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CN201345734Y - Silica-based microphone - Google Patents

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Publication number
CN201345734Y
CN201345734Y CNU2008202357263U CN200820235726U CN201345734Y CN 201345734 Y CN201345734 Y CN 201345734Y CN U2008202357263 U CNU2008202357263 U CN U2008202357263U CN 200820235726 U CN200820235726 U CN 200820235726U CN 201345734 Y CN201345734 Y CN 201345734Y
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China
Prior art keywords
back plate
vibrating body
main body
silica
based microphone
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Expired - Lifetime
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CNU2008202357263U
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Chinese (zh)
Inventor
张睿
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AAC Technologies Holdings Changzhou Co Ltd
AAC Technologies Pte Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
AAC Acoustic Technologies Changzhou Co Ltd
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Abstract

本实用新型提供了一种硅基麦克风,包括内部设有空腔的基底、收容于基底空腔内的背极板、振膜,所述振膜包括振动主体和与振动主体相连且位于振动主体中央区域的连接部,所述连接部与背极板相连,所述振动主体与背极板相对。与现有技术相比,本实用新型振膜的振动主体周缘未被固定,而是通过位于振动主体中央区域的连接部固定于背极板上,振动主体可相对背极板上下振动,这种结构设计独特,所得产品的灵敏度也很高。

Figure 200820235726

The utility model provides a silicon-based microphone, which comprises a base with a cavity inside, a back plate accommodated in the cavity of the base, and a vibrating membrane. The vibrating membrane includes a vibrating body and a The connection part in the central area is connected to the back plate, and the vibrating body is opposite to the back plate. Compared with the prior art, the periphery of the vibrating body of the vibrating membrane of the utility model is not fixed, but is fixed on the back plate through the connection part located in the central area of the vibrating body, and the vibrating body can vibrate up and down relative to the back plate. The structure design is unique, and the sensitivity of the obtained product is also high.

Figure 200820235726

Description

硅基麦克风 silicon microphone

【技术领域】 【Technical field】

本实用新型涉及一种麦克风,尤其涉及一种MEMS硅基麦克风。The utility model relates to a microphone, in particular to a MEMS silicon-based microphone.

【背景技术】 【Background technique】

随着无线通讯的发展,全球移动电话用户越来越多,用户对移动电话的要求已不仅满足于通话,而且要能够提供高质量的通话效果,尤其是目前移动多媒体技术的发展,移动电话的通话质量更显重要,移动电话的麦克风作为移动电话的语音拾取装置,其设计好坏直接影响通话质量。With the development of wireless communication, there are more and more mobile phone users around the world. The requirements of users for mobile phones are not only satisfied with calls, but also to be able to provide high-quality call effects. Especially the current development of mobile multimedia technology, the mobile phone Call quality is more important. The microphone of a mobile phone is used as a voice pick-up device for the mobile phone, and its design directly affects the call quality.

目前应用较多且性能较好的麦克风是微电机系统麦克风(Micro-Electro-Mechanical-System Microphone,简称MEMS),其封装体积比传统的驻极体麦克风小。MEMS麦克风是基于硅基半导体材料制成,故又称硅基麦克风。近几年,硅基MEMS麦克风已取得了很大的进步。Micro-Electro-Mechanical-System Microphone (MEMS for short) is currently the most widely used microphone with better performance, and its packaging volume is smaller than that of traditional electret microphones. MEMS microphones are made of silicon-based semiconductor materials, so they are also called silicon-based microphones. Silicon-based MEMS microphones have come a long way in recent years.

如图1所示,为现有常见的MEMS硅基麦克风1的剖视示意图。此类麦克风包括内部设有空腔的基底10、实现电容效应的背极板11和振膜12。振膜的周缘被固定,与背极板相对且与背极板间隔一定距离。当声音气流传递到振膜上时,振膜上下振动以产生位移,改变电容器的电容量,电容量的改变使电容器的输出端产生相应的交变电场,形成了与声波信号对应的电信号,从而完成声电转换的功能。As shown in FIG. 1 , it is a schematic cross-sectional view of a conventional MEMS silicon-based microphone 1 . This type of microphone includes a substrate 10 with a cavity inside, a back plate 11 and a diaphragm 12 to realize the capacitive effect. The periphery of the diaphragm is fixed, opposite to the back plate and spaced a certain distance from the back plate. When the sound air flow is transmitted to the diaphragm, the diaphragm vibrates up and down to generate displacement, changing the capacitance of the capacitor, and the change of capacitance causes the output terminal of the capacitor to generate a corresponding alternating electric field, forming an electrical signal corresponding to the sound wave signal. Thereby completing the function of sound-electric conversion.

【实用新型内容】 【Content of utility model】

本实用新型需解决的技术问题是提供一种结构设计独特、灵敏度高的硅基麦克风。The technical problem to be solved by the utility model is to provide a silicon-based microphone with unique structural design and high sensitivity.

根据上述需解决的技术问题,设计了一种硅基麦克风,内部设有空腔的基底、收容于基底空腔内的背极板、振膜,所述振膜包括振动主体和与振动主体相连且位于振动主体中央区域的连接部,所述连接部与背极板相连,所述振动主体与背极板相对。According to the above-mentioned technical problems to be solved, a silicon-based microphone is designed, which has a base with a cavity inside, a back plate and a diaphragm accommodated in the cavity of the base, and the diaphragm includes a vibrating body and a vibrating body connected to the vibrating body. And the connecting part located in the central area of the vibrating body, the connecting part is connected with the back plate, and the vibrating main body is opposite to the back plate.

作为本实用新型进一步改进,所述振动主体为扁圆柱形,连接部为由振动主体中央区域延伸的长圆柱形。As a further improvement of the utility model, the vibrating body is in the shape of a flat cylinder, and the connection part is in the shape of a long cylinder extending from the central area of the vibrating body.

作为本实用新型进一步改进,所述振膜的横截面为T形。As a further improvement of the utility model, the cross-section of the diaphragm is T-shaped.

与现有技术相比,本实用新型振膜振动主体周缘未被固定,而是通过位于振动主体中央区域的连接部固定于背极板上,振动主体与背极板相对且可相对背极板上下振动。此种结构设计独特,所得产品的灵敏度也很高。Compared with the prior art, the periphery of the diaphragm vibrating body of the utility model is not fixed, but is fixed on the back plate through the connection part located in the central area of the vibrating body. The vibrating body is opposite to the back plate and can be opposite to the back plate. Vibrate up and down. This kind of structural design is unique, and the sensitivity of the obtained product is also high.

【附图说明】 【Description of drawings】

图1是现有常见MEMS硅基麦克风的剖视示意图;FIG. 1 is a schematic cross-sectional view of an existing common MEMS silicon-based microphone;

图2是本实用新型硅基麦克风的立体示意图;Fig. 2 is the three-dimensional schematic diagram of silicon-based microphone of the present invention;

图3是图2中B-B方向的剖视示意图。Fig. 3 is a schematic cross-sectional view along the B-B direction in Fig. 2 .

【具体实施方式】 【Detailed ways】

下面结合附图和实施方式对本实用新型作进一步说明。Below in conjunction with accompanying drawing and embodiment the utility model is further described.

如图2和图3所示,为本实用新型实施方式硅基麦克风2,包括基底20、背极板21、振膜22。基底20内设有空腔200,背极板21收容于空腔200内。在背极板21上还设有通气孔210。As shown in FIG. 2 and FIG. 3 , it is a silicon-based microphone 2 according to an embodiment of the present invention, including a base 20 , a back plate 21 , and a diaphragm 22 . The base 20 is provided with a cavity 200 , and the back plate 21 is accommodated in the cavity 200 . Vent holes 210 are also provided on the back plate 21 .

振膜22的横截面为T形,包括扁圆柱形的振动主体220和与振动主体相连的连接部221。连接部221为由振动主体中央区域延伸的长圆柱形。振动主体220通过连接部221与背板板21相连而与背极板21相对。振动主体可相对背极板上下振动并与背极板形成电容效应。当声音气流传递到振膜上时,振动主体上下振动以产生位移,改变电容器的电容量,电容量的改变使电容器的输出端产生相应的交变电场,形成与声波信号对应的电信号,从而完成声电转换的功能。The diaphragm 22 has a T-shaped cross section and includes a flat cylindrical vibrating body 220 and a connecting portion 221 connected to the vibrating body. The connecting part 221 is a long cylinder extending from the central area of the vibrating body. The vibrating body 220 is connected to the back plate 21 through the connecting portion 221 and is opposite to the back plate 21 . The vibrating body can vibrate up and down relative to the back plate and form a capacitive effect with the back plate. When the sound air flow is transmitted to the diaphragm, the vibrating body vibrates up and down to generate displacement, changing the capacitance of the capacitor, and the change of capacitance causes the output terminal of the capacitor to generate a corresponding alternating electric field, forming an electrical signal corresponding to the sound wave signal, thereby Complete the function of sound-electric conversion.

本实用新型振膜的振动主体周缘未被固定,而是通过位于振动主体中央区域的连接部固定于背极板上,与现有技术相比,此结构设计独特,所得产品的灵敏度也很高。The periphery of the vibrating body of the vibrating membrane of the utility model is not fixed, but is fixed on the back plate through the connecting part located in the central area of the vibrating main body. Compared with the prior art, this structural design is unique, and the sensitivity of the obtained product is also high .

以上所述的仅是本实用新型的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本实用新型创造构思的前提下,还可以做出改进,但这些均属于本实用新型的保护范围。What has been described above is only the embodiment of the utility model, and it should be pointed out that for those of ordinary skill in the art, improvements can also be made without departing from the inventive concept of the utility model, but these all belong to Protection scope of the present utility model.

Claims (3)

1, a kind of silica-based microphone, comprise that inside is provided with the substrate of cavity, is contained in back pole plate, vibrating diaphragm in the substrate cavity, it is characterized in that: described vibrating diaphragm involving vibrations main body with link to each other with the vibration main body and be positioned at the connecting portion that vibrates the main body middle section, described connecting portion links to each other with back pole plate, and described vibration main body is relative with back pole plate.
2, silica-based microphone according to claim 1 is characterized in that: described vibration main body is oblate cylindricality, and connecting portion is served as reasons and vibrated the elongated cylindrical that the main body middle section extends.
3, silica-based microphone according to claim 1 and 2 is characterized in that: the cross section of described vibrating diaphragm is a T shape.
CNU2008202357263U 2008-12-26 2008-12-26 Silica-based microphone Expired - Lifetime CN201345734Y (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011144570A1 (en) * 2010-05-20 2011-11-24 Epcos Ag Electric component having a shallow physical shape, and method of manufacture
CN104581549A (en) * 2013-10-16 2015-04-29 美律电子(深圳)有限公司 Sonic sensor with high sensitivity

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011144570A1 (en) * 2010-05-20 2011-11-24 Epcos Ag Electric component having a shallow physical shape, and method of manufacture
CN102893632A (en) * 2010-05-20 2013-01-23 埃普科斯股份有限公司 Electric component having shallow physical shape, and method of manufacture
US9084366B2 (en) 2010-05-20 2015-07-14 Epcos Ag Electric component having a shallow physical shape, and method of manufacture
CN102893632B (en) * 2010-05-20 2016-11-02 埃普科斯股份有限公司 There is electric device and the manufacture method of planar design
CN104581549A (en) * 2013-10-16 2015-04-29 美律电子(深圳)有限公司 Sonic sensor with high sensitivity
CN104581549B (en) * 2013-10-16 2018-05-29 美律电子(深圳)有限公司 High sensitivity sonic sensor

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C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20170526

Address after: Singapore Ang Mo Kio 65 Street No. 10 techpoint Building 1 floor, No. 8

Co-patentee after: AAC Acoustic Technologies (Changzhou) Co., Ltd.

Patentee after: AAC Technologies (Singapore) Co., Ltd.

Address before: 518057 Nanshan District province high tech Industrial Park, Shenzhen, North West New Road, No. 18

Co-patentee before: AAC Acoustic Technologies (Changzhou) Co., Ltd.

Patentee before: AAC Acoustic Technologies (Shenzhen) Co., Ltd.

CX01 Expiry of patent term

Granted publication date: 20091111

CX01 Expiry of patent term