CN201435411Y - high-power led packaging and mounting structures - Google Patents

Abstract

A high-power LED packaging and mounting structure, the packaging structure is composed of a heat sink component (a1), an electrode component (a2), a chip (a3), a gold wire (a4), and a condenser lens (a5); the mounting structure It consists of secondary heat dissipation components, LEDs, splints, bolts, and circuit leads. The utility model has a simple and compact structure, especially the electrode component saves the manufacture of the complex lead frame used in the traditional LED technology, and reduces the production cost. In the installation structure of the high-power LED, the LED and the secondary heat dissipation component conduct heat directly, Moreover, the contact area between the two is relatively large, the thermal resistance is significantly reduced, and the heat dissipation effect of the LED is improved, which can obviously solve the problem of heat dissipation during high-power LED module lighting. The utility model can be widely used in high-power LED street lighting, LED indoor lighting, LED projection lights, LED miner's lamps, flashlights, etc.

Description

High power LED package and installation structure

technical field

The utility model relates to a high-power LED packaging and installation structure design, which belongs to the field of optoelectronic devices.

Background technique

As a light source, high-power LEDs, due to their low power consumption and long life, especially their nanosecond-level response speeds, make dynamic control of brightness and color easier, and can realize dynamic changes and digital control of colors; they can be widely used in every aspect of modern life. High-power LEDs can be divided into: large-size epoxy resin packaged high-power LEDs, imitation piranha-style epoxy resin packaged high-power LEDs, aluminum substrate (MCPCB) packaged high-power LEDs, TO packaged high-power LEDs , Power type SMD package high-power LED, MCPCB integrated package high-power LED and so on. In the existing high-power LED packaging structure, there are problems such as high cost of high-power LED resin packaging frame, poor heat dissipation effect, and affecting product service life.

Contents of the invention

The purpose of the utility model is to make up for the shortcomings of the existing high-power LED packaging structure, and disclose a high-power LED packaging structure and the LED installation structure with simple structure, good heat dissipation effect and light-taking effect, and suitable for mass production.

The LED package structure of the utility model is composed of a heat sink component, a package lens, an LED chip, an electrode component, a bonding gold wire, a fluorescent powder and the like.

The upper part of the heat sink component is provided with an assembly groove for the concentrating cup and the closed lens; the concentrating cup can be a conical groove, an elliptical gyroid or a parabolic gyroid, and the chip welding position is the bottom of the conical groove or a gyroid The focus position in order to meet the requirements of light distribution. The lower part of the heat sink component is provided with a large-area substrate; the center is provided with a through-hole groove for assembling the electrode component or a groove for assembling the electrode on the side. The substrate part of the heat sink component is used as an electrode of the LED, and its shape can be a regular polygon , circular; the substrate can be provided with through holes for LED assembly, the upper surface of the substrate is provided with a keyway for positioning and assembly of the LED, and the lower surface is provided with grooves for inlaying insulated wires in the electrode components. The LED heat sink component of the utility model has multiple functions: heat conduction and heat dissipation, light concentrating, LED package frame (LED electrode bracket, lens assembly bracket), LED one electrode, heat conduction substrate, and the LED heat sink structure can be used by using high heat conduction High-efficiency copper and aluminum are stamped at one time or processed in batches by automatic lathes, which are suitable for mass production.

The electrode component is composed of epoxy resin casting and covering electrodes, and its assembly form is through-hole insertion type or side insertion type. The electrode part is composed of a welding electrode connected with a bonding gold wire and a lead electrode at the lead end, and the lead electrode can be an insulated wire type or a copper sheet lead electrode. The structure of the electrode component is simple, which can save the production of complex lead frames in traditional LEDs and reduce the manufacturing cost.

The LED chip can be single chip or multi-chip. There are 2-6 focusing cups in the heat sink of the multi-chip LED structure, and the LED chips are respectively placed in the focusing cups.

The encapsulation lens can be in the shape of a spherical surface or a flat plate, and when the encapsulation lens is assembled with the heat sink component, it can be cured and bonded by epoxy resin.

The single-chip LED power of the utility model can reach 1-3W, and the multi-chip LED power can reach 3-20W, which can be widely used in high-power LED street lighting, LED indoor lighting, LED projection lamps, LED miner's lamps, flashlights, etc.

The installation structure of this high-power LED is mainly composed of secondary heat dissipation components, LEDs, splints, bolts, circuit leads and other parts. When the installation is completed, the LED is assembled between the splint and the secondary heat dissipation component, and is reinforced by bolts so that the bottom surface of the LED substrate is in close contact with the secondary heat dissipation component to reduce thermal resistance. In the design of the utility model, the LED and the secondary heat dissipation component conduct heat directly, and the contact area between the two is relatively large, and the thermal resistance is significantly reduced, which is very conducive to the loss of heat and can reduce the volume of the secondary heat dissipation component. This structure is suitable for LED As far as the design of the lamp is concerned, it can get rid of the restriction of the volume of the secondary heat dissipation component, so that the design of the lamp is more free.

There is a circuit lead channel on the mounting splint, and through the reinforcement of bolts, the circuit lead is connected to the special electrode bonding of the LED. On the one hand, the use of the printed circuit board in the past is eliminated; on the other hand, the welding of the LED lead in the past is eliminated. craft. The splint and the secondary cooling components can be flexibly and conveniently disassembled, which facilitates the replacement of LEDs and brings convenience to the maintenance of LED lamps.

The secondary heat dissipation component has heat dissipation fins, and the surface in contact with the LED substrate has a high thermal conductivity insulating layer and mounting screw holes. The splint is provided with step grooves for bonding and assembly with LEDs, embedding grooves for circuit leads, through holes for bolts, and the like.

The obvious effect of the utility model compared with the prior art is that the structure of the utility model is simple and compact, especially the electrode component saves the manufacture of the complex lead frame used in the traditional LED technology, reduces the production cost, and is used in high-power LED In the installation structure, the LED and the secondary heat dissipation component conduct heat directly, and the contact area between the two is large, the thermal resistance is significantly reduced, and the heat dissipation effect of the LED is improved, which can obviously solve the heat dissipation problem of the high-power LED module lighting, and increase the LED service life. The LED and clamping structure in this design, in high-power LED lighting, especially LED modular (dot-matrix) lighting, has a simple installation process (saving the connection between the LED and the aluminum substrate and the lead wires with the circuit on the substrate in the past) welding), and LED replacement is flexible. The utility model can be widely used in high-power LED street lighting, LED indoor lighting, LED projection lamps, LED miner's lamps, flashlights and the like.

Description of drawings

Accompanying drawing 1 is the three-dimensional schematic diagram of the packaging structure of the high-power LED electrode through-hole plug-in type a series in Embodiment 1;

Accompanying drawing 2 is a cross-sectional view of the high-power LED electrode through-hole plug-in type a series packaging structure in Embodiment 1;

Accompanying drawing 3 is the cross-sectional view of the high-power LED electrode through-hole plug-in type B series packaging structure in Embodiment 2;

Accompanying drawing 4 is the three-dimensional schematic diagram of the c-series packaging structure of the high-power LED electrode side-insertion type and the cyclotron concentrating type in Embodiment 3;

Accompanying drawing 5 is the top view of the c-series packaging structure of the high-power LED electrode side plug-in type and gyrotron concentrating type in embodiment 3;

Figure 6 is a cross-sectional view of the c-series packaging structure of the high-power LED electrode side plug-in type and gyrotron concentrating type in Embodiment 3;

Accompanying drawing 7 is the three-dimensional view of embodiment 4 high-power LED multi-chip type d series;

Accompanying drawing 8 is the top view of embodiment 4 high-power LED multi-chip type d series;

Accompanying drawing 9 is the sectional view of embodiment 4 high-power LED multi-chip type d series;

Accompanying drawing 10 is the three-dimensional view of the installation structure of high-power LED of embodiment 5;

Accompanying drawing 11 is the exploded view of the parts of the high-power LED installation structure of Embodiment 5;

Accompanying drawing 12 is the sectional view of embodiment 5 high-power LED installation structure;

Accompanying drawing 13 is the bottom view of the high-power LED splint structure of Embodiment 5;

Accompanying drawing 14 is the sectional view of embodiment 6 high-power LED installation;

Detailed ways

Example 1:

Embodiment 1 is a high-power LED electrode through-hole insertion type a-series packaging structure. Attached Figure 1 is a schematic perspective view of the packaging structure of this embodiment, and Figure 2 is a cross-sectional view of the packaging structure of this embodiment.

In this embodiment, the high-power LED electrode through-hole plug-in type a series packaging structure is composed of a heat sink component (a1), an electrode component (a2), a chip (a3), a gold wire (a4), and a condenser lens (a5). Among them, the heat sink component (a1) is composed of a focusing cup (a11), a lens assembly groove (a12), a bottom key (a13), and a bottom substrate (a14); the electrode component (a2) is composed of a gold wire welding electrode (a21 ), an epoxy resin frame (a22), an insulating layer (a23), and a lead electrode (a24); an encapsulation resin injection hole (a51) is placed on the flange of the condenser lens.

Example 2:

The embodiment is a high-power LED electrode through-hole insertion type b-series packaging structure, and Figure 3 is a cross-sectional view of the high-power LED electrode through-hole insertion type b-series packaging structure in Embodiment 2.

In this embodiment, the high-power LED electrode through-hole plug-in type B series packaging structure is composed of a heat sink component (b1), an electrode component (b2), a chip (b3), and a gold wire (b4). Among them, the heat sink component (b1) is composed of a focusing cup (b11), a lens assembly groove (b12), a bottom key (b13), and a bottom substrate (b14); the electrode component (b2) is composed of a gold wire welding electrode (b21 ), epoxy resin frame (b22), insulating layer (b23), lead electrodes (b24).

Example 3:

This embodiment is a high-power LED electrode side-inserted, gyroscopic concentrating type c-series packaging structure. Attached drawings 4, 5, and 6 are respectively the high-power LED electrode side-inserted, gyroscopic concentrating The three-dimensional schematic diagram, top view and cross-sectional view of the c-series package structure.

In this embodiment, the high-power LED electrode side plug-in type, gyroscopic concentrating type c-series packaging structure is composed of a heat sink component (c1), an electrode component (c2), a chip (c3), a gold wire (c4), and a lens (c5). composition. Among them, the heat sink component (c1) is composed of a focusing cup (c11), a lens assembly groove (c12), and a bottom substrate (c13); the electrode component (c2) is composed of a gold wire welding electrode (c21), an epoxy resin frame (c22 ), an insulating layer (c23), and a lead electrode (c24).

Example 4:

This embodiment is a high-power LED multi-chip d-series structure. Attached drawings 7, 8, and 9 are respectively a perspective view, a top view and a cross-sectional view of the high-power LED multi-chip d-series structure of this embodiment.

In this embodiment, the high-power LED multi-chip type d series structure is composed of a heat sink component (d1), an electrode component (d2), a chip (d3), and a gold wire (d4). Among them, the heat sink component (d1) is composed of a focusing cup (d11), a lens assembly groove (d12), a positioning key (d13), and a bottom substrate (d14); the electrode component (d2) is composed of a gold wire welding electrode (d21), It is composed of epoxy resin frame (d22), insulating layer (d23), and lead electrodes (d24).

Example 5:

This embodiment is designed for the installation structure of high-power LEDs. Accompanying drawing 10, accompanying drawing 11, accompanying drawing 12, accompanying drawing 13 are respectively the perspective view of the high-power LED installation structure, the exploded view of the parts of the installation structure, the sectional view of the installation structure and the bottom view of the splint structure.

The installation structure of the high-power LED in this embodiment is composed of a secondary heat dissipation member (e1), an LED structure (e2), a splint (e3), a bolt (e4), a negative terminal (e5), and a positive terminal (e6). Among them, the secondary heat dissipation component (e1) is composed of a high thermal conductivity insulating layer (e11), screw holes (e12), and heat sinks (e13); the LED structure (e2) is composed of LED positioning keys (e21), LED lead electrodes (e22) Composition; the splint (e3) is composed of LED mounting holes (e31), electrode embedding grooves (e32), bolt holes (e33), and LED positioning key grooves (e34).

Embodiment 6:

This embodiment is designed for the installation structure of high-power LEDs. Accompanying drawing 14 is the installation sectional view of high-power LED of this embodiment.

The installation structure of the high-power LED in this embodiment is composed of LED (f1), splint (f2), bolt (f3), electrode terminal (f4), and circuit lead (f5). Wherein the LED (f1) is composed of an LED electrode (f11), an LED electrode frame (f12), and a lens (f13).

Claims (7)

1, a kind of high-power LED encapsulation and mounting structure is characterized in that, described high-power LED encapsulation structure is made up of heat sink member, package lens, led chip, electrode member, bonding gold wire; Described great power LED mounting structure is made up of secondary radiating component, LED, clamping plate, bolt, circuit lead.

2, high-power LED encapsulation according to claim 1 and mounting structure is characterized in that,

The top of the heat sink member of described LED encapsulating structure is provided with the fitting recess with prefocus cup, sealing lens, prefocus cup can or be the parabola revolution for truncated cone-shaped groove, oval revolution, the chips welding position be the end of round platform groove or for the focal position of revolution so that meet the requirement of luminous intensity distribution;

Described heat sink member is provided with the through-hole groove of assembling electrode member or is provided with the groove of assembling electrode in the side;

The bottom of described heat sink member is provided with large-area substrates, and the substrate portion of described heat sink member is as the electrode of LED, and its shape can be regular polygon, circle;

Can be provided with through hole on the substrate of described heat sink member so that LED assembles, upper surface of base plate is provided with the keyway of LED location assembling, and lower surface is provided with groove, for inlaying of insulated conductor in the electrode member.

3, high-power LED encapsulation according to claim 1 and mounting structure, it is characterized in that, described LED encapsulating structure electrode member is that poured with epoxy resin parcel electrode constitutes, its assembling form is through hole plug-in type or side plug-in type, the electrode part is made of the welding electrode that is connected with bonding gold wire and the exit lead-in wire utmost point, and the lead-in wire electrode can be insulated conductor formula or copper sheet lead-in wire electrode.

4, high-power LED encapsulation according to claim 1 and mounting structure, it is characterized in that, described LED encapsulating structure led chip can be single-chip or for multi-chip type, and the prefocus cup in multi-chip type LED structure heat sink is 2-6, and led chip places prefocus cup respectively.

5, high-power LED encapsulation according to claim 1 and mounting structure is characterized in that, described LED encapsulating structure package lens can be sphere shape, plate shaped, when package lens and the assembling of heat sink member, and can be bonding by epoxy resin cure.

6, high-power LED encapsulation according to claim 1 and mounting structure is characterized in that, the heat sink member of described LED encapsulating structure can once be stamped to form or form by the automatic lathe batch machining by copper, the aluminium with high heat conduction.

7, high-power LED encapsulation according to claim 1 and mounting structure, it is characterized in that, described LED mounting structure middle clamp plate is provided with step groove, the embedded groove of circuit lead, the bolt hole with the assembling of LED bonding, LED is assemblied between clamping plate and the secondary radiating component, pass through screw bolt reinforcing, the LED substrate bottom surface can closely contact with the secondary radiating component, reduces thermal resistance.

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