated during its operation, common heat dissipation devices such as heat sinks, heat dissipation fans or coolant, etc., such devices must be driven by an external power supply to drive the action, or the installation space must be increased to accommodate the above heat dissipation devices, so when using above are limited.

After investigation, there is a new patent case No. M376807 "radiation device and its electronic computing system" announced by Taiwan, China on March 21, 2010, which discloses a first board body and a second board body, and the first board body and the A heat source is connected, the second board is connected with the first board through a connecting plate, and there is a heat dissipation space between the second board and the first board. The heat dissipation device can prevent the heat source from accumulating at the bottom, and can quickly dissipate the heat source into the air through the natural convection in the heat dissipation space; in addition, a plurality of heat dissipation holes are opened on the second board, and the heat dissipation holes can be elliptical Shaped, circular, polygonal or other openings with a combination of curves and straight lines to enhance the cooling effect. However, this prior patent only has some heat dissipation holes on the second board, so its heat dissipation efficiency is not good, and it cannot achieve comprehensive heat dissipation, so it is difficult to be used in devices that need heat dissipation for a long time.

There is also a new patent case No. M359909 "metal heat dissipation structure of electronic heating element and electronic device" announced by Taiwan, China on June 21, 2009, which discloses a metal heat dissipation structure of electronic heating element, which is suitable for an electronic device. The metal heat dissipation structure of the electronic heating element uses an etching process to form a plurality of micropores on at least one plane of the metal heat dissipation structure of the electronic heating element, by applying the metal heat dissipation structure of the electronic heating element to the electronic device , to produce natural convection heat conduction, to achieve a good heat dissipation effect, so that the metal heat dissipation structure of the electronic heating element has a higher heat dissipation area ratio; however, the previous patent proposal uses etching to form micropores, and the number of micropores is limited .

Utility model content

In view of the unsatisfactory heat dissipation efficiency of the current heat dissipation device, the utility model provides a microporous plate for heat dissipation.

In order to achieve the above object, the solution of the present utility model is:

A microporous plate for heat dissipation, including a plate body, the plate body at least includes a first surface and a second surface opposite, the first surface is provided with micropores, and the second surface is provided with a concave groove , the recessed groove and the micropore communicate with each other.

The plate body is provided with 80,000 to 500,000 microholes per square meter.

The number of microholes in the plate body is 250,000 to 400,000 per square meter.

Two mutually parallel first adjacent sides and another two mutually parallel second adjacent sides are connected between the first surface and the second surface.

The above-mentioned concave groove is opened between two first adjacent sides.

The above-mentioned concave grooves are regularly arranged parallel to the second adjacent side.

The above-mentioned concave grooves are respectively parallel to the first adjacent side and the second adjacent side, and are vertically staggered to each other.

The above-mentioned concave grooves are not parallel to the first adjacent side and the second adjacent side, but arranged obliquely and regularly.

At least one neck portion with tapered aperture is provided at the position between the micropore and the recessed groove.

The section of the above-mentioned concave groove is V-shaped, rectangular or arc-shaped.

The above-mentioned first surface is provided with a triangular inner concave part, the inner concave part is tapered from the first surface to the second surface to form another triangular flat part, and the intersection of the concave groove and the flat part is formed through the aforementioned micropore .

An insulating layer is arranged on the second surface of the plate body, in the recessed grooves and in the microholes.

The insulating layer on the second surface is an electrical insulating film.

After adopting the above structure, the utility model has the following advantages:

(1) The utility model utilizes the recessed grooves provided on the plate body to communicate with the micropores, so that the external cold air can be effectively introduced along the recessed grooves, and heat convection is generated through the micropores to improve its heat dissipation efficiency;

(2) In the utility model, 80,000 to 500,000 micropores are set on the plate body per square meter, which can greatly increase the surface area of the plate body to help heat dissipation;

(3) The utility model is provided with an insulating layer with good thermal conductivity, which is used as a contact surface to contact a heat source (such as a circuit board) with dispersed conductive points, which can effectively insulate and dissipate heat;

(4) The micropores of the present invention have necks with tapered pore diameters, which can cause the airflow between them to produce a Venturi effect and accelerate convection.

Description of drawings

Fig. 1 is a three-dimensional schematic diagram of the partial structure of the board body of the first embodiment of the present invention;

Fig. 2 is a schematic diagram of the second surface of the plate body attached to a heat source in the first embodiment of the present invention;

Fig. 3 is the X-X sectional view in Fig. 2 of the utility model;

Fig. 4 is the Y-Y sectional view in Fig. 2 of the utility model;

Fig. 5 is a broken line diagram of the temperature rise of the chip-on-chip LED heating source without installing the cooling device, installing the general aluminum plate and installing the utility model with the micro-hole plate body in the first embodiment of the present invention;

Fig. 6 is a broken line diagram of the temperature rise when the board is in close contact with and not in close contact with the heat source of the flip-chip LED in the first embodiment of the present invention;

Fig. 7 is a cross-sectional view of a micropore with a neck in the second embodiment of the present invention;

Fig. 8 is a three-dimensional schematic diagram of the partial structure of the board body of the third embodiment of the present invention;

Fig. 9 is a top view of the partial structure of the plate body of the third embodiment of the present invention;

Fig. 10 is a bottom view of the partial structure of the plate body of the third embodiment of the present invention;

Fig. 11 is a Z-Z sectional view in Fig. 9 of the present utility model;

Fig. 12 is a schematic diagram of the third embodiment of the present invention, where the board is set on the heat source of the flip-chip LED;

Fig. 13 is a schematic diagram of a rectangular cross-section of a recessed groove in the fourth embodiment of the present invention;

Fig. 14 is a schematic diagram of a fifth embodiment of the utility model with an arc-shaped concave groove section;

Fig. 15 is a schematic diagram of a regular arrangement of concave grooves parallel to the second adjacent side according to the sixth embodiment of the present invention;

Fig. 16 is a schematic diagram of the seventh embodiment of the utility model in which the concave grooves are parallel to the first adjacent side and the second adjacent side, and are vertically staggered with each other;

Fig. 17 is a schematic diagram of the eighth embodiment of the utility model in which the recessed grooves are not parallel to the first adjacent side and the second adjacent side, but arranged obliquely and regularly;

Fig. 18 is a schematic diagram of an insulating layer disposed on the second surface, in the recessed grooves, and in the micropores according to the ninth embodiment of the present invention.

Explanation of main component symbols

1 board body 11 first surface 12 second surface

13 The first adjacent side 14 The second adjacent side 15 Microholes

16 concave slots 1A plate body 15A microholes

16A concave groove 17A neck 1B board body

11B first surface 12B second surface 13B first adjacent edge

14B second adjacent side 15B inner concave part 16B plane part

17B sunken groove 18B micro-hole 1C plate body

16C concave groove 1D plate body 16D concave groove

1E board body 14E second adjacent side 16E recessed groove

1F board body 13F first adjacent side 14F second adjacent side

16F concave groove 1G board body 13G first adjacent side

14G second adjacent side 16G concave groove 1H board body

12H second surface 16H concave groove 15H micropore

2H insulation layer A heat source

Detailed ways

First of all, please refer to FIG. 1, which is the first embodiment of the present utility model. It is mainly provided with a plate body 1 made of metal, and the plate body 1 is provided with at least one opposite first surface 11 and a second surface 12. Two mutually parallel first adjacent sides 13 and other two mutually parallel second adjacent sides 14 are respectively connected between the first surface 11 and the second surface 12. In addition, several Regularly arranged microholes 15, the plate body 1 is provided with 80,000 to 500,000 microholes 15 per square meter, and the number of microholes 15 in its best embodiment is 250,000 to 500,000 to 500,000 per square meter. 400,000, in addition, on the second surface 12, there are several regularly arranged and V-shaped concave grooves 16 between the two first adjacent sides 13, and these concave grooves 16 are parallel to the two second adjacent sides 14, Moreover, the depressed grooves 16 communicate with all the micropores 15 respectively.

When in use, as shown in Figure 2, Figure 3 and Figure 4, the second surface 12 of the board body 1 is pasted on a heat source A, which can be a liquid crystal module, an LED lamp, a flip-chip LED or For other high-power electronic equipment, when the heat source A works, the heat energy generated can pass through the recessed groove 16 on the second surface 12 to effectively introduce the cold air from the outside into the micropore 15 to generate flow, and the heat source A The heat energy on the surface is brought out by thermal convection to improve the heat dissipation efficiency of the heat source A, and the use of the microholes 15 and the intersecting recessed grooves 16 can greatly increase the surface area of the plate body 1 for heat dissipation, and also contribute to the interaction with the cold air during heat dissipation. The contact area is increased, which further increases the heat dissipation efficiency.

The utility model has been tested through experiments. Only a general aluminum plate is installed as a chip-on-chip LED heat source for heat dissipation, and the plate body 1 with microholes 15 of the utility model is installed as a chip-on-chip LED heat source for heat dissipation. When working Observing the temperature distribution respectively, the temperature distribution of the two can be clearly seen in the infrared thermal induction photo of the heat distribution. The temperature distribution of the plate body 1 of the present invention is relatively average and the working temperature is low, so it can be proved that the present invention The heat dissipation efficiency of the utility model is far better than that of general aluminum plates.

Please refer to Fig. 5 again, which is a flip-chip LED heat source without any heat dissipation device, a flip-chip LED heat source with a general aluminum plate, and a flip-chip LED heat source with a micro-hole 15 plate body 1 of the present invention. Source, the broken line graph of the temperature rise of the three during work, it can still be easily seen through comparison that the average temperature of the board body 1 with microholes 15 of the present invention is far superior to other boards that do not install any heat dissipation devices and install general aluminum boards The average temperature of the flip-chip LED heat source is enough to prove that the utility model can achieve the best heat dissipation efficiency.

Please also refer to Fig. 6, which is to test the operation of the flip-chip LED heat source in two different ways that the board body 1 of the present invention is in close contact with the flip-chip LED heat source and not in close contact with the flip-chip LED heat source. From the broken line diagram of the temperature rise during heat dissipation, it can be clearly seen that the heat dissipation efficiency is the best when the board body 1 is in close contact with the heat source of the flip-chip LED.

In the second embodiment of the present invention, as shown in FIG. 7, at least one neck 17A with tapered aperture is provided at the position between the microhole 15A provided on the plate body 1A and the recessed groove 16A. The structure of 17A can make the air flow produce Venturi effect, accelerate the flow speed of its heat convection, thereby improving its heat dissipation efficiency.

The third embodiment of the present utility model, as shown in Fig. 8, Fig. 9 and Fig. 10, this embodiment is provided with a plate body 1B made of metal, and the plate body 1B is provided with at least one opposite first surface 11B and a second surface 12B, two mutually parallel first adjacent sides 13B and other two mutually parallel second adjacent sides 14B are respectively connected between the first surface 11B and the second surface 12B, and the first surface 11B utilizes The stamping method is formed with several triangular inner concave parts 15B, and the inner concave part 15B is tapered from the first surface 11B to the second surface 12B to form another triangular flat part 16B, and the second surface 12B is between the two second surfaces. A hollow groove 17B with a V-shaped cross section is also formed by stamping between an adjacent side 13B, and a microhole 18B (as shown in FIG. 11 ) is formed through the intersection of the sunken groove 17B and the flat portion 16B. 80,000 to 500,000 microholes 18B are set on the body 1B, and the number of microholes 18B in the best embodiment is 250,000 to 400,000 per square meter, and the microholes 18B Nearly rectangular.

When in use, as shown in Figure 12, the second surface 12B of the board body 1B is pasted on a heat source A, which can be a liquid crystal module, LED lamp, flip-chip LED or other high-power electronic equipment , when the heat source A works, the heat energy generated can be conducted to the first surface 11B via the second surface 12B, using the microhole 18B formed on the plate body 1B and the inner concave part 15B connected to the microhole 18B And the recessed groove 17B can effectively introduce the cold air from the outside to generate heat convection, and can greatly increase the surface area of the plate body 1B, so that the contact range with the cold air can be increased, and the heat generated by the heat source A can be reduced. Effectively generate heat convection with the cold air outside the plate body 1B, so as to achieve rapid convection heat dissipation, and improve the heat dissipation efficiency of the heat source A.

In the fourth embodiment of the present utility model, as shown in FIG. 13 , the section of the recessed groove 16C on the plate body 1C is rectangular.

In the fifth embodiment of the present utility model, as shown in FIG. 14 , the section of the concave groove 16D on the plate body 1D is arc-shaped.

In the sixth embodiment of the present invention, as shown in FIG. 15 , the concave grooves 16E on the board body 1E are arranged regularly parallel to the second adjacent side 14E.

In the seventh embodiment of the present invention, as shown in FIG. 16 , the recessed grooves 16F on the board body 1F are parallel to the first adjacent side 13F and the second adjacent side 14F respectively, and are vertically staggered with each other.

In the eighth embodiment of the present invention, as shown in FIG. 17 , the concave grooves 16G on the plate body 1G are not parallel to the first adjacent side 13G and the second adjacent side 14G, but are regularly arranged obliquely.

In the ninth embodiment of the present utility model, as shown in Figure 18, an insulating layer 2H is arranged on the second surface 12H of the plate body 1H, in the recessed groove 16H and the microhole 15H; Interface materials, such as: alumina, boron nitride, titanium nitride, aluminum nitride, silicon carbide, titanium carbide, zinc oxide, beryllium oxide and graphite, or composite materials formed by mixing the above thermal insulating materials, can achieve insulation And the effect of easy heat dissipation; and the insulating layer 2H has good thermal conductivity, using the insulating layer 2H as a contact surface to contact a heat source (such as a circuit board) with dispersed conductive points can effectively insulate and dissipate heat; and The insulating layer 2H on the second surface 12H may be an electrical insulating film, and the electrical insulating film is made of plastic or plastic-based composite material.

The above description is only one of the best embodiments of the utility model, and cannot limit the protection scope of the patent application of the utility model. All simple equivalent changes and replacements made according to the scope of the utility model patent application and the contents of the description , all should belong to the scope of protection covered by the patent scope of the utility model application.

Claims (13)

1. A microporous plate for heat dissipation, characterized in that: it includes a plate body, the plate body at least includes a relative first surface and a second surface, the first surface is provided with micropores, and the second surface A depression groove is arranged on the upper surface, and the depression groove and the micropore are connected with each other. 2 . The microporous plate for heat dissipation according to claim 1 , wherein 80,000 to 500,000 micropores are arranged on the plate body per square meter. 3 . 3 . The microporous plate for heat dissipation according to claim 2 , wherein the number of micropores in the plate body is 250,000 to 400,000 per square meter. 4 . 4. The microporous plate for heat dissipation according to claim 1, 2 or 3, wherein two first adjacent sides parallel to each other and two other adjacent sides are connected between the first surface and the second surface. Second adjacent sides that are parallel to each other. 5 . The microporous plate for heat dissipation according to claim 4 , wherein the concave groove is opened between two first adjacent sides. 5 . 6 . The microporous plate for heat dissipation according to claim 5 , wherein the concave grooves are regularly arranged parallel to the second adjacent side. 6 . 7 . The microporous plate for heat dissipation according to claim 5 , wherein the concave grooves are respectively parallel to the first adjacent side and the second adjacent side, and are vertically staggered with each other. 8 . 8 . The microporous plate for heat dissipation according to claim 5 , wherein the concave grooves are not parallel to the first adjacent side and the second adjacent side, but are regularly arranged obliquely. 9 . The microporous plate for heat dissipation according to claim 1 , 2 or 3 , characterized in that: at least one neck portion with tapered pore diameter is provided at a position between the microhole and the concave groove. 10 . 10. The microporous plate for heat dissipation according to claim 1, 2 or 3, characterized in that: the cross-section of the concave groove is V-shaped, rectangular or arc-shaped. 11. The microporous plate for heat dissipation according to claim 1, 2 or 3, wherein a triangular indentation is provided on the first surface, and the indentation is tapered from the first surface to the second surface Another triangular plane part is formed, and the intersection of the concave groove and the plane part is formed through the aforementioned microhole. 12. The microporous plate for heat dissipation according to claim 1, 2 or 3, characterized in that: an insulating layer is arranged on the second surface of the plate body, the concave groove and the micropore. 13. The microporous plate for heat dissipation according to claim 12, wherein the insulating layer on the second surface is an electrical insulating film.

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