CN201219345Y - Cooling module - Google Patents

Abstract

The utility model relates to a heat radiation module, which is applied to a microprocessor or a light emitting diode; the heat radiation module is provided with at least one heat conduction column, at least one end of the heat conduction column is provided with an expansion component extending outwards, and the periphery of the heat conduction column is provided with a heat radiation component; therefore, when the heat dissipation module is used for heat dissipation of the microprocessor, the area of the expansion assembly contacting with the heat source can be enlarged, and heat can be quickly dissipated through the heat conduction column and the heat dissipation assembly; in addition, when the heat radiation module is used for the light emitting diode, the heat radiation area can be enlarged by the expansion component, and the number of the light emitting diodes is increased, so that the heat radiation is accelerated.

Description

Cooling module

technical field

The utility model relates to a cooling module.

Background technique

Computers are quite popular equipment. However, with the rapid development of computer technology, computer manufacturers are constantly pursuing hardware devices with faster computing speed and better performance. At the same time, computer manufacturers are also facing the problem of heat dissipation on microprocessors. Due to the Microprocessors are getting faster and faster, and the heat generated is getting higher and higher.

Similarly, the most frequently encountered light sources in daily life are old-fashioned light bulbs, quartz light bulbs, fluorescent light bulbs, and mercury lamps. Light-emitting diodes have become an indispensable and important component in daily life due to the advantages of no need for warm-up time, fast response speed, etc., coupled with their small size, vibration resistance, suitable for mass production, and easy to meet the needs of applications. , high-brightness light-emitting diodes as light sources for lighting will also receive more and more attention, but high-brightness light-emitting diodes as light sources for lighting will generate high heat when used due to the problem of electrical-optical conversion efficiency, and continuous high heat is harmful to electronics. The components will cause damage, and when it needs to be used as a high-brightness or lighting fixture, it is necessary to gather multiple LEDs, so the heat generated will be higher.

Therefore, how to solve the heat dissipation problem of the microprocessor of the computer and the light-emitting diode used for lighting has become one of the most important issues for the manufacturer.

In order to improve the various shortcomings of the above-mentioned known devices and structures, the inventor finally developed and designed a heat dissipation module after long-term hard research and experiments.

Utility model content

The purpose of this utility model is to provide a heat dissipation module, which is a heat dissipation module used in microprocessors or light-emitting diodes. The heat dissipation module is provided with a heat conduction cylinder, and at least one end of the heat conduction cylinder is provided with a direction The expansion components extend outward, and the heat dissipation components are installed around the heat conduction cylinder. In this way, not only can the heat dissipation be rapidly dissipated by the heat conduction cylinder and heat dissipation components, but also the contact area between the expansion components and the heat source can be increased to accelerate heat dissipation.

Another object of the present invention is to provide a heat dissipation module, which expands the carrying area by the expansion assembly to increase the number of light emitting diodes placed.

Another purpose of the present utility model is to provide a heat dissipation module, the two ends of the heat conduction column are respectively provided with expansion assemblies extending outwards, and heat dissipation assemblies are provided between the expansion assemblies, and the heat dissipation assemblies are respectively connected to the expansion assemblies. contact to form a thermal backflow effect to accelerate heat dissipation.

Another object of the present invention is to provide a heat dissipation module, the end surface of the expansion component is inclined from outside to inside or from inside to outside, so as to increase the function of concentrating or diffusing light sources.

Another object of the present utility model is to provide a heat dissipation module, which is provided with at least two heat conduction cylinders, the heat conduction cylinders are corresponding, and the outer sides of the heat conduction cylinders are respectively provided with outwardly extending heat dissipation components. Moreover, a connection component is provided between the heat conduction cylinders, and the connection component is made of heat conduction material. In this way, the heat conduction cylinders are combined into one body by the connection component, and heat dissipation is accelerated.

The purpose of this utility model is achieved in this way, a cooling module, the cooling module includes:

at least one generally cylindrical thermally conductive cylinder;

at least one hollow expansion component, the expansion component is arranged on either end of the heat conduction column;

At least one heat dissipation component is fixed on the periphery of the heat conduction cylinder.

The heat conduction column is a heat pipe.

The heat conduction column is a heat column.

The end surface of the expansion component is a plane.

The end surface of the expansion component is inclined from outside to inside.

The end surface of the expansion component is inclined from inside to outside.

The heat dissipation component is combined with a collar, and the collar is set around the heat conduction cylinder.

The heat dissipation component is a heat dissipation block or a heat dissipation fin.

There are further two expansion components, which are respectively arranged on the two ends of the heat conduction column, and the heat dissipation component is arranged between the expansion components.

The heat dissipation components are respectively in contact with the expansion components to form a heat return effect to accelerate heat dissipation.

Heat pipes are arranged at the end of the heat dissipation assembly.

There are two heat conduction cylinders, and the two heat conduction cylinders are corresponding, and the outer sides of the heat conduction cylinders are respectively provided with outwardly extending heat dissipation components, and a connection is provided between the heat conduction cylinders. components.

The connecting component is made of heat-conducting material to increase the heat dissipation area and accelerate heat dissipation.

From the above, the heat dissipation module of the present invention can not only quickly dissipate heat through the heat conduction cylinder and the heat dissipation component, but also increase the contact area with the heat source through the expansion component to accelerate heat dissipation.

Description of drawings

Fig. 1: is the three-dimensional schematic view of the first embodiment of the utility model.

Fig. 2: is a schematic cross-sectional view of the first embodiment of the present utility model.

Fig. 3: is a cross-sectional schematic view of the second embodiment of the present utility model.

Fig. 4: is a three-dimensional schematic diagram of the third embodiment of the present invention.

Fig. 5 is a combined schematic view of the fourth embodiment of the present invention.

FIG. 6 : is a three-dimensional exploded schematic view of the fifth embodiment of the present invention.

Fig. 7 is a three-dimensional combined schematic view of the fifth embodiment of the present invention.

Fig. 8 is a three-dimensional exploded schematic view of the sixth embodiment of the present invention.

Fig. 9 is a schematic diagram of the seventh embodiment of the present invention.

Fig. 10 is a schematic diagram of the implementation of the eighth embodiment of the present invention.

Figure number:

Cooling module 10

Thermal cylinder 11

Expansion Kit 12

Heat dissipation components 13, 153, 163

LED 14

Collar 15

Notch 151

Fixture 152

Heat dissipation block 16

Fixture 161

Heat pipe 163

Connection Components 17

Detailed ways

The utility model is a heat dissipation module, which is a heat dissipation module 10 that can be used for heat dissipation of a microprocessor. Please refer to Figures 1 and 2, which are the first embodiment of the utility model. The heat dissipation module 10 is provided with a heat conduction cylinder 11 (the heat conduction cylinder is made of heat conduction material, can be heat pipe (HeatPipe) or heat column (Heat Column), in this embodiment is heat pipe), this heat conduction cylinder 11 is in Under specific temperature conditions, the temperature is quickly transferred from one end of the heat source to the other end, and at least one end of the heat conduction column 11 is provided with an outwardly extending expansion assembly 12 (in this embodiment, it is the bottom end, and the expansion assembly is made of a single or Composite heat-conducting material), the end face of the expansion assembly 12 is flat, and the periphery of the heat-conducting cylinder 11 is provided with a heat-dissipating assembly 13 extending outward, (the heat-dissipating assembly is made of a single or composite heat-conducting material, which can It is a heat dissipation fin or a heat dissipation block, which is a radial heat dissipation fin in this embodiment), so that not only the heat dissipation can be rapidly dissipated by the heat conduction column 11 and the heat dissipation assembly 13, but also the expansion assembly 12 can be used to enlarge the heat source contact area to accelerate heat dissipation.

Please refer to FIG. 3 , which is a heat dissipation module 10 that can be used for heat dissipation of microprocessors or light-emitting diodes. It is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is: the Two ends of the heat conduction cylinder 11 are respectively provided with expansion components 12 extending outwards, and heat dissipation components 13 are provided between the expansion components 12, and the heat dissipation components 13 are respectively in contact with the expansion components 12 to form a heat return effect to accelerate Heat dissipation.

Please refer to FIG. 4 , which is a heat dissipation module 10 used for heat dissipation of light-emitting diodes, which is the third embodiment of the present invention. 11. At least one end is provided with an outwardly extending expansion assembly 12. In this embodiment, it is the top end. The area of the component 12 is increased to increase the number of LEDs placed and to accelerate heat dissipation.

Please refer to FIG. 5 , which is also a heat dissipation module 10 used for heat dissipation of light-emitting diodes, which is the fourth embodiment of the present invention. The difference between it and the third embodiment of the present invention is that the expansion assembly 12 The end face is inclined from outside to inside (or from inside to outside), so that when the light emitting diode 14 is installed on it, the inclination angle of the expansion assembly 12 can increase the effect of concentrating light (or diffusing light source).

Please refer to Figure 6, which is a cooling module 10 used for heat dissipation of light-emitting diodes or microprocessors. 11 is made of heat-conducting material, in this embodiment, it is a heat pipe (Heat Pipe), heat column (HeatColumn), the heat-conducting column 11 is to transfer the temperature from one end of the heat source to the other end quickly under a specific temperature condition, the heat-conducting One end of the cylinder 11 is provided with an outwardly extending expansion assembly 12, which is a ring frame in this embodiment, and the heat conducting cylinder 11 is provided with a collar 15, and the collar 15 is provided with a notch 151, and the two ends of the notch 151 Fixing parts 152 are respectively provided (in this embodiment, they are screw holes and screw rods that cooperate with each other, but those who are familiar with this skill can still weld or other methods), so that when the collar 15 is sleeved on the heat conduction cylinder 11, it can be fixed by fixing The parts 152 are locked to each other, and locked on the periphery of the heat conduction column 11, and a part of the collar 15 is provided with fan-shaped heat dissipation components 153 that expand outwards, such as heat dissipation fins or heat dissipation blocks, in this embodiment It is a heat dissipation block; when in use, one end of the thermal conduction cylinder 11 provided with the expansion assembly 12 can be in contact with the heat source, so that not only the heat dissipation can be rapidly dissipated by the heat conduction cylinder 11 and the heat dissipation assembly 153, but also can be dissipated by the expansion assembly 12 Increase the contact area with the heat source to accelerate heat dissipation; in addition, on the collar 15 of the same group, the heat dissipation assembly 153 in the fan-shaped area can be increased as needed, or more than one group of the collar 15 can be increased (as shown in Figure 7 shown).

Please refer to FIG. 8, which is the sixth embodiment of the present utility model, which is provided with a heat conduction cylinder 11, which is a cylinder in this embodiment, and both ends of the heat conduction cylinder 11 are provided with expansion components extending outward. 12. In this embodiment, it is a ring frame, and the heat conduction column 11 is provided with a relative heat dissipation block 16, and the two ends of the heat dissipation block 16 are respectively provided with fixing pieces 161 (in this embodiment, they are mutually matched) screw holes and screw rods, but those who are familiar with this skill can still weld or other methods), so that when the heat dissipation block 16 is attached to the heat conduction column 11, the mutual locking of the fixing piece 161 can be used, and the jacket is on the heat conduction cylinder. The periphery of the cylinder 11 and the periphery of the heat dissipation block 16 are respectively equipped with fan-shaped heat dissipation components 162 that expand outwards. In this way, not only can the heat be dissipated quickly by the heat conduction cylinder 11 and the heat dissipation component 162, but also can be enlarged by the expansion component 12. The contact area with the light-emitting diodes increases the number of light-emitting diodes and accelerates heat dissipation.

Please refer to Fig. 9, which is the seventh embodiment of the present utility model, and its difference from the above-mentioned embodiments is that it is provided with at least two heat-conducting cylinders 11, and the heat-conducting cylinders 11 are corresponding, and the The outer sides of the heat conduction cylinders 11 are respectively provided with outwardly extending heat dissipation components 162; in addition, a connection component 17 is provided between the heat conduction cylinders 11, and the connection components 17 are made of heat conduction materials. The connecting assembly 17 integrates the heat-conducting column 11 to accelerate heat dissipation.

Please refer to FIG. 10 , which is the eighth embodiment of the present utility model, which is provided with a heat conduction column 11, which is a cylinder in this embodiment, and the two ends of the heat conduction column 11 are provided with expansion components 12 extending outward. , in this embodiment is a ring frame, and the heat-conducting column 11 is provided with a relative heat dissipation component, in this embodiment, it is a heat dissipation block 16, and the two ends of the heat dissipation block 16 are respectively provided with fixing parts 161, (In this embodiment, it is a screw hole and a screw rod that cooperate with each other, but those who are familiar with the art can still weld or other methods), so that when the heat dissipation block 16 is attached to the heat conduction cylinder 11, these fixing parts 161 can are locked together, and the jacket is around the heat conduction cylinder 11, and the end of the heat dissipation block 16 is provided with a heat conduction pipe 163 to extend to other spaces or another heat dissipation component for heat dissipation.

Claims (13)

1. One kind the heat radiation module, it is characterized in that this heat radiation module includes:

   At least one heat conduction cylinder that is column substantially;

   At least one extension component that is hollow form, described extension component are arranged on the arbitrary end of this heat conduction cylinder;

   At least one radiating subassembly, this radiating subassembly is fixed on the periphery of this heat conduction cylinder.
2. 2. heat radiation module as claimed in claim 1 is characterized in that: described heat conduction cylinder is a heat pipe.
3. 3. heat radiation module as claimed in claim 1 is characterized in that: described heat conduction cylinder is a plume.
4. 4. heat radiation module as claimed in claim 1 is characterized in that: the end face of described extension component is the plane.
5. 5. heat radiation module as claimed in claim 1 is characterized in that: the end face of described extension component is the skewed of ecto-entad.
6. 6. heat radiation module as claimed in claim 1 is characterized in that: the end face of described extension component is from inside to outside skewed.
7. 7. heat radiation module as claimed in claim 1 is characterized in that: the described radiating subassembly and a collar combine, and this collar is set in around the heat conduction cylinder.
8. 8. heat radiation module as claimed in claim 1 is characterized in that: described radiating subassembly is heat radiation block or radiating fin.
9. 9. heat radiation module as claimed in claim 1 is characterized in that: described extension component further is two, and is located at respectively on the two ends of this heat conduction cylinder, and this radiating subassembly then is located between described extension component.
10. 10. heat radiation module as claimed in claim 9 is characterized in that: described radiating subassembly also contacts with described extension component respectively.
11. 11. heat radiation module as claimed in claim 1 is characterized in that: described radiating subassembly end limit is provided with heat pipe.
12. 12. heat radiation module as claimed in claim 1, it is characterized in that: described heat conduction cylinder is two, and described two heat conduction cylinders are corresponding, then are respectively equipped with outward extending radiating subassembly on the external side of described heating column, and then are provided with a coupling assembling between described heat conduction cylinder.
13. 13. heat radiation module as claimed in claim 12 is characterized in that: described coupling assembling is to be made by Heat Conduction Material.

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