TWI411389B - Heat dissipation method by using a plate with micro pores - Google Patents

Abstract

A heat dissipation method by using a plate with micro pores, it's to provide a plate which is formed a first surface and a second surface which are relative to each other and is formed side faces near to said first surface and said second surface first, and then it's to form grooves on said first surface which are connected to two said side faces that are relative to each other, and is to form 8 millions to 50 millions pores per meter square which are passed through said first surface and said second surface on where are relate to said grooves, final to contact a heat source with said plate directly or indirectly, such that it can increase the heat dissipation rate of said heat source by increasing heat convection by said grooves and pores.

Description

Method for dissipating heat by using microplate body

The invention relates to a method for dissipating heat by using a microporous plate body, in particular to contact a plate body having micropores and recessed grooves with a heat source, and using micro holes and recessed grooves to improve air heat convection effect and accelerate heat dissipation of the heat source. speed.

At present, the commonly used liquid crystal modules, LED lamps or other high-power electronic devices generate high temperatures when used, and the high temperature system affects the efficiency of use, so that the electronic device is easily broken, so that it is shortened. The service life, so it is necessary to use various heat dissipation methods to dissipate heat to reduce its working temperature. The common heat dissipation method is mainly air-cooled or water-cooled. The water-cooling heat dissipation effect is The best, but relatively high equipment and cost, must be installed with circulating water pipes, pressure pumps and coolant, so the space occupied by the installation is quite large, and the current electronic equipment is facing miniaturization, it is impossible to install the above water-cooled Components, so today are mainly air-cooled heat dissipation, and air-cooled heat sinks such as heat sinks or cooling fans, etc., so that it is necessary to add power to drive it to act, or to increase the installation space, The heat sink is accommodated, so there are restrictions on its use.

The patent case No. M376807 entitled "Heat Dissipation Device and Electronic Computing System" promulgated by the Republic of China on March 21, 1999, has been disclosed, which discloses: a first plate body and a second plate body, the first The plate system is connected to a heat source, and the second plate body is connected to the first plate body by a connecting plate, and the second plate body and the first plate body have a heat dissipation space. The heat dissipating device can prevent the heat source from accumulating at the bottom, and can quickly dissipate the heat source into the air through the natural convection in the heat dissipating space; and the plurality of heat dissipating holes are further formed on the second plate body, and the heat dissipating holes can be elliptical Shapes, circles, polygons, or other openings with a combination of curves and lines to enhance heat dissipation. However, in the pre-patent of the patent, only a plurality of heat dissipation holes are provided on the second plate body, so that the heat dissipation efficiency is not good, and the total heat dissipation cannot be achieved, so that the device that needs heat dissipation for a long time is ineffective.

There is also a new patent No. M359909 "Metal heat-dissipating structure and electronic device for electronic heating elements" announced by the Republic of China on June 21, 1998. It discloses a metal heat-dissipating structure for electronic heating elements, which is applicable to one. In the electronic device, the metal heat dissipation structure of the electronic heating element forms a plurality of micropores in at least one plane of the metal heat dissipation structure of the electronic heating element by an etching process, and the metal heat dissipation structure of the electronic heating element is applied to the electronic device. On the top, the natural convection heat conduction is generated, and a good heat dissipation effect is achieved, so that the metal heat dissipation structure of the electronic heating element has a high heat dissipation area ratio. In the patent case, the micropores are formed by etching, and the number of micropores is limited, so there is still room for improvement in heat dissipation efficiency.

Therefore, in view of the above-mentioned shortcomings of the high-power and other electronic device heat dissipation method, the present invention mainly provides a method for dissipating heat by using a microporous plate body, and the steps are as follows: A. providing a plate body on the plate Forming a first surface and a second surface opposite to each other, and providing a plurality of sides adjacent to the first surface and the second surface, and then forming a plurality of recessed grooves communicating with the opposite sides on the first surface, and correspondingly recessing Forming a plurality of micropores penetrating the first surface and the second surface at the position of the groove; B. contacting the first surface or the second surface of the plate body with a heat source, and the heat convection of the air is enhanced by the concave groove and the micro hole The effect is to accelerate the heat dissipation rate of the heat source.

Further, the number of micropores on the plate is controlled to be 80,000 to 500,000 per square meter, and preferably the number of micropores on the plate is controlled to be 400,000 to 500,000 per square meter. It is achieved by stamping or any other drilling method, and the higher the micropore density, the better the heat dissipation effect.

Further, the micropores of the plate are arranged in an equidistant arrangement to uniformly increase the thermal convection effect at any position of the heat source to achieve uniform heat dissipation at each position of the heat source.

Further, at least a narrowing neck portion is formed at the middle of the micropores, so that the micropores are in the shape of a venturi tube, and when the air fluid is heated by the heat source or the heat of the plate body, the temperature is first Through the tapered sections of the micropores, an accelerating action is formed to accelerate the discharge of the high-temperature air fluid, and when the high-temperature air fluid passes through the necks of the micropores, it reaches the diverging section of the micropores, increasing and The low temperature air fluid contacts the area, and accelerates the convection of the low temperature air fluid and the high temperature air fluid to improve the heat dissipation effect.

Further, the cross-sections of the recessed grooves are formed into one of a tapered V-shape, a circular arc shape or a polygonal shape. Preferably, the recessed grooves are arranged in a line, a slanted arrangement or an interlaced manner. Arranging one of them, when the first surface of the plate body is in contact with the heat source, an external low-temperature air fluid is formed from the side of the plate body into the recessed grooves, and after the heat is absorbed, the micropores are Discharged heat convection flow path.

Further, the second surface of the plate body forms a plurality of tapered tapered grooves toward the first surface, and the bottom surfaces of the tapered grooves form a flat portion, and the concave groove portions intersect with the planar portions to form Preferably, the tapered grooves are triangular in shape, which is convenient for stamping and forming an effect similar to the shape of the aforementioned venturi.

Further, the plate system is in direct or indirect contact with the heat source.

Further, the first surface or the second surface of the plate body that is in contact with the heat source forms a first insulating film, or the surface of the heat source that contacts the plate body forms a second insulating film, preferably The first insulating film and the second insulating film are composite materials of any one or a combination of electroplated aluminum oxide, boron nitride, titanium nitride, aluminum nitride, tantalum carbide, titanium carbide, zinc oxide, cerium oxide or graphite. The film, when the heat source is solder or other similar electrical conductor of the circuit board, can prevent power from being transmitted to the board body, causing leakage phenomenon.

The invention has the following effects:

1. Improve the heat convection effect of the air by the micropores and the depressed grooves on the plate body, and accelerate the heat dissipation speed of the heat source.

2. With the new stamping technology, a number of pores of 80,000 to 500,000 can be produced on the plate per square meter, which can greatly increase the surface area of the plate and generate a large amount of heat convection with air. In order to improve the efficiency of heat dissipation.

(1) ‧‧‧ board

(11) ‧‧‧ first surface

(12) ‧‧‧second surface

(13) ‧‧‧ side

(14) ‧‧‧recessed trough

(15)‧‧‧Micropores

(16)‧‧‧ neck

(17)‧‧‧Conical grooves

(1'71)‧‧‧Flat Department

(2) ‧‧‧first insulating film

(3) ‧‧‧second insulation film

(A) ‧ ‧ heat source

The first figure is a three-dimensional appearance of the plate structure of the present invention.

The second figure is a schematic view of the plate body of the present invention directly contacting the heat source.

The third figure is a schematic cross-sectional view of the depressed groove in the V-shape of the present invention (ie, the X-X cross-sectional view in the second figure).

The fourth figure is a schematic cross-sectional view of the depressed groove of the present invention in a circular arc shape.

The fifth figure is a schematic cross-sectional view of the concave groove of the present invention in a polygonal shape.

The sixth figure is a schematic diagram of the linear arrangement of the depressed grooves of the present invention (the bottom view of the plate body).

The seventh figure is a schematic view of the depressed grooves of the present invention arranged in an inclined manner (the bottom view of the plate body).

The eighth figure is a schematic diagram of the staggered arrangement of the depressed grooves of the present invention (the bottom view of the plate body).

The ninth figure is a schematic diagram of the use of the heat convection effect of the depressed trench and the microhole to accelerate the heat dissipation of the heat source according to the present invention (ie, the Y-Y cross-sectional view in the second figure).

The tenth figure is a schematic view showing the formation of the neck in the micropores of the present invention.

The eleventh figure is a three-dimensional appearance of the micro-hole formed by the shearing action of the tapered groove and the concave groove of the plate body of the invention.

The twelfth figure is a top view of the micro-hole formed by the shearing action of the tapered groove and the depressed groove of the plate body of the present invention.

The thirteenth figure is a bottom view of the micro-hole formed by the shearing action of the tapered groove and the depressed groove of the plate body of the present invention.

Fig. 14 is a cross-sectional view showing the micropores formed by the shearing action of the tapered grooves and the depressed grooves in the plate body of the present invention (i.e., the Z-Z sectional view in Fig. 12).

The fifteenth figure is a temperature rise line diagram of a flip-chip LED heat source without a heat sink, a general aluminum plate, and a microplate body of the present invention.

Figure 16 is a schematic view showing the first insulating film formed on the first surface of the board body of the present invention.

Figure 17 is a schematic view showing the formation of a second insulating film on the surface in contact with the heat source and the plate body of the present invention.

The eighteenth figure is a line drawing of the temperature rise when the plate body of the present invention is in direct contact and indirect contact with the flip-chip LED heat source.

The nineteenth figure is an infrared thermal sensing photo of a flip-chip LED heat source photo and a heat distribution for mounting a general aluminum plate as a heat sink.

The twentieth figure shows the installation of the plate body of the present invention as a flip-chip LED for heat dissipation. Infrared thermal sensing photos of heat source photos and their heat distribution.

Combining the above technical features, the main effects of the present invention will be clearly shown in the following embodiments.

Please refer to the first figure and the second figure. It is a method of using the micro-hole plate to dissipate heat. The steps are as follows:

A. A plate body (1) is provided on the plate body (1) to form an opposite first surface (11) and a second surface (12) adjacent to the first surface (11) and the second surface (12) Providing a plurality of sides (13), and thereafter forming a plurality of recessed grooves (14) communicating with the opposite sides (13) on the first surface (11), the sections of the recessed grooves (14) being shaped to be tapered One of the V-shape [see the third figure], the circular arc [see the fourth figure] or the polygon [see the fifth figure, the figure is represented by a quadrilateral], preferably the depressed grooves are mutually The inter-system is set to one of the linear arrangement [see the sixth picture], the oblique arrangement [see the seventh picture] or the interlaced arrangement [see the eighth picture], and corresponding to the position of the depressed groove (14) Formed equidistantly, and 80,000 to 500,000 per micrometers of micropores (15) extending through the first surface (11) and the second surface (12), preferably 400,000 per square meter. Up to 500,000 micropores (15), which are achieved by stamping or any other drilling method, and the higher the density of the micropores (15), the better the heat dissipation effect described later.

B. contacting the first surface (11) or the second surface (12) of the plate body (1) with a heat source (A), which may be a liquid crystal module, an LED lamp, and a flip chip LED And other electronic products, but of course it is not limited to electronic products, The module that needs heat dissipation can be applied. In this embodiment, the first surface contacts the heat source (A), and when the first surface (11) of the plate body (1) is in contact with the heat source (A), The heat energy generated by the heat source (A) during operation, in addition to direct heat conduction to the second surface (12) through the first surface (11), also forms an external cryogenic air fluid from the plate body (1) The side surface (13) enters the recessed grooves (14), and after the heat is absorbed, the heat convection flow path discharged from the micro holes (15) accelerates the heat source (A) by the heat convection effect. Heat dissipation speed [see Figure 9].

In addition, as shown in the tenth figure, at least a narrowing neck (16) is formed at the middle of the micropores (15), so that the micropores (15) are in the shape of a venturi tube when the air fluid is When the heat source (A) or the plate body (1) takes away heat and heats up, it will first pass through the tapered portion of the micropores (15) to form an acceleration function, accelerate the discharge of the high-temperature air fluid, and when the high-temperature air After passing through the neck (16) of the micropores (15), the fluid reaches the diverging section of the micropores (15), increasing the contact area with the external cryogenic air, and accelerating the low temperature air fluid and the high temperature air fluid. Convection action to improve heat dissipation.

Referring to the eleventh to fourteenth drawings, the second surface (12) of the plate body (1) is stamped and formed with a plurality of triangularly equidistantly arranged tapered grooves (17). Each of the tapered grooves (17) is tapered downwardly from the second surface (12) toward the first surface (11) to form another triangular flat portion (171), and then the first surface (11) Further, a recessed groove (14) which is equidistantly arranged is formed by means of a stamping method, and any one of the recessed grooves (14) intersects with the flat portion (171) and penetrates due to shear force. The micropores (15), and the micropores (15) are rectangular, which can achieve the effect similar to the foregoing venturi, and is a convenient process for processing the metal plate body, which can save processing time. .

Please also refer to the fifteenth figure, which is a flip-chip LED heat source without any heat sink, a flip-chip LED heat source with a general aluminum plate, and a flip-chip LED heat source with the board body (1) of the present invention. According to the line graph of the temperature rise during operation, it can be easily seen by comparison that the average temperature of the plate body (1) of the present invention is much lower than that of other unmounted heat sinks and general aluminum plates. The average temperature of the flip-chip LED heat source is sufficient to demonstrate that the present invention achieves optimum heat dissipation efficiency.

Referring to FIGS. 16 and 17 again, the board body (1) of the present invention is indirectly contacted with the flip-chip LED heat source (A), and the board body (1) is in contact with the heat source (A). The first surface (11) or the second surface (12) is formed with a first insulating film (2), or the surface of the heat source (A) in contact with the plate body (1) forms a second insulating film ( 3) Preferably, the first insulating film (2) and the second insulating film (3) are electroplated aluminum oxide, boron nitride, titanium nitride, aluminum nitride, tantalum carbide, titanium carbide, zinc oxide. a film of a composite material of any one or a combination of cerium oxide or graphite. When the heat source (A) is solder or other similar electrical conductor of the circuit board, power can be prevented from being conducted to the board body (1), thereby causing The doubt of the leakage, and the comparison of the line diagram of the eighteenth figure, the plate body (1) directly contacts the flip-chip LED heat source (A), and the indirect contact flip-chip LED heat source (A) two different Contact method, in the test of the flip-chip LED heat source (A) work, respectively, the temperature rise trend when cooling, although However, it is shown that the heat dissipation efficiency of the plate body (A) and the flip-chip LED heat source (A) is in direct contact, but if it is used for heat dissipation of the conductor, the two are in indirect contact, in addition to avoiding leakage of the conductor In addition, it can still effectively increase its heat dissipation rate.

Please refer to the nineteenth and twentieth diagrams, which are respectively experimentally tested according to the present invention, and only a general aluminum plate is installed as a heat source for the flip-chip LED for heat dissipation, and the plate body (1) of the present invention is installed as The heat-dissipating flip-chip LED heat source observes the heat distribution during operation, and the heat distribution of the heat distribution through the heat distribution can clearly see the distribution of heat between the two, and the flip chip of the board (1) of the present invention is used. The heat distribution of the LED heat source is relatively average and the operating temperature is lower, and the heat dissipation efficiency is much better than that of the general aluminum plate.

However, the above description is only one of the preferred embodiments of the present invention, and the scope of the patent application and the contents of the description of the present invention are not limited thereto. All should still fall within the scope of protection covered by the scope of the patent application of the present invention.

(1) ‧‧‧ board

(11) ‧‧‧ first surface

(12) ‧‧‧second surface

(13) ‧‧‧ side

(14) ‧‧‧recessed trough

(15)‧‧‧Micropores

(A) ‧ ‧ heat source

Claims (14)

A method for dissipating heat by using a microplate body, the steps of which are as follows: A. providing a plate body, forming a first surface and a second surface on the plate body, and providing a plurality of sides adjacent to the first surface and the second surface Forming a plurality of recessed grooves communicating with the opposite sides on the first surface, and forming a plurality of micropores penetrating the first surface and the second surface at positions corresponding to the recessed grooves, the number of micropores on the plate body being Controlling from 80,000 to 500,000 per square meter; B. contacting the first surface or the second surface of the plate with a heat source, and utilizing the recessed groove and the microhole to enhance the thermal convection effect of the air for performing Cooling. The method for dissipating heat by using a microporous plate according to claim 1, wherein the number of micropores of the plate is controlled to be 400,000 to 500,000 micropores per square meter. The method for dissipating heat by using a microplate body according to claim 1, wherein the micropores of the plate body are arranged in an equidistant arrangement. The method for dissipating heat by using a microporous plate according to the first aspect of the invention, wherein the micropores are formed by at least a neck having a reduced aperture. The method for dissipating heat by using a microplate body according to the first aspect of the invention, wherein the sections of the recessed grooves are formed into one of a tapered V shape, a circular arc shape or a polygonal shape. The method for dissipating heat by using a microporous plate body according to the fifth aspect of the invention, wherein the recessed grooves are arranged in a line arrangement, an inclined arrangement or an interlaced arrangement. The method for dissipating heat by using a microplate body according to the first aspect of the invention, wherein the second surface of the plate body is formed with a plurality of tapered tapered grooves toward the first surface, and the bottom surfaces of the tapered grooves are formed. a planar portion, and the recessed grooves intersect the planar portions to form the micropores. The method for dissipating heat by using a microporous plate body according to claim 7, wherein the tapered groove is triangular. The method for dissipating heat from a microporous plate body according to claim 1, wherein the plate system is in direct contact with the heat generating source. The method of using a microporous plate to dissipate heat as described in claim 1, wherein the plate system is in indirect contact with the heat source. The method for dissipating heat by using a microporous plate according to claim 10, wherein the first surface or the second surface of the plate in contact with the heat source forms a first insulating film. The method for dissipating heat by using a microporous plate body according to claim 11, wherein the first insulating film is electroplated aluminum oxide, boron nitride, titanium nitride, aluminum nitride, tantalum carbide, titanium carbide, A film of a composite material of any one or combination of zinc oxide, cerium oxide or graphite. The method for dissipating heat from a microporous plate body according to claim 10, wherein the surface of the heat source that is in contact with the plate body forms a second insulating film. The method for dissipating heat by using a microporous plate body according to claim 13 , wherein the second insulating film is electroplated aluminum oxide, boron nitride, titanium nitride, aluminum nitride, tantalum carbide, titanium carbide, A film of a composite material of any one or combination of zinc oxide, cerium oxide or graphite.