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CN201285000Y - Led三维发光板 - Google Patents

Led三维发光板 Download PDF

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Publication number
CN201285000Y
CN201285000Y CNU2008201676736U CN200820167673U CN201285000Y CN 201285000 Y CN201285000 Y CN 201285000Y CN U2008201676736 U CNU2008201676736 U CN U2008201676736U CN 200820167673 U CN200820167673 U CN 200820167673U CN 201285000 Y CN201285000 Y CN 201285000Y
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Prior art keywords
led
light
led chip
aluminum substrate
notch
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Expired - Fee Related
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CNU2008201676736U
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English (en)
Inventor
张荣民
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TIANJIN JINMA PHOTOELECTRIC CO Ltd
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Priority to EP09174047A priority patent/EP2189706A1/en
Priority to US12/615,081 priority patent/US8039851B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H10W72/5522—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

LED三维发光板，属于光电技术领域。包括铝基板，其特征在于铝基板竖立设置，其上部边侧沿厚度方向透空设置凹口，LED芯片安装在凹口内，铝基板表面设置软性电路层，LED芯片通过金线与软性电路层电路连接，LED芯片外部配合设置荧光胶体发光罩，LED芯片与荧光胶体发光罩之间具有空腔，荧光胶体发光罩下部固定在铝基板上。上述LED三维发光板，有效提高了LED的发光亮度效率及扩大了有效发光角度，改善了光形与光色不均的问题，使LED白光灯产品能达到钨丝灯的发光效果。荧光胶体发光罩罩住LED芯片，即可防尘保护，产生白光，又适应严格的使用环境。且因结构简单，降低了生产成本。

Description

LED三维发光板
技术领域
本实用新型属于光电技术领域，具体为LED三维发光板。
背景技术
旧式LED大功率芯片固定方法有两种，一种是一颗大功率芯片先固定于铜支架的基础上再进行焊金线的工艺使芯片通电导通发光，再透过支架进行散热；另一种是将一颗芯片固定于铝基板的表面基础上，再进行焊金线的工艺使芯片通电导通发光，并且通过铝基板达成散热效果，二者均为LED平贴于平面的基础后焊垫的结构。LED芯片平贴基面的生产工艺，造成了LED的有效发角度仅为65度角，无法照到大范围有效面积，并且会有光晕的效应，使LED的发出光形，出现中央与外圈的色光有色差存在。且现有产品中，荧光粉胶体覆盖在LED芯片与金线的表面，经常因为胶体的热胀冷缩作用，造成金线被胶体拉断，而变为点死。胶体工作温度只能维持在80度至零下10度，胶体的热胀冷缩作用会影响芯片的质量，不适合于严格的工作环境中使用；因为空间过于狭小，使芯片的光能在胶体内部折射，而抵消了发光效能；现有产品的生产成本高。
实用新型内容
针对现有技术中存在的上述问题，本实用新型的目的在于设计提供一种LED三维发光板的技术方案，有效提高了LED的发光亮度效率及扩大了有效发光角度，改善了光形与光色不均的问题，使LED白光灯产品能达到钨丝灯的发光效果。
所述的LED三维发光板，包括铝基板，其特征在于铝基板竖立设置，其上部边侧沿厚度方向透空设置凹口，LED芯片安装在凹口内，铝基板表面设置软性电路层，LED芯片通过金线与软性电路层电路连接，LED芯片外部配合设置荧光胶体发光罩，LED芯片与荧光胶体发光罩之间具有空腔，荧光胶体发光罩下部固定在铝基板上。
所述的LED三维发光板，其特征在于安装在凹口内的LED芯片前后面与铝基板正反面在同一平面上。
所述的LED三维发光板，其特征在于铝基板底部设置连接卡口。
所述的LED三维发光板，其特征在于荧光胶体发光罩为下部设置开口的球形结构，其开口边套接在铝基板上通过销钉固定。
所述的LED三维发光板，其特征在于安装在凹口内的各个LED芯片串联连接，LED芯片的功率为1w。
所述的LED三维发光板，其特征在于安装在凹口内的LED芯片发光角度为259度。
所述的LED三维发光板，其特征在于LED芯片与凹口底部胶粘连接。
所述的LED三维发光板，其特征在于铝基板的厚度为1mm。
上述LED三维发光板，有效提高了LED的发光亮度效率及扩大了有效发光角度，改善了光形与光色不均的问题，使LED白光灯产品能达到钨丝灯的发光效果。LED芯片外部配合设置荧光胶体发光罩，罩住全部芯片，即可防尘保护，并产生白光，且由于胶体与芯片完全没有接触，没有热胀冷缩效应，可以在105度至零下35度的温度下工作，适应严格的使用环境。该LED三维发光板结构简单，降低了生产成本。
附图说明
图1为本实用新型的结构示意图：
图2为本实用新型侧面结构示意图；
图中：1-铝基板、2-凹口、3-LED芯片、4-金线、5-荧光胶体发光罩、6-软性电路层、7-连接卡口、8-销钉。
具体实施方式
以下结合说明书附图对本实用新型作进一步说明：
如图所示，铝基板1竖立设置，其上部边侧沿厚度方向透空设置凹口2，LED芯片3安装在凹口2内，LED芯片3与凹口2底部胶粘连接。安装在凹口2内的LED芯片3前后面与铝基板1正反面在同一平面上。铝基板1底部设置连接卡口7，用于可其它连接器连接。铝基板1的形状可以根据需要设计。铝基板1表面设置软性电路层6，LED芯片3通过金线4与软性电路层6电路连接，使电路导通。LED芯片3外部配合设置荧光胶体发光罩5，LED芯片3与荧光胶体发光罩5之间具有空腔，荧光胶体发光罩5下部固定在铝基板1上。荧光胶体发光罩5一般采用下部设置开口的球形结构，其开口边套接在铝基板1上通过销钉8固定。荧光胶体发光罩5罩住全部芯片，可达到防尘保护的效果，并产生白光，由于LED芯片3与荧光胶体发光罩5完全没有接触，没有热胀冷缩效应，可以在105度至零下35度的温度下工作，适应严格的使用环境。
铝基板1为直立结构，升高了LED芯片3的高度位置，芯片固定在铝基板1上，达到散热作用，芯片两侧完全露空，所以芯片两侧有了发光的功能，创造了大角度发光范围，使芯片的光能完全引导发挥出来，形成了LED芯片3由高处向下照射的发光形式，产生了259度的有效发光角度，使LED芯片3的发光效能提高，改善了光形与光色不均的问题。LED芯片3的功率为1w，将数个LED芯片3串联连接，即可达到钨丝灯的发光效果，通过控制LED芯片3的电源，控制其发光亮度。

Claims (8)

1、LED三维发光板，包括铝基板(1)，其特征在于铝基板(1)竖立设置，其上部边侧沿厚度方向透空设置凹口(2)，LED芯片(3)安装在凹口(2)内，铝基板(1)表面设置软性电路层(6)，LED芯片(3)通过金线(4)与软性电路层(6)电路连接，LED芯片(3)外部配合设置荧光胶体发光罩(5)，LED芯片(3)与荧光胶体发光罩(5)之间具有空腔，荧光胶体发光罩(5)下部固定在铝基板(1)上。
2、如权利要求1所述的LED三维发光板，其特征在于安装在凹口(2)内的LED芯片(3)前后面与铝基板(1)正反面在同一平面上。
3、如权利要求1所述的LED三维发光板，其特征在于铝基板(1)底部设置连接卡口(7)。
4、如权利要求1所述的LED三维发光板，其特征在于荧光胶体发光罩(5)为下部设置开口的球形结构，其开口边套接在铝基板(1)上通过销钉(8)固定。
5、如权利要求1所述的LED三维发光板，其特征在于安装在凹口(2)内的各个LED芯片(3)串联连接，LED芯片(3)的功率为1w。
6、如权利要求1所述的LED三维发光板，其特征在于安装在凹口(2)内的LED芯片(3)发光角度为259度。
7、如权利要求1所述的LED三维发光板，其特征在于LED芯片(3)与凹口(2)底部胶粘连接。
8、如权利要求1所述的LED三维发光板，其特征在于铝基板(1)的厚度为1mm。
CNU2008201676736U 2008-11-20 2008-11-20 Led三维发光板 Expired - Fee Related CN201285000Y (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CNU2008201676736U CN201285000Y (zh) 2008-11-20 2008-11-20 Led三维发光板
EP09174047A EP2189706A1 (en) 2008-11-20 2009-10-26 Three-dimensional LED light-emitting plate
US12/615,081 US8039851B2 (en) 2008-11-20 2009-11-09 Three-dimensional LED light-emitting plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201676736U CN201285000Y (zh) 2008-11-20 2008-11-20 Led三维发光板

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EP (1) EP2189706A1 (zh)
CN (1) CN201285000Y (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013177735A1 (zh) * 2012-05-28 2013-12-05 深圳市众明半导体照明有限公司 一种led光源及其照明装置
CN103715341A (zh) * 2013-12-26 2014-04-09 深圳市光之谷新材料科技有限公司 一种发光二极管灯条

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202012102963U1 (de) 2012-08-07 2013-11-13 Rp-Technik E.K. Leuchtstofflampenartiges LED-Leuchtmittel
CN108613029A (zh) 2014-03-13 2018-10-02 飞利浦照明控股有限公司 用于照明装置的灯丝
US10889861B2 (en) 2015-06-17 2021-01-12 The Translational Genomics Research Institute Systems and methods for obtaining biological molecules from a sample
CN107559614B (zh) * 2017-09-12 2024-10-01 江门沃能光电科技有限公司 一种新型led路灯发光模组
DE102018100766A1 (de) * 2018-01-15 2019-07-18 Osram Opto Semiconductors Gmbh Leuchtmodul, Leuchtmittel und Verfahren zur Herstellung eines Leuchtmoduls

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CA1023039A (en) * 1975-02-28 1977-12-20 Bowmar Canada Limited Light emitting diode display
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
JP2008527666A (ja) * 2005-01-14 2008-07-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 照明装置
US7396142B2 (en) * 2005-03-25 2008-07-08 Five Star Import Group, L.L.C. LED light bulb
WO2007138696A1 (ja) * 2006-05-31 2007-12-06 Fujikura Ltd. 発光素子実装用基板、発光素子パッケージ体、表示装置及び照明装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013177735A1 (zh) * 2012-05-28 2013-12-05 深圳市众明半导体照明有限公司 一种led光源及其照明装置
CN103715341A (zh) * 2013-12-26 2014-04-09 深圳市光之谷新材料科技有限公司 一种发光二极管灯条
CN103715341B (zh) * 2013-12-26 2017-01-18 深圳市光之谷新材料科技有限公司 一种发光二极管灯条

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EP2189706A1 (en) 2010-05-26
US8039851B2 (en) 2011-10-18
US20100123143A1 (en) 2010-05-20

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