CN201903031U - Cooling module for LED lamps - Google Patents
Cooling module for LED lamps Download PDFInfo
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- CN201903031U CN201903031U CN2010206269165U CN201020626916U CN201903031U CN 201903031 U CN201903031 U CN 201903031U CN 2010206269165 U CN2010206269165 U CN 2010206269165U CN 201020626916 U CN201020626916 U CN 201020626916U CN 201903031 U CN201903031 U CN 201903031U
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- 238000001816 cooling Methods 0.000 title description 7
- 230000005494 condensation Effects 0.000 claims abstract description 21
- 238000009833 condensation Methods 0.000 claims abstract description 21
- 238000001704 evaporation Methods 0.000 claims abstract description 15
- 230000008020 evaporation Effects 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000009977 dual effect Effects 0.000 claims 1
- 230000002269 spontaneous effect Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract 3
- 241001465382 Physalis alkekengi Species 0.000 abstract 2
- 238000004080 punching Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
Description
技术领域technical field
本实用新型涉及一种散热模块,尤指一种用于LED灯具的散热模块。The utility model relates to a heat dissipation module, in particular to a heat dissipation module used for LED lamps.
背景技术Background technique
发光二极管(Light Emitting Diode,LED)具有低耗能、省电、使用寿命长、体积小、反应快等特点,已逐步取代传统灯泡而广泛应用各种照明灯具中。但是温度的高低变化却是关系着LED的使用寿命和各种性能,因此如何对此散热模块作最合适的布置设计则为本案所研究的重要课题。Light Emitting Diode (LED) has the characteristics of low energy consumption, power saving, long service life, small size, fast response, etc. It has gradually replaced traditional light bulbs and is widely used in various lighting fixtures. However, the change of temperature is related to the service life and various performances of LEDs. Therefore, how to make the most suitable layout design for this cooling module is an important subject of this case study.
已知用于LED灯具的散热模块,如本实用新型人先前申请且公告号为TWM369430的中国台湾新型专利所揭露,其主要包括一中空筒体和一均温板,均温板具有一蒸发段和一冷凝段,冷凝段穿设于中空筒体内并与其内壁面贴接,蒸发段则固定于所述LED灯具;如此,以组合成一散热模块。The known heat dissipation module for LED lamps, as disclosed in the Taiwan Patent of China with the notification number TWM369430 previously applied by the inventor of the present invention, mainly includes a hollow cylinder and a vapor chamber, and the vapor chamber has an evaporation section and a condensing section, the condensing section is installed in the hollow cylinder and attached to the inner wall surface, and the evaporating section is fixed to the LED lamp; thus, a heat dissipation module is combined.
然而,上述结构虽然具有良好的散热效果,但对于日益提升的高功率LED或高瓦数LED而言,其散热效果显然不佳,仍然有待改进。However, although the above-mentioned structure has a good heat dissipation effect, its heat dissipation effect is obviously not good for increasingly high-power LEDs or high-wattage LEDs, and still needs to be improved.
实用新型内容Utility model content
有鉴于此,本实用新型的目的在于提供一种用于LED灯具的散热模块,其系藉由各散热鳍片与中空筒体和均温板直接热接触,而能够高效率地将LED灯具所产生的热量散逸出去。In view of this, the purpose of the present utility model is to provide a heat dissipation module for LED lamps, which can efficiently dissipate heat from LED lamps by directly thermally contacting each heat dissipation fin with the hollow cylinder and the vapor chamber. The heat generated is dissipated.
为了达成上述目的,本实用新型提供一种用于LED灯具的散热模块,所述用于LED灯具的散热模块包括:In order to achieve the above purpose, the utility model provides a heat dissipation module for LED lamps, and the heat dissipation module for LED lamps includes:
一均温板,其具有一蒸发段和自蒸发段延伸出的一对冷凝段;a vapor chamber having an evaporating section and a pair of condensing sections extending from the evaporating section;
一中空筒体,其外表面开设有相互对应的一对凹槽,凹槽内埋设有冷凝段;A hollow cylinder, the outer surface of which is provided with a pair of grooves corresponding to each other, and a condensation section is embedded in the groove;
多个散热鳍片,其环形排列于中空筒体和冷凝段外周缘且彼此热接触。A plurality of cooling fins are arranged annularly on the outer periphery of the hollow cylinder and the condensation section and are in thermal contact with each other.
作为优选方案,其中所述用于LED灯具的散热模块还包括一导热座,导热座热接触于均温板的蒸发段。As a preferred solution, the heat dissipation module for LED lamps further includes a heat conduction seat, and the heat conduction seat is in thermal contact with the evaporation section of the vapor chamber.
作为优选方案,其中所述均温板呈一U字型,其横向部分形成有蒸发段,纵向部分形成有冷凝段。As a preferred solution, the vapor chamber is U-shaped, with an evaporating section formed in its transverse portion and a condensing section formed in its vertical portion.
作为优选方案,其中所述冷凝段的横向剖断面呈一圆弧形,并分别形成有一内弧面和一外弧面,内弧面与中空筒体贴接,外弧面则与散热鳍片贴接。As a preferred solution, the transverse section of the condensing section is arc-shaped, and an inner arc surface and an outer arc surface are respectively formed, the inner arc surface is attached to the hollow cylinder, and the outer arc surface is attached to the heat dissipation fins. catch.
作为优选方案,其中所述外弧面与中空筒体的外周面共同形成一圆形周缘。As a preferred solution, the outer arc surface and the outer peripheral surface of the hollow cylinder jointly form a circular peripheral edge.
作为优选方案,其中所述导热座开设有一容置槽,在容置槽的底部形成有一贯穿槽口,蒸发段沉入容置槽内,并在蒸发段对应贯穿槽口的位置形成有裸露且与导热座底面齐平的一平表面。As a preferred solution, the heat conduction seat is provided with a housing groove, and a through notch is formed at the bottom of the housing tank, the evaporation section sinks into the housing groove, and a bare and A flat surface that is flush with the bottom surface of the thermal pad.
作为优选方案,其中所述用于LED灯具的散热模块还包括一散热体,散热体热接触于蒸发段上。As a preferred solution, the heat dissipation module for LED lamps further includes a heat dissipation body, and the heat dissipation body is in thermal contact with the evaporation section.
作为优选方案,其中所述散热体具有贴接蒸发段的一底板及在底板上延伸的多个散热柱。As a preferred solution, the radiator has a bottom plate attached to the evaporation section and a plurality of cooling columns extending on the bottom plate.
作为优选方案,其中所述底板延伸有一对凸板,导热座的容置槽二侧边分别设有对应的一台阶,凸板嵌固于台阶上。As a preferred solution, a pair of protruding plates are extended from the bottom plate, two sides of the accommodation groove of the heat conduction seat are respectively provided with a corresponding step, and the protruding plates are embedded on the steps.
作为优选方案,其中所述散热鳍片呈一L字型,散热鳍片的短边分别与中空筒体或冷凝段贴接,散热鳍片的长边则呈放射状形成于中空筒体及冷凝段外周围。As a preferred solution, the heat dissipation fins are L-shaped, the short sides of the heat dissipation fins are attached to the hollow cylinder or the condensation section respectively, and the long sides of the heat dissipation fins are radially formed on the hollow cylinder and the condensation section outside around.
作为优选方案,其中所述散热鳍片的自由端开设有多个通槽。As a preferred solution, the free ends of the heat dissipation fins are provided with a plurality of through slots.
相较于现有技术,本实用新型具有以下有益效果:Compared with the prior art, the utility model has the following beneficial effects:
本实用新型通过各散热鳍片与中空筒体和均温板直接热接触,而能够高效率地将LED灯具所产生的热量散逸出去;各散热鳍片以薄板冲压成型后再连接于均温板和中空筒体,不仅可大幅度地降低整体重量,且在单位体积内配设有较大的散热表面积;另外,在导热座设有容置槽以利于和均温板固定连接,并通过贯穿槽口设置而使均温板可与LED热源直接导热;而且还在各散热鳍片设有通槽,以在任二相邻的气体通道之间形成有侧向气体对流的效果。The utility model can efficiently dissipate the heat generated by LED lamps through the direct thermal contact between the heat dissipation fins and the hollow cylinder and the uniform temperature plate; And the hollow cylinder, not only can greatly reduce the overall weight, but also has a large heat dissipation surface area per unit volume; in addition, a housing groove is provided on the heat conduction seat to facilitate the fixed connection with the temperature chamber, and through the The notch is set so that the heat chamber can directly conduct heat with the LED heat source; and each heat dissipation fin is provided with a through groove to form a lateral gas convection effect between any two adjacent gas channels.
附图说明Description of drawings
图1为本实用新型散热模块的立体分解图;Fig. 1 is the three-dimensional exploded view of the heat dissipation module of the present invention;
图2为本实用新型散热模块的组合外观图;Fig. 2 is a combination appearance diagram of the heat dissipation module of the present invention;
图3为图2的3-3剖视图;Fig. 3 is the 3-3 sectional view of Fig. 2;
图4为图3的4-4剖视图;Fig. 4 is a sectional view of 4-4 of Fig. 3;
图5为本实用新型应用于LED灯具使用状态剖视图。Fig. 5 is a cross-sectional view of the utility model applied to LED lamps in use.
【主要组件符号说明】[Description of main component symbols]
导热座-10;容置槽-11;贯穿槽口-111;台阶-12;Heat conducting seat-10; accommodating groove-11; through notch-111; step-12;
均温板-20;蒸发段-21;平表面-211;冷凝段-22、23;内弧面-221、231;外弧面-222、232;Vapor chamber-20; evaporation section-21; flat surface-211; condensation section-22, 23; inner arc surface-221, 231; outer arc surface-222, 232;
中空筒体-30;凹槽-31、32;Hollow cylinder-30; Groove-31, 32;
散热鳍片-40;通槽-41;Radiating fins-40; Through slots-41;
散热体-50;底板-51;散热柱-52;凸板-53;Radiator-50; Bottom plate-51; Radiating column-52; Convex plate-53;
LED灯具-8;电路板-81;发光二极管-82。LED lamps - 8; circuit boards - 81; light emitting diodes - 82.
具体实施方式Detailed ways
有关本实用新型的特征及技术内容,请参阅以下的详细说明与附图,而所附图示仅提供参考与说明,并非用于限制本实用新型。For the features and technical contents of the present utility model, please refer to the following detailed description and accompanying drawings, and the accompanying drawings are provided for reference and illustration only, and are not intended to limit the present utility model.
请参阅图1至图4所示,本实用新型提供一种用于LED灯具的散热模块,本实施例的散热模块主要包括一导热座10、一均温板20、一中空筒体30及多个散热鳍片40。Please refer to Figures 1 to 4, the utility model provides a heat dissipation module for LED lamps, the heat dissipation module of this embodiment mainly includes a
导热座10由铝、铜或其合金等金属材质所制成,其大致呈一圆板状,在其中间位置开设有一矩形容置槽11,且容置槽11的底部形成有一贯穿槽口111,另在容置槽11的二侧边分别设有对应的一台阶12。The
均温板20(Vapor Chamber)为一真空容腔,内部装设有毛细组织、工作流体等组件,利用工作流体的汽液相变化来达成热传导,并通过毛细组织来提供液体的回流机制,以构成连续循环的动作;本实施例的均温板20大致呈一U字型,其具有横向部分的一蒸发段21和自蒸发段21延伸出的一对纵向部分的冷凝段22、23,蒸发段21沉入容置槽11内与导热座10热接触,并在对应贯穿槽口111的位置形成有裸露且与导热座10底面齐平的一平表面211;各冷凝段22、23的横向剖断面呈一圆弧形(如图4所示),并分别形成有一内弧面221、231和一外弧面222、232。Vapor Chamber 20 (Vapor Chamber) is a vacuum chamber with components such as capillary tissue and working fluid installed inside. It uses the vapor-liquid phase change of the working fluid to achieve heat conduction, and provides a liquid return mechanism through capillary tissue to The action of forming a continuous cycle; the
中空筒体30由铝、铜等导散性良好的材质所制成,在中空筒体30的外表面开设有相互对应的一对凹槽31、32,均温板20的各冷凝段22、23分别埋设于各凹槽31、32内,且其内弧面221、231是与中空筒体30紧密贴接以传导热量,而各冷凝段22、23的外弧面222、232则是裸露,并与中空筒体30的外周面共同形成一圆形周缘(如图4所示)。The
各散热鳍片40以薄板冲压成型,其材质可为铝、铜或其合金等,散热鳍片40大致呈一L字型(如图4所示),其短边是热接触在中空筒体30和各冷凝段22、23的外弧面222、232上且呈环形排列,长边则呈放射状形成在中空筒体30和各冷凝段22、23外周围。另在各散热鳍片40的自由端开设有多个通槽41,以在任二相邻的气体通道之间形成有侧向气体对流的效果。Each
此外,本实用新型还包括一散热体50,散热体50由铝、铜或其合金等金属材质所制成,其具有一底板51并在底板51上延伸有多个散热柱52,并在散热柱52外部自底板51延伸有一对凸板53;散热体50是以底板51压掣均温板20的蒸发段21,并使各凸板53分别嵌入台阶12而固定。In addition, the utility model also includes a
请参阅图5所示,本实用新型的散热模块可应用于一LED灯具8上,LED灯具8具有一电路板81及布设于电路板81上的多个发光二极管82;组合时是将电路板81对应于导热座10的底面贴接,并使电路板81或各发光二极管82的背面对正于平表面211位置来配设,各发光二极管82所产生的热量将从平表面211传导给均温板20,通过均温板20的汽液相热传机制将热量带到各冷凝段22、23,其中一部分的热量是传导给中空筒体30予以散逸,另一部分的热量则是直接传导给各散热鳍片40予以散逸;如此,可高效率地将LED灯具8的各发光二极管82所产生的热量散逸出去。Please refer to Fig. 5, the heat dissipation module of the present invention can be applied to an LED lamp 8, the LED lamp 8 has a circuit board 81 and a plurality of light emitting diodes 82 arranged on the circuit board 81; 81 corresponds to the bottom surface of the
以上所述,仅为本实用新型的较佳实施例,并非因此而限制本实用新型的专利保护范围,故举凡本实用新型说明书及附图所作的等效结构变化,皆应包含于本实用新型的保护范围之内。The above are only preferred embodiments of the present utility model, and are not intended to limit the scope of protection of the present utility model. Therefore, all equivalent structural changes made in the utility model description and accompanying drawings should be included in the utility model. within the scope of protection.
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| CN2010206269165U CN201903031U (en) | 2010-11-26 | 2010-11-26 | Cooling module for LED lamps |
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| CN2010206269165U CN201903031U (en) | 2010-11-26 | 2010-11-26 | Cooling module for LED lamps |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017101473A1 (en) * | 2015-12-16 | 2017-06-22 | 广州共铸科技股份有限公司 | Planar vapor chamber and manufacturing method therefor, and automotive headlamp |
| CN108870340A (en) * | 2018-04-24 | 2018-11-23 | 东莞市闻誉实业有限公司 | Heat radiation structure |
-
2010
- 2010-11-26 CN CN2010206269165U patent/CN201903031U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017101473A1 (en) * | 2015-12-16 | 2017-06-22 | 广州共铸科技股份有限公司 | Planar vapor chamber and manufacturing method therefor, and automotive headlamp |
| CN108870340A (en) * | 2018-04-24 | 2018-11-23 | 东莞市闻誉实业有限公司 | Heat radiation structure |
| CN108870340B (en) * | 2018-04-24 | 2020-11-24 | 东莞市闻誉实业有限公司 | heat dissipation structure |
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