CN104303288A - Fingerprint sensor package and method for manufacturing same - Google Patents

Abstract

The present invention discloses a fingerprint package and a method for manufacturing same, the fingerprint package which enables transmission of a driving signal required for scanning a fingerprint image, improve obtainment sensitivity of a fingerprint sensor by means of smooth swiping, and which has a simple structure so that productivity can be improved during manufacturing. The fingerprint package according to the present invention comprises: a base substrate comprising an interior area, on which a conductive pattern including a bond finger portion is formed and which includes a fingerprint sensor die paddle portion, and an exterior area which is positioned on the outer shell of the interior area and includes a driving electrode die paddle; the fingerprint sensor, which is attached to the fingerprint sensor die paddle on the base substrate and which is provided on the upper surface thereof with a sensor portion and a plurality of input/output pads; a bonding wire for electrically connecting the fingerprint sensor and the bond finger portion on the base substrate; and a mold body for integrally forming the fingerprint sensor and the driving electrode, which are positioned on the base substrate, and for protecting same from the external environment, wherein the driving electrode is formed to have the same height as that of the mold body so that the surface of the driving electrode is exposed to the exterior of the mold body, and wherein the driving electrode is formed around the fingerprint sensor and is connected to the fingerprint sensor through the conductive pattern on the base substrate.

Description

Fingerprint sensor package and manufacturing method thereof

technical field

The present invention relates to a fingerprint sensor package, and more particularly, to a structure that is simple in structure, improves mechanical strength and durability against electrostatic discharge, and can improve the acquisition sensitivity of a fingerprint sensor by smoothly swiping (swipe). Packages and methods of manufacture thereof.

Background technique

Usually, fingerprint recognition technology is mainly used to prevent security accidents through user registration and authentication procedures, and is applied to personal and organizational network defense, content and data protection, and computer or mobile device security access (access) control. wait.

Recently, with the development of mobile technology, devices such as biometric trackpads (BTP:Biometric TrackPad), etc., which use fingerprint recognition technology as a positioning device that uses finger print image data to operate a mouse pointer, etc., are widely used. expand further.

For such fingerprint recognition technology, a fingerprint sensor is used. The fingerprint sensor is a device for recognizing the pattern of the fingerprint of a human finger. The fingerprint sensor is divided into an optical sensor, an electrical sensor (electrostatic capacitance method and a conductive sensor) according to the sensing principle. Various types of fingerprint sensors obtain fingerprint image data from fingers according to their respective driving principles.

With the miniaturization and multi-function of electronic products, semiconductor packages including fingerprint sensors are also required to be miniaturized/high-density, low power, multi-functional, ultra-high-speed signal processing, high reliability, low price and clear screen wait. In order to meet such demands, various studies are underway.

Such a fingerprint sensor is sealed by epoxy molding compound (EMC: Epoxy Molding Compound) and other resin materials like ordinary semiconductor chips, and is assembled on the motherboard of electronic equipment as a fingerprint sensor package. Morphology When developing a fingerprint sensor, there has been a disadvantage of requiring an additional component for outputting a drive signal required for scanning the shape of a fingerprint.

In addition, such a fingerprint sensor package can acquire accurate fingerprint image data only if the space between the top surface of the sensing part of the fingerprint sensor and the fingerprint is minimized.

In addition, the higher the sensitivity for fingerprint data acquisition, the thicker the protective coating for the sensing part of the fingerprint sensor than in the past, thereby improving the mechanical strength of the fingerprint sensor package and preventing electrostatic discharge (electrostatic discharge). ) tolerance.

Furthermore, if the fingerprint data acquisition sensitivity of the fingerprint sensor is increased, the same or further improved image can be acquired even if the number of pixels is reduced compared to the existing fingerprint sensor with the same number of pixels per unit area. data, thus reducing the size of the fingerprint sensor package.

Moreover, when performing a sliding motion for fingerprint recognition, only by eliminating the height difference between the sensor and other different parts can the fingerprint recognition motion be performed smoothly and high-precision recognition can be maintained.

Therefore, it is actually necessary to develop a fingerprint sensor package of a new structure capable of outputting a driving signal required for scanning a fingerprint shape in the package and improving the acquisition sensitivity of the fingerprint sensor.

Contents of the invention

technical problem

The present invention is used to solve the above-mentioned problems, and its purpose is to provide a driving signal that can output the required driving signal when scanning the fingerprint shape in the package and can improve the acquisition sensitivity of the fingerprint sensor by smoothly sliding (swipe), Moreover, the fingerprint sensor package and its manufacturing method are simple in structure and can improve the productivity during manufacture.

Technical solutions

The present invention for solving the above-mentioned problems provides a fingerprint sensor package, which is characterized in that it includes: a substrate composed of an inner area and an outer area, and the inner area is formed with a conductive pattern including a bonding finger and includes a fingerprint sensor placement portion (die paddle), the outer region is located at the periphery of the inner region and includes a drive electrode placement portion (signal electrode paddle) for placement of drive electrodes; The fingerprint sensor is attached to the fingerprint sensor placement part of the substrate and has a sensing part and a plurality of input and output pads on it; a bonding wire electrically connects the fingerprint sensor and the bonding finger part of the substrate; a driving electrode , arranged around the fingerprint sensor of the substrate to output a driving signal; a plastic package that integrates the fingerprint sensor and the driving electrodes on the substrate and prevents them from being affected by the external environment, wherein the driving The electrodes are formed at the same height as the plastic package and the surfaces of the driving electrodes are exposed to the outside of the plastic package, the driving electrodes are arranged around the fingerprint sensor and configured to be electrically connected to the fingerprint sensor.

In the present invention, the driving electrodes may also be connected to the fingerprint sensor through the conductive pattern of the substrate.

Moreover, the driving electrodes are formed around the fingerprint sensor, and can also be located on the edge of the substrate to form a shape surrounding the plastic package.

The driving electrodes are connected to the main board and the conductive patterns of the substrate through the main board mounted on the substrate.

The cross-sectional shape of the driving electrode located at the outermost periphery of the substrate may be formed as " "Word form.

The feature of the fingerprint sensor package is that a coating is formed on the driving electrodes and the plastic package to prevent the driving electrodes from being exposed outside the coating.

In addition, according to another aspect of the present invention for solving the above-mentioned problems, there is provided a method of manufacturing a fingerprint sensor package, which is characterized in that it includes the steps of: preparing a substrate formed of an inner region and an outer region, the The inner area is formed with a conductive pattern including bonding fingers and includes a fingerprint sensor placement portion (die paddle), and the outer area is located at the periphery of the inner area and includes driving electrodes for arranging driving electrodes. a placement part (signal electrode paddle); a fingerprint sensor placement part for attaching a fingerprint sensor to the substrate; arranging a drive electrode for outputting a drive signal around the fingerprint sensor; bonding the fingerprint sensor by wire bonding The input and output pads of the fingerprint sensor are electrically connected to the bonding fingers of the substrate; the encapsulant is used to carry out plastic sealing so that the surface of the driving electrode is exposed and the fingerprint sensor and the driving electrode on the substrate are protected from external influence. environmental impact.

Beneficial effect

The beneficial effects of the fingerprint sensor package and the manufacturing method thereof of the present invention are as follows.

First, according to the present invention, productivity is improved by simplifying the structure of a fingerprint sensor package.

And, according to the present invention, since the distance between the top (top) surface of the sensing portion in the fingerprint sensor and the fingerprint is very small, clearer and more accurate fingerprint image data can be acquired, thereby sufficiently ensuring the coating thickness , so that the mechanical strength and the resistance against electrostatic discharge can be improved compared with the existing fingerprint sensor package.

In addition, the fingerprint sensor package of the present invention has the following effects: by eliminating the height difference between the plastic package and the driving electrodes, it is easier to realize finger movement for fingerprint recognition.

In addition, when the present invention realizes an ultra-thin fingerprint sensor package, it can be manufactured in the same way as a wafer-level package that is not individually packaged.

That is, a pre-prepared fingerprint sensor is arranged on a die pad (Die Paddle) arranged in a predetermined pattern on a substrate having a wide area to the extent that a plurality of packages can be manufactured, and die attach is performed individually. ), wire bonding, plastic encapsulation, and other packaging processes, and then perform a separation (Singulation) process that separates into individual packages, which can help improve productivity when manufacturing fingerprint sensors.

Description of drawings

The features and advantages of the present invention will become easier to understand by referring to the detailed description of the embodiments of the present invention and the accompanying drawings to be described below, in which:

1 is a sectional view showing the constitution of a fingerprint sensor package according to the present invention;

Fig. 2 is the top view of Fig. 1;

3 is a cross-sectional view illustrating another embodiment of a fingerprint sensor package according to the present invention;

Fig. 4 is the top view of Fig. 3;

FIG. 5 is a cross-sectional view illustrating a state where the fingerprint sensor package of FIG. 3 is mounted on a motherboard so that the driving electrodes can be electrically connected to the fingerprint sensor.

Detailed ways

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 5 . When describing the embodiments of the present invention, the same symbols are used for the same configurations.

[Example 1]

FIG. 1 is a cross-sectional view showing the configuration of a fingerprint sensor package according to the present invention, and FIG. 2 is a plan view of FIG. 1 .

Referring to FIG. 1 and FIG. 2 , the fingerprint sensor package according to the present embodiment is configured to include: a substrate 2 consisting of an inner area and an outer area, and the inner area is formed with a conductive layer including a bonding finger (bondfinger) portion 200. pattern and includes a fingerprint sensor placement portion (die paddle (die paddle)) 210, the outer region is located at the periphery of the inner region and includes a driving electrode placement portion (signal electrode paddle (signal electrode paddle)) for arranging the driving electrode 3 electrode paddle)) 220; the fingerprint sensor 1 is attached to the fingerprint sensor placement part 210 of the substrate 2 and has a sensing part 100 and a plurality of input and output paddles 110 thereon; bonding wire 4 makes the fingerprint sensor 1 is electrically connected to the bonding finger 200 of the substrate 2; the driving electrode 3 is arranged around the fingerprint sensor 1 of the substrate 2 to output a driving signal; the plastic package 5 makes the fingerprint sensor on the substrate 2 1 and the driving electrode 3 are integrated and they are protected from the external environment.

At this time, the driving electrode 3 is formed to have substantially the same height as the plastic package 5 and the surface of the drive electrode 3 is exposed to the outside of the plastic package 5 .

And, the driving electrode 3 is configured to be connected to the fingerprint sensor 1 through the conductive pattern of the substrate 2 .

The driving electrode 3 receives a driving signal from the conductive pattern of the substrate 2 and radiates it to a medium such as a finger. The driving signal is an electrical signal including RF for generating differences in electrical properties of ridges and valleys of the fingerprint. For example, a difference in electrostatic capacity due to a height difference between ridges and valleys of a fingerprint occurs.

In addition, conductive patterns are formed on the upper and lower surfaces of the substrate 2 centered on the resin layer, and the upper and lower conductive patterns are connected by conductive vias (not shown).

The fingerprint sensor 1 generates an image or its template through the aforementioned electrical characteristic difference. Moreover, the generated fingerprint image or template is not only used to identify and authenticate the fingerprint but also to track the movement of the finger.

In this specification, a device that performs all fingerprint identification, authentication, and tracking of movement for navigation is collectively referred to as a "fingerprint sensor".

The manufacturing process of the fingerprint sensor package of the present invention constituted as described above will be described below.

First, the substrate 2 is prepared. The substrate 2 is a circuit board formed with conductive patterns, which has a relatively larger area than the fingerprint sensor 1 .

That is, prepare the electronic device that is formed with a conductive pattern including the bonding finger portion 200 and has a fingerprint sensor placement portion (die paddle) 210 and a driving electrode placement portion (electrode paddle (electrode paddle)) 220 outside it. Substrate 2.

Next, after the adhesive is applied to the fingerprint sensor placement part 210 of the substrate 2 , the fingerprint sensor 1 is attached to the fingerprint sensor placement part 210 .

And, a driving electrode 3 for outputting a driving signal is attached around the fingerprint sensor 1 .

Afterwards, the input and output pads 110 of the fingerprint sensor 1 and the bonding fingers 200 of the substrate 2 are electrically connected by wire bonding.

After the input and output pads 110 and the bonding fingers 200 are electrically connected, plastic packaging is performed by an encapsulant to form the plastic package 5. At this time, the plastic packaging is performed so that the surface of the driving electrode 3 is exposed to the plastic package. 5 outside and protect the fingerprint sensor 1 and the driving electrodes 3 on the substrate 2 from being affected by the external environment.

The fingerprint sensor package of this embodiment, which is completed through the above-mentioned process, can be mounted on the motherboard 6 of mobile devices and electrical and electronic products including computers to perform its own functions. At this time, the fingerprint sensor package of this embodiment can be used in The drive signal required for scanning the shape of the fingerprint is output in the package, and the drive electrode 3 and the surface of the plastic package 5 are formed at the same height, so that the acquisition sensitivity of the fingerprint sensor can be improved by smoothly sliding (swipe).

[Example 2]

3 is a sectional view showing another embodiment of the fingerprint sensor package according to the present invention, FIG. 4 is a top view of FIG. 3 , and FIG. 5 shows that the fingerprint sensor package of FIG. A cross-sectional view of a state where electrodes can be electrically connected to a fingerprint sensor.

Referring to the drawings, the fingerprint sensor package according to the present embodiment is constituted to include: a substrate 2 consisting of an inner area and an outer area, the inner area is formed with a conductive pattern including a bonding finger 200 and includes a fingerprint sensor placement part (die paddle (die paddle)) 210, the outer region is located at the periphery of the inner region and includes a driving electrode placement part (signal electrode paddle (signal electrode paddle)) 220 for arranging the driving electrode 3; The fingerprint sensor 1 is attached to the fingerprint sensor placement part 210 of the substrate 2 and has a sensing part 100 and a plurality of input and output pads 110 thereon; bonding wire 4 makes the bonding of the fingerprint sensor 1 and the substrate 2 The finger part 200 is electrically connected; the drive electrode 3 is arranged on the upper edge of the substrate 2 to output a drive signal; the plastic package 5 integrates the fingerprint sensor 1 and the drive electrode 3 on the substrate 2 and prevents them from influenced by the external environment.

At this time, the driving electrodes 3 are formed to have the same height as the plastic packaging body 5 and the surfaces of the driving electrodes 3 are exposed to the outside of the plastic packaging body 5 .

In addition, although such a basic configuration is the same as the package of the above-mentioned [Example 1], the fingerprint sensor package of the present example is not implemented by the conductive pattern of the substrate 2 and the bonding wire 4 as in [Example 1]. The electrical connection between the driving electrode 3 and the fingerprint sensor 1 is realized, but through other paths.

That is, the fingerprint sensor package according to the present embodiment is mounted on the main board 6, and the driving electrodes 3 are configured to pass through the conductive pattern (not shown) of the main board 6 and the conductive pattern of the substrate 2 electrically connected thereto by means of Bonding wires are connected to the fingerprint sensor 1.

In addition, the cross-sectional shape of the drive electrode 3 arranged on the outermost periphery of the substrate 2 is formed as " ” shape, which can improve the binding force for the plastic package 5.

In a word, although the basic composition principle of the fingerprint sensor package according to this embodiment is similar to that of the above-mentioned [Example 1] package, there are differences in the position and shape of the drive electrode 3 and the electrical connection relationship with the fingerprint sensor. Structural differences.

That is, the fingerprint sensor according to the present embodiment is characterized in that the driving electrodes 3 are formed around the fingerprint sensor 1, and are formed to be located on the upper side of the edge of the substrate 2 to form a form surrounding the plastic package 5, and are attached When mounted on the motherboard 6, it is electrically connected with the fingerprint sensor 1.

The manufacturing process of the fingerprint sensor package according to the present embodiment constituted as described above is basically the same as that of the above-mentioned [Embodiment 1] except that the driving electrodes 3 are located at the edge of the substrate 2 in the manufacturing process.

As shown in Figure 5, the fingerprint sensor package of this embodiment completed through the above process can only be installed on the main board of electrical and electronic products including mobile devices and computers, so that the driving electrodes 3 can be electrically powered through the main board and the substrate. Connect to the fingerprint sensor 1 side to perform its own function.

Moreover, the fingerprint sensor package of this embodiment can also output the drive signal required when scanning the fingerprint image in the package, and make the drive electrode 3 and the surface of the plastic package 5 form the same height, so that it can be passed smoothly Swipe to increase the fingerprint sensor acquisition sensitivity.

In addition, the present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the scope of the technical idea of the present invention.

For example, although the above embodiment shows that the top of the driving electrodes is exposed, it is possible to prevent the driving electrodes from being exposed by forming a coating (not shown) such as a black coating on the driving electrodes 3 and the plastic package 5. exposed.

Therefore, it should be considered that the described embodiments are not restrictive but exemplary, thus those skilled in the art should understand that the present invention is not limited to the above description, and can be made without departing from the claims and their equivalent scope. Revise.

Industrial availability

The present invention can be used in various fields such as security using fingerprint sensing, authentication, and the interface of electronic devices, and can improve productivity during manufacturing due to its simple structure, and because the top of the sensing part of the fingerprint sensor (top) The distance between the surface and the fingerprint becomes minimized to obtain accurate fingerprint image data, and the mechanical strength and resistance against electrostatic discharge can be improved, so that it can be effectively applied to authentication and fingerprint recognition that require fingerprint recognition It is an invention with high industrial applicability because it is a mobile device with a pointer function or various devices including a computer.

Claims (7)

1. A fingerprint sensor package, characterized in that, comprising: The substrate is composed of an inner area and an outer area, the inner area is formed with a conductive pattern including a bonding finger portion and includes a fingerprint sensor placement portion, and the outer area is located at the periphery of the inner area and includes a drive electrode. Drive electrode placement part; a fingerprint sensor attached to the fingerprint sensor placement part of the substrate and having a sensing part and a plurality of input and output pads thereon; bonding wires to electrically connect the fingerprint sensor to the bonding fingers of the substrate; a driving electrode arranged around the fingerprint sensor of the substrate to output a driving signal; a plastic package that integrates the fingerprint sensor and the driving electrodes on the substrate and protects them from the external environment, Wherein, the drive electrode is formed to be substantially the same height as the plastic package and the surface of the drive electrode is exposed to the outside of the plastic package, and the drive electrode is arranged around the fingerprint sensor and uses the contact finger as a medium Instead, a driving signal is provided to the fingerprint sensor. 2. The fingerprint sensor package according to claim 1, wherein, The driving electrodes are connected to the fingerprint sensor through conductive patterns of the substrate. 3. The fingerprint sensor package of claim 1, wherein The driving electrodes are formed around the fingerprint sensor and located on the edge of the substrate to form a shape surrounding the plastic package. 4. The fingerprint sensor package according to claim 3, wherein, The driving electrodes are connected to the main board and the conductive patterns of the substrate through the main board mounted on the substrate. 5. The fingerprint sensor package of claim 1, wherein The cross-sectional shape of the drive electrode located at the outermost periphery of the substrate is formed as word form. 6. The fingerprint sensor package of claim 1, wherein A coating is formed on the driving electrodes and the plastic package to prevent the driving electrodes from being exposed outside the coating. 7. A method for manufacturing a fingerprint sensor package, comprising the steps of: preparing a substrate formed of an inner region formed with a conductive pattern including a bonding finger portion and including a fingerprint sensor placement portion, and an outer region located on the periphery of the inner region and including a drive electrode for placement. The drive electrode placement part; attaching a fingerprint sensor to a fingerprint sensor placement portion of the substrate; arranging drive electrodes for outputting drive signals around the fingerprint sensor; The input and output pads of the fingerprint sensor are electrically connected to the bonding fingers of the substrate by wire bonding; The plastic encapsulation is performed by an encapsulant to expose the surface of the driving electrodes and protect the fingerprint sensor and the driving electrodes on the substrate from being affected by the external environment.