CN108124406A - Heat sink device - Google Patents

Abstract

A heat dissipation device is used to solve the problems of high manufacturing cost of existing heat dissipation devices. The heat dissipation device of the present invention is used to be installed in a heat-generating object, and the heat dissipation device comprises: a heat-conducting base, the heat-conducting base is provided with a plurality of plug holes, the heat-conducting base contacts the heat source of the heat-generating object, and the heat source defines at least one heat-generating zone; and a plurality of heat-dissipating columns, the plurality of heat-dissipating columns are provided in the heat-generating zone, and the plurality of heat-dissipating columns are respectively inserted and positioned in the corresponding plug holes, and a heat-conducting silicone layer is provided on the outer peripheral surface of each heat-dissipating column.

Description

heat sink

technical field

The present invention relates to a heat dissipation device, in particular to a heat dissipation device in which a heat dissipation column can be arranged according to a heat source generating area.

Background technique

Since the electronic components in electronic products will generate heat during operation, many electronic products have been equipped with heat sinks for a long time. So that electronic products can maintain stable operation. Among them, the heat dissipation structure of general heat sinks is mostly heat dissipation fins or heat dissipation columns. However, in recent years, the development trend of thinner and more high-performance electronic products has increased the heating temperature of electronic products during operation, coupled with factors such as limited heat dissipation space, The heat dissipation fins or heat dissipation columns on the radiator alone are not enough to effectively dissipate heat, and often cause heat accumulation, which makes electronic products prone to unstable functions, affects the reliability of electronic products, and even causes thermal crashes and other problems .

Please refer to Fig. 1, it is a kind of existing cooling device 9, and this existing cooling device 9 has a base 91 and a plurality of cooling fins 92, and one end surface of this base 91 is provided with a plurality of cooling columns 911, each The cooling fins 92 are provided with a plurality of openings 921 that can be tightly matched with the plurality of cooling columns 911, so that the plurality of cooling fins 92 can be sequentially matched and inserted into the plurality of cooling columns 911; therefore, the plurality of cooling columns 911 The sheet 92 can further increase the heat dissipation area of the heat dissipation device 9 to achieve the effect of improving heat dissipation efficiency. An embodiment similar to the existing cooling device 9 has been disclosed in the patent document of Taiwan Publication No. I411383 "Pillar Radiator with Radiating Fins".

However, the heat dissipation efficiency of the existing heat dissipation device 9 is better, and the quantity of its heat dissipation fins 92 must be large enough, so that the thickness of the overall heat dissipation device 9 is difficult to be thinned, and the weight is also difficult to reduce, so it cannot be applied to most light and thin designs. in electronic products. Simultaneously, a plurality of heat dissipation columns 911 of the existing heat dissipation device 9 are integrally connected with the base 91 and arranged in groups, so no matter how the heat distribution of the heat source is, each component of the existing heat dissipation device 9 has no possible Adjustability; that is, the existing heat dissipation device 9 corresponds to the parts of the electronic product where the heat is not high. In fact, it does not substantially help heat dissipation, but only wastes the cost of setting these components.

In view of this, it is necessary to improve the existing cooling device.

Contents of the invention

In order to solve the above problems, the present invention provides a heat dissipation device, which can greatly improve the heat dissipation efficiency of each heat dissipation column, and can achieve a good heat dissipation effect without installing heat dissipation fins.

The invention provides a heat dissipation device, which can arrange heat dissipation columns according to the distribution of heat sources.

The heat dissipation device of the present invention is used to be installed in a heat-generating object. The heat-dissipating device includes: a heat-conducting base, the heat-conducting base is provided with a plurality of sockets, and the heat-conducting base contacts the heat source of the heat-generating object. At least one heating area is defined at the heat source; and a plurality of heat dissipation columns are arranged in the heating area, and the plurality of heat dissipation columns are respectively inserted and positioned in corresponding jacks, and the outer peripheral surface of each heat dissipation column is set There is a layer of thermally conductive silicone.

Therefore, the heat dissipation device of the present invention is provided with a heat-conducting silica gel layer on the outer peripheral surface of each heat dissipation column, so as to greatly improve the heat dissipation efficiency of each heat dissipation column, and a very good heat dissipation effect can be achieved without providing a heat sink. Therefore, the overall heat dissipation device The thickness will be thinned and the weight will be reduced, which can be applied to electronic products with thin and light design. In addition, the heat dissipation device of the present invention utilizes detachable heat dissipation columns, and according to the distribution of heat sources, the heat dissipation columns are only provided for the positions where heat dissipation needs to be strengthened, which can avoid excessive cost increase due to the installation of heat dissipation columns at unnecessary positions. Therefore, the manufacturing cost and weight of the overall cooling device can be reduced, and the cooling efficiency can be improved.

Wherein, each socket is provided with a joint part, and at least one end of each cooling column is provided with an assembly part, and the plurality of heat dissipation columns are respectively inserted into corresponding sockets by the assembly part and combined with the joint part; the structure can be The stability of inserting and positioning the plurality of heat dissipation columns on the heat conduction base is improved.

Wherein, the joint part of the socket is an internal thread, and the assembly part is an external thread provided on the outer peripheral surface of the cooling post; the structure is simple and easy to process and form, and enables each cooling post to be quickly combined with the heat conduction base or Separation has the effects of reducing manufacturing costs and improving assembly convenience.

Wherein, the joint part is a magnetic attraction component arranged in the socket, and the assembly part is a magnetically attracted structure provided on the end surface of the heat dissipation column, or the reverse arrangement, so that each heat dissipation column can be quickly Combined with or separated from the heat conduction base, it has the functions of improving the convenience of assembly and the like.

Wherein, the thermally conductive silica gel layer completely covers the outer peripheral surface of the heat dissipation column and avoids the assembly part, so as to prevent the thermally conductive silica gel layer from affecting the bonding stability of the heat dissipation column and the heat conduction base, and make the thermally conductive silica gel layer capable of The heat dissipation column exerts the best heat dissipation effect.

Wherein, two ends of each heat dissipation column are respectively provided with an assembly part, so that the heat dissipation column can also be used as a component for connecting two heat conduction bases in series, which has the effect of improving practicability and the like.

Wherein, the depth of each socket is less than half of the axial length of the heat dissipation column, so that an air duct can be formed between the heat conduction bases connected in series, so that the heat energy absorbed by the heat dissipation column can be taken away by the air flow, and the heat dissipation efficiency can be improved. .

Wherein, the heat conduction base has an opposite first end surface and a second end surface, and a circumferential surface connecting the first end surface and the second end surface, wherein a plurality of insertion holes are arranged on the first end surface, and A plurality of jacks are arranged on the circumferential surface; this structure enables a plurality of heat conduction bases to be connected vertically or horizontally in series, so as to meet the requirements of different heat dissipation areas.

Wherein, the depth of the insertion hole provided on the circumferential surface is greater than or equal to half of the axial length of the heat dissipation column, so that the circumferential surfaces of any two adjacent heat conduction bases can abut against each other, which is suitable for heat generation with limited assembly space. object.

Wherein, the heat-conducting silica gel layer of each heat-dissipating column has a microstructure, so as to increase the total heat-dissipating surface area of the heat-conducting silica gel layer, so as to further improve heat-dissipating efficiency and other effects.

Wherein, a graphene layer is arranged outside the heat-conducting silica gel layer of each heat dissipation column, and the heat dissipation efficiency of each heat dissipation column is effectively increased by the graphene layer, so that the total number of heat dissipation columns can be reduced, which has the advantages of reducing the manufacturing cost of the overall heat dissipation device and weight etc.

Wherein, the graphene layer of each cooling column has a microstructure, so as to increase the total surface area of the graphene layer for heat dissipation, so as to further improve heat dissipation efficiency and other effects.

The beneficial effects of the present invention are:

To sum up, the heat dissipation device of the present invention is provided with a heat-conducting silica gel layer on the outer peripheral surface of each heat dissipation column to greatly improve the heat dissipation efficiency of each heat dissipation column, and can achieve a very good heat dissipation effect without providing a heat sink. Therefore, The thickness of the overall heat dissipation device can be reduced, and the weight can also be reduced, which can be applied to electronic products with thin and light design. In addition, the heat dissipation device of the present invention has detachable heat dissipation columns, and according to the distribution of heat sources, the heat dissipation columns can only be installed at the positions where heat dissipation needs to be strengthened, which can avoid excessively increasing costs due to the installation of heat dissipation columns at unnecessary positions , so the manufacturing cost and weight of the overall heat dissipation device can be reduced, and the heat dissipation efficiency can be improved.

Description of drawings

The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

Figure 1: A schematic diagram of a three-dimensional exploded structure of an existing heat dissipation device;

Fig. 2: a schematic diagram of a three-dimensional structure of the first embodiment of the present invention;

Figure 2a: a schematic top view of the first embodiment of the present invention;

Fig. 3: a schematic diagram of a partially cut-away three-dimensional decomposition structure of the first embodiment of the present invention;

Fig. 4: a schematic diagram of a side sectional structure of the first embodiment of the present invention;

Fig. 5: a schematic diagram of the cross-sectional structure of the cooling column according to the first embodiment of the present invention;

Fig. 6: A cross-sectional structural schematic diagram of the heat dissipation column of the first embodiment of the present invention provided with a microstructure on the heat-conducting silica gel layer;

Fig. 7: a schematic side sectional structure diagram of the second embodiment of the present invention;

Fig. 8: a cross-sectional schematic diagram of the heat dissipation column of the second embodiment of the present invention;

Fig. 9: a cross-sectional schematic diagram of the heat dissipation column of the second embodiment of the present invention provided with a microstructure on the graphene layer;

Fig. 10: The three-dimensional exploded structural diagram of the third embodiment of the present invention when long cooling columns are connected in series;

Figure 11: A schematic diagram of the combined three-dimensional structure of the third embodiment of the present invention when long heat dissipation columns are connected in series;

Figure 12: The three-dimensional exploded structural diagram of the third embodiment of the present invention when the short cooling columns are connected in series;

FIG. 13 : A schematic diagram of the combined three-dimensional structure of the third embodiment of the present invention when short cooling columns are connected in series.

Explanation of reference signs

1 Thermal base 1a First end surface

1b Second end face 1c Circumferential face

11 Jack 111 Joint

2 Heat sink 21 Assembly part

22 Thermal silica layer 221 Microstructure

3 Heat sink 31 Assembly part

32 Thermal silica layer 33 Graphene layer

331 Microstructure

4 Heat sink 41 Assembly part

42 Thermal silicone layer

H hot zone

﹝current technology﹞

9 heat sink 91 base

911 Cooling post 92 Heat sink

921 openings.

Detailed ways

In order to make the above-mentioned and other objects, features and advantages of the present invention more comprehensible, the following is based on the preferred embodiments of the present invention and is described in detail as follows in conjunction with the accompanying drawings:

Please refer to FIG. 2 , which shows the first embodiment of the heat dissipation device of the present invention. The heat dissipation device generally includes a heat conduction base 1 and a plurality of heat dissipation columns 2 , and the plurality of heat dissipation columns 2 are inserted and positioned on the heat conduction base 1 .

Please refer to Figures 2 and 2a, the heat conducting base 1 is made of a material with good thermal conductivity (such as copper or silicon carbide, etc.), and is used to contact a heat source of a heat generating object (not shown in the figure), and quickly dissipate the heat at the heat source. In addition, the heat-conducting base 1 contacts the heat source of the heat-generating object, and at least one heat-generating region H can be formed correspondingly at the heat-generating object.

Referring to FIGS. 2 and 3 , the heat conduction base 1 is provided with a plurality of insertion holes 11 , and the cross-sectional shape of each insertion hole 11 is not limited, and the principle is that a single cooling column 2 can be inserted and positioned. The heat conduction base 1 has an opposite first end surface 1a and a second end surface 1b, and a circumferential surface 1c connecting the first end surface 1a and the second end surface 1b; in this embodiment, each insertion hole 11 Extends from the first end face 1a toward the second end face 1b, but does not penetrate to the second end face 1b to form a blind hole shape.

In order to improve the stability of inserting and positioning the plurality of heat dissipation columns 2 on the heat conduction base 1, a joint portion 111 may be provided in each socket 11, and at least one end of each heat dissipation column 2 is provided with an assembly portion 21. A plurality of cooling posts 2 are respectively inserted into corresponding insertion holes 11 by the assembly portion 21 and combined with the combination portion 111 . For example but without limitation, the joint portion 111 of the insertion hole 11 may be an internal thread, and the assembly portion 21 may be an external thread provided on the outer peripheral surface of the cooling post 2; or as shown in FIG. 7, the joint portion 111 It can be selected as a magnetic attraction component (such as a magnet) arranged in the socket 11, and the assembly part is a magnetically attracted structure (such as an iron sheet) arranged on the end surface of the heat dissipation post, or the opposite . In addition, the combination manner of the combination part 111 and the assembly part may also be any combination structure such as tight fitting or clamping.

Referring to Figures 3 and 4, a heat-conducting silica gel layer 22 is provided on the outer peripheral surface of each heat dissipation column 2 to greatly improve the heat dissipation efficiency of each heat dissipation column 2. Even without additional heat dissipation fins, a good heat dissipation effect can be achieved. Wherein, the heat-conducting silica gel is viscous after being heated, so the heat-conducting silica gel layer 22 can be firmly bonded to the outer periphery of the heat-dissipating pillars 2 without applying adhesive on the outer periphery of each heat-dissipating pillar 2 . In addition, the thermally conductive silicone layer 22 is preferably completely covered on the outer peripheral surface of the heat dissipation column 2 and avoids the assembly part 21, so as to prevent the thermally conductive silicone layer 22 from affecting the stable combination of the heat dissipation column 2 and the thermally conductive base 1. properties, and enable the thermally conductive silicone layer 22 to exert the best heat dissipation effect on the heat dissipation column 2; in other embodiments, the thermally conductive silicone layer can also be wrapped around the outer peripheral surface of the heat dissipation column like an adhesive tape.

It is worth mentioning that in the manufacturing process of LEDs, excess thermally conductive silica gel will be regarded as waste, and the present invention can recycle these thermally conductive silica gels and combine them on the outer peripheral surfaces of each heat dissipation column 2, which can not only greatly Improve the heat dissipation efficiency of each heat dissipation column 2, and recycle waste materials to meet the concept of environmental protection. Compared with the past, a plurality of heat dissipation fins 92 are provided, and the plurality of heat dissipation fins 92 are nested in a plurality of heat dissipation columns 911 to improve heat dissipation efficiency (please refer to FIG. 1 ), the manufacturing cost of the cooling column 2 of the present invention can be relatively reduced a lot.

In addition, please refer to Figures 2 and 2a again, the present invention can prefabricate a plurality of identical heat conduction bases 1, and make each heat conduction base 1 covered with sockets 11, so as to be applicable to different heat dissipation requirements; that is to say , when in use, just select an appropriate number of cooling columns 2 according to the distribution of heat sources of the heat-generating object to be installed next time, and make the plurality of cooling columns 2 inserted into the heat-conducting base 1 and then align to the heat-conducting base The heating area H of the base 1 is sufficient, and the number of the heat dissipation columns 2 can be increased or decreased at any time or their insertion positions can be changed, which has the effects of improving assembly efficiency and convenience of use, and can also reduce the weight of the heat conduction base 1 . Or, the heat conduction base 1 can also be customized according to the distribution of heat sources of the heat-generating objects to be installed, and the position and quantity of the sockets 11 are accurately selected, so that the plurality of heat-dissipating columns 2 can be positioned at high-heat places after assembly. , so as to effectively exert a good heat dissipation effect without wasting the cost of forming the socket 11 and the plurality of heat dissipation columns 2 .

In summary, the heat dissipation device of the present invention utilizes the heat conduction base 1 and the heat dissipation column 2 that are not integrally connected, so that each heat dissipation column 2 is detachably combined with the heat conduction base 1 to meet different heat dissipation requirements. Accurate alignment of the heat dissipation column 2 at the position where heat dissipation needs to be enhanced can avoid excessive cost increase due to the installation of the heat dissipation column 2 at an unnecessary position, thereby reducing the manufacturing cost and weight of the overall heat dissipation device and improving heat dissipation efficiency.

Please refer to Fig. 4, 5, the outer surface of the thermally conductive silica gel layer 22 of each heat dissipation column 2 can be set as a smooth surface; or as shown in Fig. structure 221 to increase the surface area of the outer surface of the thermally conductive silica gel layer 22, thereby increasing the total heat dissipation surface area of the thermally conductive silica gel layer 22 to further improve heat dissipation efficiency and other effects.

Please refer to Fig. 7, which is the second embodiment of the heat dissipation device of the present invention, the second embodiment of the present invention is substantially the same as the above-mentioned first embodiment, the main difference is: each heat dissipation column of the second embodiment of the present invention 3 are also provided with a graphene layer 33 outside.

In detail, each cooling column 3 of this embodiment can be provided with an assembly part 31 at at least one end thereof, so that the assembly part 31 can be inserted into the corresponding socket on the heat conduction base 1 according to the heat generation area on the heat conduction base 1 . hole 11, and combined with the joint portion 111 in the insertion hole 11. The outer peripheral surface of each heat dissipation column 3 is also provided with a heat-conducting silica gel layer 32, and the heat-conducting silica gel layer 32 is also provided with an aforementioned graphene layer 33, so that the heat dissipation efficiency of each heat dissipation column 3 is effectively increased by the graphene layer 33 Therefore, the heat dissipation device of this embodiment can achieve the same heat dissipation efficiency as the first embodiment with a smaller number of heat dissipation columns 3, and by reducing the total number of heat dissipation columns 3, the manufacturing cost and weight of the overall heat dissipation device can be reduced. For example but without limitation, graphene may be coated on the outer surface of the thermally conductive silica gel layer 32 of each cooling post 3 to form the graphene layer 33 .

Please refer to Fig. 8, the outer surface of the graphene layer 33 of each heat dissipation column 3 outermost layer can be set as smooth surface form; The microstructure 331 is used to increase the surface area of the outer surface of the graphene layer 33 , thereby increasing the total heat dissipation surface area of the graphene layer 33 to further improve heat dissipation efficiency and other effects.

Please refer to Fig. 10, which is the third embodiment of the heat dissipation device of the present invention, the third embodiment of the present invention is substantially the same as the above-mentioned first embodiment, the main difference is that the third embodiment of the present invention can be installed on the cooling column An assembly part 41 is respectively provided at both ends of the heat dissipation column 4, so that the heat dissipation column 4 can also be used as a component for connecting two heat conduction bases 1 in series.

In detail, in this embodiment, each heat conduction base 1 can be regarded as a unit, and a plurality of heat dissipation columns 4 can be connected vertically or horizontally in series to form heat dissipation devices meeting different heat dissipation area requirements. That is, the heat conduction base 1 of this embodiment is not only provided with a plurality of insertion holes 11 on the first end surface 1a, but also provided with a plurality of insertion holes 11 on the circumferential surface 1c of the heat conduction base 1, and each insertion hole 11 is provided with a plurality of insertion holes 11. There is a connecting portion 111 for connecting the assembly portion 41 at either end of the cooling column 4 .

Wherein, when the depth of each insertion hole 11 is less than half of the axial length of the heat dissipation column 4, if two heat conduction bases 1 are to be vertically connected in series, the first end surfaces 1a of the two heat conduction bases 1 can be opposite to each other. , so that the plurality of cooling columns 4 respectively insert the assembly parts 41 at both ends into the opposite sockets 11 and combine them with the joint part 111, and the two heat conducting bases 1 are jointly supported by the plurality of cooling columns 4, so that the longitudinal series The first end surfaces 1 a of the two heat conduction bases 1 are kept spaced apart to form an air duct, so that air flow can flow between the two heat conduction bases 1 so as to take away the heat energy absorbed by the plurality of heat dissipation columns 4 .

Please refer to Fig. 11, if two or more heat conduction bases 1 are to be horizontally extended and connected in series, the circumferential surfaces 1c of any two adjacent heat conduction bases 1 may be opposed so that a plurality of heat dissipation columns 4 The assembly parts 41 at both ends are respectively inserted into the opposite sockets 11 and combined with the joint part 111, and the two or more heat conduction bases 1 are connected in series by the plurality of heat dissipation columns 4 to form a larger piece of cooling device. In addition, since the depth of each insertion hole 11 is less than half of the axial length of the heat dissipation column 4, the circumferential surfaces 1c of the two or more heat conduction bases 1 extending horizontally and connected in series can be spaced apart from each other. In order to form an air duct, the airflow can flow between any two adjacent heat conduction bases 1 so as to take away the heat energy absorbed by the plurality of cooling columns 4 . Wherein, on the first end surface 1a of each heat conducting base 1, an appropriate number of heat dissipation columns 4 can be inserted at appropriate places according to the distribution of heat sources of the heat generating object to be installed at that time, so that each heat dissipation column 4 can be aligned to the corresponding position. The heat generation area H of the heat conduction base 1 is to dissipate heat rapidly against the high heat of the heat generating object; and the heat dissipation column 4 inserted on the first end surface 1a of each heat conduction base 1 can be provided with an assembly part 41 at only one end, or two Each end is provided with an assembly part 41, which is not limited by the present invention.

Please refer to Figures 12 and 13, when the depth of each socket 11 is greater than or equal to half of the axial length of the heat dissipation column 4, and when two or more heat conduction bases 1 are connected in series by extending horizontally, it is used to connect any two heat conduction bases in series. The heat dissipation columns 4 of two adjacent heat conduction bases 1 can be completely submerged in the two opposite sockets 11, so that the circumferential surfaces 1c of any two adjacent heat conduction bases 1 can abut against each other, which is more suitable for use in the assembly space In limited fever objects.

Wherein, at least one heat-conducting silica gel layer 42 is provided on the outer peripheral surface of each cooling column 4 in Figs. The heat dissipation column 4 of the third embodiment still has good heat dissipation efficiency.

To sum up, the heat dissipation device of the present invention is provided with a heat-conducting silica gel layer on the outer peripheral surface of each heat dissipation column to greatly improve the heat dissipation efficiency of each heat dissipation column, and can achieve a very good heat dissipation effect without providing a heat sink. Therefore, The thickness of the overall heat dissipation device can be reduced, and the weight can also be reduced, which can be applied to electronic products with thin and light design. In addition, the heat dissipation device of the present invention has detachable heat dissipation columns, and according to the distribution of heat sources, the heat dissipation columns can only be installed at the positions where heat dissipation needs to be strengthened, which can avoid excessively increasing costs due to the installation of heat dissipation columns at unnecessary positions , so the manufacturing cost and weight of the overall heat dissipation device can be reduced, and the heat dissipation efficiency can be improved.

The above descriptions are only preferred embodiments of the present invention, and obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Claims (12)

1. a kind of radiator, to be installed in a fever object, which is characterized in that the radiator includes：

One heat conducting base, the heat conducting base are equipped with multiple jacks, which contacts at the heat source of the fever object, the heat At least one hot zone is defined at source；And

Multiple thermal columns, the plurality of thermal column is arranged on the hot zone, and the plurality of thermal column is planted be positioned at corresponding insert respectively Kong Zhong, the outer circumferential surface of each thermal column set that there are one heat conduction silicones.

2. radiator as described in claim 1, it is characterised in that：It is set in each jack there are one engaging portion, each thermal column At least one end is set there are one assembled portion, and the plurality of thermal column is inserted into corresponding jack by the assembled portion respectively and is bound to the knot Conjunction portion.

3. radiator as claimed in claim 2, it is characterised in that：The engaging portion of the jack is internal thread, which is Arranged on the external screw thread of the thermal column outer circumferential surface.

4. radiator as claimed in claim 2, it is characterised in that：The engaging portion is a magnetic group in the jack Part, the assembled portion are that by the structure of magnetic or can be reversed arranged on one of the thermal column end face.

5. radiator as claimed in claim 2, it is characterised in that：The heat conduction silicone is completely coated on the outer of the thermal column Circumferential surface and avoid the assembled portion.

6. radiator as claimed in claim 2, it is characterised in that：The both ends of each thermal column are respectively equipped with an assembled portion.

7. radiator as claimed in claim 6, it is characterised in that：The depth of each jack is less than the thermal column axial length Half.

8. radiator as claimed in claim 6, it is characterised in that：The heat conducting base have an opposite first end face and One second end face and connect the first end face and a circumferential surface of the second end face, plurality of jack be arranged on this End face also has multiple jacks to be arranged on the circumferential surface.

9. radiator as claimed in claim 8, it is characterised in that：Depth arranged on the jack of the circumferential surface is greater than or equal to The half of the thermal column axial length.

10. radiator as claimed in any one of claims 1-9 wherein, it is characterised in that：The heat conduction silicone tool of each thermal column There is micro-structure.

11. radiator as claimed in any one of claims 1-9 wherein, it is characterised in that：Outside the heat conduction silicone of each thermal column It is additionally provided with a graphene layer.

12. radiator as claimed in claim 11, it is characterised in that：The graphene layer of each thermal column has micro-structure.