CN201638812U - Novel high-power LED packaging structure - Google Patents
Novel high-power LED packaging structure Download PDFInfo
- Publication number
- CN201638812U CN201638812U CN2010201067434U CN201020106743U CN201638812U CN 201638812 U CN201638812 U CN 201638812U CN 2010201067434 U CN2010201067434 U CN 2010201067434U CN 201020106743 U CN201020106743 U CN 201020106743U CN 201638812 U CN201638812 U CN 201638812U
- Authority
- CN
- China
- Prior art keywords
- encapsulating structure
- power led
- injection molded
- heating panel
- molded layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 241000218202 Coptis Species 0.000 claims abstract description 12
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 12
- 239000004411 aluminium Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 17
- 238000002347 injection Methods 0.000 claims description 17
- 239000007924 injection Substances 0.000 claims description 17
- 238000009413 insulation Methods 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 4
- 101150038956 cup-4 gene Proteins 0.000 description 4
- 150000001398 aluminium Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a novel high-power LED packaging structure which comprises at least two LED chips, wherein all LED chips are connected by aluminum wires to form a series module; and both ends of the series module are connected to the positive and negative poles of a circuit through gold threads. Because a plurality of LEDs are connected by the aluminum wires to form the high-power series LED module, the connection is not realized by pure gold threads so as to greatly reduce the packaging cost.
Description
[technical field]
The utility model relates to a kind of lighting apparatus field, particularly a kind of novel large-power LED encapsulating structure.
[background technology]
At present, LED lamp internal structure is on the market being carried out LED components and parts when encapsulation, mostly is that the technology with the welding of proof gold line encapsulates, owing to the cost of gold thread than higher, thereby cause holding at high price of led lamp.
[summary of the invention]
The technical problems to be solved in the utility model is to provide a kind of novel large-power LED encapsulating structure, adopts aluminum steel to be connected to form powerful series LED module a plurality of LED, reduces packaging cost greatly.
The utility model is achieved in that a kind of novel large-power LED encapsulating structure, comprises at least two led chips, and wherein: all led chips are connected to form a string gang mould group by aluminum steel, and the two ends of this series mould set are connected to the both positive and negative polarity of circuit by gold thread.
Preferable, the top of described series mould set is provided with a silica gel prefocus cup that is used to encapsulate all led chips, and the hypomere of this silica gel prefocus cup is a cylinder, epimere is an arc body, the silica gel prefocus cup that uses this cylinder to add arc body encapsulates, lighting angle is controlled in 100 degree, light source can be evenly distributed in the effective range of exposures.
Preferable, technique scheme also comprises an aluminium base heating panel and insulation injection molded layers, this insulation injection molded layers is fixed on the top of described aluminium base heating panel, and the reflector of a half-cone is formed on the bottom of this insulation injection molded layers, all led chips promptly are located at the bottom of this reflector, this aluminium base heating panel can fully dispel the heat to high-power LED chip, and radiating effect is better.
Preferable, make contact and settle described gold thread in the middle part of described insulation injection molded layers both sides, and this gold thread one wide one is narrow, to distinguish both positive and negative polarity, is convenient to be connected to the both positive and negative polarity of circuit.
Preferable, described aluminium base heating panel is provided with the plurality of fixed hole, and described insulation injection molded layers is to being arranged on a plurality of injection moulding pin by fixing hole, with fixing aluminium base heating panel and insulation injection molded layers.
Preferable, also be provided with a plurality of binding holes that are used to bind this encapsulating structure on the described aluminium base heating panel.
Advantage of the present utility model is: it adopts aluminum steel to be connected to form powerful series LED module a plurality of LED, reduces packaging cost greatly.The silica gel prefocus cup that this series LED module also can use cylinder to add arc body encapsulates, and lighting angle is controlled in 100 degree, and light source can be evenly distributed in the effective range of exposures; Because the setting of aluminium base heating panel can fully be dispelled the heat to high-power LED chip, radiating effect is better again.
[description of drawings]
In conjunction with the embodiments the utility model is further described with reference to the accompanying drawings.
Fig. 1 is a plan structure schematic diagram of the present utility model.
Fig. 2 is the structural representation of looking up of the present utility model.
Fig. 3 is a forward sight sectional structure schematic diagram of the present utility model.
Fig. 4 is a side-looking sectional structure schematic diagram of the present utility model.
[embodiment]
See also Fig. 1 to shown in Figure 4, novel high-power LED encapsulation structure of the present utility model, wrap an aluminium base heating panel 1, insulation injection molded layers 2, at least two led chips 3 and silica gel prefocus cup 4, all led chips 3 are connected to form a string gang mould group by aluminum steel 5, and the two ends of this series mould set are connected to the both positive and negative polarity of circuit by gold thread 6.
Described aluminium base heating panel 1 is according to the watt level punching press or be cast into needed size, comprise aluminium lamination, insulating barrier, copper layer and silver coating (all not shown), this aluminium base heating panel 1 is provided with plurality of fixed hole 12 and a plurality of binding hole 14 that is used to bind this encapsulating structure.This aluminium base heating panel can fully dispel the heat to high-power LED chip 3, and radiating effect is better.
2 pairs of described insulation injection molded layers should be arranged on a plurality of injection moulding pin 22 by fixing hole 12, and cooperating of the fixing hole 12 on this injection moulding pin 22 and the described aluminium base heating panel 1 can be fixed on described insulation injection molded layers 2 top of described aluminium base heating panel 1.And the reflector 24 of a half-cone is formed on the bottom of this insulation injection molded layers 2.Make contact and settle described gold thread 6 in the middle part of the both sides of described insulation injection molded layers 2, this gold thread 6 one wide one is narrow, to distinguish both positive and negative polarity.
Described led chip 3 promptly is located at the bottom of the reflector 24 of described insulation injection molded layers 2, and the top of described series mould set is provided with a silica gel prefocus cup 4 that is used to encapsulate all led chips 3, and the hypomere of this silica gel prefocus cup 4 is a cylinder 42, and epimere is an arc body 44.This silica gel prefocus cup 4 can make the lighting angle of led chip 3 be controlled in 100 degree, and light source can be evenly distributed in the effective range of exposures.
In sum, encapsulating structure of the present utility model because a plurality of LED adopt aluminum steel to be connected to form powerful series LED module, is avoided adopting the proof gold line to connect, thereby is reduced packaging cost greatly.In addition, its light source can be evenly distributed in the effective range of exposures, good heat dissipation effect.
Claims (6)
1. a novel large-power LED encapsulating structure comprises at least two led chips, it is characterized in that: all led chips are connected to form a string gang mould group by aluminum steel, and the two ends of this series mould set are connected to the both positive and negative polarity of circuit by gold thread.
2. a kind of novel large-power LED encapsulating structure according to claim 1 is characterized in that: the top of described series mould set is provided with a silica gel prefocus cup that is used to encapsulate all led chips, and the hypomere of this silica gel prefocus cup is cylinder, and epimere is an arc body.
3. a kind of novel large-power LED encapsulating structure according to claim 2, it is characterized in that: also comprise an aluminium base heating panel and insulation injection molded layers, this insulation injection molded layers is fixed on the top of described aluminium base heating panel, and the reflector of a half-cone is formed on the bottom of this insulation injection molded layers, and all led chips promptly are located at the bottom of this reflector.
4. a kind of novel large-power LED encapsulating structure according to claim 3 is characterized in that: make contact and settle described gold thread in the middle part of described insulation injection molded layers both sides, this gold thread one wide one is narrow, to distinguish both positive and negative polarity.
5. a kind of novel large-power LED encapsulating structure according to claim 3 is characterized in that: described aluminium base heating panel is provided with the plurality of fixed hole, and described insulation injection molded layers is to being arranged on a plurality of injection moulding pin by fixing hole.
6. a kind of novel large-power LED encapsulating structure according to claim 5 is characterized in that: also be provided with a plurality of binding holes that are used to bind this encapsulating structure on the described aluminium base heating panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201067434U CN201638812U (en) | 2010-02-02 | 2010-02-02 | Novel high-power LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201067434U CN201638812U (en) | 2010-02-02 | 2010-02-02 | Novel high-power LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201638812U true CN201638812U (en) | 2010-11-17 |
Family
ID=43083316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201067434U Expired - Fee Related CN201638812U (en) | 2010-02-02 | 2010-02-02 | Novel high-power LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201638812U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545426A (en) * | 2013-10-31 | 2014-01-29 | 桂林福冈新材料有限公司 | LED bracket |
| CN105390597A (en) * | 2014-09-02 | 2016-03-09 | 亿光电子工业股份有限公司 | Light emitting element and display device |
-
2010
- 2010-02-02 CN CN2010201067434U patent/CN201638812U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545426A (en) * | 2013-10-31 | 2014-01-29 | 桂林福冈新材料有限公司 | LED bracket |
| CN105390597A (en) * | 2014-09-02 | 2016-03-09 | 亿光电子工业股份有限公司 | Light emitting element and display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: FUJIAN WANBANG OPTOELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: FUJIAN ZHONGKE WANBAN OPTRONICS CO., LTD. Effective date: 20110323 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20110323 Address after: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Patentee after: Fujian Wanban optoelectronic Technology Co., Ltd. Address before: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District Patentee before: Fujian Zhongkewanbang Photoelectric Shares Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101117 Termination date: 20150202 |
|
| EXPY | Termination of patent right or utility model |