CN201111087Y - Touch-sliding type fingerprint identifier package structure - Google Patents

Abstract

A touch-slide type fingerprint recognizer package structure is defined with a touch-slide area and a conductive connection part, and comprises a substrate, a fingerprint recognition wafer and a metal plate, wherein a window of a dielectric layer of the substrate exposes a sensing area of the fingerprint recognition wafer, the fingerprint recognition wafer is electrically connected with the substrate, a touch-slide surface of the metal plate is adjacent to the sensing area of the fingerprint recognition wafer, and the window of the dielectric layer exposes the sensing area and the touch-slide surface, wherein the sensing area of the fingerprint recognition wafer and the touch-slide surface of the metal plate are positioned in the touch-slide area, and a plurality of external pads of a circuit layer of the substrate are positioned in the conductive connection part. Because the window of the dielectric layer exposes the sensing area and the sliding surface, and the sensing area of the fingerprint identification chip and the sliding surface of the metal plate are positioned in the sliding area, when a finger contacts the sliding area, the static electricity can be discharged by the sliding surface of the metal plate, and the thickness and the manufacturing cost of the sliding fingerprint identifier packaging structure can be reduced.

Description

Touch-swipe fingerprint reader package structure

technical field

The utility model relates to a packaging structure of a fingerprint recognizer, in particular to a packaging structure of a touch-slip fingerprint recognizer.

Background technique

As shown in FIG. 14 , a conventional fingerprint reader packaging structure 10 mainly includes a substrate 11, a semiconductor chip 12, and an encapsulant 13. The substrate 11 has an upper surface 11a and a lower surface 11b. The semiconductor chip 12 is attached to The upper surface 11a of the substrate 11 is electrically connected to the substrate 11. The semiconductor chip 12 has a fingerprint sensing surface 12a. The encapsulant 13 is formed on the upper surface 11a of the substrate 11 and covers part of the substrate. The semiconductor chip 12 and the fingerprint sensing surface 12 a of the semiconductor chip 12 are exposed. However, the existing conventional fingerprint reader packaging structure 10 is not equipped with an electrostatic discharge device, so when the finger touches the fingerprint sensing surface 12a of the semiconductor chip 12, the static electricity generated cannot be electrostatically discharged, and it is easy to cause the existing conventional fingerprint A short circuit occurs in the package structure 10 of the identifier.

It can be seen that the above-mentioned prior packaging structure of the fingerprint reader obviously still has inconveniences and defects in structure and use, and needs to be further improved urgently. In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. urgent problem to be solved. Therefore, how to create a new packaging structure of the touch-swipe fingerprint reader is one of the current important research and development topics, and it has also become a goal that the industry needs to improve.

In view of the above-mentioned defects in the existing packaging structure of the fingerprint reader, the designer, based on his rich practical experience and professional knowledge in the design and manufacture of such products for many years, combined with the application of academic principles, actively researched and innovated, in order to create a new type of fingerprint reader. The packaging structure of the touch-slip fingerprint reader can improve the general existing packaging structure of the fingerprint reader and make it more practical. Through continuous research, design, and after repeated trial samples and improvements, the utility model with practical value is finally created.

Contents of the invention

The main purpose of the utility model is to overcome the defects existing in the packaging structure of the existing fingerprint reader, and provide a new packaging structure of the touch-slip fingerprint reader. The static electricity generated during the fingerprint sensing area is electrostatically discharged, which is very suitable for practical use.

The purpose of this utility model and its technical solution are to adopt the following technical solutions to achieve. According to the package structure of the touch-slip fingerprint reader proposed by the utility model, it defines a touch-slide area and a connecting portion, and the package structure of the touch-slide fingerprint reader includes:

A substrate, the substrate includes: a dielectric layer, which has an upper surface, a lower surface, and a window passing through the upper surface and the lower surface; a circuit layer, which has a first surface, a second surface, multiple an inner pad and a plurality of outer pads, the inner pads are formed on the lower surface of the dielectric layer; and a first protective layer is formed on the first surface of the circuit layer, the first protective layer having a plurality of first openings exposing the internal contact pads;

A fingerprint identification chip, which is electrically connected to the substrate, the fingerprint identification chip has an active surface, a back surface and a sensing region, the sensing region is formed on the active surface, and the window of the dielectric layer exposes the sensor survey area; and

a metal plate, which is electrically connected to the substrate, the metal plate has a touch-slip surface, the touch-slip surface is adjacent to the sensing area of the fingerprint identification chip, and the window of the dielectric layer exposes the touch-slip surface;

Wherein the sensing area of the fingerprint identification chip and the touch-slip surface of the metal plate are located in the touch-slip area, and the external pads of the circuit layer are located in the conducting portion.

The purpose of this utility model and the solution to its technical problems can also be further realized by adopting the following technical measures.

In the packaging structure of the aforementioned touch-slip fingerprint reader, the metal plate has a cavity formed on the touch-slip surface, and the fingerprint identification chip is accommodated in the cavity.

In the packaging structure of the aforementioned touch-slip fingerprint reader, the circuit layer includes a first circuit layer and a second circuit layer, the first circuit layer is formed on the lower surface of the dielectric layer, and the second circuit layer is formed on the lower surface of the dielectric layer. A layer is formed on the upper surface of the dielectric layer, the second circuit layer has the second surface, the first circuit layer has the first surface, at least one electrostatic conductive pad and the inner pads, the metal plate Electrically connect the electrostatic conductive pad.

In the packaging structure of the aforementioned touch-slip fingerprint reader, the external pads are formed on the second circuit layer.

In the packaging structure of the aforementioned touch-slip fingerprint reader, the substrate further includes a second protective layer, the second protective layer is formed on the second surface of the second circuit layer, and the second protective layer has a plurality of The second openings expose the external pads.

In the package structure of the aforementioned touch-slide fingerprint reader, the external pads are formed on the first circuit layer.

In the package structure of the aforementioned touch-swipe fingerprint reader, the dielectric layer has a plurality of third openings, and the third openings expose the external pads.

In the package structure of the aforementioned touch-swipe fingerprint reader, the electrostatic conductive pad is adjacent to the window of the dielectric layer.

In the packaging structure of the aforementioned touch-slide fingerprint reader, the window of the dielectric layer has two long sides, and there is a distance between the long sides, and the metal plate has a width, and the distance is not greater than the width.

The packaging structure of the aforementioned touch-slide fingerprint reader further includes a casing, and the casing at least covers the metal plate.

Compared with the prior art, the utility model has obvious advantages and beneficial effects. Since the window of the dielectric layer of the present invention exposes the sensing area and the touch-slip surface, and the sensing area of the fingerprint recognition chip and the touch-slip surface of the metal plate are located in the touch-slip area, when When a finger touches the touch-slide area, static electricity can be discharged through the touch-slide surface of the metal plate, and the thickness and manufacturing cost of the package structure of the touch-slide fingerprint reader can be reduced.

With the above technical solution, the package structure of the touch-slip fingerprint reader of the present invention has at least the following advantages and beneficial effects:

1. The packaging structure of the touch-slip fingerprint reader of the present invention is simple, and the manufacturing cost is relatively reduced, so that the cost can be greatly reduced, the economic benefit can be improved, and it has considerable industrial application value.

2. The packaging structure of the touch-slip fingerprint reader of the present invention, because it only makes a slight structural change to the packaging structure of the fingerprint reader, the structure is simple, the manufacturing cost is relatively reduced, and it is cost-effective, and it is comparable to what the product can achieve. Compared with the efficacy and practicality of use, it is more value for money, and has quite industrial utilization value.

3. The packaging structure of the touch-slip fingerprint reader of the present invention is not only simple in structure, but also more practical in use, and can better meet the needs of users for the packaging structure of the touch-slide fingerprint reader, and can give consumers better The choice can greatly improve its overall effectiveness, so it is more suitable for practical use.

4. The utility model can indeed achieve practical effects. Not only is it convenient to use without complicated procedures, but also the processing of the structure is more convenient and cost-effective. It does have industrial utilization value and is suitable for a wide range of industries. Promotional use.

To sum up, the package structure of the touch-slip fingerprint reader of the present invention defines a touch-slide area and a conductive part, including a substrate, a fingerprint identification chip and a metal plate, and a dielectric layer of the substrate A window of the fingerprint identification chip reveals a sensing area of the fingerprint identification chip, and the fingerprint identification chip and the metal plate are electrically connected to the substrate, a touch-slip surface of the metal plate is adjacent to the sensing area of the fingerprint identification chip, and the fingerprint identification chip The window of the dielectric layer exposes the sensing area and the touch-slip surface, wherein the sensing area of the fingerprint recognition chip and the touch-slide surface of the metal plate are located in the touch-slip area, and the number of a circuit layer of the substrate is An external pad is located on the lead. The utility model has the above-mentioned many advantages and practical value, it has great improvement no matter in product structure or function, has remarkable progress in technology, and has produced easy-to-use and practical effect, and compared with the existing fingerprint identification The packaging structure of the device has enhanced outstanding functions, so it is more suitable for practical use, and has wide application value in the industry. It is a novel, progressive and practical new design.

The above description is only an overview of the technical solutions of the present utility model. In order to better understand the technical means of the present utility model, it can be implemented according to the contents of the description, and in order to make the above-mentioned and other purposes, features and advantages of the present utility model better It is obvious and easy to understand. The preferred embodiments are specifically cited below, together with the accompanying drawings, and detailed descriptions are as follows.

Description of drawings

FIG. 1 : An exploded perspective view of a packaging structure of a touch-slide fingerprint reader according to a first embodiment of the present invention.

Fig. 2: A top view of the packaging structure of the touch-swipe fingerprint reader according to a first specific embodiment of the present invention.

FIG. 3 : According to a first embodiment of the present invention, a schematic cross-sectional view of the packaging structure of the touch-swipe fingerprint reader along the direction of FIG. 2A-A.

FIG. 4 : According to a first specific embodiment of the present invention, a schematic cross-sectional view of the packaging structure of the touch-slide fingerprint reader along the direction of FIG. 2B-B.

FIG. 5 : According to a first specific embodiment of the present invention, another schematic cross-sectional view of the packaging structure of the touch-swipe fingerprint reader along the direction of FIG. 2C-C.

FIG. 6 : According to a first embodiment of the present invention, another schematic cross-sectional view of the packaging structure of the touch-swipe fingerprint reader along the direction of FIG. 2D-D.

FIG. 7 : According to a first embodiment of the present invention, a schematic cross-sectional view of a double-sided bending covering casing of the guiding portion of the packaging structure of the touch-slide fingerprint reader.

FIG. 8 : According to a first specific embodiment of the present invention, a schematic cross-sectional view of the wrapping shell of the package structure of the touch-slide fingerprint reader, where the guiding part is unilaterally bent.

FIG. 9 : A top view of another package structure of a touch-slide fingerprint reader according to a second embodiment of the present invention.

FIG. 10 : According to a second embodiment of the present invention, a schematic cross-sectional view of the packaging structure of the touch-swipe fingerprint reader along the direction of FIG. 9E-E.

FIG. 11 is a schematic cross-sectional view of the packaging structure of the touch-swipe fingerprint reader along the direction of FIG. 9F-F according to a second embodiment of the present invention.

FIG. 12 : According to a second specific embodiment of the present invention, a schematic cross-sectional view of the packaging structure of the touch-swipe fingerprint reader along the direction of FIG. 9G-G.

FIG. 13 : According to a second embodiment of the present invention, a schematic cross-sectional view of the packaging structure of the touch-swipe fingerprint reader along the direction of FIG. 9H-H.

Fig. 14: A schematic cross-sectional view of a conventional fingerprint reader package structure.

[Description of main component symbols]

10: Fingerprint reader package structure

11: Substrate 11a: Upper surface

11b: lower surface

12: Semiconductor wafer 12a: Fingerprint sensing surface

13: sealant

100: Touch-swipe fingerprint reader package structure

100a: Touch-slip area 100b: Leading part

110: substrate 111: dielectric layer

111a: upper surface

111b: lower surface 111c: window

111d: long sides

112: Line layer 112’: First line layer

112": the second circuit layer

112a: first surface 112b: second surface

112c: inner pad

112d: External pad 112e: Electrostatic conductive pad

113: The first protective layer 113a: The first opening

114: Second protective layer

114a: second opening

120: Fingerprint identification chip 121: Active surface

122: back

123: Sensing area 124: Bump

130: metal plate 131: touch-slip surface

132: Dimple

140: Bottom filler 150: Housing

200: Touch and slide fingerprint reader package structure

210: Substrate 211: Dielectric layer

211a: upper surface

211b: lower surface 211c: window

211d: third opening

212: The first circuit layer 212a: The first surface

212b: inner pad

212c: External pad 212d: Electrostatic conductive pad

213: The first protective layer

213a: first opening

220: Fingerprint identification chip 221: Active surface

222: back

223: Sensing area 224: Bump

230: metal plate 231: touch-slip surface

232: Dimple

D: Spacing W: Width

Detailed ways

In order to further explain the technical means and effects of the utility model to achieve the intended purpose of the invention, the specific implementation method, Structure, characteristic and effect thereof are as follows in detail.

The aforementioned and other technical contents, features and effects of the present utility model will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. For convenience of description, in the following embodiments, the same elements are denoted by the same numbers.

Through the description of the specific implementation, one can get a deeper and more specific understanding of the technical means and effects of the utility model to achieve the intended purpose, but the attached drawings are only for reference and description, and are not used to explain the present invention. Utility models are restricted.

Please refer to FIG. 1 , FIG. 2 and FIG. 3 . According to a first embodiment of the present invention, a package structure 100 of a touch-slip fingerprint reader is disclosed, which defines a touch-slide area 100a and a conductive portion 100b. It includes a substrate 110, a fingerprint identification chip 120 and a metal plate 130. The substrate 110 can be a printed circuit board or a flexible circuit board. In this embodiment, the substrate 110 is a flexible substrate. The substrate 110 includes a Dielectric layer 111, a circuit layer 112 and a first protective layer 113, the dielectric layer 111 has an upper surface 111a, a lower surface 111b and a window 111c through the upper surface 111a and the lower surface 111b, the circuit layer 112 has a first surface 112a, a second surface 112b, a plurality of inner pads 112c and a plurality of outer pads 112d. In this embodiment, the circuit layer 112 includes a first circuit layer 112' and a second circuit layer 112' Layer 112", the first circuit layer 112' is formed on the lower surface 111b of the dielectric layer 111, the first circuit layer 112' has the first surface 112a, a plurality of electrostatic conductive pads 112e and the inner contacts Pads 112c, these electrostatic conductive pads 112e are adjacent to the window 111c of the dielectric layer 111, the internal contact pads 112c are formed on the lower surface 111b of the dielectric layer 111, and the second circuit layer 112" is formed on the On the upper surface 111a of the dielectric layer 111, the second circuit layer 112" has the second surface 112b. In this embodiment, the external pads 112d are formed on the second circuit layer 112".

Please refer to FIG. 2 and FIG. 3 again, the first protection layer 113 is formed on the first surface 112a of the first wiring layer 112", the first protection layer 113 has a plurality of first openings 113a, and these first openings 113a exposes the internal contact pads 112c. Preferably, the substrate 110 further includes a second protection layer 114, the second protection layer 114 is formed on the second surface 112b of the second wiring layer 112", the second The protective layer 114 has a plurality of second openings 114a exposing the external pads 112d. The fingerprint identification chip 120 is electrically connected to the inner pads 112c of the substrate 110. The fingerprint identification chip 120 has an active surface 121, a back surface 122, a sensing area 123 and a plurality of bumps 124. The sensing area 123 is formed on the active surface 121, and the window 111c of the dielectric layer 111 exposes the sensing region 123, the bumps 124 are formed on the active surface 121 and the bumps 124 are located outside the sensing region 123, The bumps 124 are electrically connected to the inner pad 112c, wherein the bumps 124 can be electrically connected through anisotropic conductive paste (Antisotropic Conductive Paste, ACP) or non-conductive paste (Non-Conductive Paste, NCP). To the inner pads 112c, preferably, the touch-slide fingerprint reader package structure 100 further includes an underfill 140, the underfill 140 is formed between the substrate 110 and the fingerprint identification chip 120 and includes covering the bump 124.

Please refer to FIG. 2 and FIG. 4, the metal plate 130 is electrically connected to the electrostatic conductive pads 112e of the substrate 110 through solder, bumps or anisotropic conductive glue, the metal plate 130 has a sliding surface 131, The touch-slip surface 131 is adjacent to the sensing area 123 of the fingerprint identification chip 120, and the window 111c of the dielectric layer 111 exposes the touch-slide surface 131, wherein the sensing area 123 of the fingerprint identification chip 120 and the metal The touch-slip surface 131 of the plate 130 is located in the touch-slide area 100a, and the window 111c of the dielectric layer 111 exposes the sensing area 123 of the fingerprint identification chip 120 and the touch-slide surface 131 of the metal plate 130, the The external pads 112d of the second circuit layer 112" are located on the conducting portion 100b, please refer to Fig. 1, Fig. 2 and Fig. Formed on the touch-slip surface 131, the fingerprint recognition chip 120 is accommodated in the recess 132, preferably, the active surface 121 of the fingerprint recognition chip 120 is flush with the touch-slide surface 131 of the metal plate 130, When a finger touches the touch-slide area 100a of the touch-slide fingerprint reader package structure 100 and the sensing area 123 of the fingerprint identification chip 120, the metal plate 130 in the touch-slide area 100a can be touched. The touch-slip surface 131 is electrostatically discharged. In the present embodiment, please refer to FIG. 5 and FIG. 6, the recess 132 runs through the metal plate 130, and the recess 132 exposes the back side 122 of the fingerprint identification chip 120. In addition, Please refer to FIG. 1 again, the window 111c of the dielectric layer 111 has two long sides 111d, there is a distance D between the long sides 111d, the metal plate 130 has a width W, the distance D is not greater than the Width W.

Please refer to FIG. 7, the package structure 100 of the touch-slide fingerprint reader further includes a housing 150, the housing 150 at least covers the metal plate 130, and in this embodiment, the housing 150 also covers the fingerprint reader The back side 122 of the chip 120, the material of the housing 150 is selected from polymer materials (such as encapsulants) or metal materials (such as metal covers), and the external pads 112d are located on both sides of the substrate 110. The touch-slip type The conducting portion 100b of the fingerprint reader packaging structure 100 can be bent to cover the casing 150 on both sides, and at least one external pad 112d is located under the casing 150 . Or, please refer to FIG. 8 , the external pads 112d are located on the same side of the substrate 110 , and the conducting portion 100b can be bent to cover the casing 150 at one side.

In addition, please refer to FIG. 9 , which is a top view of a second specific embodiment of the present invention, revealing another packaging structure 200 of a touch-swipe fingerprint reader. Please refer to FIGS. 9 and 10 . The reader package structure 200 includes a substrate 210, a fingerprint identification chip 220 and a metal plate 230. In this embodiment, the substrate 210 is a single circuit layer, and the substrate 210 includes a dielectric layer 211, a first circuit layer 212 and a first protection layer 213, the dielectric layer 211 has an upper surface 211a, a lower surface 211b and a window 211c that runs through the upper surface 211a and the lower surface 211b, please refer to Figure 9, Figure 10 and Figure 11, The first circuit layer 212 has a first surface 212a, a plurality of inner pads 212b, a plurality of outer pads 212c and a plurality of electrostatic conductive pads 212d, and the inner pads 212b are formed under the dielectric layer 211. Surface 211b, the electrostatic conductive pads 212d are adjacent to the window 211c of the dielectric layer 211, the first protective layer 213 is formed on the first surface 212a of the first circuit layer 212, the first protective layer 213 has multiple A first opening 213a, the first openings 213a expose the inner pads 212b, please refer to FIG. 12, the dielectric layer 211 has a plurality of third openings 211d, the third openings 211d expose the outer pads 212c .

Please refer to FIG. 10 again, the fingerprint identification chip 220 is electrically connected to the inner pads 212b of the substrate 210, and the fingerprint identification chip 220 has an active surface 221, a back surface 222, a sensing area 223 and a plurality of bumps 224, the sensing region 223 is formed on the active surface 221, and the window 211c of the dielectric layer 211 exposes the sensing region 223, please refer to FIG. 10 and FIG. Or the anisotropic conductive glue is electrically connected to the electrostatic conductive pads 212d of the substrate 210, the metal plate 230 has a touch-slip surface 231, and the touch-slip surface 231 is adjacent to the sensing area 223 of the fingerprint recognition chip 220, And the window 211c of the dielectric layer 211 exposes the sliding surface 231. Please refer to FIG. 12 and FIG. Hole 232 runs through the metal plate 230, the fingerprint identification chip 220 is accommodated in the cavity 232 and the cavity 232 exposes the back side 222 of the fingerprint identification chip 220, preferably, the active surface of the fingerprint identification chip 220 221 is flush with the touch-slip surface 231 of the metal plate 230 , so that when a finger touches the sensing area 223 of the fingerprint recognition chip 220 , static electricity can be discharged by touching the touch-slide surface 231 of the metal plate 230 .

The above are only preferred embodiments of the present utility model, and do not limit the utility model in any form. Although the utility model has been disclosed as above with preferred embodiments, it is not intended to limit the utility model. Any Those who are familiar with this profession, without departing from the scope of the technical solution of the present utility model, can use the technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes, but all without departing from the technical solution of the utility model Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the utility model still belong to the scope of the technical solution of the utility model.

Claims (10)

1, a kind of gliding style fingerprint identifier packaging structure that touches is characterized in that a skating area and a junction are touched in its definition, and the described gliding style fingerprint identifier packaging structure that touches comprises:

One substrate, this substrate comprises:

One dielectric layer, it has the window that a upper surface, a lower surface and run through this upper surface and this lower surface;

One line layer, it has a first surface, a second surface, a plurality of interior connection pads and a plurality of outer connection pad, and connection pads are formed at this lower surface of this dielectric layer in those; And

One first protective seam, it is formed at this first surface of this line layer, and this first protective seam has a plurality of first openings, and those first openings appear connection pad in those;

One fingerprint identifying chip, it electrically connects this substrate, and this fingerprint identifying chip has an active surface, a back side and a sensing area, and this sensing area is formed at this active surface, and this window of this dielectric layer appears this sensing area; And

One sheet metal, it electrically connects this substrate, and this sheet metal has and touches sliding surface, and this touches this sensing area of contiguous this fingerprint identifying chip in sliding surface, and this window of this dielectric layer appears this and touches sliding surface;

Wherein this of this sensing area of this fingerprint identifying chip and this sheet metal touches sliding surface and is positioned at this and touches the skating area, and the outer connection pad of those of this line layer is positioned at this junction.

2, the gliding style fingerprint identifier packaging structure that touches according to claim 1 is characterized in that wherein said sheet metal has a depression, and this depression is formed at this and touches sliding surface, and this fingerprint identifying chip is located in this depression.

3, the gliding style fingerprint identifier packaging structure that touches according to claim 1, it is characterized in that wherein this line layer includes one first line layer and one second line layer, this first line layer is formed at this lower surface of this dielectric layer, this second line layer is formed at this upper surface of this dielectric layer, this second line layer has this second surface, this first line layer has this first surface, at least one static connection pad and those interior connection pads, and this sheet metal electrically connects this static connection pad.

4, the gliding style fingerprint identifier packaging structure that touches according to claim 3 is characterized in that wherein those external pulvilliform are formed in this second line layer.

5, the gliding style fingerprint identifier packaging structure that touches according to claim 4; it is characterized in that wherein this substrate includes one second protective seam in addition; this second protective seam is formed at this second surface of this second line layer; this second protective seam has a plurality of second openings, and those second openings appear those outer connection pads.

6, the gliding style fingerprint identifier packaging structure that touches according to claim 3 is characterized in that wherein those external pulvilliform are formed in this first line layer.

7, the gliding style fingerprint identifier packaging structure that touches according to claim 6 is characterized in that wherein this dielectric layer has a plurality of the 3rd openings, and those the 3rd openings appear those outer connection pads.

8, the gliding style fingerprint identifier packaging structure that touches according to claim 3 is characterized in that wherein this window of contiguous this dielectric layer of this static connection pad.

9, the gliding style fingerprint identifier packaging structure that touches according to claim 1 is characterized in that wherein this window of this dielectric layer has two long sides, has a spacing between those long sides, and this sheet metal has a width, and this spacing is not more than this width.

10, the gliding style fingerprint identifier packaging structure that touches according to claim 1 is characterized in that it includes a housing in addition, and this housing is this sheet metal of cover cap at least.

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