CN201167448Y - Heat sink device - Google Patents

Abstract

The utility model provides a heat dissipation device for dissipating heat of a heat-generating electronic component. The heat dissipation device comprises a heat conducting plate, a temperature averaging plate and a heat sink group, wherein the heat conducting plate is fixedly arranged above the heat-generating electronic component, and one or more accommodating grooves are arranged on the top surface of the heat conducting plate; the temperature averaging plate is plate-shaped and arranged in the accommodating groove of the heat conducting plate, and the temperature averaging plate has a working fluid and a capillary structure inside; the heat sink group is installed on the heat conducting plate and the temperature averaging plate; because the plate-shaped temperature averaging plate used in the utility model increases the contact area between the heat conducting plate or the heat sink group, rapid heat conduction can be achieved, so that the heat dissipation efficiency of the entire heat dissipation device can be greatly improved.

Description

heat sink

technical field

The utility model relates to a heat dissipation device, in particular to a heat dissipation device applied to heating electronic components.

Background technique

The radiator 10a currently used on the central processing unit (CPU) of the printed circuit board, as shown in Figure 1, comprises a heat conducting plate 1a installed on the central processing unit, and this heat conducting plate 1a is an aluminum material; On the heat conducting plate 1a Two or more heat conduction tubes 4a are provided, capillary tissue and working fluid are provided inside these heat conduction tubes 4a, and the effect of heat dissipation is achieved by using the movement of the capillary tissue and working fluid. One end of the heat pipe 4a extends to the outside of the heat conduction plate 1a and is provided with a heat dissipation fin set 3a in series, and a heat dissipation fan (not shown) may also be provided beside the heat dissipation fin set 3a. When in use, use the heat conduction plate 1a to conduct the heat source generated by the central processing unit upwards into the heat pipe 4a, and conduct the heat source to the heat dissipation fin group 3a through the capillary tissue and working fluid in the heat pipe 4a , the thermal energy is discharged to the outside by the heat dissipation fin group 3a, so as to achieve the purpose and effect of heat dissipation.

However, the heat energy produced by the central processing unit in order to cooperate with the calculation speed is getting higher and faster. When the heat energy produced by the central processing unit is absorbed by the heat pipe 4a, since the heat pipe 4a is a cylindrical tube, it is connected with the heat conduction plate 1a. Or there is only linear contact between the cooling fin groups 3a, which will not only reduce the conduction efficiency of the heat pipe 4a, but also cause a gas phase change in the working fluid inside the heat pipe 4a due to the high temperature of the heat energy, thereby making the heat pipe 4a The service life is reduced, which affects its heat dissipation efficiency.

Utility model content

In view of this, the main purpose of the present utility model is to provide a heat dissipation device for providing heat dissipation of heat-generating electronic components, which can increase the heat dissipation area, thereby improving heat dissipation efficiency.

In order to achieve the above purpose, the technical solution of the utility model is realized as follows: the heat dissipation device provided by the utility model is installed and connected with the heating electronic component, and the heat dissipation device includes:

The heat conduction plate is fixed above the heat-generating electronic components, and one or more receiving grooves are arranged on the top surface of the heat conduction plate;

At least one vapor chamber is placed in the receiving groove of the heat conduction plate in a plate shape, and the interior of the vapor chamber has working fluid and capillary tissue; and

Because the utility model uses a plate-like temperature chamber, it can increase the contact area with the heat conduction plate or the heat dissipation fin group, achieve rapid heat conduction, and greatly improve the heat dissipation efficiency of the entire heat dissipation device.

In addition, the utility model adopts a plate-like temperature chamber, which does not require perforation processing for installing heat pipes on the heat sink group, which makes the manufacture and assembly of the entire heat sink more convenient and easy.

Description of drawings

Fig. 1 is a side view of a known heat sink;

Fig. 2 is a three-dimensional exploded view of the heat dissipation device of the present invention;

Fig. 3 is a perspective view of the utility model cooling device;

Fig. 4 is a side view of the utility model heat sink installed on the central processing unit;

Fig. 5 is a side view of the second embodiment of the utility model.

Explanation of reference signs

Radiator 10a Heat conduction plate 1a

Radiating fin set 3a Heat pipe 4a

Cooling device 10 CPU 20

Heat conduction plate 1 Accommodating groove 11

Vapor plate 2 Heat sink group 3

Detailed ways

The detailed description and technical content of the utility model are as follows in conjunction with the accompanying drawings.

Embodiment one

Please refer to shown in Fig. 2, the cooling device 10 in the present embodiment can be applied on the central processing unit 20 (as Fig. 4), and it comprises the heat conducting plate 1 that is installed and connected on the central processing unit 20, and the heat conducting plate 1 can be aluminum or copper and other materials with good thermal conductivity, one or more accommodation grooves 11 are provided on the top surface of the heat conduction plate 1, and this embodiment is provided with three accommodation grooves 11 arranged at equal intervals, of course, it can also be a single accommodation groove. The shape of the groove 11; in addition, the accommodating groove 11 of this embodiment is in the shape of a flat bottom "U".

A plate-shaped uniform temperature plate 2 is correspondingly arranged in the accommodation groove 11. The uniform temperature plate 2 has a working fluid that can be used for heat exchange and a capillary tissue that uses capillary suction to suck the working fluid back. After installation, the uniform temperature The plate 2 is flush with the top surface of the heat conduction plate 1; in addition, a heat sink set 3 is installed on the heat conduction plate 1, and the heat sink set 3 can be a continuous stack heat sink set (not shown in the figure) or an aluminum extruded heat sink set , In this embodiment, it is an aluminum extruded heat sink group. In addition, two or more vapor chambers 2 can also be arranged in the receiving groove 11 , as long as the installed vapor chambers 2 are flush with the top surface of the heat conduction plate 1 .

Please refer to FIG. 2 and as shown in FIG. 3 , when the heat dissipation device 10 in this embodiment is assembled, several plate-shaped equalization plates 2 are respectively fixed in the receiving grooves 11 on the heat conducting plate 1, and then Fix the heat sink group 3 on the heat conducting plate 1 so that the bottom surface of the heat sink group 3 is attached to and contacts with the surfaces of the heat conducting plate 1 and the vapor chamber 2 respectively, thus basically completing the assembly of the heat sink 10 .

Please refer to FIG. 4 , the assembled heat sink 10 can be installed on the CPU 20 to dissipate heat from the CPU 20 . When the central processing unit 20 is in operation, the working heat energy generated will be conducted to the heat conducting plate 1 first, and then the vapor chamber 2 on the heat conducting plate 1 will exchange heat with the working heat energy, and then the vapor chamber 2 will transfer the heat exchanged The working heat energy is conducted to the cooling fin group 3 , and finally the working heat energy is dissipated by the cooling fin group 3 , so that the central processing unit 20 is radiated repeatedly in this way.

Embodiment two

Please refer to Fig. 5, which is the second embodiment of the present utility model, the heat dissipation device in this embodiment is basically the same as that of Embodiment 1, the difference is that two groups of heat dissipation devices 10 can be stacked in this embodiment, namely Another set of heat sinks 10 is installed on the heat sink group 3 of one set of heat sinks 10, and the heat conducting plate 1 of the present invention can be installed on the uppermost heat sink 10 to form a stacked heat sink.

It can be seen from the above structure that the utility model uses the plate-shaped vapor chamber 2 to increase the contact area with the heat conduction plate 1 or the heat sink group 3, so that heat conduction can be carried out very quickly, and the heat dissipation efficiency of the entire heat dissipation device 10 is improved. A substantial increase. In addition, because the utility model adopts the plate-shaped temperature chamber 2, there is no need to perform perforation processing for installing heat pipes on the cooling fin group 3, which makes the manufacture and assembly of the entire cooling device 10 more convenient and easy.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the protection scope of the present utility model.

Claims (5)

1, a kind of heat abstractor is connected with the installation of heating electronic building brick, it is characterized in that this heat abstractor comprises:

Heat-conducting plate is installed in described heating electronic building brick top, is provided with one or more pockets at this heat-conducting plate end face;

At least one temperature-uniforming plate is in the tabular pockets that is placed in this heat-conducting plate, and this temperature-uniforming plate inside has working fluid and capillary structure; And

Groups of fins is installed on this heat-conducting plate and this temperature-uniforming plate.

2, heat abstractor as claimed in claim 1 is characterized in that, the pockets of described heat-conducting plate is flat " U " font.

3, heat abstractor as claimed in claim 1 is characterized in that, the end face of described temperature-uniforming plate is concordant with the end face of described heat-conducting plate, and the bottom surface of described groups of fins contacts with mutual attaching the in described temperature-uniforming plate surface with described heat-conducting plate respectively.

4, heat abstractor as claimed in claim 1 is characterized in that, described groups of fins is continuous storehouse type groups of fins.

5, heat abstractor as claimed in claim 1 is characterized in that, described groups of fins is the aluminium extruded type groups of fins.

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