CN201351892Y - Lotus base heat dissipation device - Google Patents
Lotus base heat dissipation device Download PDFInfo
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- CN201351892Y CN201351892Y CNU2008201289983U CN200820128998U CN201351892Y CN 201351892 Y CN201351892 Y CN 201351892Y CN U2008201289983 U CNU2008201289983 U CN U2008201289983U CN 200820128998 U CN200820128998 U CN 200820128998U CN 201351892 Y CN201351892 Y CN 201351892Y
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- emitting element
- dissipation plate
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 47
- 240000002853 Nelumbo nucifera Species 0.000 title claims abstract description 18
- 235000006508 Nelumbo nucifera Nutrition 0.000 title claims abstract description 18
- 235000006510 Nelumbo pentapetala Nutrition 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000001816 cooling Methods 0.000 claims description 17
- 239000007769 metal material Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
本实用新型涉及一种莲花座散热装置,属于机电类。它包括有电路基板,该电路基板上设有至少一个发光元件;至少一个散热板,该散热板一面与电路基板的背面相连,该散热板可供发光元件所产生的热能将其导热,该散热板通过层叠方式增设为复数个散热板。优点在于:结构简单,制作所需工时短;降低了整体制作成本;可在有效范围内做不同的设计使用,应用面极广;使用铆钉固定,简易且牢固。
The utility model relates to a lotus seat heat dissipation device, which belongs to the electromechanical category. It includes a circuit substrate, on which at least one light-emitting element is arranged; at least one heat dissipation plate, one side of which is connected to the back side of the circuit substrate, and the heat dissipation plate can be used to conduct the heat energy generated by the light-emitting element, and the heat dissipation plate is added to a plurality of heat dissipation plates by stacking. The advantages are: simple structure, short production time; reduced overall production cost; can be used in different designs within the effective range, and has a wide range of applications; fixed with rivets, simple and firm.
Description
技术领域 technical field
本实用新型涉及机电类,特别涉及一种莲花座散热装置。The utility model relates to electromechanical products, in particular to a heat dissipation device for a lotus seat.
背景技术 Background technique
众所周知,由于发光二极体(LED)是一种固态的半导体元件,利用电子电洞的相互配合将能量以光的形式释放,属冷光发光,具有体积小、反应速度快、使用寿命长、耗电量低、耐震性佳及无污染等优势,为各种电器、资讯看板、通讯产品等的发光元件,至目前已经广泛运用在各领域中,特别是目前的照明设备上,利用发光二极体作为发光元件,虽然初期的发光二极体效率不如预期的媲美传统照明设备,但在后续的技术及材料改良下,发光二极体所营造出的发光亮度已有明显的进步,逐渐有取代传统发光元件的趋势。As we all know, since a light-emitting diode (LED) is a solid-state semiconductor element, it uses the cooperation of electron holes to release energy in the form of light. With the advantages of low power, good shock resistance, and no pollution, it is a light-emitting element for various electrical appliances, information boards, and communication products. It has been widely used in various fields, especially in current lighting equipment. The use of light-emitting diodes As a light-emitting element, although the initial efficiency of light-emitting diodes is not as good as expected, it is comparable to traditional lighting equipment, but with subsequent technology and material improvements, the luminous brightness created by light-emitting diodes has been significantly improved, gradually replacing The trend of traditional lighting components.
再者,由于后续的技术及材料的影响,发光二极体所需的电流也日益增加,因此发光二极体所产生的热能也逐渐增加,而为了不使过多的热能影响到发光二极体的寿命,因此对于以发光二极体作为发光元件的照明设备,适当的散热结构成了目前照明设备所必要的手段之一。Furthermore, due to the impact of subsequent technologies and materials, the current required by the light-emitting diodes is also increasing, so the heat generated by the light-emitting diodes is also gradually increasing, and in order not to cause excessive heat to affect the light-emitting diodes Therefore, for lighting equipment that uses light-emitting diodes as light-emitting elements, an appropriate heat dissipation structure has become one of the necessary means for current lighting equipment.
为了解决照明装置的散热问题,一般是配合原有照明装置的设计,在照明装置上设置复数的散热片,以利用传导及气冷散热的相互配合,将照明装置所产生的热能传至复数散热片上,再经由空气与散热片的热交换作用,以减低热能对照明装置的影响,如附图1所示,常用的LED灯具的散热结构1包括有复数个鳍片11,该等鳍片11由扣合方式将其串接在一起,以形成完整的散热结构1,该等鳍片11在有限范围内利用扣片以增加散热面积,以达到散热的效果。In order to solve the heat dissipation problem of the lighting device, a plurality of heat sinks are generally arranged on the lighting device in accordance with the design of the original lighting device, so as to use the mutual cooperation of conduction and air cooling to transfer the heat energy generated by the lighting device to the multiple heat sinks. on the chip, and then through the heat exchange between the air and the heat sink to reduce the impact of heat on the lighting device. As shown in Figure 1, the heat dissipation structure 1 of a commonly used LED lamp includes a plurality of fins 11, and these fins 11 The fins 11 are connected in series by buckling to form a complete heat dissipation structure 1 , and the fins 11 use buckles within a limited range to increase the heat dissipation area to achieve the effect of heat dissipation.
然而,上述LED灯具的散热结构在使用时,仍存在下列问题:However, the heat dissipation structure of the above-mentioned LED lamps still has the following problems when in use:
散热结构1在制作时,所需要的模具较昂贵;结构复杂,使制作工时较长;成本高,体积大,需要加以改进。When the heat dissipation structure 1 is manufactured, the required mold is relatively expensive; the structure is complicated, which makes the manufacturing time longer; the cost is high and the volume is large, which needs to be improved.
实用新型内容 Utility model content
本实用新型的目的在于提供一种莲花座散热装置,解决了常用散热结构制作时所需要的模具较昂贵、结构复杂、制作工时较长、成本高及体积大等问题。The purpose of the utility model is to provide a lotus seat cooling device, which solves the problems of expensive molds, complex structures, long manufacturing hours, high cost and large volume required for the production of common cooling structures.
本实用新型的技术方案是:包括有电路基板,该电路基板上设有至少一个发光元件;至少一个散热板,该散热板一面与电路基板的背面相连,该散热板可供发光元件所产生的热能将其导热,该散热板通过层叠方式增设为复数个散热板,发光元件点亮而发生的热能,经由该散热板迅速导出,使发光元件使用寿命增长;The technical scheme of the utility model is: comprising a circuit substrate, on which at least one light-emitting element is arranged; The thermal energy conducts heat, and the heat dissipation plate is added to a plurality of heat dissipation plates by stacking, and the heat energy generated by the lighting of the light-emitting element is quickly exported through the heat dissipation plate, so that the service life of the light-emitting element is increased;
其中,电路基板周围形成有复数凸部;Wherein, a plurality of protrusions are formed around the circuit substrate;
发光元件延伸有导电用的电性元件;The light-emitting element is extended with an electrical element for conducting electricity;
电路基板上具有与供电性元件通过的复数孔洞;The circuit substrate has a plurality of holes through which the power supply components pass;
发光元件为发光二极体或卤素灯其中之一;The light-emitting element is one of a light-emitting diode or a halogen lamp;
散热板周围形成有复数凸部;A plurality of protrusions are formed around the cooling plate;
散热板为高导热性金属材料,该金属材料为铜、铝其中之一;The heat dissipation plate is a metal material with high thermal conductivity, and the metal material is one of copper and aluminum;
散热板上具有与孔洞相对应的对接孔;There are butt holes corresponding to the holes on the cooling plate;
电路基板具有固定部;The circuit substrate has a fixing portion;
固定部为铆钉固定或黏贴固定其中之一。The fixing part is one of rivet fixing or adhesive fixing.
本实用新型的优点在于:结构简单,制作所需工时短;降低了整体制作成本;可在有效范围内做不同的设计使用,应用面极广;使用铆钉固定,简易且牢固。The utility model has the advantages of simple structure and short man-hours required for production; overall production cost is reduced; different designs can be used within the effective range, and the application range is extremely wide; fixed by rivets, it is simple and firm.
附图说明: Description of drawings:
图1为常用LED灯具散热结构的示意图;Figure 1 is a schematic diagram of the heat dissipation structure of commonly used LED lamps;
图2为本实用新型的立体示意图;Fig. 2 is the three-dimensional schematic view of the utility model;
图3为本实用新型的分解示意图;Fig. 3 is the exploded schematic view of the utility model;
图4为本实用新型的动作示意图;Fig. 4 is the action schematic diagram of the present utility model;
图5为本实用新型的另一结构的实施例示意图;Fig. 5 is the embodiment schematic diagram of another structure of the present utility model;
图6为本实用新型的又一结构的实施例示意图。Fig. 6 is a schematic diagram of another structure embodiment of the present utility model.
具体实施方式: Detailed ways:
如附图2及附图3所示,本实用新型莲花座散热装置2包括有:As shown in accompanying
电路基板3,该电路基板3上设有至少一个发光元件31,发光元件31可为发光二极体(LED)或卤素灯其中之一,发光元件31延伸有导电用的电性元件311,电路基板3上具有与供电性元件311通过的复数孔洞32;再者,该电路基板3周围形成有复数凸部;The
至少一个散热板4,该散热板4一面与电路基板3的背面相连,该散热板4可供发光元件31所产生的热能将其导热,该散热板4通过层叠方式增设为复数个散热板4,使其导热效果更佳;散热板4上具有与该等孔洞32相地应的对接孔41,对接孔41也可供电性元件311穿透,使电性元件311得以顺利由电路基板3背面穿出导电,且散热板4为高导热性金属材料,该金属材料为铜、铝其中之一,此种高导热性金属材料可使散热板4的散热效果更佳;再者,散热板4周围形成有复数凸部42,藉由上述该等凸部33、42在电路基板3与散热板4结合时,得以形成莲花座的样式,非常时尚且特殊,因此,根据上述结构可以看出,散热装置2具有体积小,延展性高,且结构简单,使得成本大为降低等优势。At least one
电路基板3上具有固定部34,固定部34用以固定电路基板3及散热板4的接合,且固定部34可为铆钉固定或黏贴固定其中之一。The
如附图3及附图4所示,电路基板3周围形成有复数凸部33,电路基板3上设有至少一个发光元件31,该发光元件31延伸有导电用的电性元件311,通过电性元件311可使发光元件31作动,电路基板3上具有复数可供电性元件311通过的孔洞32,电路基板3背面设有复数散热板4,该等散热板4具有与孔洞32相对应的对接孔41,对接孔41可使电性元件311通过,且该等散热板4周围形成有复数凸部42,当电路基板3通过固定部34固接时,通过上述凸部33、42的展现可使散热装置2像似莲花座;当电性元件311导电后,电流5经由电性元件311流至发光元件31,发光元件31随即导通发亮,且同时产生出热能6,该热能6经由散热板4做热交换,将热能6导出,并且若该等散热板4层叠愈多,散热效果愈佳。As shown in accompanying
如附图5所示,电路基板3a上设有至少一发光元件31a,该电路基板3a的背面设有至少一散热板4a,散热板4a通过固定部34a与电路基板3a相连,并且散热装置2a另一侧可进一步连接增设一组相反方向的散热装置2a,使散热装置2a可组合出不同的样式。As shown in Figure 5, at least one light-
如附图6所示,散热装置2b包括有电路基板3b及至少一散热板4b,电路基板3b周围形成有复数凸部33b,且该等散热板4b也在周围形成有复数凸部42b,并且通过不同的角度排列方式,得以制作出具有莲花座样式的散热装置2b。As shown in Figure 6, the
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| Application Number | Priority Date | Filing Date | Title |
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| CNU2008201289983U CN201351892Y (en) | 2008-12-24 | 2008-12-24 | Lotus base heat dissipation device |
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| CNU2008201289983U CN201351892Y (en) | 2008-12-24 | 2008-12-24 | Lotus base heat dissipation device |
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| CN201351892Y true CN201351892Y (en) | 2009-11-25 |
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| CNU2008201289983U Expired - Fee Related CN201351892Y (en) | 2008-12-24 | 2008-12-24 | Lotus base heat dissipation device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032542A (en) * | 2010-11-22 | 2011-04-27 | 蔡铭钧 | Lamp housing of LED lamp |
| CN102098903A (en) * | 2010-12-11 | 2011-06-15 | 郭小华 | Efficient heat radiating device |
| CN102548349A (en) * | 2010-12-30 | 2012-07-04 | 东莞市光宇实业有限公司 | An efficient cooling device |
| CN105423257A (en) * | 2015-12-07 | 2016-03-23 | 谢彦涛 | Radiator, manufacturing method of radiator and lamp with radiator |
-
2008
- 2008-12-24 CN CNU2008201289983U patent/CN201351892Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102032542A (en) * | 2010-11-22 | 2011-04-27 | 蔡铭钧 | Lamp housing of LED lamp |
| CN102098903A (en) * | 2010-12-11 | 2011-06-15 | 郭小华 | Efficient heat radiating device |
| CN102098903B (en) * | 2010-12-11 | 2013-07-03 | 四川飞碟光电科技有限公司 | Efficient heat radiating device |
| CN102548349A (en) * | 2010-12-30 | 2012-07-04 | 东莞市光宇实业有限公司 | An efficient cooling device |
| CN105423257A (en) * | 2015-12-07 | 2016-03-23 | 谢彦涛 | Radiator, manufacturing method of radiator and lamp with radiator |
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| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091125 Termination date: 20101224 |