CN201303481Y - Thermoelectric separated heat dissipation module structure - Google Patents

Abstract

The utility model discloses a thermal module structure of thermoelectric separation, it contains: the heat dissipation device comprises a heat dissipation unit, a conductive layer, an insulating layer, a solder mask layer, a circuit layer and an electronic element; the heat radiating unit is made of aluminum, the conducting layer is made of copper, so that heat emitted by the electronic element can be radiated by the heat radiating unit and the conducting layer, and the circuit layer is controlled by the pins of the electronic element to achieve the effect of thermoelectric separation.

Description

Heat dissipation module structure with thermoelectric separation

technical field

The utility model relates to the arrangement of a heat dissipation module structure, in particular to a heat dissipation module structure with thermoelectric separation.

Background technique

The heat dissipation problem in the use of electronic components has always been the most concerned issue for manufacturers and users, especially the recently developed light-emitting diodes. Its high luminosity and power-saving properties are amazing, but it has the disadvantage of high heat generation. However, due to the poor heat dissipation of electronic components, extremely high temperatures will be generated, which will cause the phenomenon of "electron migration". This phenomenon is affected by the following factors. Obviously, another factor is temperature: high temperature is conducive to the generation of "electron migration", so how to improve its high heat generation, and with the other two advantages: high luminosity and power saving properties, making it a pioneer of a new generation of use, is The goal of each manufacturer.

Generally, heat sinks used with light-emitting diodes are mostly extruded from aluminum, but the characteristics of aluminum are poor heat absorption and fast heat dissipation, so that the high temperature generated by the electronic components themselves cannot be used as an aluminum heat sink. Rapid heat absorption, so the heat dissipation of electronic components is quite limited, and there is another heat sink made of copper on the market, although it has the characteristics of fast heat absorption, although this can improve the heat absorption efficiency of aluminum heat sinks, However, the heat dissipation of copper radiators is not as good as that of aluminum radiators, and due to the rise in international raw material prices, the manufacturing cost of copper radiators is higher than that of aluminum radiators, so the economic benefits are not high.

Therefore, how to achieve a balance between electrical conduction and heat transfer in the use of electronic components, and how to design a heat sink product that can be used by related electronic components in terms of material characteristics are the directions that the inventors have been actively working on all the time. .

Utility model content

Therefore, the purpose of this utility model is to prevent electronic components from being affected by the "electron migration" phenomenon and to achieve the best heat dissipation power of heat absorption and heat dissipation in the use of heat dissipation materials, and to design a heat dissipation module structure with thermoelectric separation.

Based on the above purpose, the utility model utilizes a thermally and electrically separated heat dissipation module structure, which includes: a heat dissipation unit, a conductive layer, an insulating layer, a solder resist layer, a circuit layer and at least one electronic component; the conductive layer is stacked on On the heat dissipation unit, at least one conduction portion protrudes from the conduction layer, the insulating layer is stacked on the conduction layer outside the conduction portion, and the solder resist layer is stacked on the insulating layer, the solder resist The layer is provided with a plurality of openings. At this time, the circuit layer is arranged in the opening and stacked on the insulating layer, and the electronic component is relatively arranged on the conductive part. The electronic component has a plurality of holes connected to the circuit layer. root pin.

Through the above technical solution, the utility model is a heat dissipation module structure with thermoelectric separation, which has the following advantages:

1. Since the electronic component is connected to the circuit layer by the pin, the electronic component can be prevented from being affected by the high-temperature nature of the “electron migration” phenomenon, and the wear and tear of the electronic component can be avoided.

2. The utility model selects copper material and aluminum material for the conduction layer and the heat dissipation unit respectively, so that the conduction part can quickly absorb heat for the electronic component, and then the direct contact between the conduction layer and the heat dissipation unit makes the aluminum The rapid heat dissipation property of the material can be exerted, and accordingly, the utility model can achieve the best heat dissipation power of heat absorption and heat dissipation.

Description of drawings

FIG. 1 is a structural schematic diagram of a thermal-electricity separation heat dissipation module structure of the present invention.

Fig. 2-1 is a schematic diagram of a rolling combination of a thermoelectric separation heat dissipation module structure of the present invention.

Fig. 2-2 is an etching schematic diagram of a thermoelectric separation heat dissipation module structure of the present invention.

Fig. 2-3 is a schematic diagram of cladding of a thermoelectric separation heat dissipation module structure of the present invention.

2-4 are schematic diagrams of pin connections of a thermoelectric separation heat dissipation module structure of the present invention.

Detailed ways

The detailed content and technical description of the present utility model will be further described by examples, but it should be understood that these examples are only for illustration and should not be construed as limitations on the implementation of the utility model.

Referring to Fig. 1, the utility model is a heat dissipation module structure with thermoelectric separation, which includes: a heat dissipation unit 10, a conductive layer 20, an insulating layer 30, a solder resist layer 40, a circuit layer 50 and at least one Electronic component 60; the conduction layer 20 is stacked on one side of the heat dissipation unit 10, and a plurality of heat dissipation fins 11 are formed on the other side different from the conduction layer 20, and the conduction layer 20 is protruded with At least one conductive part 21, the insulating layer 30 is stacked on the conductive layer 20 outside the conductive part 21, thereby producing the function of preventing conduction, the solder resist layer 40 is stacked on the insulating layer 30, and is provided with a plurality of opening, the circuit layer 50 is disposed in the opening and stacked on the insulating layer 30, at this time, the electronic component 60 is relatively disposed on the conductive portion 21, and the electronic component 60 has a connection with the circuit layer 50 and generates electricity. A plurality of pins 61 that are connected, and in this embodiment, the electronic component 60 is a light emitting diode, wherein the heat dissipation unit 10 is any one selected from aluminum, aluminum alloy or copper alloy, and the conductive layer 20 is in In this embodiment, it is made of copper.

Referring to Figure 2-1-Figure 2-4, the description of the manufacturing process of the present utility model is as follows. Figure 2-1 is a schematic diagram of the rolling combination of the present utility model. First, a copper material 70 and an aluminum material 80 are rolled together It is a combination unit 90, so that it is closely attached; FIG. 2-2 is a schematic diagram of etching of the present invention, and the copper material 70 on the combination unit 90 is etched to form the conductive layer 20 and the conductive part 21 , then the bottom is the cooling unit 10; Fig. 2-3 is a schematic diagram of the application of the present invention, and the insulation layer 30, the solder resist layer 40 and the circuit layer 50 are applied layer by layer from bottom to top. On the conductive layer 20 outside the conductive part 21; Figure 2-4 is a schematic diagram of the connection of the pin 61 of the present utility model. When the electronic component 60 is arranged on the conductive part 21, the pin of the electronic component 60 61 and the circuit layer 50 are connected and set, accordingly, the aluminum material 80 can be set as the heat dissipation fin 11, so that the heat energy generated by the electronic component 60 disposed on the conductive part 21 can be smoothly conducted by the copper material 70 To the aluminum 80.

In addition, due to the heat-absorbing nature of metals, the heat transfer coefficient is considered. The definition of heat transfer coefficient is "the heat passing through a unit area in a unit time under a unit temperature difference". It has been proved by experiments that the heat transfer coefficient of copper is greater than that of aluminum. Heat transfer coefficient, so copper and aluminum are used to manufacture radiators with the same cross-sectional area. Copper can take away more heat than aluminum per unit time. In addition, the heat dissipation properties of metals need to be factored into another thermodynamic parameter: specific heat, specific heat The definition of copper is "the heat required to increase the temperature of a unit mass of material by 1 degree". In terms of specific heat coefficient, copper dissipates heat faster than aluminum, but since copper has a density about 3 times greater than aluminum, when made of copper and aluminum For a heat sink with the same volume, the mass of copper will be about 3 times larger than that of aluminum, so the heat capacity of copper is larger than that of aluminum, so its heat dissipation will be slower.

According to the heat absorption and heat dissipation properties of the above metal materials, the conduction layer 20 and the heat dissipation unit 10 of the present invention are respectively made of copper and aluminum, so that the direct contact between the conduction part 21 and the electronic component 60 can be quickly The thermal energy of the electronic component 60 can be sucked away, and the thermal energy can be dissipated quickly by the direct contact between the heat dissipation unit 10 and the conductive layer 20; in addition, on the electrical conduction of the electronic component 60, the electronic component The pin 61 of 60 is connected to the circuit layer 50 , and the operation of the electronic component 60 is controlled by the circuit layer 50 .

Therefore, through the utility model, the thermal energy and electrical conduction of the electronic component 60 are separately distinguished from the conduction area and mode, and the purpose is to achieve the effect of thermoelectric separation. The purpose of this thermoelectric separation is to reduce the electronic component 60 or the circuit layer 50. The electrical conduction path is damaged by the phenomenon of "electron migration", reducing the shape of the metal material due to high electrical conduction or high temperature, which in turn causes the metal material to suffer slow and irreversible damage.

The concept of the utility model is based on active research on the relationship between electrical conduction and thermal energy conduction coefficient between metals, and then the utility model is developed, which solves the high temperature properties of the electronic component 60 and matches the electronic component 60 The circuit is arranged separately, so that the contribution of the utility model in the electronic industry and environmental protection has been greatly improved.

The above are only preferred embodiments of the present utility model, and are not intended to limit the implementation scope of the present utility model. That is, all equivalent changes and modifications made according to the patent scope of the utility model are covered by the patent scope of the utility model.

Claims (5)

1. A cooling module structure with thermoelectric separation, characterized in that it comprises: A cooling unit (10); A conduction layer (20), the conduction layer (20) is stacked on one side of the heat dissipation unit (10), and at least one conduction portion (21) is protruded on the conduction layer (20); an insulating layer (30), the insulating layer (30) stacked on the conducting layer (20) outside the conducting part (21); A solder resist layer (40), the solder resist layer (40) is stacked on the insulating layer (30), and is provided with a plurality of openings; a circuit layer (50), the circuit layer (50) is disposed in the opening and stacked on the insulating layer (30); and At least one electronic component (60), the electronic component (60) is relatively arranged on the conductive part (21), the electronic component (60) has a plurality of pins connected to the circuit layer (50) (61). 2. The heat dissipation module structure with thermoelectric separation according to claim 1, characterized in that, the electronic component (60) is a light emitting diode. 3. The heat dissipation module structure with thermoelectric separation according to claim 1, characterized in that, the heat dissipation unit (10) is any one selected from aluminum, aluminum alloy or copper alloy. 4. The heat dissipation module structure of thermoelectric separation according to claim 1, characterized in that, the heat dissipation unit (10) is formed with a plurality of heat dissipation fins ( 11). 5. The heat dissipation module structure with thermoelectric separation according to claim 1, characterized in that, the conductive layer (20) is made of copper.

Images